3.0x2.0mm SURFACE MOUNT LED
LAMP
Published Date : JUL 23, 2010 Drawing No : XDSB4853 V1 Checked : B.L.LIU P.1/5
Part Number: XZMD105S
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. Specifications are subject to change without notice.
Absolute Maximum Ratings
(TA=25°C)
MD
(AlGaInP) Unit
Reverse Voltage VR 5 V
Forward Current IF 30 mA
Forward Current (Peak)
1/10 Duty Cycle
0.1ms Pulse Width
iFS 185 mA
Power Dissipation PD 75 mW
Operating Temperature TA -40 ~ +85
°C
Storage Temperature Tstg -40 ~ +85
Operating Characteristics
(TA=25°C)
MD
(AlGaInP) Unit
Forward Voltage (Typ.)
(IF=20mA) VF 1.9 V
Forward Voltage (Max.)
(IF=20mA) VF 2.5 V
Reverse Current (Max.)
(VR=5V) IR 10 uA
Wavelength of Peak
Emission (Typ.)
(IF=20mA)
λP 650 nm
Spectral Line Full Width
At Half-Maximum (Typ.)
(IF=20mA)
Δλ 27 nm
Capacitance (Typ.)
(VF=0V, f=1MHz) C 45 pF
Wavelength of Dominant
Emission (Typ.)
(IF=20mA)
λD 630 nm
Part
Number
Emitting
Color
Emitting
Material Lens-color
Luminous
Intensity
(IF=20mA)
mcd
Wavelength
nm
λP
Viewing
Angle
2θ1/2
min. typ.
XZMD105S Red AlGaInP Water Clear 200 397 650 125°
Features
z3.0mm x 2.0mm, 1.3mm high, only minimum space
required.
zSuitable for compact optoelectronic applications.
zLow power consumption.
zPackage : 2000pcs / reel.
zMoisture sensitivity level : level 3.
zRoHS compliant.
3.0x2.0mm SURFACE MOUNT LED
LAMP
Published Date : JUL 23, 2010 Drawing No : XDSB4853 V1 Checked : B.L.LIU P.2/5
Part Number: XZMD105S
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner
diameter of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
3.0x2.0mm SURFACE MOUNT LED
LAMP
Published Date : JUL 23, 2010 Drawing No : XDSB4853 V1 Checked : B.L.LIU P.3/5
Part Number: XZMD105S
MD
3.0x2.0mm SURFACE MOUNT LED
LAMP
Published Date : JUL 23, 2010 Drawing No : XDSB4853 V1 Checked : B.L.LIU P.4/5
Part Number: XZMD105S
Tape Specification (Units : mm)
Recommended Soldering Pattern
(Units : mm; Tolerance: ±0.1)
The device has a single mounting surface. The device
must be mounted according to the specifications.
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Remarks:
If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength),
the typical accuracy of the sorting process is as follows:
1. Wavelength: +/-1nm
2. Luminous intensity / luminous flux: +/-15%
3. Forward Voltage: +/-0.1V
Note: Accuracy may depend on the sorting parameters.
3.0x2.0mm SURFACE MOUNT LED
LAMP
Published Date : JUL 23, 2010 Drawing No : XDSB4853 V1 Checked : B.L.LIU P.5/5
Part Number: XZMD105S
PACKING & LABEL SPECIFICATIONS XZMD105S
