Datasheet Power Management IC for Cell phoneSmart Phone Power Management IC for Near Field Communication LSI BD7602GUL Summary Key Parameters BD7602GUL is a Power Management IC for mobile device with NFC IC. Each LDO output is controlled by 2 line serial interface which supports I2C Bus protocol. This helps to save space to integrate all PMIC for NFC IC. Features Low current consumption 10A (Typ) 2 Channel LDO 2.7V UVLO detection 1 Channel GPO Thermal Shut Down function 2 line serial interface which supports I2C bus protocol. Input voltage range Output voltage(LDO1) Output voltage range(LDO2) Output current(LDO1) Output current(LDO2) VBAT operating current Operating temperature range PACKAGE 2.7V 5.5V 3.0V(Typ) 2.8V 3.3V 100mA(Max) 150mA(Max) 10A (Typ) -35C +85C W (Typ) x D (Typ) x H (Max) 1.60mm x 1.60mm x 0.57mm VCSP50L1C USE Smart Phones Cell Phones Mobile device which has NFC IC VCSP50L1C Application Schematic 1F VBAT Voltage Detect (2.7V) LDO1 VOUT1 3.0V 100mA TSD LDO2 VOUT2 2.8V3.3V 150mA DVDD 2.2K VREF DPREF 4.7uF REFC (IC Internal Power DVDD 4.7uF 0.1F 2.2K SCL SDA I2C SLAVE GPO GPO REGISTER GND Figure 1. Application schematic. Product structure : Silicon monolithic integrated circuit. This product has no designed protection against radioactive rays. www.rohm.co.jp TSZ02201-0Q4Q0AB00010-1-2 (c) 2014 ROHM Co., Ltd. All rights reserved. 1/22 25.Feb.2014 Rev.001 TSZ2211114001 BD7602GUL Pinout Diagram 1 2 3 A VOUT1 VBAT VOUT2 C REFC SCL SDA B GND GPO DVDD B GND GPO DVDD C REFC SCL SDA A VOUT1 VBAT VOUT2 1 2 Top View 3 Bottom View Figure 2. Pinout Diagram Pin Descriptions Terminal Number Name SiA1 VOUT1 A2 VBAT A3 VOUT2 B1 B2 Diode Function +side -side LDO1 OUTPUT VBAT GND POWER Supply - GND LDO2 OUTPUT VBAT GND GND Ground VBAT - GPO GPO OUTPUT - GND B3 DVDD I2C Serial Interface I/O Power supply - GND C1 REFC Power for logic circuit. VBAT GND C2 SCL I2C serial interface CLK input DVDD GND C3 SDA I2C serial interface DATA inout DVDD GND IC Block Diagram VBAT Voltage Detect (2.7V) LDO1 3.0V 100mA TSD LDO2 2.8V3.3V 150mA VREF DPREF (IC Internal Power VOUT1 VOUT2 REFC DVDD SCL SDA I2C SLAVE GPO GPO REGISTER GND Figure 3. Block Diagram www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Block Explanation The output voltage for LDO1 is 3V (Typ) with an output current capability of 100mA (Max). UVLO Function is released when the IC starts by turning the power ON (VBAT). LDO1 turns OFF when UVLO function is enabled. I2C controller can also be used to turn off the IC. When LDO1 turns off, VOUT1 automatically connects with 100 discharge resistance. VOUT1 needs 4.7uF external capacitor. LDO2 has an adjustable output voltage from 2.8V to 3.3V.The initial value is 3V (Typ) with an output current capability of 150mA (Max). UVLO Function is released when the IC starts by turning the power ON (VBAT). LDO2 turns OFF when UVLO function is enabled. I2C Controller is used to adjust output voltage from 2.8V to 3.3V (8steps). It is also used to turn off the IC. When LDO2 turns off, VOUT2 automatically connects with 100 discharge resistance. VOUT2 needs 4.7uF external capacitor. GPO is a logic output pin from register and could be used as enable or disable signal. The register can also set its output to CMOS type or NMOS type with an output current capability of 3mA. Initial condition of GPO is disabled or in HI-Z state. Maximum pull up voltage during NMOS output is equal to VBAT I2C SLAVE REGISTER is the function for I2C serial interface. Input voltage level is DVDD. Voltage Detect for VBAT UVLO is 2.7V (Typ). When UVLO is detected, registers are reset. Also at this time VREF, LDO1 and LDO2 outputs turn off. VREF is equal to 2.5V (Typ). It powers the internal circuit and cannot be used externally. UVLO Function is released when the IC starts by turning power ON (VBAT). When UVLO function is detected, IC turns off. REFC needs 0.1uF external capacitor. DPREF is reference voltage for LDO VREF and Voltage Detect. TSD is for thermal shut down function. This prevents damaging and breaking of IC. When ICs internal temperature rise up to a certain temperature, LDO1 and LDO2 are automatically turned off. When temperature goes down, LDO1 and LDO2 automatically return to its normal operation. In this case, register doesnt need to be reset. www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Absolute Maximum Rating(s) (Ta = 25C) Parameter Symbol Value Unit Power Supply (VBAT) VINVBAT -0.3 +7.0 V Power Supply (DVDD) VINDVDD -0.3 +7.0 Power Dissipation Pd 0.66 V (Note 1) W Topr -35 +85 C Storage Temperature Tstg -55 +150 C Junction Temperature Tjmax 150 C Other Pin Voltage VOTH -0.3 +7.0 V Operating Temperature Range (Note 1) Derate by 5.2mW/when operating above Ta=25. (Mounted on a ROHM specification board.50mm x 58mm) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Condition (Ta= -35C to +85C) Parameter Symbol MIN TYP MAC UNIT Power Supply(VBAT) VBAT 2.7 3.6 5.5 V Power Supply(DVDD) VDVDD 1.70 1.80 3.50 V www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Electrical Characteristic (Unless otherwise specified, VBAT=3.6V, VDVDD=1.8V, Ta=25C) Parameter Symbol MIN VBAT Circuit Current(VBAT=3.6V) ICCBAT - VBAT Circuit Current(VBAT=3.1V) ICCBAT TYP MAX UNIT Condition Circuit Current DVDD Circuit Current 10 18 A LDO1,2: No Load 9.5 15 A LDO1,2: No Load ICCDVDD - 0 1 A VUVLO 2.64 2.70 2.76 V Voltage Detector Detect Voltage Detect Voltage Hysteresis VREF Output Voltage VUVLOHYS 50 100 150 mV VOREF 2.45 2.50 2.55 V Down Sweep LDO1 Output Voltage VOUT1 2.94 3.00 3.06 V IOUT1MAX 100 - - mA Line Regulation VIS1 - 2 - mV VBAT=3.34.5V, IOUT1= 50mA Load Regulation VLS1 - 20 - mV PSRR PSRR1 - 45 - dB RDIS1 - 100 - IOUT1= 1100mA VBAT=4.2V+0.2Vpp, IOUT1= 50mA fr=120Hz,BW=2020kHz VBAT=2.5V Output Voltage VOUT2 2.94 3.00 3.06 V IOUT1= 50mA Variable Output Voltage VO2RNG 2.80 - 3.30 V Output Max Current IOUT2MAX 150 - - mA Line Regulation VIS2 - 2 - mV Load Regulation VLS2 - 20 - mV PSRR PSRR2 - 45 - dB RDIS2 - 100 - VBAT=VOUT2+0.3V4.5V, IOUT2= 50mA IOUT2= 1150mA VBAT=4.2V+0.2Vpp, IOUT2= 50mA fr=120Hz,BW=2020kHz VBAT=2.5V V ISINKGPO= 3mA V ISOURCEGPO= 3mA Output Max Current Discharge Resistance IOUT1= 50mA LDO2 Discharge resistance GPO - 0.3+ VOUT1 0.4 - - VBAT V -0.3 - 0.4 V ISOURCEGPO= 3mA -1 0 1 A Terminal voltage=VOUT1, 0V VIH 0.75x VDVDD - Input L Level (SCL, SDA) VIL -0.3 - Input Leak Current ILK -1 VOL -0.3 Output H Level VOHGPO Output L Level VOLGPO NMOS output pulled up max voltage VMXGPON NMOS output L level VOLGPON NMOS output leak current ILKGPON Input H Level (SCL, SDA) 0.8x VOUT1 -0.3 - I2Cserial interface (SCL, SDA) Output L Level (SDA) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/22 0 0.3+ VDVDD 0.25x VDVDD 1 A Terminal voltage=VDVDD, 0V - 0.4 V ISOURCE= 6mA V V TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Electrical Characteristic (Unless otherwise specified, VBAT=3.6V, VDVDD=1.8V, Ta=-3585C( Note2)) Parameter Symbol MIN TYP MAX UNIT Condition ICCBAT - 10 18 A LDO1,2: No Load LDO1,2: No Load Circuit Current VBAT Circuit Current(VBAT=3.6V) VBAT Circuit Current(VBAT=3.1V) DVDD Circuit Current ICCBAT - 9.5 15 A ICCDVDD - 0 1 A Voltage Detector Detect Voltage Detect Voltage Hysteresis VREF Output Voltage VUVLO 2.6 2.7 2.8 V VUVLOHYS 50 100 150 mV VOREF 2.4 2.5 2.6 V VOUT1 2.88 3 3.12 V Down Sweep LDO1 Output Voltage Output Max Current IOUT1= 50mA IOUT1MAX 100 - - mA Line Regulation VIS1 - 2 - mV VBAT=3.34.5V, IOUT1= 50mA Load Regulation VLS1 - 20 - mV PSRR PSRR1 - 45 - dB RDIS1 - 100 - IOUT1= 1100mA VBAT=4.2V+0.2Vpp, IOUT1= 50mA fr=120Hz,BW=2020kHz VBAT=2.5V VOUT2 2.88 3 3.12 V IOUT1= 50mA Discharge Resistance LDO2 Output Voltage Variable Output Voltage VO2RNG 2.8 - 3.3 V Output Max Current IOUT2MAX 150 - - mA Line Regulation VIS2 - 2 - mV Load Regulation VLS2 - 20 - mV PSRR PSRR2 - 45 - dB RDIS2 - 100 - VBAT=VOUT2+0.3V4.5V, IOUT2= 50mA IOUT2= 1150mA VBAT=4.2V+0.2Vpp, IOUT2= 50mA fr=120Hz,BW=2020kHz VBAT=2.5V V ISINKGPO= 3mA V ISOURCEGPO= 3mA Discharge resistance GPO Output H Level VOHGPO Output L Level VOLGPO 0.8x VOUT1 -0.3 - 0.3+ VOUT1 0.4 NMOS output pulled up max voltage VMXGPON - - VBAT NMOS output L level VOLGPON NMOS output leak current ILKGPON -0.3 - 0.4 V ISOURCEGPO= 3mA -1 0 1 A Terminal voltage=VOUT1, 0V Input H Level (SCL, SDA) VIH 0.75x VDVDD - Input L Level (SCL, SDA) VIL -0.3 - ILK -1 VOL -0.3 - V I2Cserial interface Input Leak Current (SCL, SDA) Output L Level (SDA) 0 0.3+ VDVDD 0.25x VDVDD 1 A Terminal voltage=VDVDD, 0V - 0.4 V ISOURCE= 6mA V V (Note2)These are guaranteed by design engineering from -35 to 85. www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) 50 50 45 45 40 Circuit Current : ICCVBAT[A] Circuit Current : ICCVBAT[uA] 40 35 30 25 20 15 35 30 25 20 15 10 10 5 5 0 0 -50 0 50 0 100 2 Temp : Ta[] Figure 4. Circuit Current VS temperature (VBAT=3.6V,Ta=-35~85) 6 Figure 5. Input Current VS Input Voltage (VBAT=0V~5.5V,Ta=25) 4 4 3 3 Output Voltage : VOUT2 [V] Output Voltage : VOUT1 4 Input Voltage : V BAT[V] 2 Io=1mA 1 2 Io=1mA 1 Io=30mA Io=30mA Io=50mA Io=50mA Io=100mA Io=100mA 0 0 0 2 4 6 0 Input Voltage : V BAT[V] 4 6 Input Voltage : VBAT[V] Figure 6. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2 Figure 7. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25,Vout=2.8V) 7/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance 4 3 3 Output Voltage : V OUT2 [V] Output Voltage : VOUT2 [V] VOUT2=2.9V 4 2 Io=1mA 1 VOUT2=2.95V 2 Io=1mA 1 Io=30mA Io=30mA Io=50mA Io=50mA Io=100mA 0 Io=100mA 0 0 0 2 4 2 6 4 6 Input Voltage : V BAT[V] Input Voltage : V BAT[V] Figure 8. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25,Vout=2.9V) VOUT2=3.0V 4 VOUT2=3.05V 4 3 3 Output Voltage : V OUT2 [V] Output VOltage : VOUT2 [V] Figure 9. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25,Vout=2.95V) 2 Io=1mA 1 2 Io=1mA 1 Io=30mA Io=30mA Io=50mA Io=50mA Io=100mA 0 0 2 4 0 Input Voltage : VBAT[V] 2 4 6 Input Voltage : VBAT[V] Figure 10. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25,Vout=3.0V) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Io=100mA 0 6 Figure 11. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25,Vout=3.05V) 8/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance VOUT2=3.2V 4 3 3 Output Voltage : VOUT2 [V] Output Voltaqge : VOUT2 [V] VOUT2=3.1V 4 2 Io=1mA 1 Io=30mA 2 Io=1mA 1 Io=50mA Io=30mA Io=100mA Io=50mA 0 0 2 4 Io=100mA 0 6 0 Input Voltage : VBAT[V] 2 4 6 Input Voltage : VBAT[V] Figure 12. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25,Vout=3.1V) Figure 13. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25,Vout=3.2V) VOUT2=3.3V 4 Output Voltage : V OUT2 [V] 3 2 Io=1mA 1 Io=30mA Io=50mA Io=100mA 0 0 2 4 6 Input Volatage : VBAT[V] Figure 14. Output Voltage VS Input Voltage (VBAT=0V~5.5V,Ta=25,Vout=3.3V) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance 3.4 3.2 3.3 VOUT2=3.3V Output Voltage : VOUT2 [V] Output Voltage : V OUT1 [V] 3.1 3 2.9 VOUT2=3.2V 3.2 VOUT2=3.1V 3.1 VOUT2=3.05V 3 VOUT2=3.0V VOUT2=2.95V 2.9 VOUT2=2.9V 2.8 VOUT2=2.8V 2.8 -50 0 50 100 2.7 Temp : Ta[] -50 0 300 300 250 250 200 150 VBAT=3.1V VBAT=3.3V 100 VBAT=3.6V 100 200 150 VBAT=3.1V VBAT=3.3V 100 VBAT=3.6V VBAT=3.9V 50 VBAT=3.9V 50 50 Figure 16. Output Voltage VS Temperature (VBAT=3.6V,Ta=25,Io=1mA) Output Current : IOUT2MAX[mA] Output Current : IOUT1MAX [mA] Figure 15. Output Voltage VS Temperature (VBAT=3.6V,Ta=25,Io=1mA) Temp : Ta[] VBAT=5.5V VBAT=5.5V 0 0 0 1 2 3 0 4 Figure 17. Output Current VS VOUT1 Voltage (VBAT=3.6V,Ta=25) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1 2 3 4 VOUT2 Voltage : V OUT2[V] VOUT1 Voltage : VOUT1 [V] Figure 18. Output Current VS VOUT2 Voltage (VBAT=3.6V,Ta=25,VOUT2=3.0V) 10/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance 60 Ripple Rejection : PSRR2[dB] Ripple Rejection : PSRR1[dB] 60 40 20 Io=1mA 40 20 Io=1mA Io=50mA Io=50mA Io=100mA Io=100mA 0 0 10 100 1000 10000 100000 10 Frequency : fR[Hz] 1000 10000 100000 Frequency : fR[Hz] Figure 19. Ripple Rejection VS Frequency (VBAT=4.2V+0.2Vpp,Cout=4.7F,fR=120Hz,Ta=25) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100 Figure 20. Ripple Rejection VS Frequency (VBAT=4.2V+0.2Vpp,Cout=4.7F,fR=120Hz,Ta=25) 11/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance VBAT:0.5V/Div VBAT:0.5V/Div VOUT1:20mV/Div VOUT1:20mV/Div 30.83mV 104.17mV Figure 21. VBAT Response(Rise) (VBAT=4V5V,Cout=4.7F,Ta=25,Tf=0.5s) Figure 22. VBAT Response(Fall) (VBAT=5V4V,Cout=4.7F,Ta=25,Tf=0.5s) VBAT:0.5V/Div VBAT:0.5V/Div VOUT2:20mV/Div VOUT2:20mV/Div 112.50mV 30.00mV Figure 23. VBAT Response(Rise) (VBAT=4V5V,Cout=4.7F,Ta=25,Tf=0.5s) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 24. VBAT Response(Fall) (VBAT=5V4V,Cout=4.7F,Ta=25,Tf=0.5s) 12/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance IVOUT1 5mA/Div IVOUT1 5mA/Div VOUT1 100mV/Div VOUT1 100mV/Div 36.00mV 32.00mV Figure 25. Load Response(Rise) (VBAT=3.6V,Cout=4.7F,Ta=25,Iout=1mA10mA,Tr=0.5s) Figure 26. Load Response(Fall) (VBAT=3.6V,Cout=4.7F,Ta=25,Iout=10mA1mA,Tf=0.5s) IVOUT2 5mA/Div IVOUT2 5mA/Div VOUT2 100mV/Div VOUT2 100mV/Div 32.00mV 30.00mV Figure 27. Load Response(Rise) (VBAT=3.6V,Cout=4.7F,Ta=25,Iout=1mA10mA,Tr=0.5s) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 28. Load Response(Fall) (VBAT=3.6V,Cout=4.7F,Ta=25,Iout=10mA1mA,Tf=0.5s) 13/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance IVOUT1 5mA/Div IVOUT1 5mA/Div VOUT1 100mV/Div VOUT1 100mV/Div 82mV 78mV Figure 29. Load Response(Rise) (VBAT=3.6V,Cout=4.7Ta=25,F,Iout=50mA100mA,Tr=0.5s) Figure 30. Load Response(Fall) (VBAT=3.6V,Cout=4.7F,Ta=25,Iout=100mA50mA,Tf=0.5s) IVOUT2 50mA/Div IVOUT2 50mA/Div VOUT2 100mV/Div VOUT2 100mV/Div 80mV 82mV Figure 31. Load Response(Rise) (VBAT=3.6V,Cout=4.7F,Ta=25,Iout=50mA100mA,Tr=0.5s) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 32. Load Response(Fall) (VBAT=3.6V,Cout=4.7F,Ta=25,Iout=100mA50mA,Tf=0.5s) 14/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance VBAT 2.0V/Div VBAT 2.0V/Div VOUT1 2.0V/Div VOUT2 2.0V/Div 152mA 164mA IVBAT 100A/Div IVBAT 100A/Div Figure 33. Rush Current (VBAT=3.6V, LDO_EN=LH ,Cout=4.7F,Ta=25) Figure 34. Rush Current (VBAT=3.6V,LDO_EN=LH Cout=4.7F,Ta=25) 3.5 Output Voltage : V OUT1 [V] 3 2.5 2 1.5 1 0.5 0 2.5 2.7 2.9 3.1 Input Voltage : VBAT[V] Figure 35. Output Voltage VS Input Voltage (VBAT=3.6V,Ta=25) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Characteristic Data(Reference Data) -continuance 300 Output Voltage : V OLGPO[mV] Output Voltage : V OHGPO[V] 3 2.8 2.6 200 100 0 0 2 4 0 Source Current : ISOURCEGPO[mA] 2 4 Sink Current : ISINKGPO[mA] Figure 36. Output Voltage VS Source Current(CMOS Output) (VBAT=3.6V,Ta=25) Figure 37. Output Voltage VS Sink Current(CMOS Output) (VBAT=3.6V,Ta=25) Output Voltafe : VOLGPON[mV] 300 200 100 0 0 2 4 Sink Current : ISINKGPO[mA] Figure 38. Output Voltage VS Sink Current(NMOS Output) (VBAT=3.6V,Ta=25) www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL I2C Interface Timing Specification BD7602GUL has 2 line serial interface which supports I2C Bus protocol. A7 A6 0 0 Table 1. I2C slave address A5 A4 A3 A2 1 1 1 1 A1 R/W 0 1/0 Figure 39. I2C interface Timing (Unless otherwise specified, VBAT=3.6V, VDVDD=1.8V, Ta=25C) Parameter Symbol MIN TYP MAX UNIT - - 400 kHz SCL Clock Frequency fSCL START Hold time tHD:STA 0.6 - - s SCL of "L" time tLOW 1.3 - - s SCL of "H" time tHIGH 0.6 - - s Data input hold time tHD:DAT 0.0 - - ns Data input setup time tSU:DAT 100 - - ns STOP condition setup time tSU:STO 0.6 - - s www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/22 Condition TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Register Map Table 2.Register Map Address 00h 01h 02h 03h 04h Register name R/W INIT D7 D6 D5 D4 ICREV LDOCNT LDO2ADJ GPOCNT GPOMODE R R/W R/W R/W R/W 09h 03h 03h 00h 00h - - - - - DEVICE [2:0] - R/W INIT D7 D6 D5 D4 D3 D2 R 09h - - D3 D2 - D1 D0 CHIPREV [2:0] LDO2_EN LDO1_EN LDO2_VOUT [2:0] REG_GPO GPO_EN Reserved GPO_SEL Register Detail Address 00h Register name ICREV Bit[5:3]: DEVICE [2:0] Bit[2:0]: CHIPREV [2:0] Address 01h Register name LDOCNT Bit[1]: LDO2_EN Bit[0]: LDO1_EN Address 02h Register name LDO2ADJ DEVICE [2:0] D1 D0 CHIPREV [2:0] DEVICE Name Notification 001: BD7602GUL (Initial Value) CHIP Revision Notification 001: DS1 (Initial Value) R/W INIT D7 D6 D5 D4 D3 D2 D1 D0 R/W 03h - - - - - - LDO2_EN LDO1_EN D2 D1 D0 LDO2 Output ON/OFF Control 0: OFF 1: ON (Initial Value) LDO1 Output ON/OFF Control 0: OFF 1: ON (Initial Value) R/W INIT D7 D6 D5 D4 D3 R/W 03h - - - - - LDO2_VOUT [2:0] Bit[2:0]: LDO2_VOUT [2:0] LDO2 Output Voltage set " 000: 2.80V 001: 2.90V 010: 2.95V 011: 3.00V (Initial Value) 100: 3.05V 101: 3.10V 110: 3.20V 111: 3.30V Address 03h Register name GPOCNT Bit[1]: GPO_EN Bit[0]: REG_GPO Address 04h R/W INIT D7 D6 D5 D4 D3 D2 D1 D0 R/W 00h - - - - - - GPO_EN REG_GPO GPO Enable/Disable Control 0: Disable (Hi-Z) (Initial Value) 1: Enable (Output Type and Output Voltage follow data of address 04h) GPO Output Control 0: Low Output (Initial Value) 1: High Output (CMOS Output), Hi-Z (NMOS Output) Register name R/W INIT D7 D6 D5 D4 D3 D2 D1 D0 GPOMODE R/W 00h - - - - - - Reserved GPO_SEL Bit[1]: Reserved Reserved Register no any function In case of writing address 04h, note to set this bit to "0". Bit[0]: GPO_SEL GPO Output Type 0: CMOS Output (Initial Value) 1: NMOS Output www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Timing Chart 2.8V 2.7V VBAT(External input) VBATUVLO(Internal signal) 2.3V (Reference) VREF DVDD(External input) I2C Access W/R Disable W/R Enable W/R Disable 500sec LDO1 Output GPO Input W/R Disable GPO Output Initial: Hi-Z W/R Operation Write Data W/R Disable Initial: Hi-Z Figure 40. Timing Chart www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ICs power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Thermal Consideration Should by any chance the power dissipation (Pd) rating be exceeded, the rise in temperature of the chip may result in deterioration of its properties. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 1.64mm x 1.64mm x 0.57mm glass epoxy board. In case the absolute maximum rating has been exceeded, increase the board size and copper area to prevent exceeding the Pd rating. 5. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 6. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The ICs power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Operational Notes - continued 10. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P P+ N B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 41.Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Save Operating Range When using this IC, set output transistor not to exceed absolute maximum range or ASO. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the ICs power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn off all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage 15. Over Current Protection circuit Because output has an Over Current Protection (OCP) circuit that operates in accordance with the rated output capacity, IC is protected from breakage or possible damage when the load becomes shorted. This protection circuit is also effective in preventing damage to the IC in case of sudden and unexpected current surges only and not for its continuous protection. www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/22 TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 BD7602GUL Ordering Name B D information 7 6 0 2 Name of Product G U L - Package GUL: VCSP50L1C E2 Packingforming specification E2: reel type emboss taping Package Dimensions Unit: mm < Tape and Reel Information > Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1234 1234 Reel www.rohm.co.jp (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1234 1234 1pin 22/22 1234 1234 Direction of feed TSZ02011-0Q4Q0AB00010-1-2 25.Feb.2014 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd7602gul - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd7602gul VCSP50L1C 3000 3000 Taping inquiry Yes