MC74LVX138 3-to-8 Line Decoder With 5V-Tolerant Inputs The MC74LVX138 is an advanced high speed CMOS 3-to-8 line decoder. The inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V systems to 3.0 V systems. When the device is enabled, three Binary Select inputs (A0 - A2) determine which one of the outputs (O0 - O7) will go Low. When enable input E3 is held Low or either E2 or E1 is held High, decoding function is inhibited and all outputs go high. E3, E2, and E1 inputs are provided to ease cascade connection and for use as an address decoder for memory systems. http://onsemi.com SOIC-16 D SUFFIX CASE 751B Features * * * * * * * * * TSSOP-16 DT SUFFIX CASE 948F PIN ASSIGNMENT High Speed: tPD = 5.5 ns (Typ) at VCC = 3.3 V Low Power Dissipation: ICC = 4 mA (Max) at TA = 25 C Power Down Protection Provided on Inputs Balanced Propagation Delays Low Noise: VOLP = 0.5 V (Max) Pin and Function Compatible with Other Standard Logic Families Latchup Performance Exceeds 300 mA ESD Performance: Human Body Model > 2000 V; Machine Model > 200 V These Devices are Pb-Free and are RoHS Compliant VCC O0 O1 O2 O3 O4 O5 O6 16 15 14 13 12 11 10 9 7 8 1 2 3 4 5 6 A0 A1 A2 E1 E2 E3 O7 GND 16-Lead (Top View) PIN NAMES Pins Function A0-A2 E1-E2 E3 O0-O7 Address Inputs Enable Inputs Enable Input Outputs MARKING DIAGRAMS 16 16 LVX 138 ALYWG G LVX138G AWLYWW 1 1 SOIC-16 LVX138 A WL, L Y WW, W G or G TSSOP-16 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2014 August, 2014 - Rev. 4 1 Publication Order Number: MC74LVX138/D MC74LVX138 15 14 1 A0 13 12 SELECT INPUTS 2 A1 11 10 3 A2 9 7 4 E1 ENABLE INPUTS O0 O1 O2 O3 DATA OUTPUTS O4 O5 O6 O7 5 E2 6 E3 Figure 1. Logic Diagram INPUTS OUTPUTS E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7 H X X X H X X X L X X X X X X X X X H H H H H H H H H H H H H H H H H H H H H H H H L L L L L L L L H H H H L H L H L L H H L L L L L H H H H L H H H H L H H H H L H H H H H H H H H H H H H H H H L L L L L L L L H H H H L H L H L L H H H H H H H H H H H H H H H H H H H H H H L H H H H L H H H H L H H H H L H = High Voltage Level; L = Low Voltage Level; X = High or Low Voltage Level and Transitions Are Acceptable; For ICC reasons, DO NOT FLOAT Inputs A0 A1 A2 04 A3 A4 H 123 A0 A1 A2 E O0 O1 O2 O3 O4 O5 O6 O7 123 A0 A1 A2 123 E A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7 E O0 O1 O2 O3 O4 O5 O6 O7 O0 123 A0 A1 A2 E O0 O1 O2 O3 O4 O5 O6 O7 O31 Figure 2. Expansion to 1-of-32 Decoding http://onsemi.com 2 MC74LVX138 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Parameter -0.5 to +7.0 V Vin DC Input Voltage -0.5 to +7.0 V Vout DC Output Voltage -0.5 to VCC +0.5 V IIK Input Diode Current -20 mA IOK Output Diode Current 20 mA Iout DC Output Current, per Pin 25 mA ICC DC Supply Current, VCC and GND Pins 75 mA PD Power Dissipation 180 mW Tstg Storage Temperature -65 to +150 _C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 2.0 3.6 V VCC DC Supply Voltage Vin DC Input Voltage 0 5.5 V Vout DC Output Voltage 0 VCC V -40 +85 _C 0 100 ns/V TA Dt/DV Operating Temperature, All Package Types Input Rise and Fall Time Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS VCC V TA = 25C TA = -40 to 85C Min Typ Max Min Max Unit VIH High-Level Input Voltage 2.0 3.0 3.6 1.5 2.0 2.4 - - - - - - 1.5 2.0 2.4 - - - V VIL Low-Level Input Voltage 2.0 3.0 3.6 - - - - - - 0.5 0.8 0.8 - - - 0.5 0.8 0.8 V VOH High-Level Output Voltage (Vin = VIH or VIL) IOH = -50mA IOH = -50mA IOH = -4mA 2.0 3.0 3.0 1.9 2.9 2.58 2.0 3.0 - - - - 1.9 2.9 2.48 - - - V VOL Low-Level Output Voltage (Vin = VIH or VIL) IOL = 50mA IOL = 50mA IOL = 4mA 2.0 3.0 3.0 - - - 0.0 0.0 - 0.1 0.1 0.36 - - - 0.1 0.1 0.44 V Iin Input Leakage Current Vin = 5.5V or GND 3.6 - - 0.1 - 1.0 mA ICC Quiescent Supply Current Vin = VCC or GND 3.6 - - 4.0 - 40.0 mA Symbol Parameter Test Conditions Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. http://onsemi.com 3 MC74LVX138 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns) TA = 25C Symbol tPLH, tPHL tPLH, tPHL tPLH, tPHL tOSHL tOSLH Parameter Test Conditions Propagation Delay Input to Output Propagation Delay E3 to O Propagation Delay E1 or E2 to O Output-to-Output Skew (Note 1) TA = -40 to 85C Min Typ Max Min Max Unit ns VCC = 2.7V CL = 15pF CL = 50pF - - 7.1 9.6 13.8 17.3 1.0 1.0 16.5 20.0 VCC = 3.3 0.3V CL = 15pF CL = 50pF - - 5.5 8.0 8.8 12.3 1.0 1.0 10.5 14.0 VCC = 2.7V CL = 15pF CL = 50pF - - 8.7 11.2 16.3 19.8 1.0 1.0 19.5 23.0 VCC = 3.3 0.3V CL = 15pF CL = 50pF - - 6.8 9.3 10.6 14.1 1.0 1.0 12.5 16.0 VCC = 2.7V CL = 15pF CL = 50pF - - 8.8 11.3 16.0 19.5 1.0 1.0 18.5 22.0 VCC = 3.3 0.3V CL = 15pF CL = 50pF - - 6.9 9.4 10.4 13.9 1.0 1.0 11.5 15.0 VCC = 2.7V VCC = 3.3 0.3V CL = 50pF CL = 50pF - - - - 2.5 2.5 - - 2.5 2.5 ns ns ns 1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH); parameter guaranteed by design. CAPACITIVE CHARACTERISTICS TA = 25C Symbol Parameter TA = -40 to 85C Min Typ Max Min Max Unit Cin Input Capacitance - 4 10 - 10 pF CPD Power Dissipation Capacitance (Note 2) - 34 - - - pF 2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC . CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package) TA = 25C Symbol Characteristic Typ Max Unit VOLP Quiet Output Maximum Dynamic VOL - 0.5 V VOLV Quiet Output Minimum Dynamic VOL - -0.5 V VIHD Minimum High Level Dynamic Input Voltage - 2.0 V VILD Maximum Low Level Dynamic Input Voltage - 0.8 V http://onsemi.com 4 MC74LVX138 SWITCHING WAVEFORMS VALID A VALID VCC 50% tPLH tPHL tPHL O 50% GND GND tPLH VCC E3 50% VCC 50% VCC O Figure 3. . Figure 4. . VCC E2 or E1 50% GND tPHL O tPLH 50% VCC Figure 5. TEST CIRCUIT TEST POINT OUTPUT DEVICE UNDER TEST CL* *Includes all probe and jig capacitance Figure 6. ORDERING INFORMATION Package Shipping MC74LVX138DR2G SOIC-16 (Pb-Free) 2500 Tape & Reel MC74LVX138DTR2G TSSOP-16 (Pb-Free) 2500 Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC74LVX138 PACKAGE DIMENSIONS TSSOP-16 CASE 948F ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S S K EEE CCC CCC EEE K1 2X L/2 16 9 J1 B -U- L SECTION N-N J PIN 1 IDENT. N 0.25 (0.010) 8 1 M 0.15 (0.006) T U S A -V- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N F DETAIL E -W- C 0.10 (0.004) -T- SEATING PLANE H D DETAIL E G DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74LVX138 PACKAGE DIMENSIONS SOIC-16 CASE 751B-05 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 16 9 -B- 1 P 8 PL 0.25 (0.010) 8 M B S DIM A B C D F G J K M P R G R K F X 45 _ C -T- SEATING PLANE J M D MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT* 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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