tyco Product 4108-57134 Electronics Specification 12-AUG-2005 Rev B COMPACT FLASH CARD, 1.27mm(.050) PITCH 1. SCOPE 1.1. CONTENTS This specification covers the performance, tests and quality requirements for COMPACT FLASH CARD, 1.27mm(.050) PITCH Connector. 1.2. QUALIFICATION When tests are performed on the subject product line, the procedures specified in Tyco 109 series specifications shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. 2. APPLICABLE DOCUMENT The following Tyco documents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1. TYCO SPECIFICATIONS A. 109-1: General Requirements for Test Specifications B. 109-197 : Tyco Specification vs EIA and IEC Test Methods C. 501-57118 : Test Report 3. REQUIREMENTS 3.1. DESIGN AND CONSTRUCTION Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2. MATERIALS A. Housing : Thermoplastic High Temperature, UL94V-0. B.Contact : Copper Alloy, Gold plating on contact area, Tin Plating on soldertail over Nickel underplating overall. 3.3. RATINGS A. Voltage: 100 VAC rms. B. Current: 0.5 A Max. C. Temperature: - 55 C to 85 C DR DATE | APVD DATE Oblic Hu 12-Aug-2005 | Wei-Jei Ke 12-Aug-2005 P-05-000084 TYCO Holdings (Bermuda) VII LTD. i ification i tyco 8 Tanean Branch. . This specification is a controlled document. 3F, No. 45, Dongsing Road, 1 of 4 : Taipei, 1070, Taiwan. ROC. Flectronics TEL : 86-2-8768-2788 Loc DWtyco Flectronics 108-57134 3.4. PERFOMANCE REQUEIREMENT AND TEST DESCRIPTION The product is designed to meet the electrical, mechanical and environmental performance requirements specified in Figure 1. 3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY TEST ITEM REQUIREMENT PROCEDURE Examination of Product Meets requirements of product drawing. No physical damage. Visual inspection. ELECTRICAL Contact Resistance [40] m Ohm Max(Initial) [40] m Ohm Max(Final) Subject mated contacts assembled in housing to 20mV Max open circuit at 10mA Max. EIA-364-6B. Refer to Fig.3 Dielectric withstanding Voltage No creeping discharge or flashover shall occur. Current leakage: 0.5 mA MAX [500]VAC for 1minute Test between adjacent circuits of unmated connector. EIA-364-20B Insulation Resistance [1000] M Ohm Min.(Initial) [1000] M Ohm Min.(Final) Impressed voltage 500 VDC. Test between adjacent circuits of unmated connector. EIA-364-21C. MECHANICAL Operation Speed : [25] mm/min. Mating Force 2.94kgf Max. Measure the force required to mate connector. EIA-364-13B Operation Speed : [25] mm/min. Unmating Force 0.5kgf Min. Measure the force required to unmate connector. EIA-364-13B Operation Speed : [10] cycle/min. Durability See Note Durability Cycles : 10,000 Cycles EIA-364-9C No electrical discontinuity Subject mated connectors Beet Hz Vibration greater than 0.1 or 1. sec shall amplitude 2 Hours each of 3 mutually occur. See Note. perpendicular planes. 100mA Max. Applied. EIA-364-28D Mechanical Shock No electrical discontinuity greater than 0.1 or 1 4 sec shall occur. Accelerate Velocity : 490m/s2 (50G ) Waveform : Half-sine shock plus Duration : 11msec No. of Drops : 3 drops each to normal and reversed directions of X,Y and Z axes, See Note. totally 18 drops, passing DC 1mA current during the test. EIA-364-27B MECHANICAL Contact Retention Force 4kgf Min. Measure the contact retention force with Tensile strength tester. Solder ability The inspected area of each lead must have 95% solder coverage minimum. Steam Aging Preconditioning : 93+3/-5C 100%RH 8hrs. Solder pot temperature: 245+5C , 5sec Figure 1 (Cont. ) Rev B 2 of 4tyco Flectronics 108-57134 ENVIRONMENTAL Resistance to Wave Soldering Heat No physical damage shall occur. Solder Temp. : 265+5C, 10+0.5sec. Tyco spec. 109-202, Condition B Resistance to Reflow Soldering Heat No physical damage shall occur. Pre-soak condition, 85C /85% RH for 168 hours. Pre Heat : 150~180C , 90+30sec. Heat : 230C Min., 30410sec. Peak Temp. : 245+0/-5C, 10~30sec. Duration : 3 cycles Tyco spec. 109-201, Condition A Resistance to Reflow Soldering Heat No physical damage shall occur. Pre-soak condition, 85C /85% RH for 168 hours. Pre Heat : 150~180C , 90+30sec. Heat : 230C Min., 30410sec. Peak Temp. : 260+0/-5C , 20~40sec. Duration : 3 cycles Tyco spec. 109-201, Condition B Thermal Shock See Note Mated Connector -55+/-3C (30 minutes), +85+/-2C (30 minutes) Perform this a cycle, repeat 5 cycles EIA-364-32C Humidity-Temperature Cycle See Note Mated Connector 25~65C , 90~95% RH, 10 Cycles EIA-364-31B. Temperature Life See Note Mated Connector 85C , 250 hours, EIA-364-17B. Salt Spray No detrimental corrosion allowed in contact area and base metal exposed. Subject mated connectors to 35+/-2 C and 5+/-1% salt condition for 48hours. After test, rinse the sample with water and recondition the room temperature for 1 hour. EIA-364-26B. Figure 1 (End) NOTE : Shall meet visual requirements, show no physical damage, and meet requirement of additional tests as specified in the test sequence in Figures 2 Rev B 3 of 4tyco Flectronics 108-57134 3.6. PRODUCT QUALIFICATION AND REQUALIFICATION TEST Test or Examination Test Group A|B/|C|D]E]FIGI]HI 1 Test Sequence (a) {Examination of Product 1,6 1,5 1,5 1,5 1,3 1,3 Contact Resistance 1,9 2,8] 2,5 2,4 2,4 2,4 1,5 2,4 {Dielectric withstanding Voltage insulation Resistance alo IMating Force |Unmating Force |e OIN IDurability Vibration IMechanical Shock Contact Retention Force Solderability iResistance to Soldering Heat Thermal Shock {Humidity Temperature Cycling Temperature Life Salt Spray Figure 2 NOTE: (a) Numbers indicate sequence in which tests are performed. (b) Discontinuities shall not take place in this test group, during tests. Rev 4of 4