200 ASICs for Aerospace i n t e g r a t i o n s o l u t i o n s System Level Integration for the space market R aerospace S y s t e m Meeting communication satellite challenges tmel Wireless & Microcontollers A the way for System Level Integration. hardened VLSI products for space The currently Atmel Wireless & Microcontrollers dual- applications. experiencing the development of new use approach consists of adapting Committed since almost 20 years to applications like: commercial technologies that have is a major supplier of radiation serve we this demanding continuously market, improve our integration solutions. Being part of Atmel Corporation, a leading semiconductor company, Atmel Wireless & Microcontollers has access to advanced technolo- market is encrypted communication networks demonstrated their performance and very high resolution radar and in volume production, to meet the stringent rad-hard application sonar for military applications, technologies and products to provide our customers the most advanced space Dual use wide band communication satellites requirements, while keeping constellations, market compatibility. requiring more and more integration This gives our customers access capability for the ASICs, including to the latest innovations and allows based on LEO while for competitive solutions achieving lower power consumption and fast time-to-market. embedded functionality and shorter design cycle times. gies, manufacturing facilities and product portfolio. This enable us to extend our offer to the space industry with a unique capability, paving An impressive heritage Technology 0.6 m in the early 80's, the MART series allows integration to a few thousand gates, in the mid 80's, the MBRT series upgrades to 10K used gates, 0.35 m in the late 80's, the MCRT, series up to 45K used gates, first sub-micronic ASIC series ESA 0.25 m qualified under the capability approval concept which pioneered the later QML concept, 0.18 m in the mid 90's, the MG1RT series tackles the 300K used gate level, in 97 and 98, MG2RT and MG2RTP series allow 500K used gate / 100 Krad and 350K used gate / 350 Krad respectively, currently introduced, the MH1RT exhibits a gate complexity close to 2M used gates on our qualified 0.35 m CMOS process, 4 metal layers, characterized for 200 Krad, under development the hardening of 0.25 m process allowing to introduce in 2001 the MH2RT series which will offer close to 5M used gates. 0.5 m SEU immune RAM DPRAM FIFO FPGA Reusable IPs Flash E2PROM Embedded cores Libraries ASICs series offering A u n i q u e c a p a b i l i t y f o r i n t e g r a t i o n MH1RT AT56KRT 0.35 4 LOCOS MH2RT AT57KRT 0.25 5 STI SoG 700K 2200 94.6 607 available SoG 495K 1600 110 501 available SoG 7800K 20000 80 700 2Q2001 5 V 10% 3 V 10% 0.84 @ 3V 250 @ 3 V 130 @ 3 V 410 @ 5 V +l +l 5 V 10% 3 V 10% 1.1 @ 3V 200 @ 5 V 200 @ 5 V 440 @ 5 V SoG 3300K 8000 94.6 588 2Q2000 3.3 V 0,3 V 3 V 10 % 2.5 V 5% 0.4 @ 3V 180 @ 3.3 V 300 @ 3.3 V 800 @ 3.3 V 2.5 V 5% 1.8 V 5% 0.1 @ 2.5 V 115 @ 2.5 V 450 @ 2.5 V 900 @ 2.5 V Radiation Functional TID (Krads) Latch up (MeV) SEU LET threshold (MeV) 100 @ 5.5 V >100 >100 @ 2.7 V* 350 @ 5.5 V >100 >100 @ 2.7 V* 200 @ 3.3 V >100 >100 @ 2.7 V* 300 @ 2.625 V >100 >100 @ 2.375 V* Quality flow SCC/QML/883 SCC/QML/883 SCC/QML ASIC Available gates Used gates /mm2 Pad pitch (m) I/O capacity Availability Libraries +l +l +l Power consumption (W/gate/MHz) NAND2 typ. prop. delay (ps) Max PLL speed (MHz) Max toggle frequency (MHz) +l +l MG2RTP SCMOS3RTP 0.5 3 LOCOS +l +l MG2RT SCMOS3RT 0.5 3 LOCOS Process Feature size (m) Metal Layers Isolation SCC/883 * when using SEU free cell library Design tools Placement Routing > > System System Level Level Integration Integration > > Static analysis Power estimate Test insertion Abbreviations BGA - Ball Grid Array Packaging KGD BGA MQFPs MCM available CSP - Chip Size Package KGD - Known Good Die MCM - Multi Chip Module STI - Shallow Trench Isolation SoG - Sea of Gate Flip chip TID - Total Induced Dose on going development Wire bonding IP - Intellectual Property future development CSP Developing for the future Getting outstanding support Dedicated technical centers located in France, Germany, Italy, UK and USA allow us to provide our customers with the best support during the ASIC development project. Also Our permanent evaluation and manufacturing, assembly and test phases, are managed by a dedicated engineering team, activities permit ensuring the respect of all necessary steps and screening according to quality flows such forward movement in the fields of: as Mil 883, SCC9000 or QML Q or V. new IPs focusing on communication protocol standards such as the reducing ball pitch from current product is a 25 MHz single chip 1553 bus controller recently added 1.27 mm down to 0.5 mm, including the Integer Unit, Floating to our portfolio, new solutions for emerging hybrid Point unit, memory controller, and On SRAM based FPGAs, SEU immune and MCM applications requiring Chip Debugger with JTAG emulation, will enable a couple thousand either a new high density package gates to be embedded into any of style, such as CSP (Chip Size/Scale pin our ASIC series, Package) or our KGD concept, radiation hardened version of the EPROM and Flash memory , already available, combined with flip popular ADSP-21020, operating new assembly technologies allowing chip capabilities. at 60 MFLOPs, to accommodate almost 1000 pads with smaller packages: the flip chip solution will allow us to break this barrier, new package styles allowing more interconnects into a smaller size and lighter solution, like BGAs do, Atmel Wireless & Microcontrollers La Chantrerie, BP 70602 44306 Nantes cedex 3, France Tel : +33 2 40 18 18 18 Fax : +33 2 40 18 19 60 Main Sales Offices France Tel : 33 1 30 60 70 00 Germany Tel : 49 89 31 97 00 Broad range of products Floating Point DSP that is a C51 and Intel code based compatible 8-bit micro- controllers, SRAMs, DPRs and FIFOs memories, Atmel Wireless & Microcontrollers including optimized blocks and portfolio for aerospace also include: embedded processor cores for ASIC. 32-bit RISC microprocessors, based on Sparc architecture. The latest Italy Spain Sweden United Kingdom USA - Eastern USA - Western Hong Kong Korea Japan Tel : 39 2 38 03 71 Tel : 34 91 564 51 81 Tel : 46 8 587 48 800 Tel : 44 1 344 707 300 Tel : 1 908 730 7426 Tel : 1 408 441 0311 Tel : 852 23 789 789 Tel : 822 785 1136 Tel : 81 3 35 23 3551 For technical questions please contact: micro@tatmel-wm.com visit our web site: www.atmel-wm.com/nt/ams www.atmel-wm.com Atmel Wireless & Microcontrollers Ref.: ASIC AERO / 02.2000 - (c)Atmel Wireless & Microntrollers, 2000 development