Part Number: XZMD105S 3.0x2.0mm SURFACE MOUNT LED LAMP Features z 3.0mm x 2.0mm, 1.3mm high, only minimum space required. z Suitable for compact optoelectronic applications. z Low power consumption. z Package : 2000pcs / reel. z Moisture sensitivity level : level 3. z RoHS compliant. Notes: Operating Characteristics (TA=25C) 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25C) MD (AlGaInP) Unit Reverse Voltage VR 5 V Forward Current IF 30 mA Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS 185 mA Power Dissipation PD 75 mW Operating Temperature TA -40 ~ +85 Tstg -40 ~ +85 Storage Temperature Part Number XZMD105S Emitting Color Red Published Date : JUL 23, 2010 Emitting Material AlGaInP C Unit Forward Voltage (Typ.) (IF=20mA) VF 1.9 V Forward Voltage (Max.) (IF=20mA) VF 2.5 V Reverse Current (Max.) (VR=5V) IR 10 uA Wavelength of Peak Emission (Typ.) (IF=20mA) P 650 nm Wavelength of Dominant Emission (Typ.) (IF=20mA) D 630 nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) 27 nm Capacitance (Typ.) (VF=0V, f=1MHz) C 45 pF Luminous Intensity (IF=20mA) mcd Lens-color Water Clear Drawing No : XDSB4853 MD (AlGaInP) V1 min. typ. 200 397 Wavelength nm P Viewing Angle 2 1/2 650 125 Checked : B.L.LIU P.1/5 Part Number: XZMD105S 3.0x2.0mm SURFACE MOUNT LED LAMP Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. Published Date : JUL 23, 2010 Drawing No : XDSB4853 V1 Checked : B.L.LIU P.2/5 Part Number: XZMD105S 3.0x2.0mm SURFACE MOUNT LED LAMP MD Published Date : JUL 23, 2010 Drawing No : XDSB4853 V1 Checked : B.L.LIU P.3/5 Part Number: XZMD105S 3.0x2.0mm SURFACE MOUNT LED LAMP Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) The device has a single mounting surface. The device must be mounted according to the specifications. Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Published Date : JUL 23, 2010 Drawing No : XDSB4853 V1 Checked : B.L.LIU P.4/5 Part Number: XZMD105S 3.0x2.0mm SURFACE MOUNT LED LAMP PACKING & LABEL SPECIFICATIONS Published Date : JUL 23, 2010 Drawing No : XDSB4853 XZMD105S V1 Checked : B.L.LIU P.5/5