APTM10AM05FT
APTM10AM05FT– Rev 0 May, 2005
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/
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G1
Q1
VBUS NTC2
OUT
S1
G2
S2
Q2
0/VBUS NTC1
S2
G2
NTC 2
OUT
OUT
VBUS
NTC 1
S1 S2
G2
0/VBUS
G1
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
S
ymbol Parameter Ma
x
ratings Unit
VDSS Drain - Source Breakdown Voltage 100 V
Tc = 25°C 278
ID Continuous Drain Current Tc = 80°C 207
IDM Pulsed Drain current 1100
A
VGS Gate - Source Voltage ±30 V
RDSon Drain - Source ON Resistance 5 m
PD Maximum Power Dissipation Tc = 25°C 780 W
IAR Avalanche current (repetitive and non repetitive) 100 A
EAR Repetitive Avalanche Energy 50
EAS Single Pulse Avalanche Energy 3000 mJ
VDSS = 100V
RDSon = 4.5m typ @ Tj = 25°C
ID = 278A @ Tc = 25°C
Applicatio
n
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Features
Power MOS V® FREDFETs
- Low RDSon
- Low input and Miller capacitance
- Low gate charge
- Fast intrinsic reverse diode
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- Lead frames for power connections
Internal thermistor for temperature monitoring
High level of integration
Benefits
Outstandi ng perfor mance at hi gh freque nc y operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
P
hase leg
MOSFET Power Module
APTM10AM05FT
APTM10AM05FT– Rev 0 May, 2005
APT website
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/
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All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
VGS = 0V,VDS = 100V Tj = 25°C 200
IDSS Zero Gate Voltage Drain Current VGS = 0V,VDS = 80V Tj = 125°C 1000
µA
RDS(on) Drain – Source on Resistance VGS = 10V, ID = 125A 4.5 5
m
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 5mA 2 4 V
IGS S Gate – Source Leakage Current VGS = ±30 V, VDS = 0V ±200 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Cis s Input Capacitance 20
Coss Output Capacitance 8
Crss Reverse Transfer Capacitance
VGS = 0V
VDS = 25V
f = 1MHz 2.9
nF
Qg Total gate Charge 700
Qgs Gate – Source Charge 120
Qgd Gate – Drain Charge
VGS = 10V
VBus = 50V
ID = 250A 360
nC
Td(on) Tur n-o n Delay Ti me 80
Tr Rise Time 165
Td(off) Turn-off Delay Time 280
Tf Fall Time
Resistive Switching
VGS = 15V
VBus = 66V
ID = 250A
RG = 2.5 135
ns
Eon Tur n-o n Switchi ng Energy X 1.1
Eoff Turn-off Switching Energy Y
Inductive switching @ 25°C
VGS = 15V, VBus = 66V
ID = 250A, RG =2.5 1.2 mJ
Eon Tur n-o n Switchi ng Energy X 1.22
Eoff Turn-off Switching Energy Y
Inductive switching @ 125°C
VGS = 15V, VBus = 66V
ID = 250A, RG = 2.5 1.28 mJ
Source - Drain diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Tc = 25°C 278 IS Continuous So urce current
(Body diode)
Tc = 80°C 207 A
VSD Diode Forward Voltage VGS = 0V, IS = - 250A 1.3 V
dv/dt Peak Diode Recovery Z 5 V/ns
Tj = 25°C 190
trr Reverse Recovery Time
IS = - 250A
VR = 50V
diS/dt = 200A/µs Tj = 125°C 370 ns
Tj = 25°C 0.8
Qrr Reverse Recovery Charge
IS = - 250A
VR = 50V
diS/dt = 200A/µs Tj = 125°C 3.4
µC
X Eon includes diode reverse recovery.
Y In accordance with JEDEC standard JESD24-1.
Z dv/dt numbers reflect the limitations of the circuit rather than the device itself.
IS - 278A di/dt 200A/µs VR VDSS Tj 150°C
APTM10AM05FT
APTM10AM05FT– Rev 0 May, 2005
APT website
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/
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Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
RthJC Junction to Case 0.16 °C/W
VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V
TJ Operating junction temperature range -40 150
TSTG Storage Temperature Range -40 125
TC Operating Case Temperature -40 100
°C
Torque Mounting torque To Heatsink M5 1.5 4.7 N.m
Wt Package Weight 160 g
Temperature sensor NTC (see application note APT0406 on www.advancedpower.com for more information).
Symbol Characteristic Min Typ Max Unit
R25 Resistance @ 25°C 50 k
B 25/85 T
25 = 298.15 K 3952 K
=
TT
B
R
RT
11
exp
25
85/25
25
Package outline (dimensions in mm)
T: Thermistor temperature
RT: Thermistor value at T
APTM10AM05FT
APTM10AM05FT– Rev 0 May, 2005
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/
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Typical Performance Curve
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
6V
7V
8V
0
200
400
600
800
1000
1200
0 4 8 1216202428
VDS , Drain to Source Voltage (V)
ID, Drain Current (A)
Low Voltage Output Characteristics
VGS=15V, 10V & 9V
Transfert Characteristics
TJ=-55°C
TJ=25°C
TJ=125°C
0
40
80
120
160
200
240
01234567
VGS, Gate to Source Voltage (V)
ID, Drain Current (A)
VDS > ID(on)xRDS(on)MAX
250µs pulse test @ < 0.5 duty cycle
RDS (on) vs Drain Current
VGS=10V
VGS=20 V
0.8
0.9
1
1.1
1.2
0 25 50 75 100 125 150 175 200
ID, Drain Current (A)
RDS(on) Drain to Source ON Resistance
Normalized to
VGS=10V @ 125A
0
50
100
150
200
250
300
25 50 75 100 125 150
TC, Case Temperature (°C)
ID, DC Drain Current (A)
DC Drain Current vs Case Temperature
APTM10AM05FT
APTM10AM05FT– Rev 0 May, 2005
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0.90
0.95
1.00
1.05
1.10
1.15
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
BVDSS
, Drain to Source Breakdown
Volta
g
e
(
Normalized
)
Breakdown Voltage vs Temperature ON resistance vs Temperature
0.0
0.5
1.0
1.5
2.0
2.5
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
RDS(on), Drain to Source ON resistance
(Normalized)
VGS=10V
ID= 125A
Threshold Voltage vs Temperature
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-50 -25 0 25 50 75 100 125 150
TC, Case Temperature (°C)
VGS(TH), Threshold Voltage
(Normalized)
Maximum Safe Operating Area
10ms
1ms
100µs
10
100
1000
110100
VDS, Drain to Source Voltage (V)
ID, Drain Current (A)
Single pulse
TJ=150°C
limited by
RDSon
Ciss
Crss
Coss
1000
10000
100000
0 1020304050
VDS, Drain to Source Voltage (V)
C, Capacitance (pF)
Capacitance vs Drain to Source Voltage
VDS =20V
VDS=50V
VDS =80V
0
2
4
6
8
10
12
14
16
0 200 400 600 800 1000
Gate Charge (nC)
VGS, Gate to Source Voltage (V)
Gate Charge vs Gate to Source Voltage
ID=250A
TJ=25°C
APTM10AM05FT
APTM10AM05FT– Rev 0 May, 2005
APT website
http:/
/
www.advancedpower.com 6 - 6
Delay Times vs Current
td(on)
td(off)
0
50
100
150
200
250
300
350
0 100 200 300 400
ID, Drain Current (A)
td(on) and td(off) (ns)
VDS=66V
RG=2.5
TJ=125°C
L=100µH
Rise and Fall times vs Current
tr
tf
0
50
100
150
200
250
0 100 200 300 400
ID, Drain Current (A)
tr and tf (ns)
VDS=66V
RG=2.5
TJ=125°C
L=100µH
Switching Energy vs Current
Eon
Eoff
0
0.5
1
1.5
2
2.5
3
0 100 200 300 400
ID, Drain Current (A)
Eon and Eoff (mJ)
VDS=66V
RG=2.5
TJ=125°C
L=100µH
Eon
Eoff
0
1
2
3
4
5
0 5 10 15 20 25 30
Gate Resistance (Ohms)
Switching Energy (mJ)
Switching Energy vs Gate Resistance
VDS =66V
ID=200A
TJ=125°C
L=100µH
Hard
switching ZVS
ZCS
0
20
40
60
80
100
50 100 150 200 250
ID, Drain Current (A)
Frequency (kHz)
Operating Frequency vs Drain Curren
t
VDS=66V
D=50%
RG=2.5
TJ=125°C
TC=75°C
TJ=25°C
TJ=150°C
1
10
100
1000
0.3 0.5 0.7 0.9 1.1 1.3 1.5
VSD
, Source to Drain Voltage (V)
IDR, Reverse Drain Current (A)
Source to Drain Diode Forward Voltage
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APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
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