The RGB Series 1SC5050VGB00CF09 Outline (L* W*H): 5.0*5.0*1.6mm Good thermal dissipation & optical uniformity Features Table of Contents Product Code Method------------------------------------------2 Forward current:25mA Maximum Rating-----------------------------------------------2 Typical view angle 50% Iv: 120 Typical Product Characteristics------------------------------3 Lens color: water transparent Range of Bins--------------------------------------------------3 RoHS2.0 and REACH-compliant Color Coordinate Comparison-------------------------------4 Qualified according to JEDEC moisturevity Electronic-Optical Characteristics---------------------------5 Level 4 ESD level 1kV(HBM) Dimensions -----------------------------------------------------6 Applications Reflow Profile--------------------------------------------------7 Test Circuit and Handling Precautions----------------------8 Indoor decorating Packing------------------------------------------------------------9 Outdoor lighting for amusement Precautions -----------------------------------------------------11 Consumer electronics Test Items and Results of Reliability------------------------12 Other applications Version: IS-1.1 BT-SMD-171213001 Page 1 of 14 The RGB Series Product Code Method ----------------------------------------------------------------------------------------------------------------------------------- 1 - S - C - 5050 - VGB0 - 0 - C - F - 09 Process Type Category LED Type Lead Frame Size Dice wavelength &luminous rank C: PLCC top view 5050: D: PLCC side view 5.0*5.0mm V:red 1: normal process S: SMD LED G:green B:blue Lap Polarity Cap Color PCB Module Code Flow Code C: water transparent F: article mode 0: non-common anode and 09: no expression above non-common cathode meaning for company Maximum Rating(Ta=25) -----------------------------------------------------------------------------------------------------------------------------------Characteristics Symbol Rating Unit DC Forward Current IF 25 mA Pulse Forward Current*3 IPF 100 mA Reverse Voltage VR 5 V Power Dissipation PD G&B:80 / R:100 mW Junction Temperature TJ 110 o Operating Temperature Range TOP -40~85 o Storage Temperature Range TSTG -40~100 o Soldering Temperature*4 TSD 260 o C C C C Notes 1: There is no maximum or typical voltage parameter 2: For other ambient, limited setting of current will be depended on de-rating curves. 3: Duty 1/10, pulse width 0.1ms 4: The maximum of soldering time is 5 seconds in TSD Version: IS-1.1 BT-SMD-171213001 Page 2 of 14 The RGB Series Typical Product Characteristics(Ta=25) -----------------------------------------------------------------------------------------------------------------------------------Characteristics Forward Voltage Symbol VF Reverse Current Luminous Intensity Min. Typ. Max. R 1.8 2.0 2.4 G 2.8 3.2 3.6 B 2.8 3.2 3.6 - 10 A VR= 5V IF=60mA IR Iv W Unit IF=20mA V View Angle IF=20mA IF=20mA 2900 3100 5050 mcd x - 0.254 - - y - 0.261 - - R 615 - 630 G 520 - 535 B 460 - 470 - 120 - Color Coordinate Dominant Wavelength Test condition IF=60mA d 21/2 IF=20mA nm IF=20mA IF=20mA deg IF=20mA Notes: 1. Measurement Errors: Forward Voltage: 0.1V, Luminous Intensity: 10%Iv, Dominant Wavelength: 1.0nm 2. Electrical-Optical Characteristics (Ta=25) Range of Bins -----------------------------------------------------------------------------------------------------------------------------------1) Luminous Intensity white (IF=60mA) Bin Code Min. IV (mcd) Max. IV (mcd) ZB 2900 3500 ZC 3500 4250 ZD 4250 5050 Version: IS-1.1 BT-SMD-171213001 Page 3 of 14 The RGB Series Color Coordinate Comparison (IF=60mA) ------------------------------------------------------------------------------------------------------------------------------------ Color Rank Bin code X Y X Y X Y X Y W00 0.172 0.265 0.172 0.29 0.197 0.3 0.197 0.275 W01 0.197 0.275 0.197 0.3 0.222 0.31 0.222 0.285 W02 0.222 0.285 0.222 0.31 0.247 0.32 0.247 0.295 W03 0.247 0.295 0.247 0.32 0.272 0.33 0.272 0.305 W04 0.172 0.24 0.172 0.265 0.197 0.275 0.197 0.25 W05 0.197 0.25 0.197 0.275 0.222 0.285 0.222 0.26 W06 0.222 0.26 0.222 0.285 0.247 0.295 0.247 0.27 W07 0.247 0.27 0.247 0.295 0.272 0.305 0.272 0.28 W08 0.172 0.215 0.172 0.24 0.197 0.25 0.197 0.225 W09 0.197 0.225 0.197 0.25 0.222 0.26 0.222 0.235 W10 0.222 0.235 0.222 0.26 0.247 0.27 0.247 0.245 W11 0.247 0.245 0.247 0.27 0.272 0.28 0.272 0.255 W12 0.172 0.19 0.172 0.215 0.197 0.225 0.197 0.2 W13 0.197 0.2 0.197 0.225 0.222 0.235 0.222 0.21 W14 0.222 0.21 0.222 0.235 0.247 0.245 0.247 0.22 W15 0.247 0.22 0.247 0.245 0.272 0.255 0.272 0.23 Version: IS-1.1 BT-SMD-171213001 Page 4 of 14 The RGB Series Electronic-Optical Characteristics Relative Luminous Intensity -----------------------------------------------------------------------------------------------------------------------------------1). Relative Spectral Distribution 2). Typical Spatial Distribution Wavelength (nm) 4). Relative Luminous Flux .Ambient Temperature Relative Luminous Flux 10000 1000 100 10 0 0 5 25 20 15 10 30 Relative Luminous Flux(%) 3). Relative Luminous Flux .Current 110% 100% 90% 80% 70% 0 20 40 60 80 100 Ambient Temperature() Forward Current (mA) 5). Electrical Characteristics 6). Forward Voltage Temperature 25 3.4 20 Forward Voltage Forward Current IF(mA) 30 15 10 5 3.2 3.0 2.0 1.8 0 1.5 2.5 2 3 3.5 1.6 Forward Voltage VF(V) 620 600 520 500 470 450 420 0 Version: IS-1.1 10 20 30 85 45 65 Ambient Temperature() 105 8). Thermal Design Forward Current IF(mA) Choromaticity Coordinates(wd) 7). Wavelength and current 25 40 Forward Current (mA) 50 50 40 30 20 10 0 0 BT-SMD-171213001 20 40 60 80 Ambient Temperature Ta(C) 100 Page 5 of 14 The RGB Series Dimensions ------------------------------------------------------------------------------------------------------------------------------------ Recommend Padlayout 1.4 0.6 1 0.6 RECOMMEND PADLAYOUT 2 2.4 2 All dimensions are in millimeters. Tolerance is 0.1mm unless other specified Specifications are subject to change without notice Version: IS-1.1 BT-SMD-171213001 Page 6 of 14 The RGB Series Reflow Profile -----------------------------------------------------------------------------------------------------------------------------------1. IR reflow soldering Profile for Lead Free solder 300 250 temperature 10sec. max 1-5/sec Pre heating 150-180 200 260 max 2-5/sec 230 max 2-5/sec 150 120sec.Max 50sec.max 100 50 25 0 0 50 100 Time 150 200 250 300 sec Notes: 1. We recommend the reflow temperature 240 (5).the maximum soldering temperature should be limited to 260. 2. Don't cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall be less than 3 times. Version: IS-1.1 BT-SMD-171213001 Page 7 of 14 The RGB Series Test Circuit and Handling Precautions -----------------------------------------------------------------------------------------------------------------------------------1. Test circuit V LED 2. Handling precautions 2.1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.2. Storage 1). It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5~30(41~86) 2). Shelf life in sealed bag: 12 month at 5~30 and 60% R.H. after the package is Opened, the products should be used within 72 hours or they should be keeping to stored at 20%R.H. with zip-lock sealed. 2.3. Baking Suggest packing opened after 72 hours, before use baking products, conditions as follows: The Conditions are as followings: 1). 603 X 6hrs and 5%RH, for reel 2). 1253 X 2hrs, for single LED It shall be normal to see slight color fading of carrier (light yellow) after baking in process Version: IS-1.1 BT-SMD-171213001 Page 8 of 14 The RGB Series Reflow Profile -----------------------------------------------------------------------------------------------------------------------------------2. IR reflow soldering Profile for Lead Free solder 300 250 temperature 10sec. max 1-5/sec Pre heating 150-180 200 260 max 2-5/sec 230 max 2-5/sec 150 120sec.Max 50sec.max 100 50 25 0 0 50 100 Time 150 200 250 300 sec Notes: 1. We recommend the reflow temperature 240 (5).the maximum soldering temperature should be limited to 260. 2. Don't cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall be less than 3 times. Version: IS-1.1 BT-SMD-171213001 Page 9 of 14 The RGB Series Test Circuit and Handling Precautions -----------------------------------------------------------------------------------------------------------------------------------3. Test circuit V LED 4. Handling precautions 2.1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.2. Storage 1). It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5~30(41~86) 2). Shelf life in sealed bag: 12 month at 5~30 and 60% R.H. after the package is Opened, the products should be used within 72 hours or they should be keeping to stored at 20%R.H. with zip-lock sealed. 2.3. Baking Suggest packing opened after 72 hours, before use baking products, conditions as follows: 1). 603 X 6hrs and 5%RH, for reel 2). 1253 X 2hrs, for single LED It shall be normal to see slight color fading of carrier (light yellow) after baking in process Version: IS-1.1 BT-SMD-171213001 Page 10 of 14 The RGB Series Packing ----------------------------------------------------------------------------------------------------------------------------------- Dimensions of Reel (Unit: mm) 1.0 0.5 130.5 12.40.2 18.4max Note: 01.The tolerance unless mentioned is 0.2mm. 02.The measured unit is "mm". Dimensions of Tape (Unit: mm) 4.00.05 1.750.1 5.30.1 5.50.05 120.2 8.00.1 0.30.5 2.00.05 1.750.1 1.50.10 5.350.1 1.50.01 Arrangement of Tape Empty parts Loaded Parts Empty Parts (min.10) (LED) (min.40) Feeding Direction Cover Tape Emboss Tape Conclusion Parts Introduction Parts (Min.40mm) (Min.160mm) Notes: 1. Empty component pockets are sealed with top cover tape 2. The max loss number of SMD is 2pcs 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications 4. 1000pcs per reel Version: IS-1.1 BT-SMD-171213001 Page 11 of 14 The RGB Series Packing ---------------------------------------------------------------------------------------------------------------------------------- Packaging specifications Reel(1000pcs) Moisture-poof bag Label inspection request form Inner box(Max. 5 reels) Label Outer box(Max. 4 inner boxes) Notes: Reeled product (max.1000) is packed in a sealed moisture-proof bag. Five bags are packed in an inner box (size: about 260 X 230 X 100 mm) and four inner boxes are in an outer box (size: about 480 X 275 X 215mm). On the label of moisture-poof bag, there should be the information of Part No., Lot No. and quantity number; also the total quantity number should be on inspection request form on outer box. Version: IS-1.1 BT-SMD-171213001 Page 12 of 14 The RGB Series Precautions ---------------------------------------------------------------------------------------------------------------------------------------1. Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product's quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet's lowering down height is not well set, it will bring damage to the gold wire at the time of collet's picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2. How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out Outer diameter of collet should be larger than the lighting area Picture 1() Picture 2(X) 3. Other points for attention A. No pressure should be exerted to the epoxy shell of the SMD under high temperature. B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C. LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. 4. This usage and handling instruction is only for your reference. Version: IS-1.1 BT-SMD-171213001 Page 13 of 14 The RGB Series Test Items and Results of Reliability ------------------------------------------------------------------------------------------------------------------------------ Test Item Normal Temperature Life High Temperature Life Test Conditions Ta23(5) IF=20mA Ta85(5) IF=20mA Duration/ Cycle Ac/Re Number of Damage Reference 1008 hrs 0/1 0/22 JESD22 A-108 1008 hrs 0/1 0/22 JESD22 A-108 1008 hrs 0/1 0/22 JESD22 A-108 1008 hrs 0/1 0/22 JESD22 A-104 Ta85(5) High Humidity Heat Life RH=85% IF=20mA -45/30min~105 Thermal shock /30min (5) Electrostatic Discharge (ESD) Test According to the SPEC 3 cycles 0/1 0/22 AEC Q101-001 Low Temperature Storage Ta=-40 1008 hrs 0/1 0/22 JESD22-A103D High Temperature Storage Ta=125 1008 hrs 0/1 0/22 JESD22-A103D Symbol Condition *Criteria for Judging Criteria for Judgment of Pass Item Min Max Forward Voltage VF IF=20mA - USL*1x1.1 Reverse Current IR VR= 5V - 10A Luminous Intensity Iv IF=20mA LSL*2x0.7 - [Note] USL*1: Upper Specification Level LSL*2: Lower Specification Level Version: IS-1.1 BT-SMD-171213001 Page 14 of 14