6 GHz to 14 GHz, GaAs, MMIC,
Double-Balanced Mixer
Data Sheet HMC553ALC3B
Rev. B Document Feedback
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rights of third parties that may result from its use. Specifications subject to change without notice. No
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Tel: 781.329.4700 ©2018–2019 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Passive: no dc bias required
Conversion loss: 7 dB typical at 6 GHz to 11 GHz
Input IP3: 18 dBm typical at 6 GHz to 11 GHz
LO to RF isolation: 36 dB typical
Wide IF bandwidth: dc to 5 GHz
RoHS compliant, 12-terminal, 2.90 mm × 2.90 mm LCC package
APPLICATIONS
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Point to point radios
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
FUNCTIONAL BLOCK DIAGRAM
1
GND
7GND
8RF
9GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
HMC553ALC3B
16420-001
Figure 1.
GENERAL DESCRIPTION
The HMC553ALC3B is a general-purpose, double-balanced,
gallium arsenide (GaAs), monolithic microwave integrated
circuit (MMIC) mixer housed in a leadless Pb-free, RoHS
compliant LCC package. The HMC553ALC3B can be used as an
upconverter or downconverter between 6 GHz and 14 GHz.
This mixer requires no external components or matching
circuitry.
The HMC553ALC3B provides local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF) suppression
due to optimized balun structures. The mixer operates with LO
drive levels from 9 dBm to 15 dBm. The HMC553ALC3B
eliminates the need for wire bonding, allowing use of surface-
mount manufacturing techniques.
HMC553ALC3B Data Sheet
Rev. B | Page 2 of 25
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance ...................................................... 6
Upconverter Performance ......................................................... 14
Isolation and Return Loss ......................................................... 18
IF Bandwidth—Downconverter, Upper Sideband ................. 20
IF Bandwidth—Downconverter, Lower Sideband ................. 21
Spurious and Harmonics Performance ................................... 22
Theory of Operation ...................................................................... 23
Applications Information .............................................................. 24
Typical Application Circuit ....................................................... 24
Evaluation PCB Information .................................................... 24
Outline Dimensions ....................................................................... 25
Ordering Guide .......................................................................... 25
REVISION HISTORY
3/2019—Rev.A to Rev. B
Change to Table 5 ........................................................................... 22
Changes to Downconversion, Upper Sideband Section,
Downconversion, Lower Sideband Section, Upconversion, Upper
Sideband Section, and Upconversion, Lower Sideband Section ... 22
6/2018—Rev.0 to Rev. A
Added 6 GHz to 11 GHz Downconverter Performance, Noise
Figure Parameter and 11 GHz to 14 GHz Downconverter
Performance, Noise Figure Parameter, Table 1 ............................. 3
2/2018—Revision 0: Initial Version
Data Sheet HMC553ALC3B
Rev. B | Page 3 of 25
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, RF = −10 dBm, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless
otherwise noted, on the evaluation printed circuit board (PCB).
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE
RF 6 14 GHz
LO Input 6 14 GHz
IF DC 5 GHz
LO DRIVE LEVELS 9 13 15 dBm
6 GHz to 11 GHz PERFORMANCE
Downconverter
Conversion Loss 7 9 dB
Noise Figure 8.5 dB
Input Third-Order Intercept IP3 15 18 dBm
Input 1 dB Compression Point P1dB 9.5 dBm
Input Second-Order Intercept IP2 40 dBm
Upconverter IFIN
Conversion Loss 7 dB
Input Third-Order Intercept IP3 19 dBm
Input 1 dB Compression Point P1dB 8 dBm
Isolation
RF to IF 18 32 dB
LO to RF 30 36 dB
LO to IF 28 32 dB
11 GHz to 14 GHz PERFORMANCE
Downconverter
Conversion Loss 9 10 dB
Noise Figure 10 dB
Input Third-Order Intercept IP3 18 22 dBm
Input 1 dB Compression Point P1dB 11.5 dBm
Input Second-Order Intercept IP2 45 dBm
Upconverter IFIN
Conversion Loss 8 dB
Input Third-Order Intercept IP3 19 dBm
Input 1 dB Compression Point P1dB 8 dBm
Isolation
RF to IF 25 29 dB
LO to RF 30 37 dB
LO to IF 28 33 dB
HMC553ALC3B Data Sheet
Rev. B | Page 4 of 25
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power 25 dBm
IF Input Power 25 dBm
IF Source/Sink Current 3 mA
Reflow Temperature 260°C
Maximum Junction Temperature 175°C
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 4.6 mW/°C Above 85°C)
414 mW
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 1000 V
Field Induced Charged Device Model
(FICDM)
1250 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θJA θ
JC Unit
E-12-41 120 175 °C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
Data Sheet HMC553ALC3B
Rev. B | Page 5 of 25
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
GND
7
GND
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
NOTES
1. NOT I NTERNALLY CONNECTED. THESE PINS
CAN BE CON NE CT E D TO RF/ DC G ROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
HMC553ALC3B
TOP VI EW
(Not to Scale)
16420-002
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 6, 7, 9 GND Ground. These pins and package bottom must be connected to RF/dc ground.
2 LO Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
5 IF
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block
this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible
die failure may result.
8 RF Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
10, 11, 12 NIC Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
16420-003
Figure 3. GND Interface Schematic
LO
16420-004
Figure 4. LO Interface Schematic
IF
16420-005
Figure 5. IF Interface Schematic
RF
16420-006
Figure 6. RF Interface Schematic
HMC553ALC3B Data Sheet
Rev. B | Page 6 of 25
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
IF = 100 MHz, Upper Sideband (Low-Side LO)
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF F RE QUENCY (GHz)
T
A
= –40° C
T
A
= +25°C
T
A
= +85°C
16420-007
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF F RE QUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-008
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF F RE QUENCY (GHz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-010
Figure 9. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQ UENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-011
Figure 10. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC553ALC3B
Rev. B | Page 7 of 25
Downconverter P1dB and IP2, IF = 100 MHz, Upper Sideband (Low-Side LO)
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQ UE NCY ( GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-013
Figure 11. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
10
20
40
60
30
50
56789101112131415
INPUT IP2 (dBm)
RF FREQ UENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-014
Figure 12. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQ UE NCY ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-015
Figure 13. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
10
20
40
60
30
50
5 6 7 8 9 101112131415
INPUT IP2 (dBm)
RF FREQ UENCY (GHz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-016
Figure 14. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC553ALC3B Data Sheet
Rev. B | Page 8 of 25
IF = 100 MHz, Lower Sideband (High-Side LO)
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF F REQ UE NCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-017
Figure 15. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQUENC Y ( GHz)
TA= –40°C
TA = +25°C
TA= +85°C
16420-018
Figure 16. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
56789101112131415
NOISE FI G URE ( dB)
RF F RE QUENCY ( GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-019
Figure 17. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF F REQ UE NCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-020
Figure 18. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF F R EQUENCY ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-021
Figure 19. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
15
20
5 6 7 8 9 101112131415
NOISE F IG URE ( dB)
RF FREQUENC Y ( GHz )
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-022
Figure 20. Noise Figure vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC553ALC3B
Rev. B | Page 9 of 25
Downconverter P1dB and IP2, IF = 100 MHz, Lower Sideband (High-Side LO)
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-023
Figure 21. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
10
20
40
80
70
60
30
50
56789101112131415
INPUT IP2 (dBm)
RF F RE QUENCY ( GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-024
Figure 22. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-025
Figure 23. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
10
20
40
80
70
60
30
50
5 6 7 8 9 101112131415
INPUT IP2 (dBm)
RF FREQUENC Y ( GHz )
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-026
Figure 24. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC553ALC3B Data Sheet
Rev. B | Page 10 of 25
IF = 4000 MHz, Upper Sideband (Low-Side LO)
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF F REQ UE NCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-027
Figure 25. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQUENC Y ( GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-028
Figure 26. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
56789101112131415
CONVERSION GAIN (dB)
RF FREQ U ENCY (G Hz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-029
Figure 27. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF F RE QUENCY ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-030
Figure 28. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC553ALC3B
Rev. B | Page 11 of 25
Downconverter P1dB and IP2, IF = 40000 MHz, Upper Sideband (Low-Side LO)
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-031
Figure 29. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
10
20
40
80
70
60
30
50
5 6 7 8 9101112131415
INPUT IP2 (dBm)
RF F R EQUENCY ( GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-032
Figure 30. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-033
Figure 31. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
10
20
40
80
70
60
30
50
5 6 7 8 9101112131415
INPUT IP2 (dBm)
RF F R EQUENCY ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-034
Figure 32. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC553ALC3B Data Sheet
Rev. B | Page 12 of 25
IF = 4000 MHz, Lower Sideband (High-Side LO)
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF F REQ UE NCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-035
Figure 33. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
56789101112131415
INPUT IP3 (dBm)
RF FREQ UENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-036
Figure 34. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF FREQUENCY (G Hz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-037
Figure 35. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQUENC Y ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-038
Figure 36. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC553ALC3B
Rev. B | Page 13 of 25
Downconverter P1dB and IP2, IF = 4000 MHz, Lower Sideband (High-Side LO)
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-039
Figure 37. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
10
20
40
80
70
60
30
50
5 6 7 8 9101112131415
INPUT IP2 (dBm)
RF F R EQUENCY ( GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-040
Figure 38. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-041
Figure 39. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
10
20
40
80
70
60
30
50
5 6 7 8 9101112131415
INPUT IP2 (dBm)
RF F R EQUENCY ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-042
Figure 40. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC553ALC3B Data Sheet
Rev. B | Page 14 of 25
UPCONVERTER PERFORMANCE
IFIN = 100 MHz, Upper sideband (Low-Side LO)
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF FRE QUE NC Y (GH z )
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-043
Figure 41. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQUENC Y (G Hz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-044
Figure 42. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-045
Figure 43. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF FREQ UE NCY (GHz )
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-046
Figure 44. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
5 6 7 8 9 101112 131415
INPUT IP3 (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-047
Figure 45. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENC Y ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-048
Figure 46. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC553ALC3B
Rev. B | Page 15 of 25
IFIN = 100 MHz, Lower Sideband (High-Side LO)
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONV E RS IO N GAI N ( dB)
RF FREQ UE NCY (GHz )
T
A
= –40° C
T
A
= +25°C
T
A
= +85°C
16420-049
Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
56789101112131415
INPUT IP3 (dBm)
RF F R EQUENCY ( GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-050
Figure 48. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
5 6 7 8 9 101112131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-051
Figure 49. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONV E RSION G AIN (dB)
RF F REQ UE NCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-052
Figure 50. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-053
Figure 51. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
15
5 6 7 8 9 101112 131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-054
Figure 52. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC553ALC3B Data Sheet
Rev. B | Page 16 of 25
IFIN = 4000 MHz, Upper Sideband (Low-Side LO)
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (d B)
RF FREQ UE NCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-055
Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQUENC Y ( GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-056
Figure 54. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
5 6 7 8 9 101112 131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-057
Figure 55. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (d B)
RF FREQUE NCY ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-058
Figure 56. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-059
Figure 57. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
15
20
5 6 7 8 9 101112 131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-060
Figure 58. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC553ALC3B
Rev. B | Page 17 of 25
IFIN = 4000 MHz, Lower Sideband (High-Side LO)
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONVERSION GAIN (dB)
RF F REQ UE NCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-061
Figure 59. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQ UENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-062
Figure 60. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
15
20
5 6 7 8 9 101112 131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-063
Figure 61. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
CONV E RSION G AIN (dB)
RF F RE Q UENCY ( GHz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-064
Figure 62. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
5 6 7 8 9 101112131415
INPUT IP3 (dBm)
RF FREQUENC Y ( GHz )
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-065
Figure 63. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
15
5 6 7 8 9 101112 131415
INPUT P1dB (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-066
Figure 64. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC553ALC3B Data Sheet
Rev. B | Page 18 of 25
ISOLATION AND RETURN LOSS
Downconverter performance at IF = 100 MHz, upper sideband (low-side LO).
0
10
20
40
60
30
50
5 6 7 8 9 101112131415
LO TO RF ISOLATION (dB)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-067
Figure 65. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
10
20
40
60
30
50
5 6 7 8 9 101112131415
LO TO IF ISOLATION (dB)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-068
Figure 66. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
10
20
40
60
30
50
56789101112131415
RF TO IF ISOLATION (dB)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-069
Figure 67. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
10
20
40
60
30
50
5 6 7 8 9 101112131415
LO TO RF ISOL ATION ( dB)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-070
Figure 68. LO to RF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
10
20
40
60
30
50
5 6 7 8 9 101112131415
LO TO IF ISOLATION (dB)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-071
Figure 69. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
0
10
20
40
60
30
50
5 6 7 8 9 101112131415
RF TO IF ISOLATION (dB)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-072
Figure 70. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC553ALC3B
Rev. B | Page 19 of 25
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
LO RE TURN L OS S ( dB)
LO FRE QUENCY ( GHz)
16420-073
Figure 71. LO Return Loss vs. LO Frequency at LO = 13 dBm,
TA = 25°C
–45
–40
–35
–30
–25
–20
–15
–10
–5
0
5 6 7 8 9 101112131415
RF RE TURN LO S S ( dB)
RF F RE Q UENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-074
Figure 72. RF Return Loss vs. RF Frequency at LO Power Levels,
TA = 25°C, LO = 10 GHz
–25
–20
–15
–10
–5
0
0.01 1.01 2.01 3.01 4.01 5.01 6.01 7.01 8.01
IF RETURN LOSS ( d B)
IF F RE QUENCY ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-075
Figure 73. IF Return Loss vs. IF Frequency at LO Power Levels,
TA = 25°C, LO = 10 GHz
HMC553ALC3B Data Sheet
Rev. B | Page 20 of 25
IF BANDWIDTH—DOWNCONVERTER, UPPER SIDEBAND
LO frequency = 8 GHz.
–20
–15
–10
–5
0
0.11.12.13.14.15.16.17.1
CONVE RSIO N GAIN ( dB)
IF FREQUENC Y (G H z)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-076
Figure 74. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
INPUT IP3 (dBm)
IF FRE QUENCY ( GHz)
0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-077
Figure 75. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1
CONVERSION GAIN (dB)
IF F RE Q UENCY (GHz)
LO = 9dBm
LO = 11d Bm
LO = 13d Bm
LO = 15d Bm
16420-078
Figure 76. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
INPUT IP3 (dBm)
IF F REQUENCY ( GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1
16420-079
Figure 77. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC553ALC3B
Rev. B | Page 21 of 25
IF BANDWIDTH—DOWNCONVERTER, LOWER SIDEBAND
LO frequency = 13 GHz.
–20
–15
–10
–5
0
0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1
CONV E RS IO N GAI N ( dB)
IF F RE Q UENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-080
Figure 78. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
INPUT IP3 (dBm)
IF FREQUENCY (GHz)
0.11.12.13.14.15.16.17.1
T
A
= –40° C
T
A
= +25°C
T
A
= +85°C
16420-081
Figure 79. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1
CONVERSION GAIN (dB)
IF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-082
Figure 80. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
0
5
10
20
30
15
25
INPUT IP3 (dBm)
IF FREQUENCY (GHz)
0.11.12.13.14.15.16.17.1
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-083
Figure 81. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
HMC553ALC3B Data Sheet
Rev. B | Page 22 of 25
SPURIOUS AND HARMONICS PERFORMANCE
LO Harmonics
LO = 13 dBm, all values in dBc below input LO level and
measured at RF port. N/A means not applicable.
Table 5. LO Harmonics at RF
N × LO Spur at RF Port (dBc)
LO Frequency (GHz) 1 2 3 4
6 37 21 51 53
8 38 41 43 64
9 38 46 49 70
10 37 45 58 82
12 37 50 45 105
14 39 50 71 N/A
LO = 13 dBm, all values in dBc below input LO level and
measured at IF port. N/A means not applicable.
Table 6. LO Harmonics at IF
N × LO Spur at IF Port (dBc)
LO Frequency (GHz) 1 2 3 4
6 43 38 60 74
8 28 50 88 104
9 29 66 102 109
10 29 76 103 108
12 31 84 88 10
14 43 93 107 N/A
M × N Spurious Outputs
Downconversion, Upper Sideband
Spur values are (M × RF) − (N × LO). RF = 10.1 GHz, LO =
10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer
spurious products are measured in dBc from the IF output power
level. N/A means not applicable.
N × LO
0 1 2 3 4
M × RF
0 N/A 0.6 26 25 N/A
1 22 0 44 70 68
2 71 67 58 70 78
3 84 92 93 71 91
4 N/A 82 93 98 101
Downconversion, Lower Sideband
Spur values are (M × RF) − (N × LO). RF = 14 GHz, LO =
14.1 GHz, RF power = −10 dBm, and LO power = 13 dBm.
Mixer spurious products are measured in dBc from the IF
output power level. N/A means not applicable.
N × LO
0 1 2 3 4
M × RF
0 N/A 3 26 N/A N/A
1 18 0 40 65 N/A
2 55 72 70 77 56
3 N/A 57 93 74 89
4 N/A N/A 58 95 101
Upconversion, Upper Sideband
Spur values are (M × IFIN) + (N × LO). IFIN = 0.1 GHz, LO =
10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer
spurious products are measured in dBc from the RF output power
level. N/A means not applicable.
N × LO
0 1 2 3 4
M × IFIN
−5 N/A 99 96 64 61
−4 N/A 86 94 62 61
−3 N/A 81 83 75 61
−2 N/A 51 59 72 59
−1 N/A 0 35 22 43
0 N/A 6 10 27 19
+1 36 0 36 20 N/A
+2 81 50 58 68 N/A
+3 95 63 84 76 N/A
+4 101 85 92 84 N/A
+5 102 100 94 84 N/A
Upconversion, Lower Sideband
Spur values are (M × IFIN) + (N × LO).
IFIN = 0.1 GHz, LO = 14.1 GHz, RF power = −10 dBm, and
LO power = 13 dBm. Mixer spurious products are measured in
dBc from the RF output power level. N/A means not applicable.
N × LO
0 1 2 3 4
M × IFIN
−5 N/A 96 82 N/A N/A
−4 N/A 85 84 N/A N/A
−3 N/A 71 77 N/A N/A
−2 N/A 52 60 N/A N/A
−1 N/A 0 28 N/A N/A
0 N/A 8 20 N/A N/A
+1 34 0 28 N/A N/A
+2 79 50 61 N/A N/A
+3 96 63 61 N/A N/A
+4 100 86 84 N/A N/A
+5 100 95 62 N/A N/A
Data Sheet HMC553ALC3B
Rev. B | Page 23 of 25
THEORY OF OPERATION
The HMC553ALC3B is a general-purpose, double-balanced
mixer that can be used as an upconverter or a downconverter
from 6 GHz to 14 GHz.
When used a downconverter, the HMC553ALC3B downconverts
radio frequencies (RF) between 6 GHz and 14 GHz to intermediate
frequencies (IF) between dc and 5 GHz.
When used as an upconverter, the mixer upconverts intermediate
frequencies between dc and 5 GHz to radio frequencies between
6 GHz and 14 GHz.
HMC553ALC3B Data Sheet
Rev. B | Page 24 of 25
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 82 shows the typical application circuit for the
HMC553ALC3B. The HMC553ALC3B is a passive device and
does not require any external components. The LO and RF pins
are internally ac-coupled. The IF pin is internally dc-coupled.
When IF operation to dc is not required, use of an external
series capacitor is recommended, of a value chosen to pass the
necessary IF frequency range. When IF operation to dc is
required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
GND
GND
RF
GND
NI
C
NI
C
NI
C
GND
LO
LO RF
IF
GND
IF
GND
HMC553ALC3B
16420-084
1
7
8
9
101112
4
2
3
56
Figure 82. Typical Application Circuit
EVALUATION PCB INFORMATION
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance,
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 83). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 83 is
available from Analog Devices, Inc., upon request.
Table 7. List of Materials for Evaluation PCB
EV1HMC553ALC3B
Item Description
J1, J2 SRI 2.92 mm connector
J3 Johnson Surface-Mount Type A (SMA) connector
U1 HMC553ALC3B
PCB1 117611-7 evaluation board
1 117611-7 is the raw bare PCB identifier. Reference EV1HMC553ALC3B when
ordering the complete evaluation PCB.
J1
J3
IF
LO RF
117611–7
U1
J2
16420-085
553A
Figure 83. Evaluation PCB Top Layer
Data Sheet HMC553ALC3B
Rev. B | Page 25 of 25
OUTLINE DIMENSIONS
03-02-2017-A
P
KG-004837
0.50
BSC
0.32
BSC
BOT TOM V IEW
TOP VIEW
SIDE V IEW
0.08
BSC
1
4
6
7
9
10 12
3
FOR PROPE R CONNECTION OF
THE EXPOSED PAD, REFER TO
THE P I N CO NF IG URATION AND
FUN CTION DESCRI P TI ONS
SECTION OF T HIS DATA SHEET.
0.36
0.30
0.24
PIN 1
EXPOSED
PAD
PIN 1
INDICATOR
3.05
2.90 S Q
2.75
2.10 BSC
1.00 REF
1.60
1.50 SQ
1.40
0.90
0.80
0.70
SEATING
PLANE
Figure 84. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Moisture Sensitivity Level (MSL) Rating2 Package Description Package Option
HMC553ALC3B −40°C to +85°C MSL3 12-Terminal Ceramic LCC E-12-4
HMC553ALC3BTR −40°C to +85°C MSL3 12-Terminal Ceramic LCC E-12-4
HMC553ALC3BTR-R5 −40°C to +85°C MSL3 12-Terminal Ceramic LCC E-12-4
EV1HMC553ALC3B Evaluation PCB Assembly
1 All models are RoHS compliant.
2 The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.
©2018–2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16420-0-3/19(B)
