MEMSIC MXA2500E Rev G Page 1 of 9 2/26/2007
Ultra Low Noise, Offset Drift
±
±±
±1 g Dual Axis Accelerometer
with Analog Outputs
MXA2500E
FEATURES
Better than 1 mg resolution
Dual axis accelerometer fabricated on a monolithic CMOS IC
RoHS compliant
On-chip mixed mode signal processing
No moving parts
50,000 g shock survival rating
17 Hz bandwidth expandable to >160 Hz
3V to 5.25V single supply continuous operation
Small (5mm x 5mm x 2mm) surface mount package
Continuous self test
Custom programmable specifications
Independent axis programmability (special order)
APPLICATIONS
Automotive – Vehicle Security/Active Suspension/ABS
Headlight Angle Control/Tilt Sensing
Security – Gas Line/Elevator/Fatigue Sensing
Office Equipment – Computer Peripherals/PDA’s/
Cell Phones
Internal
Oscillator
Sck
(optional)
CLK
Heater
Control
X axis
Y axis
Factory Adjust
Offset & Gain
Low Pass
Filter
Low Pass
Filter
Temperature
Sensor
Voltage
Reference VREF
AOUTX
VDD VDA
Gnd
2-AXIS
SENSOR
AOUTY
TOUT
Continous
Self Test
MXA2500E FUNCTIONAL BLOCK DIAGRAM
Gaming – Joystick/RF Interface/Menu Selection/Tilt Sensing
White Goods – Spin/Vibration Control
GENERAL DESCRIPTION
The MXA2500E is an ultra low noise and low cost, dual
axis accelerometer fabricated on a standard, submicron
CMOS process. It is a complete sensing system with on-
chip mixed mode signal processing. The MXA2500E
measures acceleration with a full-scale range of ±1 g and a
sensitivity of 500mV/g @5V at 25°C. It can measure both
dynamic acceleration (e.g., vibration) and static
acceleration (e.g., gravity). The MXA2500E design is
based on heat convection and requires no solid proof mass.
This eliminates stiction and particle problems associated
with competitive devices and provides shock survival of
50,000 g, leading to significantly lower failure rates and
lower loss due to handling during assembly.
The MXA2500E provides two absolute analog outputs.
The typical noise floor is 0.2 mg/Hz allowing signals
below 1 mg to be resolved at 1 Hz bandwidth. The 3dB
rolloff of the device occurs at 17 Hz but is expandable to
>160 Hz (ref. Application Note AN-00MX-003). The
MXA2500E is available in a LCC surface mount package
(5 mm x 5 mm x 2 mm). It is hermetically sealed and is
operational over a -40°C to +105°C temperature range. It
also contains an on-chip temperature sensor and a bandgap
voltage reference.
Due to the standard CMOS structure of the MXA2500E,
additional circuitry can easily be incorporated into custom
versions for high volume applications. Contact the factory
for more information.
Information furnished by MEMSIC is believed to be accurate and reliable.
However, no responsibility is assumed by MEMSIC for its use, nor for any
infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or
patent rights of MEMSIC.
MEMSIC, Inc.
One Technology Drive Suite 325,Andover MA01810,USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
MEMSIC MXA2500E Rev G Page 2 of 8 2/26/2007
MXA2500E SPECIFICATIONS (Measurements @ 25°C, Acceleration = 0 g unless otherwise noted; VDD, VDA = 5.0V
unless otherwise specified)
Parameter
Conditions
Min
MXA2500E
Typ
Max
Units
SENSOR INPUT
Measurement Range1
Each Axis
±1.0
g
Nonlinearity Best fit straight line 0.5 1.0 % of FS
Alignment Error2 ±1.0 degree
Transverse Sensitivity3 ±2.0 %
SENSITIVITY
Sensitivity, Analog Outputs at pins
AOUTX and AOUTY6
Each Axis
475
500
525
mV/g
Change over Temperature (uncompensated)4 from 25°C, at –40°C +120 %
from 25°C, at +105°C -55 %
Change over Temperature (compensated) 4 from 25°C, –40°C to +105°C <3.0 %
ZERO g BIAS LEVEL
0 g Offset6
Each Axis
-0.1
0.00
+0.1
g
0 g Voltage6 1.20 1.25 1.30 V
0 g Offset over Temperature from 25°C
from 25°C, based on 500mV/g
±0.4
±0.2
mg/°C
mV/°C
NOISE PERFORMANCE
Noise Density, rms
Without frequency compensation
0.2
0.4
mg/Hz
FREQUENCY RESPONSE
3dB Bandwidth - uncompensated 17 Hz
3dB Bandwidth - compensated5 >160 Hz
TEMPERATURE OUTPUT
Tout Voltage 1.15 1.25 1.35 V
Sensitivity 4.6 5.0 5.4 mV/°C
VOLTAGE REFERENCE OUTPUT
VRef output @3V-5.25V supply 2.4 2.5 2.65 V
Change over Temperature 0.1 mV/°C
Current Drive Capability Source 100 µA
SELF TEST
Continuous Voltage at AOUTX, AOUTY under
Failure
@5.0V Supply, output rails to
supply voltage
5.0
V
Continuous Voltage at AOUTX, AOUTY under
Failure
@3.0V Supply, output rails to
supply voltage
3.0
V
AOUTX and AOUTY OUTPUTS
Normal Output Range @5.0V Supply
@3.0V Supply
0.1
0.1
4.9
2.9
V
V
Current Source or sink, @ 3.0V-5.25V supply
100 µA
Turn-On Time7 @5.0V Supply
@3.0V Supply
160
300
mS
mS
POWER SUPPLY
Operating Voltage Range 3.0 5.25 V
Supply Current @ 5.0V 2.7 3.3 4.1 mA
Supply Current6 @ 3.0V 3.2 4.0 4.8 mA
TEMPERATURE RANGE
Operating Range -40 +105 °C
NOTES
1 Guaranteed by measurement of initial offset and sensitivity.
2 Alignment error is specified as the angle between the true and indicated
axis of sensitivity.
3 Transverse sensitivity is the algebraic sum of the alignment and the
inherent sensitivity errors.
4 The sensitivity change over temperature for thermal accelerometers is based
on variations in heat transfer that are governed by the laws of physics and it is
highly consistent from device to device. Please refer to the section in this data
sheet titled “Compensation for the Change of Sensitivity over Temperature”
for more information.
5 External circuitry is required to extend the 3dB bandwidth. (ref.
Application Note: AN-00MX-003).
6 The device operates over a 3.0V to 5.25V supply range. Please note that
sensitivity and zero g bias level will be slightly different at 3.0V operation.
For devices to be operated at 3.0V in production, they can be trimmed at the
factory specifically for this lower supply voltage operation, in which case the
sensitivity and zero g bias level specifications on this page will be met.
Please contact the factory for specially trimmed devices for low supply
voltage operation.
7 Output settled to within ±17mg.
MEMSIC MXA2500E Rev G Page 3 of 8 2/26/2007
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage (VDD, VDA) ………………...-0.5 to +7.0V
Storage Temperature ……….…………-65°C to +150°C
Acceleration ……………………………………..50,000 g
*Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only; the functional operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Package Characteristics
Package θ
θθ
θJA θ
θθ
θJC Device Weight
LCC-8 110°C/W 22°C/W < 1 gram
Pin Description: LCC-8 Package
Pin Name Description I/O
1 TOUT Temperature (Analog Voltage) O
2 AOUTY Y-Axis Acceleration Signal O
3 Gnd Ground I
4 VDA Analog Supply Voltage I
5 AOUTX X-Axis Acceleration Signal O
6 Vref 2.5V Reference Output O
7 Sck Optional External Clock I
8 VDD Digital Supply Voltage I
Ordering Guide
Model Package Style
MXA2500EL LCC8 RoHS compliant
MXA2500EF LCC8, Pb-free RoHS compliant
*LCC parts are shipped in tape and reel packaging.
Caution
ESD (electrostatic discharge) sensitive device.
8
4
1
2
3
7
6
5
Top View
M E M S IC
X +g
Y +g
Note: The MEMSIC logo’s arrow indicates the +X sensing
direction of the device. The +Y sensing direction is rotated 90°
away from the +X direction following the right-hand rule.
Small circle indicates pin one (1).
MEMSIC MXA2500E Rev G Page 4 of 8 2/26/2007
THEORY OF OPERATION
The MEMSIC device is a complete dual-axis acceleration
measurement system fabricated on a monolithic CMOS IC
process. The device operation is based on heat transfer by
natural convection and operates like other accelerometers
having a proof mass except it is a gas in the MEMSIC
sensor.
A single heat source, centered in the silicon chip is
suspended across a cavity. Equally spaced
aluminum/polysilicon thermopiles (groups of
thermocouples) are located equidistantly on all four sides
of the heat source (dual axis). Under zero acceleration, a
temperature gradient is symmetrical about the heat source,
so that the temperature is the same at all four thermopiles,
causing them to output the same voltage.
Acceleration in any direction will disturb the temperature
profile, due to free convection heat transfer, causing it to be
asymmetrical. The temperature, and hence voltage output
of the four thermopiles will then be different. The
differential voltage at the thermopile outputs is directly
proportional to the acceleration. There are two identical
acceleration signal paths on the accelerometer, one to
measure acceleration in the x-axis and one to measure
acceleration in the y-axis. Please visit the MEMSIC
website at www.memsic.com for a picture/graphic
description of the free convection heat transfer principle.
PIN DESCRIPTIONS
VDD – This is the supply input for the digital circuits and
the sensor heater in the accelerometer. The DC voltage
should be between 3.0 volts and 5.25 volts. Refer to the
section on PCB layout and fabrication suggestions for
guidance on external parts and connections recommended.
VDA – This is the power supply input for the analog
amplifiers in the accelerometer. Refer to the section on
PCB layout and fabrication suggestions for guidance on
external parts and connections recommended.
Gnd – This is the ground pin for the accelerometer.
AOUTX – This pin is the output of the x-axis acceleration
sensor. The user should ensure the load impedance is
sufficiently high as to not source/sink >100µA. While the
sensitivity of this axis has been programmed at the factory
to be the same as the sensitivity for the y-axis, the
accelerometer can be programmed for non-equal
sensitivities on the x- and y-axes. Contact the factory for
additional information on this feature.
AOUTYThis pin is the output of the y-axis acceleration
sensor. The user should ensure the load impedance is
sufficiently high as to not source/sink >100µA. While the
sensitivity of this axis has been programmed at the factory
to be the same as the sensitivity for the x-axis, the
accelerometer can be programmed for non-equal
sensitivities on the x- and y-axes. Contact the factory for
additional information on this feature.
TOUT – This pin is the buffered output of the temperature
sensor. The analog voltage at TOUT is an indication of the
die temperature. This voltage is useful as a differential
measurement of temperature from ambient and not as an
absolute measurement of temperature. After correlating
the voltage at TOUT to 25°C ambient, the change in this
voltage due to changes in the ambient temperature can be
used to compensate for the change over temperature of the
accelerometer offset and sensitivity. Please refer to the
section on Compensation for the Change in Sensitivity
Over Temperature for more information.
Sck – The standard product is delivered with an internal
clock option (800kHz). This pin should be grounded
when operating with the internal clock. An external
clock option can be special ordered from the factory
allowing the user to input a clock signal between 400kHz
and 1.6MHz.
Vref – This pin is the output of a reference voltage. It is set
at 2.50V typical and has 100µA of drive capability.
COMPENSATION FOR THE CHANGE IN
SENSITIVITY OVER TEMPERATURE
All thermal accelerometers display the same sensitivity
change with temperature. The sensitivity change depends
on variations in heat transfer that are governed by the laws
of physics. Manufacturing variations do not influence the
sensitivity change, so there are no unit-to-unit differences
in sensitivity change. The sensitivity change is governed
by the following equation (and shown in Figure 1 in °C):
Si x Ti
2.90 = Sf x Tf
2.90
where Si is the sensitivity at any initial temperature Ti, and
Sf is the sensitivity at any other final temperature Tf with
the temperature values in °K.
0.0
0.5
1.0
1.5
2.0
2.5
-40 -20 0 20 40 60 80 100
Temperature (C)
Sensitivity (normalized)
Figure 1: Thermal Accelerometer Sensitivity
MEMSIC MXA2500E Rev G Page 5 of 8 2/26/2007
In gaming applications where the game or controller is
typically used in a constant temperature environment,
sensitivity might not need to be compensated in hardware
or software. Any compensation for this effect could be
done instinctively by the game player.
For applications where sensitivity changes of a few percent
are acceptable, the above equation can be approximated
with a linear function. Using a linear approximation, an
external circuit that provides a gain adjustment of
0.9%/°C would keep the sensitivity within 10% of its room
temperature value over a 0°C to +50°C range.
For applications that demand high performance, a low cost
micro-controller can be used to implement the above
equation. A reference design using a Microchip MCU (p/n
16F873/04-SO) and MEMSIC developed firmware is
available by contacting the factory. With this reference
design, the sensitivity variation over the full temperature
range (-40°C to +105°C) can be kept below 3%. Please
visit the MEMSIC web site at www.memsic.com for
reference design information on circuits and programs
including look up tables for easily incorporating sensitivity
compensation.
DISCUSSION OF TILT APPLICATIONS AND
RESOLUTION
Tilt Applications: One of the most popular applications
of the MEMSIC accelerometer product line is in
tilt/inclination measurement. An accelerometer uses the
force of gravity as an input to determine the inclination
angle of an object.
A MEMSIC accelerometer is most sensitive to changes in
position, or tilt, when the accelerometer’s sensitive axis is
perpendicular to the force of gravity, or parallel to the
Earth’s surface. Similarly, when the accelerometer’s axis
is parallel to the force of gravity (perpendicular to the
Earth’s surface), it is least sensitive to changes in tilt.
Table 1 and Figure 2 help illustrate the output changes in
the X- and Y-axes as the unit is tilted from +90° to 0°.
Notice that when one axis has a small change in output per
degree of tilt (in mg), the second axis has a large change in
output per degree of tilt. The complementary nature of
these two signals permits low cost accurate tilt sensing to
be achieved with the MEMSIC device (reference
application note AN-00MX-007).
Top View
X
Y
+900
00
gravity
M
M
M
ME
E
E
EM
M
M
MS
S
S
SI
I
I
IC
C
C
C
Figure 2: Accelerometer Position Relative to Gravity
X-Axis Y-Axis
X-Axis
Orientation
To Earth’s
Surface
(deg.)
X
Output
(g)
Change
per deg.
of tilt
(mg)
Y
Output
(g)
Change
per deg.
of tilt
(mg)
90 1.000 0.15 0.000 17.45
85 0.996 1.37 0.087 17.37
80 0.985 2.88 0.174 17.16
70 0.940 5.86 0.342 16.35
60 0.866 8.59 0.500 15.04
45 0.707 12.23 0.707 12.23
30 0.500 15.04 0.866 8.59
20 0.342 16.35 0.940 5.86
10 0.174 17.16 0.985 2.88
5 0.087 17.37 0.996 1.37
0 0.000 17.45 1.000 0.15
Table 1: Changes in Tilt for X- and Y-Axes
Resolution: The accelerometer resolution is limited by
noise. The output noise will vary with the measurement
bandwidth. With the reduction of the bandwidth, by
applying an external low pass filter, the output noise drops.
Reduction of bandwidth will improve the signal to noise
ratio and the resolution. The output noise scales directly
with the square root of the measurement bandwidth. The
maximum amplitude of the noise, its peak- to- peak value,
approximately defines the worst case resolution of the
measurement. With a simple RC low pass filter, the rms
noise is calculated as follows:
Noise (mg rms) = Noise(mg/ Hz ) * )6.1*)(( HzBandwidth
The peak-to-peak noise is approximately equal to 6.6 times
the rms value (for an average uncertainty of 0.1%).
EXTERNAL FILTERS
AC Coupling: For applications where only dynamic
accelerations (vibration) are to be measured, it is
recommended to ac couple the accelerometer output as
shown in Figure 3. The advantage of ac coupling is that
variations from part to part of zero g offset and zero g
offset versus temperature can be eliminated. Figure 3 is a
HPF (high pass filter) with a –3dB breakpoint given by the
MEMSIC MXA2500E Rev G Page 6 of 8 2/26/2007
equation: RC
f
π
2
1
=. In many applications it may be
desirable to have the HPF –3dB point at a very low
frequency in order to detect very low frequency
accelerations. Sometimes the implementation of this HPF
may result in unreasonably large capacitors, and the
designer must turn to digital implementations of HPFs
where very low frequency –3dB breakpoints can be
achieved.
AOUT X
R
C
AOUT Y
R
C
AOUT X
Filtered
Output
AOUTY
Filtered
Output
Figure 3: High Pass Filter
Low Pass Filter: An external low pass filter is useful in
low frequency applications such as tilt or inclination. The
low pass filter limits the noise floor and improves the
resolution of the accelerometer. The low pass filter shown
in Figure 4 has a –3dB breakpoint given by the equation:
RC
f
π
2
1
=. For the 200 Hz ratiometric output device
filter, C=0.1µF and R=8k, ±5%, 1/8W.
AOUT X
R
C
AOUTY
R
C
AOUTX
Filtered
Output
AOUT Y
Filtered
Output
Figure 4: Low Pass Filter
COMPENSATION FOR EXTENDING THE
FREQUENCY RESPONSE
The response of the thermal accelerometer is a function of
the internal gas physical properties, the natural convection
mechanism and the sensor electronics. Since the gas
properties of MEMSIC's mass produced accelerometer are
uniform, a simple circuit can be used to equally
compensate all sensors. For most applications, the
compensating circuit does not require adjustment for
individual units.
A simple compensating network comprising two
operational amplifiers and a few resistors and capacitors
provides increasing gain with increasing frequency (see
Figure 5). The circuit shown is for an absolute output
accelerometer operating at 5 V supply. It provides a DC
gain of X2, so the offset at the output is 2.5V and the
sensitivity is doubled. The 14.3 K and the 5.9K
resistors along with the non-polarized 0.82µF capacitors
tune the gain of the network to compensate for the output
attenuation at the higher frequencies. The resistors and the
capacitors provide noise reduction and stability.
Figure 5: Frequency Response Extension Circuit
The accelerometer response (bottom trace), the network
response (top trace) and the compensated response (middle
trace) are shown in Figure 6. The amplitude remains above
–3db beyond 100 Hz, and there is useable signal well
after this frequency.
-60
-45
-30
-15
0
15
30
45
60
1 0 1 0 0 1 0 0 0
F req u e ncy - H z
Amplitude - dB
8.06K
5.9K
160K
1.5uF
-
+
UA
0.01uF
8.06K
14.3K
0.01uF
0.047uF
5.9K
-
+
UB
1.5uF
0.047uF
14.3K
0.0022uF
Aout X or Y
Freq. Comp. Output
MEMSIC MXA2500E Rev G Page 7 of 8 2/26/2007
Figure 6: Amplitude Frequency Response
COMPENSATION FOR ZERO G OFFSET CHANGE
OVER TEMPERATURE
In applications where a stable zero g offset is required, and
where the AC coupling external filter described earlier can
not be used, analog or digital temperature compensation
can be applied. The compensation requires individual
calibration because the magnitude of the zero g offset
change over temperature is different for each unit. To
compensate the change, a calibrated temperature
dependent signal equal in magnitude but with opposite
polarity is added to the accelerometer output. The circuit
in Figure 7 shows a circuit example applying an analog
linear compensation technique. In this circuit the
accelerometer temperature sensor output is added to or
subtracted from the accelerometer output. The calibration
sequence is: start at room temperature with the 100K pot
set so that its wiper is at Vref. Next, soak the accelerometer
at the expected extreme temperature and observe the
direction of the change. Then set the switch to the non-
inverting input if the change is negative or vice versa.
Finally, adjust the 100K pot while monitoring the circuit
output, until the zero g offset change is removed.
+5V
-
+
100K
Aoutx or y
zero g drift
compensated
SW SPDT
100K
Aoutx or y
100K
100K
100K
10K
100K
10K
Tout
Vref
10K
Figure 7: Zero g Offset Temperature Compensation Circuit
Various digital compensation techniques can be applied
using a similar concept. Digital techniques can provide
better compensation because they can compensate for non-
linear zero g offset vs. temperature. A micro-controller or
micro-processor would perform the compensation. The
acceleration signal and the temperature signal would be
digitized using an analog to digital converter. Like in the
analog compensation, the first step is to test and
characterize the zero g change. The purpose of the
characterization is to create a look up table or to estimate a
mathematical representation of the change. For example,
the change could be characterized by an equation of the
form:
Change = a * Temperature 2 + b * Temperature + c
where a,b,c are unique constants for each accelerometer.
In normal operation the processor calculates the output:
Compensated Output = Acceleration – Change.
For a more detail discussion of temperature compensation
reference MEMSIC application note #AN-00MX-002.
TEMPERATURE OUTPUT NOISE REDUCTION
It is recommended that a simple RC low pass filter is used
when measuring the temperature output. Temperature
output is typically a very slow changing signal, so a very
low frequency filter eliminates erroneous readings that may
result from the presence of higher frequency noise. A
simple filter is shown in Figure 8.
Filtered TOUT
8.2K
0.1uFMEMSIC
Accel.
TOUT
Figure 8: Temperature Output Noise Reduction
POWER SUPPLY NOISE REJECTION
Two capacitors and a resistor are recommended for best
rejection of power supply noise (reference Figure 9 below).
The capacitors should be located as close as possible to the
device supply pins (VDA, VDD). The capacitor lead length
should be as short as possible, and surface mount
capacitors are preferred. For typical applications,
capacitors C1 and C2 can be ceramic 0.1 µF, and the
resistor R can be 10 .
R
MEMSIC
Accelerometer
VDA
C1 C2
VDD
V SUPPLY
Figure 9: Power Supply Noise Rejection
PCB LAYOUT AND FABRICATION SUGGESTIONS
1. The Sck pin should be grounded to minimize noise.
MEMSIC MXA2500E Rev G Page 8 of 8 2/26/2007
2. Liberal use of ceramic bypass capacitors is
recommended.
3. Robust low inductance ground wiring should be used.
4. Care should be taken to ensure there is “thermal
symmetryon the PCB immediately surrounding the
MEMSIC device and that there is no significant heat
source nearby.
5. A metal ground plane should be added directly
beneath the MEMSIC device. The size of the ground
plane should be similar to the MEMSIC device’s
footprint and be as thick as possible.
6. Vias can be added symmetrically around the ground
plane. Vias increase thermal isolation of the device
from the rest of the PCB.
PACKAGE DRAWING
Fig 10: Hermetically Sealed Package Outline