COUT
0.1 µF
LM3480IM3-5.0
3
2 1 5 V, 100 mA OUT6.5 V IN
CIN
0.1 µF
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
LM3480 100-mA, SOT-23, Quasi Low-Dropout Linear Voltage Regulator
1 Features 3 Description
The LM3480 is an integrated linear voltage regulator.
1• Input Voltage Range: up to 30 V It features operation from an input as high as 30 V
• 3.3-V, 5-V, 12-V, and 15-V Versions Available and an ensured maximum dropout of 1.2 V at the full
• Packaged in the Tiny 3-Lead SOT-23 Package 100-mA load. Standard packaging for the LM3480 is
the 3-lead SOT-23 package.
• 30-V Maximum Input for Operation
• 1.2-V Ensured Maximum Dropout Over Full Load The 5-V, 12-V, and 15-V members of the LM3480
and Temperature Ranges series are intended as tiny alternatives to industry
standard LM78Lxx series and similar devices. The
• 100-mA Ensured Minimum Load Current 1.2-V quasi-low dropout of LM3480 series devices
• ±5% Ensured Output Voltage Tolerance Over Full makes them a nice fit in many applications where the
Load and Temperature Ranges 2-V to 2.5-V dropout of LM78Lxx series devices
•−40 to 125°C Junction Temperature Range for precludes their (LM78Lxx series devices) use.
Operation The LM3480 series also features a 3.3-V member.
The SOT-23 packaging and quasi-low dropout
2 Applications features of the LM3480 series converge in this device
to provide a very nice, very tiny, 3.3-V, 100-mA bias
• Tiny Alternative to LM78Lxx Series and Similar supply that regulates directly off the system 5-V ±5%
Devices power supply.
• Tiny 5-V ±5% to 3.3-V, 100-mA Converter
• Post Regulator for Switching DC/DC Converter Device Information(1)
• Bias Supply for Analog Circuits PART NUMBER PACKAGE BODY SIZE (NOM)
LM3480 SOT-23 (3) 2.92 mm × 1.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
space
space
space
Typical Application Circuit
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
www.ti.com
Table of Contents
7.2 Functional Block Diagram....................................... 10
1 Features.................................................................. 17.3 Feature Description................................................. 10
2 Applications ........................................................... 17.4 Device Functional Modes........................................ 10
3 Description............................................................. 18 Application and Implementation ........................ 11
4 Revision History..................................................... 28.1 Application Information............................................ 11
5 Pin Configuration and Functions......................... 38.2 Typical Application ................................................. 11
6 Specifications......................................................... 49 Power Supply Recommendations...................... 13
6.1 Absolute Maximum Ratings ...................................... 410 Layout................................................................... 13
6.2 ESD Ratings.............................................................. 410.1 Layout Guidelines ................................................. 13
6.3 Recommended Operating Conditions....................... 410.2 Layout Example .................................................... 13
6.4 Thermal Information.................................................. 411 Device and Documentation Support................. 14
6.5 Electrical Characteristics: LM3480-3.3, LM3480-5... 511.1 Trademarks........................................................... 14
6.6 Electrical Characteristics: LM3480-12, LM3480-15.. 611.2 Electrostatic Discharge Caution............................ 14
6.7 Typical Characteristics.............................................. 711.3 Glossary................................................................ 14
7 Detailed Description............................................ 10 12 Mechanical, Packaging, and Orderable
7.1 Overview................................................................. 10 Information........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (December 2014) to Revision G Page
• Changed pin numbers indicated in Typical Application drawing; fix typos............................................................................. 1
• Deleted soldering specs - found in POA ................................................................................................................................ 4
• Changed Handling Ratings to ESD Ratings format ............................................................................................................... 4
Changes from Revision E (March 2013) to Revision F Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes,Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section; add updated Thermal Information............................................................................................................................. 1
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ............................................................................................................. 9
2Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM3480
LM3480
www.ti.com
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
5 Pin Configuration and Functions
SOT-23 (DBZ) Package
3 Pins
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
OUT 1 O Output voltage
IN 2 I Input voltage supply
GND 3 — Common ground
Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM3480
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
MIN MAX UNIT
Input voltage (IN to GND) –0.3 35 V
Power dissipation(3) Internally
Limited
Junction temperature(3) –40 150 °C
Storage temperature, Tstg −65 150 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which operation of the device is ensured. Recommended operating ratings do not imply ensured performance limits.
For ensured performance limits and associated test conditions, see the Electrical Characteristics: LM3480-3.3, LM3480-5.
(2) If Military- or Aerospace-specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (TJ– TA) / RθJA where
TJis the junction temperature, TAis the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. The 370-mW
rating results from substituting the Absolute Maximum junction temperature, 150°C for TJ, 50°C for TA, and 269.6°C/W for RθJA. More
power can be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures.
The Absolute Maximum power dissipation can be increased by 3.7 mW for each °C below 50°C ambient. It must be derated by 3.7 mW
for each °C above 50°C ambient. Heat sinking enables the safe dissipation of more power. The LM3480 actively limits its junction
temperature to about 150°C.
6.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
Electrostatic
V(ESD) V
discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Maximum input voltage (IN to GND) 0 30 V
Junction temperature (TJ) –40 125 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which operation of the device is ensured. Recommended operating ratings do not imply ensured performance limits.
For ensured performance limits and associated test conditions, see the Electrical Characteristics: LM3480-3.3, LM3480-5.
6.4 Thermal Information LM3480
THERMAL METRIC(1) SOT-23 (DBZ) UNIT
3 PINS
RθJA Junction-to-ambient thermal resistance 269.6
RθJC(top) Junction-to-case (top) thermal resistance 141.1
RθJB Junction-to-board thermal resistance 63.1 °C/W
ψJT Junction-to-top characterization parameter 24.2
ψJB Junction-to-board characterization parameter 62.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM3480
LM3480
www.ti.com
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
6.5 Electrical Characteristics: LM3480-3.3, LM3480-5
Typical and other limits apply for TA= TJ= 25°C, unless otherwise specified. Nominal output voltage (VNOM) = 3.3 V or 5
V.(1)(2)(3)
VNOM = 3.3 V VNOM = 5 V
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
VIN = VNOM + 1.5 V 3.17 3.3 3.43 4.8 5 5.2
1 mA ≤IOUT ≤100 mA
VOUT Output voltage V
VIN = VNOM + 1.5 V
1 mA ≤IOUT ≤100 mA 3.14 3.46 4.75 5.25
−40°C ≤TJ≤125°C
VNOM + 1.5 V ≤VIN ≤30 V 10 12
IOUT = 1 mA
ΔVOUT Line regulation mV
VNOM + 1.5 V ≤VIN ≤30 V
IOUT = 1 mA 25 25
−40°C ≤TJ≤125°C
VIN = VNOM + 1.5 V 20 20
10 mA ≤IOUT ≤100 mA
ΔVOUT Load regulation mV
VIN = VNOM + 1.5 V
10 mA ≤IOUT ≤100 m 40 40
−40°C ≤TJ≤125°C
VNOM + 1.5 V ≤VIN ≤30 V 2 2
No Load
IGND Ground pin current mA
VNOM + 1.5 V ≤VIN ≤30 V
No Load, 4 4
−40°C ≤TJ≤125°C
IOUT = 10 mA 0.7 0.9 0.7 0.9 V
IOUT = 10 mA 1 1
−40°C ≤TJ≤125°C
VIN -Dropoutvoltage
VOUT IOUT = 100 mA 0.9 1.1 0.9 1.1 V
IOUT = 100 mA 1.2 1.2
−40°C ≤TJ≤125°C
VIN = 10 V
enOutput noise voltage 100 150 µVrms
Bandwidth: 10 Hz to 100 kHz
(1) A typical is the center of characterization data taken with TA= TJ= 25°C. Typicals are not ensured.
(2) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA= TJ= 25°C. All
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
(3) All voltages except dropout are with respect to the voltage at the GND pin.
Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM3480
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
www.ti.com
6.6 Electrical Characteristics: LM3480-12, LM3480-15
Typical and other limits apply for TA= TJ= 25°C, unless otherwise specified. Nominal output voltage (VNOM) = 12 V or 15
V.(1)(2)(3)
VNOM = 12 V VNOM = 15 V
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
VIN = VNOM + 1.5 V 11.52 12 12.48 14.4 15 15.6
1 mA ≤IOUT ≤100 mA
VOUT Output voltage V
VIN = VNOM + 1.5 V
1 mA ≤IOUT ≤100 mA 11.4 12.6 14.25 15.75
−40°C ≤TJ≤125°C
VNOM + 1.5 V ≤VIN ≤30 V 14 16
IOUT = 1 mA
ΔVOUT Line regulation mV
VNOM + 1.5 V ≤VIN ≤30 V
IOUT = 1 mA 40 40
−40°C ≤TJ≤125°C
VIN = VNOM + 1.5 V 36 45
10 mA ≤IOUT ≤100 mA
ΔVOUT Load regulation mV
VIN = VNOM + 1.5 V
10 mA ≤IOUT ≤100 mA 60 75
−40°C ≤TJ≤125°C
VNOM + 1.5 V ≤VIN ≤30 V 2 2
No Load
IGND Ground pin current mA
VNOM + 1.5 V ≤VIN ≤30 V 4 4
No Load, −40°C ≤TJ≤125°C
IOUT = 10 mA 0.7 0.9 0.7 0.9 V
IOUT = 10 mA, 1 1
−40°C ≤TJ≤125°C
VIN -Dropout voltage
VOUT IOUT = 100 mA 0.9 1.1 0.9 1.1 V
IOUT = 100 mA , 1.2 1.2
−40°C ≤TJ≤125°C
VIN = 10 V
enOutput noise voltage 360 450 µVrms
Bandwidth: 10 Hz to 100 kHz
(1) A typical is the center of characterization data taken with TA= TJ= 25°C. Typicals are not ensured.
(2) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA= TJ= 25°C. All
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
(3) All voltages except dropout are with respect to the voltage at the GND pin.
6Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM3480
LM3480
www.ti.com
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
6.7 Typical Characteristics
Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.
Figure 1. Dropout Voltage vs Load Current Figure 2. Dropout Voltage vs Junction Temperature
Figure 3. Ground Pin Current vs Input Voltage Figure 4. Ground Pin Current vs Input Voltage
Figure 5. Ground Pin Current vs Load Current Figure 6. Ground Pin Current vs Junction Temperature
Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM3480
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
www.ti.com
Typical Characteristics (continued)
Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.
Figure 7. Input Current vs Input Voltage Figure 8. Input Current vs Input Voltage
Figure 9. Output Voltage vs Input Voltage Figure 10. Output Voltage vs Input Voltage
Figure 11. Output Voltage vs Input Voltage Figure 12. Output Voltage vs Input Voltage
8Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM3480
LM3480
www.ti.com
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
Typical Characteristics (continued)
Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.
Figure 13. Output Short-Circuit Current Figure 14. Output Short-Circuit Current
Figure 15. Power Supply Rejection Ratio Figure 16. Power Supply Rejection Ratio
Figure 17. DC Load Regulation
Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LM3480
+
Thermal
Shutdown
IN OUT
GND
PNP
Bandgap
Reference
OVSD
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
www.ti.com
7 Detailed Description
7.1 Overview
The LM3480 is an integrated linear voltage regulator with inputs that can be as high as 30 V. It ensures a
maximum dropout of 1.2 V at the full load of 100 mA. The LM3480 has different output options including 3.3-V, 5-
V, 12-V, and 15-V outputs, making LM3480 the tiny alternative to industry standard LM78Lxx series and similar
devices.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 3.3-V, 5-V, 12-V, and 15-V Versions Available
The 3.3-V, 5-V, 12-V, and 15-V versions of LM3480 series are intended as tiny alternatives to industry standard
LM78Lxx series and similar devices.
7.3.2 1.2-V Ensured Maximum Dropout
The 1.2-V quasi-low dropout of the LM3480 series devices make them a nice fit in many application where the 2-
V to 2.5-V dropout of LM78Lxx series devices precludes their use.
7.4 Device Functional Modes
7.4.1 Operation with VIN =5V
The 3.3-V member of LM3480 can operate with an input of 5 V ±5%, its tiny SOT-23 package and quasi-low
dropout makes it suitable for providing a very tiny, 3.3-V, 100-mA bias supply from 5-V power supply.
10 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM3480
COUT
0.1 µF
LM3480IM3-5.0
3
2 1 5 V, 100 mA OUT6.5 V IN
CIN
0.1 µF
LM3480
www.ti.com
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM3480 is a linear voltage regulator with 1.2-V ensured maximum dropout and 100-mA ensured minimum
load current. This device has 3.3-V, 5-V, 12-V, and 15-V versions. The implementation of LM3480 is discussed in
this section.
8.2 Typical Application
8.2.1 Design Requirements
DESIGN PARAMETER EXAMPLE VALUE
Input voltage 6.5 V
Output voltage 5 V
Output current 100 mA
8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both
equivalent series resistance (ESR) and minimum amount of capacitance.
8.2.2.1.1 Output Capacitor
The output capacitance required to maintain stability is 0.1 µF. Larger values of output capacitance will give
improved transient response.
8.2.3 Application Curves
Unless indicated otherwise, VIN = 6.5 V, VOUT =5V,COUT = 0.1 µF, and TA= 25°C
Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LM3480
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
www.ti.com
Figure 18. Line Transient Response Figure 19. Line Transient Response
Figure 20. Load Transient Response Figure 21. Load Transient Response
Figure 22. Load Transient Response Figure 23. Load Transient Response
12 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM3480
VOUT
VIN
GND
IN
GND
OUT
2 1
3
LM3480
www.ti.com
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
9 Power Supply Recommendations
The LM3480 is designed to operated from up to a 30-V input voltage supply. This input supply must be well
regulated. If the input supply is noisy, additional input capacitors with low ESR can help to improve the output
noise performance.
10 Layout
10.1 Layout Guidelines
For best overall performance, place all the circuit components on the same side of the circuit board and as near
as practical to the respective LDO pin connections. Place ground return connections to the input and output
capacitors, and to the LDO ground pin as close to each other as possible, connected by a wide, component-side,
copper surface. The use of vias and long traces to create LDO circuit connections is strongly discouraged and
negatively affects system performance. This grounding and layout scheme minimizes the inductive parasitic, and
thereby reduces load-current transients, minimizes noise, and increases circuit stability.
A ground reference plane is also recommended and is either embedded in the PCB itself or located on the
bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output
voltage, shield noise, and behaves similar to a thermal plane to spread heat from the LDO device. In most
applications, this ground plane is necessary to meet thermal requirements.
10.2 Layout Example
Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LM3480
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
www.ti.com
11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
14 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM3480
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM3480IM3-12 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-12/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-15/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-3.3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-3.3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-12 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-12/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-15/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-3.3 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-3.3/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-5.0 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3480IM3-12 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-12/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-15/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-3.3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-3.3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3X-12 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-12/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-15/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-3.3 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-3.3/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-5.0 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2015
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LM3480IM3-12 LM3480IM3-12/NOPB LM3480IM3-15/NOPB LM3480IM3-3.3 LM3480IM3-3.3/NOPB LM3480IM3-
5.0 LM3480IM3-5.0/NOPB LM3480IM3X-12 LM3480IM3X-12/NOPB LM3480IM3X-15/NOPB LM3480IM3X-3.3
LM3480IM3X-3.3/NOPB LM3480IM3X-5.0 LM3480IM3X-5.0/NOPB