The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 1 of 14
1SC5050VGB00CF09
◆Outline (L* W*H): 5.0*5.0*1.6mm
◆Good thermal dissipation & optical uniformity
Table of Contents
Product Code Method------------------------------------------2
Maximum Rating-----------------------------------------------2
Typical Product Characteristics------------------------------3
Range of Bins--------------------------------------- -----------3
Color Coordinate Comparison-------------------------------4
Electronic-Optical Characteristics---------------------------5
Dimensions -----------------------------------------------------6
Reflow Profile--------------------------------------------------7
Test Circuit and Handling Precautions----------------------8
Packing------------------------------------------------------------9
Precautions -----------------------------------------------------11
Test Items and Results of Reliability------------------------12
Features
Forward current:≦25mA
Typical view angle 50% Iv: 120°
Lens color: water transparent
RoHS2.0 and REACH-compliant
Qualified according to JEDEC moisturevity
Level 4
ESD level 1kV(HBM)
Applications
Indoor decorating
Outdoor lighting for amusement
Consumer electronics
Other applications
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 2 of 14
Product Code Method
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1 - S - C - 5050 - VGB0 - 0 - C - F - 09
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨
①
②
③
④
Process Type
Category
LED Type
Lead Frame Size
1: normal process
S: SMD LED
C: PLCC top view
D: PLCC side view
5050:
5.0*5.0mm
⑥
⑦
⑧
⑨
Lap Polarity
Cap Color
PCB Module Code
Flow Code
0: non-common anode and
non-common cathode
C: water transparent
F: article mode
09: no expression above
meaning for company
Maximum Rating(Ta=25℃)
------------------------------------------------------------------------------------------------------------------------------------
Characteristics
Symbol
Rating
Unit
DC Forward Current
IF
25
mA
Pulse Forward Current*3
IPF
100
mA
Reverse Voltage
VR
5
V
Power Dissipation
PD
G&B:80 / R:100
mW
Junction Temperature
TJ
110
oC
Operating Temperature Range
TOP
-40~85
oC
Storage Temperature Range
TSTG
-40~100
oC
Soldering Temperature*4
TSD
260
oC
Notes 1: There is no maximum or typical voltage parameter
2: For other ambient, limited setting of current will be depended on de-rating curves.
3: Duty 1/10, pulse width 0.1ms
4: The maximum of soldering time is 5 seconds in TSD
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 3 of 14
Typical Product Characteristics(Ta=25℃)
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Characteristics
Symbol
Min.
Typ.
Max.
Unit
Test condition
Forward Voltage
VF
R
1.8
2.0
2.4
V
IF=20mA
G
2.8
3.2
3.6
IF=20mA
B
2.8
3.2
3.6
IF=20mA
Reverse Current
IR
-
-
10
μA
VR= 5V
Luminous Intensity
Iv
W
2900
3100
5050
mcd
IF=60mA
Color Coordinate
x
-
0.254
-
-
IF=60mA
y
-
0.261
-
-
Dominant Wavelength
λd
R
615
-
630
nm
IF=20mA
G
520
-
535
IF=20mA
B
460
-
470
IF=20mA
View Angle
2θ1/2
-
120
-
deg
IF=20mA
Notes: 1. Measurement Errors:
Forward Voltage: ±0.1V, Luminous Intensity: ±10%Iv, Dominant Wavelength: ±1.0nm
2. Electrical-Optical Characteristics (Ta=25℃)
Range of Bins
------------------------------------------------------------------------------------------------------------------------------------
1) Luminous Intensity white (IF=60mA)
Bin Code
Min. IV
(mcd)
Max. IV
(mcd)
ZB
2900
3500
ZC
3500
4250
ZD
4250
5050
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 4 of 14
Color Coordinate Comparison (IF=60mA)
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Color Rank
Bin code
X
Y
X
Y
X
Y
X
Y
W00
0.172
0.265
0.172
0.29
0.197
0.3
0.197
0.275
W01
0.197
0.275
0.197
0.3
0.222
0.31
0.222
0.285
W02
0.222
0.285
0.222
0.31
0.247
0.32
0.247
0.295
W03
0.247
0.295
0.247
0.32
0.272
0.33
0.272
0.305
W04
0.172
0.24
0.172
0.265
0.197
0.275
0.197
0.25
W05
0.197
0.25
0.197
0.275
0.222
0.285
0.222
0.26
W06
0.222
0.26
0.222
0.285
0.247
0.295
0.247
0.27
W07
0.247
0.27
0.247
0.295
0.272
0.305
0.272
0.28
W08
0.172
0.215
0.172
0.24
0.197
0.25
0.197
0.225
W09
0.197
0.225
0.197
0.25
0.222
0.26
0.222
0.235
W10
0.222
0.235
0.222
0.26
0.247
0.27
0.247
0.245
W11
0.247
0.245
0.247
0.27
0.272
0.28
0.272
0.255
W12
0.172
0.19
0.172
0.215
0.197
0.225
0.197
0.2
W13
0.197
0.2
0.197
0.225
0.222
0.235
0.222
0.21
W14
0.222
0.21
0.222
0.235
0.247
0.245
0.247
0.22
W15
0.247
0.22
0.247
0.245
0.272
0.255
0.272
0.23
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 5 of 14
Electronic-Optical Characteristics
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1). Relative Spectral Distribution
2). Typical Spatial Distribution
3). Relative Luminous Flux .Current
4). Relative Luminous Flux .Ambient Temperature
10000
1000
100
10
0
Relative Luminous Flux
0 5 10 15 20 25 30
Forward Current (mA)
110%
100%
90%
80%
70%
0 20 40 60 80 100
Ambient Temperature(℃)
Relative Luminous Flux(%)
5). Electrical Characteristics
6). Forward Voltage Temperature
30
25
20
15
10
5
01.5 2 2.5 33.5
Forward Current IF(mA)
Forward Voltage VF(V)
3.4
3.2
3.0
2.0
1.8
1.6
25 45 65 85 105
Ambient Temperature(℃)
Forward Voltage
7). Wavelength and current
8). Thermal Design
420
Choromaticity Coordinates(wd)
0 10 20 30 40 50
Forward Current (mA)
450
470
500
520
600
620
0 20 40 60 80 100
50
40
30
20
10
0
Ambient Temperature Ta(°C)
Forward Current IF(mA)
Relative Luminous Intensity
Wavelength (nm)
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 6 of 14
Dimensions
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Recommend Padlayout
0.6 0.6
22
2.4
1.4 1
RECOMMEND PADLAYOUT
§ All dimensions are in millimeters.
§ Tolerance is ±0.1mm unless other specified
§ Specifications are subject to change without notice
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 7 of 14
Reflow Profile
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1. IR reflow soldering Profile for Lead Free solder
25℃
2-5℃/sec
10sec. max
2-5℃/sec
120sec.Max
50sec.max
0
50
100
150
200
250
300
050 100 150 200 250 300
sec
℃
1-5℃/sec
Pre heating 150-180℃
260℃ max
230℃ max
Time
temperature
Notes:
1. We recommend the reflow temperature 240℃ (±5℃).the maximum soldering temperature should be
limited to 260℃.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be less than 3 times.
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 8 of 14
Test Circuit and Handling Precautions
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1. Test circuit
2. Handling precautions
2.1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big current
change (Burn out will happen).
2.2. Storage
1). It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened,
the products should be used within 72 hours or they should be keeping to stored at ≦20%R.H. with
zip-lock sealed.
2.3. Baking
Suggest packing opened after 72 hours, before use baking products, conditions as follows:
The Conditions are as followings:
1). 60±3℃ X 6hrs and ＜5%RH, for reel
2). 125±3℃ X 2hrs, for single LED
It shall be normal to see slight color fading of carrier (light yellow) after baking in process
LED
V
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 9 of 14
Reflow Profile
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2. IR reflow soldering Profile for Lead Free solder
25℃
2-5℃/sec
10sec. max
2-5℃/sec
120sec.Max
50sec.max
0
50
100
150
200
250
300
050 100 150 200 250 300
sec
℃
1-5℃/sec
Pre heating 150-180℃
260℃ max
230℃ max
Time
temperature
Notes:
1. We recommend the reflow temperature 240℃ (±5℃).the maximum soldering temperature should be
limited to 260℃.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be less than 3 times.
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 10 of 14
Test Circuit and Handling Precautions
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3. Test circuit
4. Handling precautions
2.1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big current
change (Burn out will happen).
2.2. Storage
1). It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened,
the products should be used within 72 hours or they should be keeping to stored at ≦20%R.H. with
zip-lock sealed.
2.3. Baking
Suggest packing opened after 72 hours, before use baking products, conditions as follows:
1). 60±3℃ X 6hrs and ＜5%RH, for reel
2). 125±3℃ X 2hrs, for single LED
It shall be normal to see slight color fading of carrier (light yellow) after baking in process
LED
V
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 11 of 14
Packing
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Dimensions of Reel (Unit: mm)
13±0.5
±0.5
±1.0
18.4max
12.4±0.2
Note: 01.The tolerance unless mentioned is ±0.2mm.
02 .T h e measured u n it is "m m".
Dimensions of Tape (Unit: mm)
1.5±0.10 2.0±0.05 4.0±0.05
8.0±0.1 1.5±0.01
5.5±0.05
1.75±0.1
12±0.2
5.35±0.1
0.3±0.5
5.3±0.1
1.75±0.1
Arrangement of Tape
Notes:
1. Empty component pockets are sealed with top cover tape
2. The max loss number of SMD is 2pcs
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481
specifications
4. 1000pcs per reel
Empty parts
(min.10)
Loaded Parts
(LED)
Empty Parts
(min.40)
Feeding Direction
Conclusion Parts
(Min.40mm)
Introduction Parts
(Min.160mm)
Emboss Tape
Cover Tape
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 12 of 14
Packing
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Packaging specifications
Notes:
Reeled product (max.1000) is packed in a sealed moisture-proof bag. Five bags are packed in an inner
box (size: about 260 X 230 X 100 mm) and four inner boxes are in an outer box (size: about 480 X 275 X
215mm). On the label of moisture-poof bag, there should be the information of Part No., Lot No. and
quantity number; also the total quantity number should be on inspection request form on outer box.
Reel(1000pcs) Moisture-poof bag Label
inspection request form
Inner box(Max. 5 reels)
Label
Outer box(Max. 4 inner boxes)
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 13 of 14
Precautions
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1. Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different from other
electronic components, which is not only about electrical output but also for optical output. This
characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well
set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the
LED fail to light up, light up now and then or other quality problems
2. How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in
case that improper position of collet will damage the gold wire inside the LED. Different collets fit for
different products, please refer to the following pictures cross out
3. Other points for attention
A. No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out
easy to break.
C. LED should be used as soon as possible when being taken out of the original package, and should
be stored in anti-moisture and anti-ESD package.
4. This usage and handling instruction is only for your reference.
Outer diameter of collet should be larger than the lighting area
Picture 1()
Picture 2(X)
The RGB Series
Version: IS-1.1 BT-SMD-171213001 Page 14 of 14
Test Items and Results of Reliability
------------------------------------------------------------------------------------------------------------------------------
[Note] USL*1: Upper Specification Level
LSL*2: Lower Specification Level
Test Item
Test Conditions
Duration/
Cycle
Ac/Re
Number of
Damage
Reference
Normal Temperature Life
Ta＝23℃(±5℃)
IF=20mA
1008 hrs
0/1
0/22
JESD22 A-108
High Temperature Life
Ta＝85℃(±5℃)
IF=20mA
1008 hrs
0/1
0/22
JESD22 A-108
High Humidity Heat Life
Ta＝85℃(±5℃)
RH=85%
IF=20mA
1008 hrs
0/1
0/22
JESD22 A-108
Thermal shock
-45℃/30min~105℃
/30min
(±5℃)
1008 hrs
0/1
0/22
JESD22 A-104
Electrostatic Discharge (ESD)
Test
According to the
SPEC
3 cycles
0/1
0/22
AEC Q101-001
Low Temperature Storage
Ta=-40℃
1008 hrs
0/1
0/22
JESD22-A103D
High Temperature Storage
Ta=125℃
1008 hrs
0/1
0/22
JESD22-A103D
*Criteria for Judging
Item
Symbol
Condition
Criteria for Judgment of Pass
Min
Max
Forward Voltage
VF
IF=20mA
-
USL*1×1.1
Reverse Current
IR
VR= 5V
-
10μA
Luminous Intensity
Iv
IF=20mA
LSL*2×0.7
-