Ecliptek Corporaon 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
144
EP13E7D2H-14.7456M TR
ELECTRICAL SPECIFICATIONS
Nominal Frequency 14.7456MHz
Frequency Tolerance/Stability ±50ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability
over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°, 260°C
Reflow, Shock, and Vibration)
Aging at 25°C ±5ppm/Year Maximum
Supply Voltage 3.3Vdc ±5%
Input Current 12mA Maximum
Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH = -8mA)
Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL = +8mA)
Rise/Fall Time 6nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle 50 ±5(%) (Measured at 50% of waveform)
Load Drive Capability 30pF Maximum
Output Logic Type CMOS
Pin 1 Connection Tri-State
Pin 1 Input Voltage (Vih and Vil) 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output
Disable Current 8mA Maximum (Pin 1 = Ground)
Absolute Clock Jitter 350pSec Maximum
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to 125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500Vdc
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Thermal Shock MIL-STD-883, Method 1011, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 1 of 7
Ecliptek Corporaon 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
EP13E7D2H-14.7456M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
2.50
±0.15
3.20
±0.15
1.05
±0.15 0.75 ±0.10 (X4)
1.20
±0.10
1.00
±0.10
1.00
±0.10
1
23
4
MARKING
ORIENTATION
PIN CONNECTION
1 Tri-State
2 Ground
3 Output
4 Supply Voltage
LINE MARKING
1E14.745
E=Ecliptek Designator
2XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
1.00
0.80
0.95 (X4)
1.20 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 2 of 7
Ecliptek Corporaon 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
EP13E7D2H-14.7456M TR
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80% of Waveform
50% of Waveform
20% of Waveform
Fall
Time
Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUT TRI-STATE INPUT
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 3 of 7
Ecliptek Corporaon 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
EP13E7D2H-14.7456M TR
Supply
Voltage
(VDD)
Test Circuit for CMOS Output
Output
Tri-State or
Power Down
Ground
+ +
+_
__
Power
Supply
0.01µF
(Note 1) 0.1µF
(Note 1)
CL
(Note 3)
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.
Voltage
Meter
Current
Meter
Oscilloscope Frequency
Counter
Probe
(Note 2)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 4 of 7
DIA 50 MIN
DIA 20.20 MIN
DIA 13.00 ±0.20
2.50 MIN Width
10 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.50 MIN
1-800-ECLIPTEK or 714.433.1200 3545 Cadillac Ave., Costa Mesa, CA 92626
PART NUMBER DATA SHEET
Tape & Reel Dimensions
All Dimensions in Millimeters
Compliant to EIA-481
EP13E7D2H-14.7456M TR
8.00 ±0.30
3.50 ±0.05
DIA 1.00 MIN
4.00 ±0.10
2.00 ±0.05
4.00 ±0.10 A0
DIA 1.50 +0.10/-0.00
1.75 ±0.10
B0
0.60 MAX
0.10 MAX
K0
14.40 MAX
Quantity Per Reel: 1,000 units
180 MAX
8.40 +1.50/-0.00
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 5 of 7
Ecliptek Corporaon 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
Recommended Solder Reflow Methods
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
EP13E7D2H-14.7456M TR
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 6 of 7
Ecliptek Corporaon 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
Recommended Solder Reflow Methods
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
EP13E7D2H-14.7456M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 7 of 7
