Data Brief
For further information contact your local STMicroelectronics sales office.
September 2013 Rev 2 1/14
14
Rev 2
STA1052
DSP/MCU system for CD-DA, CD-CA, CD-ROM player
Features
■CD-R, CD-RW playback
■Audio decoding (MP3,WMA,AAC)
■CLV (1x, 2x, 4x) and CAV mode (6x)
■On-chip USB-OTG host full speed
■3.3 V ±5 % operating supply range for I/O
■1.8 V ±5 % operating supply range for logic
■IDLE, WFI and STOP modes
■Power on reset / Brownout controller
■33.8688 MHz external quartz/resonator
■Operating temperature range: -40 °C to +85 °C
Embedded ARM7TDMI microcontroller
■32 bit MCU with 3-stage pipeline @ 67 MHz
■384 KB internal ROM (4 Mb on package RAM
for development version) and 128 KB RAM
■I2C master/slave (400 kHz) + 1 CRQ line
■Two high-speed UART full-duplex
■Two buffered SPI master/slave interface
Analog Front-end part
■A, B, C, D, E, F voltage inputs
■Automatic gain and offset control
■ALPC circuit with integrated Power MOS
■8 bit 2 channels general purpose ADC
Digital servo
■Automatic fine gain/balance/offset adjustment
for tracking and focus
■Embedded 16 bit servo DSP (33.8688 MHz)
■
PDM controls for focus, tracking, spindle, sledge
■Embedded stepping sledge motor controller
■CLV & CAV spindle control
Acquisition
■Full range adjustment-free digital PLL
■EFM demodulation and synchronization
■Q subcode and CD text decoder
Error correction
■CIRC, capable of dual C1, quad C2 erasure
■RSPC capable of C3 corrections
■Jitter absorbing capacity ±24 frames (CLV)
Shock-proof controller
■Up to 64 Mbit external SDRAM interface
■8/16 bit data bus interface
■ADPCM (4:1) lossy compression for extended
shock proof capability
Audio features
■Two I2S transmitters and one I2S receiver
■SPDIF transmitter (IEC958) and receiver
■Sample-rate conversion from 8 kHz - 48 kHz
input to 44.1 kHz output
■Digital equalizer for bass/treble control
■Built-in stereo DAC
Development environment
■5 pin JTAG port (IEEE 1149.1 standard)
Table 1. Device summary
Order code Package Packing
STA1052S1 LQFP144 Tray
LQFP144 (20x20x1.4 mm)
www.st.com
Contents STA1052
2/14
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Pin function description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
STA1052 Description
3/14
1 Description
The STA1052 is a single chip device which performs all functions related to read back of
optical disk: servo control operations, reading optical disc decoding the High frequency
signals, EFM decoding, error correction, software decoding of MP3 and WMA encoded
audio, sample rate conversion, managing file system, serial transfer of audio/program
through I2S/SPDIF, direct playback of audio through in-built audio DAC.
It also performs software decoding of MP3, AAC and WMA encoded audio from USB or
SD card™ memory supports.
Commands can be exchanged with the Host MCU either via one I2C port or two SPI ports.
STA1052 chip comes along a broad software suite that comprehends different types of
compressed audio files, File System Management, Play Lists.
The key Media and File Types supported are briefly reported below:
●Ability to play any USB/SD card compatible solid state memory media
●MPEG1-Layer 2 compressed audio files
●Playback of MP3 compressed audio files (all bit rates and VBR)
●Playback of lower bit rate MPEG2 layer 3 files and MPEG-2.5 extension
●Playback of WMA version 9 compressed audio files
●Playback of iTunes AAC compressed audio files
●Sample rate converter for recorded sampling rates other than 44.1kHz
●Support FAT16/FAT32 file systems
●Support ISO9660 and Joliet file systems
The software can manage the following File Information: folder and file names.
ID3 tag information - as per versions 1.0-1.1, 2.0 - 2.4- is reported. Further parameters
made available by ST software are: File type (i.e. .mp3, .wav, .wma, .cda, .aac), Bit rate,
entire file path for current track and track elapsed time.
STA1052 software provides the essential Navigation Commands: Previous/Next , Fast
forward/Rewind, Jump to any file, Scan, Pause. All these commands can be programmed
and configured via Command Protocol Interface.
Two different types of Playlists are supported: Playlists with .pls extension, Playlists with
.m3u extension.
Robust software architecture provides an efficient error handling and related messaging.
ST developed a software architecture that allows the patching of a few parts of software
resident in ROM. Software patches are loaded into a very inexpensive serial Flash which
provides the capability to patch up to 40 KByte of ROM software.
Software build (patching) upgrade from media USB and SD card and from host MCU onto
serial Flash is supported.
STA1052 is intended for use in automotive entertainment system.
System block diagram STA1052
4/14
2 System block diagram
Figure 1 provides the complete system block diagram, where the ARM sub-system is
represented as a hierarchical block.
Figure 1. STA1052 block diagram
Sync protection &
EFM demodulator
Track Loop filter
Focus Loop filter
SLED Loop filter
DECIM.
A+C
E
B+D
F
DSP
PDM/
Sub code
decoder
Cross Interleaving
Reed-Solomon
Laser
control
PLL
Quartz/
AUDIO L/R out Focus Actuator
Track Actuator
Sled Motor
Spindle Motor
DAC
ANALOG
MD
LD
filter
+
Ceramic
digital
Digital PLL
equalizer
SPDIF-SONYLSI-I2S
1.7Kx32 PRAM
256x16 XRAM
256x16 YRAM
+
RATE
I/V OFFSET GAIN ADC
ADC1
ADC2 AUX ADC
stepper
JumpSpeed
TrackCount
A+C B+D E F
TE
FE
CLV
buffer
fade/
mute/
Spindle Motor Feedback (CAV)
A
B
C
D
E
F
master clock
defect
deemph
SDRAM Interface
RSPC
De-
Scram
+
Frame
Org
Ext
Mem
Obs/Debug
ADPCM
Encoder
ADPCM
Decoder AHB
ITF
ARM Subsystem
Application interfaceOutput interface
External
Interrupt
STA1052 Pin description
5/14
3 Pin description
3.1 Pin connection
Figure 2. LQFP144 pin configuration (top view)
1. NC defines not connected pins.
1
2
3
5
6
4
7
8
9
10
46
11
47 48 49 50 51
135134 133 132 130
131 129128 127 126125
100
99
98
96
95
97
105
104
103
101
102
AC00563
41 42 43 44 45
136
138139140141
37 38 39 40
94
93
91
90
92
12
13
14
15
16
54 55 56 57 58 59
124 122
123 121120 119 118117
52 53
17
18
19
88
87
89
86
85
83
82
84
20
21
22
23
24
25
26
27
80
79
81
78
77
75
74
76
28
29
30
31
32
62 63 64 65 66 67
116 114
115 113112 111 110109
60 61
73
33
34
35
68 69 70
36
71 72
106
107
108
137142143144
DRD9
DRD8
GPB12
GPB13
GPB14
GPB15
DRD7
DRD6
DRD5
VDD
VSS
VDD3
DRD4
DRD3
DRD2
DRD1
DRD0
PLL_VSS18P
PLL_VDDA33P
PLL_XTI
PLL_XTO
PLL_VDDA18P
PLL_VDD18P
FE_VSSA33S
FE_A
FE_C
FE_B
FE_D
FE_E
FE_F
FE_VDDA33S
FE_VDDPAD1
FE_ADCIN1
FE_ADCIN2
FE_VREF_ADC
FE_VREF
DRD10
DRD11
GPB11
GPB10
GPB9
DRD12
DRD13
DRD14
DRD15
VDD3_Core1
VSS
DRCLK
DRCLKE
DRRAS
DRCAS
DRWR
DRA0
DRA1
DRA2
DRA3
DRA4
VDD3
VSS
VDD
DRA5
DRA6
DRA7
DRA8
DRA9
DRA10
DRA11
DRBA0
DRBA1
JTRST
JTCK
NC
OUTR
ADAC_REF1
VCM
ADAC_REF2
OUTL
ADAC_VDDA
ADAC_VSSA
VSS
VDD3
JTMS
JTDO
JTDI
GPB7
GPB6
VDD
GPB8
GPB5
GPB4
GPB3
GPB2
GPB1
VDD3_Core2
VSS
GPB0
GPA8
GPA7
GPA6
GPA5
GPA4
GPA13
GPA3
GPA2
GPA1
NC
NC
NC
FE_VDDA33R
FE_CEXT
FE_REXT
FE_VSSA33R
FE_MD_LAS
FE_CAP_LAS
FE_LD_LAS
FE_LD1_LAS
FE_VDDPAD2
FE_VDDA33T
FE_TESTP
FE_TESTN
FE_VSSA33T
FE_VDDA18AD
FE_VSSA18AD
VSS
RESETN
TESTEN
FFSR
REFFSR
SPDL
SLED1
SLED2
VDD
VSS
VDD3
TFSR
CAV
LRCK
GPA9
GPA10
GPA11
GPA12
SDO
BCLK
GPA0
Pin description STA1052
6/14
3.2 Pin function description
This pin list contains the definition and description of all pins.
Ta bl e 2 gives pin list for LQFP144.
Table 2. Pin List
N° Name Description Pin type LQFP144
1 GPC9(DRD9) GPIO PC9 (SDRAM data 9) bidir, 3.3V , 4 mA 1
2 GPC8(DRD8) GPIO PC8 (SDRAM data 8) bidir, 3.3 V, 4 mA 2
3 GPB12 GPIO PB12(BSPI1_SS) bidir, 3.3 V, 2 mA,
PU (default off) 3
4 GPB13 GPIO PB13 (BSPI1_MISO) bidir, 3.3 V, 2 mA,
PU (default off) 4
5 GPB14 GPIO PB14 (BSPI1_MOSI) bidir, 3.3 V, 2 mA,
PU (default off) 5
6 GPB15 GPIO PB15 (BSPI1_SCK) bidir, 3.3 V, 2 mA,
PU (default off) 6
7 GPC7(DRD7) GPIO PC7 (SDRAM data 7) bidir, 3.3 V, 4 mA 7
8 GPC6(DRD6) GPIO PC6 (SDRAM data 6) bidir, 3.3 V, 4 mA 8
9 GPC5(DRD5) GPIO PC5 (SDRAM data 5) bidir, 3.3 V, 4 mA 9
10 VDD Core VDD1.8 V VDD 10
11 VSS Digital pad ring VSS ground VSS 11
12 VDD3 Digital pad ring VDD3 3.3 V VDD3 12
13 GPC4(DRD4) GPIO PC4 (SDRAM data 4) bidir, 3.3 V, 4 mA 13
14 GPC3(DRD3) GPIO PC3 (SDRAM data 3) bidir, 3.3 V, 4 mA 14
15 GPC2(DRD2/
SFLASH_MISO)
GPIO PC2 (SDRAM data 2 or serial
flash master in/slave out) bidir, 3.3 V, 4 mA 15
16 GPC1(DRD1/
SFLASH_MOSI)
GPIO PC1 (SDRAM Data 1 or serial
flash master out/slave in) bidir, 3.3 V, 4 mA 16
17 GPC0(DRD0/
SFLASH_SCK)
GPIO PC0 (SDRAM data 0 or serial
Flash clock) bidir, 3.3 V, 4 mA 17
18 PLL_VSS18P PLL digital & analog ground VSS 18
19 PLL_VDDA33P PLL 3.3 analog power supply VDD 19
20 PLL_XTI Crystal input analog in 20
21 PLL_XTO Crystal output analog out 21
22 PLL_VDDA18P PLL 1.8V analog power supply VDD 22
23 PLL_VDD18P PLL 1.8V digital power supply VDD 23
24 FE_VSSA33S Ground for servo channels VSS 24
25 FE_A OPU A input analog in 25
26 FE_C OPU C input analog in 26
STA1052 Pin description
7/14
27 FE_B OPU B input analog in 27
28 FE_D OPU D input analog in 28
29 FE_E OPU E input analog in 29
30 FE_F OPU F input analog in 30
31 FE_VDDA33S
3.3 V analog for servo channels/ 3.3 V
for AFE pad ring (decoupling cap to
Vssa)
VDD 31
32 FE_VDDPAD1 3.3V for AFE pad ring VDD 32
33 FE_ADCIN1 General purpose ADC input 1 analog in 33
34 FE_ADCIN2 General purpose ADC input 2 analog in 34
35 FE_VREF_ADC General purpose ADC Vtop reference
output analog out 35
36 FE_VREF External Vref pickup (decoupling cap 1
nF) analog out 36
37 FE_VDDA33R Analog 3.3 V for bandgap VDD 37
38 FE_CEXT External cap for bandgap (1 nF) analog 38
39 FE_REXT External res for bandgap (25 kOhm) analog 39
40 FE_VSSA33R Analog ground bandgap Vss 40
41 FE_MD_LAS Laser driver input from monitor diode analog in 41
42 FE_CAP_LAS Laser driver compensation cap (30 nF) analog 42
43 FE_LD_LAS First laser driver output analog out 43
44 FE_LD1_LAS Second laser driver output analog out 44
45 FE_VDDPAD2 3.3 V for AFE pad ring VDD 45
46 FE_VDDA33T Analog 3.3 V for test buffer VDD 46
47 FE_TESTP Test buffer positive output analog out 47
48 FE_TESTN Test buffer negative output analog out 48
49 FE_VSSA33T Analog ground test buffer VSS 49
50 FE_VDDA18AD Analog 1.8 V ADC VDD 50
51 FE_VSSA18AD Analog ground ADC VSS 51
52 VSS Core VSS ground VSS 52
53 RESETN Hardware reset input (pull-up) in, schmitt, 3.3 V 53
54 TESTEN Test enable signal (active low) in, 3.3V 54
55 FFSR Focusing actuator control signal output -
PDM Out, 3.3 V, 4 mA 55
56 REFFSR Clock (50% duty cycle) for actuator
PDM reference Out, 3.3 V, 2 mA 56
Table 2. Pin List (continued)
N° Name Description Pin type LQFP144
Pin description STA1052
8/14
57 SPDL Spindle motor control signal output -
PDM Out, 3.3 V, 2 mA 57
58 SLED1 SLED motor control signal output1
(stepping/DC) - PDM Out, 3.3 V, 2 mA 58
59 SLED2 SLED motor control signal output2
(stepping) -PDM Out, 3.3 V, 2 mA 59
60 VDD Core VDD 1.8 V VDD 60
61 VSS Digital pad ring VSS ground VSS 61
62 VDD3 Digital pad ring VDD3 3.3 V VDD3 62
63 TFSR Tracking actuator control signal output -
PDM Out, 3.3 V, 4 mA 63
64 CAV CAV feedback input in, 3.3 V 64
65 LRCK Serial L/R clock bidir, 3.3 V, 2 mA 65
66 GPA9 GPA9 (I2S1_Tx_SCK (SCK1)) bidir, 3.3 V, 2 mA,
PU (default off) 66
67 GPA10 GPA10 (I2S1_Tx_WCK (SC12)) bidir, 3.3 V, 2 mA,
PU (default off) 67
68 GPA11 GPA11 (I2S1_Tx_SDO (STD1)) bidir, 3.3 V, mA,
PU (default off) 68
69 GPA12 GPA12 (I2S1_ref_CK) bidir, 3.3 V, 2 mA,
PU (default off) 69
70 SDO/SPDIF Serial bit data or SPDIF Digital output bidir, 3.3 V, 2 mA 70
71 BCLK Serial bit clock bidir, 3.3 V, 2 mA 71
72 GPA0 (EINT0) GPIO PA0 (external interrupt 0/timer 0
output 0)
bidir, 3.3 V, 2 mA,
PU (default off) 72
- NC Not connected 73
- NC Not connected 74
- NC Not connected 75
73 GPA1 (EINT1) GPIO PA1 (external interrupt 1/timer 0
output 1)
bidir, 3.3 V, 2 mA,
PU (default off) 76
74 GPA2 (EINT2) GPIO PA2 (external interrupt 2/timer 1
output 0)
bidir, 3.3 V, 2 mA,
PU (default off) 77
75 GPA3 (EINT3) GPIO PA3 (external interrupt 3/timer 1
output1 )
bidir, 3.3 V, 2 mA,
PU (default off) 78
76 GPA13 GPIO PA13 (SPDIF Rx) bidir, 3.3 V, 2 mA,
PU (default off) 79
77 GPA4 (EINT4) GPIO PA4 (external interrupt 4) bidir, 3.3 V, 2 mA,
PU (default off) 80
78 GPA5 (EINT5) GPIO PA5 (external interrupt 5) bidir, 3.3 , 2 mA,
PU (default off) 81
Table 2. Pin List (continued)
N° Name Description Pin type LQFP144
STA1052 Pin description
9/14
79 GPA6 (EINT6) GPIO PA6 (external interrupt 6) bidir, 3.3 V, 2 mA,
PU (default off) 82
80 GPA7 (EINT7) GPIO PA7 (external interrupt 7) bidir, 3.3 V, 2 mA,
PU (default off) 83
81 GPA8 (EINT8) GPIO PA8 (external interrupt 8) bidir, 3.3 V, 2 mA,
PU (default off) 84
82 GPB0/SFLASH_SS
(EINT9)
GPIO PB0 or serial Flash slave select
(external interrupt 9)
bidir, 3.3 V, 2 mA,
PU (default off) 85
83 VSS Digital pad ring VSS ground Vss 86
84 VDD3_Core2 Digital pad ring VDD3 3.3 V VDD3 87
85 GPB1/I2C_CRQ
(EINT10)
GPIO PB1 or I2C CRQ line
(external interrupt 10) bidir, 5 V tol, 2 mA(sink) 88
86 GPB2/I2C_SCL
(EINT11)
GPIO PB2 or I2C I/F clock
(external interrupt 11) bidir, 5 V tol, 2 mA(sink) 89
87 GPB3/I2C_SDA
(EINT12)
GPIO PB3 or I2C I/F data
(external interrupt 12) bidir, 5 V tol, 2 mA(sink) 90
88 GPB4/SCI0TX GPIO PB4 or serial interface 0 TX or
EXTCK_OIF
bidir, 3.3 V, 2mA,
PU (default off) 91
89 GPB5/SCI0RX
(EINT13)
GPIO PB5 or serial interface 0 RX
(external interrupt 13)
bidir, 3.3V, 2mA,
PU (default off) 92
90 GPB8/C2PO/USBCK GPIO PB8 or C2PO (EIAJ CP-340) or
USB clock line (48 MHz)
bidir, 3.3V, 2mA,
PU (default off) 93
91 VDD Core VDD 1.8 V VDD 94
92 GPB6/SCI1TX/USBDM GPIO PB6 or serial interface 1 TX or
USB D- line
bidir, 3.3 V, 2 mA, PU
(default off)(1)
USB pad (Full / Low
speed )
95
93 GPB7/SCI1RX/USBDP
(EINT14)
GPIO PB7 or serial interface 1 RX or
USB D+ line
(external interrupt 14)
bidir, 3.3 V, 2 mA, PU
(default off)(1)
USB pad (Full / Low
speed )
96
94 JTDI JTAG test data input in, 3.3V 97
95 JTDO JTAG test data output out, 3.3 V, 2 mA 98
96 JTMS JTAG test mode select input in, 3.3 V 99
97 VDD3 Digital pad ring VDD3 3.3 V VDD3 100
98 VSS Digital pad ring VSS ground Vss 101
99 ADAC_VSSA Audio DAC ground VSSDAC 102
100 ADAC_VDDA Audio DAC supply 3.3 V VDDDAC 103
101 OUTL Left channel analog output analog out 104
102 ADAC_REF2 Audio DAC VLO (GND) analog in 105
Table 2. Pin List (continued)
N° Name Description Pin type LQFP144
Pin description STA1052
10/14
103 VCM Common Mode input for audio DAC
(1.65 V) analog in 106
104 ADAC_REF1 Audio DAC VHI (3.3 V) analog in 107
105 OUTR Right channel analog output analog out 108
- NC Not Connected 109
106 JTCK JTAG test clock input in, 3.3 V 110
107 JTRST JTAG test reset input in, schmitt, 3.3 V 111
108 DRBA1 SDRAM bank sel address 1 out, 3.3 V, 4 mA 112
109 DRBA0/CFG4
SDRAM bank sel address 0 and
configuration bit 4
(latched at reset)
bidir, 3.3 V, 4 mA 113
110 DRA11/CFG3
SDRAM address 11 and configuration
bit 3
(latched at reset)
bidir, 3.3V, 4mA 114
111 DRA10/CFG2
SDRAM Address 10 and configuration
bit 2
(latched at reset)
bidir, 3.3 V, 4 mA 115
112 DRA9/CFG1
SDRAM Address 9 and configuration bit
1
(latched at reset)
bidir, 3.3 V, 4 mA 116
113 DRA8/CFG0
SDRAM Address 8 and configuration bit
0
(latched at reset)
bidir, 3.3 V, 4 mA 117
114 DRA7 SDRAM address 7 out, 3.3 V, 4 mA 118
115 DRA6 SDRAM address 6 out, 3.3 V, 4 mA 119
116 DRA5 SDRAM address 5 out, 3.3 V, 4 mA 120
117 VDD Core VDD 1.8 V VDD 121
118 VSS Digital pad ring VSS ground VSS 122
119 VDD3 Digital pad ring VDD3 3.3 V VDD3 123
120 DRA4 SDRAM address 4 out, 3.3 V, 4 mA 124
121 DRA3 SDRAM address 3 out, 3.3 V, 4 mA 125
122 DRA2 SDRAM address 2 out, 3.3 V, 4 mA 126
123 DRA1 SDRAM address 1 out, 3.3 V, 4 mA 127
124 DRA0 SDRAM address 0 out, 3.3 V, 4 mA 128
125 DRWR SDRAM write control out, 3.3 V, 4 mA 129
126 DRCAS SDRAM col address sel out, 3.3 V, 4 mA 130
127 DRRAS SDRAM row address sel out, 3.3 V, 4 mA 131
128 DRCLKE SDRAM CLK enable out, 3.3 V, 4 mA 132
129 DRCLK SDRAM CLK out, 3.3 V, 4 mA 133
Table 2. Pin List (continued)
N° Name Description Pin type LQFP144
STA1052 Pin description
11/14
130 VSS Digital pad ring VSS ground VSS 134
131 VDD3_Core1 Digital pad ring VDD3 3.3 V VDD3 135
132 GPC15 (DRD15) GPIO PC15 (SDRAM Data 15) bidir, 3.3 V, 4 mA 136
133 GPC14 (DRD14) GPIO PC14 (SDRAM Data 14) bidir, 3.3 V, 4 mA 137
134 GPC13 (DRD13) GPIO PC13 (SDRAM Data 13) bidir, 3.3 V, 4 mA 138
135 GPC12 (DRD12) GPIO PC12 (SDRAM Data 12) bidir, 3.3 V, 4 mA 139
136 GPB9 GPB9 (I2S1_Rx_SCK (SC10)) bidir, 3.3 V, 2 mA,
PU (default off) 140
137 GPB10 GPB10 (I2S1_Rx_WCK (SC11)) bidir, 3.3V, 2mA,
PU (default off) 141
138 GPB11 GPB11 (I2S1_Rx_SDI (SRD1)) bidir, 3.3 V, 2 mA,
PU (default off) 142
139 GPC11 (DRD11) GPIO PC11 (SDRAM Data 11) bidir, 3.3 V, 4 mA 143
140 GPC10 (DRD10) GPIO PC10 (SDRAM Data 10) bidir, 3.3V , 4 mA 144
1. The specifications in USB mode are as per USB specifications for low and full speed interface.
Table 2. Pin List (continued)
N° Name Description Pin type LQFP144
Package information STA1052
12/14
4 Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 3. LQFP144 (20x20x1.4mm) mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A1.600 0.0630
A1 0.050 0.150 0.0020 0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b0.170 0.220 0.270 0.0067 0.0087 0.0106
c0.090 0.200 0.0035 0.0079
D21.800 22.000 22.200 0.8583 0.8661 0.8740
D1 19.800 20.000 20.200 0.7795 0.7874 0.7953
D3 17.500 0.6890
E21.800 22.000 22.200 0.8583 0.8661 0.8740
E1 19.800 20.000 20.200 0.7795 0.7874 0.7953
E3 17.500 0.6890
e0.500 0.0197
L0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 1.000 0.0394
k0˚(min.), 3.5˚(typ.), 7˚(max.)
ccc 0.080 0.0031
LQFP144 (20x20x1.40mm)
Low profile plastic Quad Flat Package
Note 1: Exact shape of each corner is optional.
0099183 C
STA1052 Revision history
13/14
5 Revision history
Table 3. Document revision history
Date Revision Changes
12-Mar-2008 1 Initial release.
17-Sep-2013 2 Updated Disclaimer.
STA1052
14/14
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
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