45
AXK(1)
SIL terminal DIL terminal
FEATURES
1. An ultra thin, lightweight PC board
to PC board space of max. 0.1 mm is
realized. Contributes to miniaturiza-
tion of equipment.
An effective stacking height of 0.4 mm
and weight of 0.05 g is realized (with a
pitch between SIL terminals of 1.4 mm
and 8 contacts).
2. With bellows type contact construc-
tion, a large spring stroke is main-
tained, and the corresponding
stacking capacity is increased.
3. Automatic assembly and reduction
in part runs is possible, providing a
total cost reduction.
Compared to rubber connectors, the
number of parts and mounting costs can
be reduced.
4. For twin contact construction, the
SIL terminal realizes a high contact
reliability.
Also, the 1.0 mm terminal pitch type sup-
ports single-contact types for light loads
with leeway in positioning when assem-
bling the device.
APPLICATIONS
Cellular phones, PHS, PDAs and other
small portable devices.
• Example of connection between PC
board and LCD display of cellular
phone
• What is meant by “direct type”
connector?
Using this connector, the terminal
part is mounted on the PC board (B
in the figure below) by soldering, the
contact part, is pressed to the
pattern on the PC board (A in the
figure below) and stacking
connection performed.
SIL terminal
DIL terminal
,,
,,
,,
,,
,
,,
,
Pattern
B
A
Terminal part
Contact part
A
B
Effective
stacking
height (Min.)
Effective
stacking
height
Terminal part
Contact part Pattern
,
,
LCD display
PC board
Stacking height
Min. 0.4 mm
FPC
Hold
down
PRODUCT TYPES
Terminal layout Terminal pitch Recommended
stacking height Effective
stacking height No. of
contacts Contact tip Part No. Packing quantity
Inner carton (1 reel) Outer carton
SIL terminal
1.0mm
0.8mm 0.6mm to 1.0mm
14 Twin AXK1114355J 3,500 pcs. 7,000 pcs.
15 Twin AXK1115355J 3,500 pcs. 7,000 pcs.
17 Twin AXK1117335J 3,500 pcs. 7,000 pcs.
Single AXK1117375J 3,500 pcs. 7,000 pcs.
18 Single AXK1118375J 3,500 pcs. 7,000 pcs.
1.25mm 1.05mm to 1.4mm 10 Twin AXK1110535J 3,000 pcs. 6,000 pcs.
Single AXK1110575J 3,000 pcs. 6,000 pcs.
12 Twin AXK1112535J 3,000 pcs. 6,000 pcs.
1.45mm 1.25mm to 1.6mm 12 Twin AXK1112735J 3,000 pcs. 6,000 pcs.
13 Single AXK1113775J 3,000 pcs. 6,000 pcs.
1.1mm 1.15mm 0.95mm to 1.3mm 18 Twin AXK1418635J 3,000 pcs. 6,000 pcs.
1.35mm 1.15mm to 1.5mm 12 Twin AXK1412835J 3,000 pcs. 6,000 pcs.
18 Twin AXK1418835J 3,000 pcs. 6,000 pcs.
1.4mm 0.6mm 0.4mm to 0.8mm 8 Twin AXK1208435J 4,000 pcs. 8,000 pcs.
0.45mm to 0.8mm 14 Twin AXK1214435J 4,000 pcs. 8,000 pcs.
15 Twin AXK1215435J 4,000 pcs. 8,000 pcs.
0.65mm 0.5mm to 0.8mm 20 Twin AXK1220435J 4,000 pcs. 8,000 pcs.
3.5mm 0.95mm 0.7mm to 1.1mm 2 Twin AXK1302235J 3,000 pcs. 6,000 pcs.
DIL terminal 1.0mm 3.4mm 3.35mm to 3.6mm 20 Single AXK120185P 1,000 pcs. 2,000 pcs.
NARROW-PITCH
CONNECTORS
FOR BOARD-ON BOARD
CONNECTIONS
NARROW-PITCH
CONNECTORS
— DIRECT TYPE —
46
AXK(1)
SPECIFICATIONS
1. Characteristics
1) SIL terminal (terminal pith 1.0mm, 1.1mm)
Note) After pushing the connector contacting part from the recommended stacking height up to the connector part, return it to the same position and then measure.
Item Specifications Conditions
Terminal pitch 1.0mm Terminal pitch 1.1mm
Electrical
characteristics
Rated current 0.5A
Rated voltage 60V AC/DC
Breakdown
voltage 250V AC for 1 minute Detection current: 1mA
Insulation
resistance Min. 1,000M
Ω
(initial) Using 500V DC megger (applied for 1min.)
Contact
resistance Max. 50m
Ω
Measured based on the HP4338B measurement
method of JIS C 5402.
Mechanical
characteristics Contact force
(Note)
Environmental
characteristics
Ambient
temperature –55°C to +85°C No freezing at low temperature
Soldering heat
resistance Max. peak temperature of 245°C Infrared reflow soldering. However,
the temperature of the of PC board surface
adjacent to connector terminals.
300°C within 5 seconds/350°C within 3 seconds Soldering iron
Thermal shock
resistance
(header and
socket mated)
5 cycles,
insulation resistance Min. 100M
Ω
,
contact resistance Max. 50m
Ω
Lifetime
characteristics Insertion and
removal life 50 times,
contact resistance Max. 50m
Ω
Do not press the contact in further than the
surface of the molded portion of the connector.
Unit weight 0.1g (14 contacts) 0.1g (18 contacts)
Sequence Temperature (°C) Time (minutes)
1 –55 30
2 25 Max. 5
385 30
4 25 Max. 5
+0
−3
+10
−5
+3
−0
+10
−5
2) SIL terminal (terminal pith 1.4mm, 3.5mm)
Note) After pushing the connector contacting part from the recommended stacking height up to the connector part, return it to the same position and then measure.
Item Specifications Conditions
Terminal pitch 1.4mm Terminal pitch 3.5mm
Electrical
characteristics
Rated current 0.5A
Rated voltage 60V AC/DC
Breakdown
voltage 250V AC for 1 minute Detection current: 1mA
Insulation
resistance Min. 1,000M
Ω
(initial) Using 500V DC megger (applied for 1min.)
Contact
resistance Max. 80m
Ω
Measured based on the HP4338B measurement
method of JIS C 5402.
Mechanical
characteristics Contact force
(Note)
Environmental
characteristics
Ambient
temperature –55°C to +85°C No freezing at low temperature
Soldering heat
resistance Max. peak temperature of 245°C Infrared reflow soldering. However, the
temperature of the of PC board surface adjacent
to connector terminals.
300°C within 5 seconds/350°C within 3 seconds Soldering iron
Thermal shock
resistance
(header and
socket mated)
5 cycles,
insulation resistance Min. 100M
Ω
,
contact resistance Max. 80m
Ω
Lifetime
characteristics Insertion and
removal life 50 times,
contact resistance Max. 80m
Ω
Do not press the contact in further than the
surface of the molded portion of the connector.
Unit weight 0.05g (8 contacts) 0.03g (2 contacts)
Sequence Temperature (°C) Time (minutes)
1 –55 30
2 25 Max. 5
385 30
4 25 Max. 5
+0
−3
+10
−5
+3
−0
+10
−5
0.637
14, 15, 17 contacts twin connection:
N{65 gf}/2 points
+0.147
–0.098 +15
–10
10, 12 contacts twin connection:
0.441 N{45 gf}/2 points
+0.147
–0.098 +15
–10
10, 13, 17, 18 contacts single connection:
0.441 N{45 gf}/1 point
+0.147
–0.098 +15
–10
0.441 N{45 gf}/2 points
+0.147
–0.098 +15
–10
0.490 N{50 gf}/2 points
+0.196
–0.098 +20
–10
0.588 N{60 gf}/2 points
+0.147
–0.098 +15
–10
47
AXK(1)
3) DIL terminal
2. Material and surface treatment
3. Contact Side PC Board Specifications
mm General tolerance ±0.2
DIMENSIONS
1. SIL terminal Terminal pitch 1.0mm, stacking height 0.8mm, 14 contacts twin type
Item Specifications Conditions
Terminal pitch 1.0mm
Electrical
characteristics
Rated current 0.5A
Rated voltage 60V AC/DC
Breakdown
voltage 250V AC for 1 minute Detection current: 1mA
Insulation
resistance Min. 1,000M
Ω
(initial) Using 500V DC megger (applied for 1min.)
Contact
resistance Max. 60m
Ω
Measured based on the HP4338B measurement
method of JIS C 5402.
Mechanical
characteristics Contact force 0.29N to 0.78N{30gf to 80gf}/contacts
Environmental
characteristics
Ambient
temperature –55°C to +85°C No freezing at low temperature
Soldering heat
resistance Max. peak temperature of 245°C Infrared reflow soldering. However, the
temperature of the of PC board surface adjacent
to connector terminals.
300°C within 5 seconds/350°C within 3 seconds Soldering iron
Thermal shock
resistance
(header and
socket mated)
5 cycles,
insulation resistance Min. 100M
Ω
,
contact resistance Max. 60m
Ω
Lifetime
characteristics Insertion and
removal life 50 times,
contact resistance Max. 60m
Ω
Do not press the contact in further than the
surface of the molded portion of the connector.
Unit weight 0.33g (20 contacts)
Part name Material Surface treatment
Molded portion Heat resistant resin (UL94V-0) —
Contact/Post Copper alloy Contact portion: Au plating over Ni (Min. 0.1µm)
Soldering terminal portion: Au plating over Ni (Except for thick of terminal)
Contact portion surface treatment Au plating over Ni (Min. 0.2µm)
Sequence Temperature (°C) Time (minutes)
1 –55 30
2 25 Max. 5
385 30
4 25 Max. 5
+0
−3
+10
−5
+3
−0
+10
−5
0.80
2.20 1.96
0.20
0.80
(Operating position)
X-Y cross section
5.50
0.12
0.1
±0.1
0.60
+0.2
0
1.55
+0.08
0.60 0
16.70
17.65
17.25
14.70
7.00
0.65
0.40
13.00
17.00
1.00
1.60
1.50
0.40
4.30
0.60
2.45
(0.60)
±0.15
±0.15
±0.1 ±0.05
±0.05
±0.15
±0.1
±0.1
X
Y
13.00
0.66
C 0.25
0.72 dia.
15.00
0.72 dia.
0.12
±0.1
-0.15
0
±0.07
0
-0.05
±0.08
0
-0.05
0.55±0.08
±0.08
0.15
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.70±0.05
±0.05
1.00 13.00±0.05
16.40±0.05
18.40±0.05
±0.1
1.10
4.30±0.05
±0.1
1.10±0.1
3.352.05±0.05
15.00±0.05
0.90 dia.
+0.1
–0
0.80 dia.
±0.05
±0.05
17.00
1.00±0.05
±0.05
±0.05
13.00
0.65
2.00
48
AXK(1)
mm General tolerance ±0.2
2. SIL terminal Terminal pitch 1.0mm, stacking height 0.8mm, 15 contacts twin type
15.70
17.70
18.25
18.65
0.80
2.20
18.00±0.15
14.00±0.15
1.00±0.1
±0.05
0.40
0.65±0.1 0.35±0.1
X
Y
1.96
2.45
(0.60)
0.20
0.80 (Operating
position)
5.50
0.12
0.1
1.60
±0.1
4.30 ±0.15
0.60
±0.1
0.60
+0.2
0
1.55
+0.08
0.60 0
0.40±0.05
X-Y cross section
16.00±0.08
0.15±0.08
14.00±0.1 (Contact portion)
±0.08
0.55
0.12
±0.07
C 0.25
0.66 0
-0.15
0
0.72-0.05
0.72 dia.dia.
-0.05
0
Boss
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
19.40±0.05
17.40±0.05
14.00±0.05
1.00±0.05
0.70±0.05
16.00±0.05
18.00±0.05
1.10±0.1
0.80 dia.
4.30
2.05 3.35
1.10
±0.05
±0.05
±0.05 ±0.1
±0.1
0.90 dia.
0
+0.1
14.00±0.05
1.00±0.05 (0.65 )
±0.05
2.00
3. SIL terminal Terminal pitch 1.0mm, stacking height 0.8mm, 17 contacts twin type
±0.15
16.00
±0.05
0.40 ±0.1
1.00
20.00
19.50
17.70
±0.1
0.65 ±0.1
0.35
±0.1
16.00 ±0.08
0.55
0.72 dia.
0
–0.05
0.72 dia.
0
–0.05 ±0.08
18.00
±0.07
C 0.25
0.80
2.20
(0.60)
0
–0.15
0.66 2.03
1.60
4.30±0.1
0.60±0.15
1.60
±0.08
0.15
X-Y cross section
5.50
1.55
0.60
0.80 (Operating
position)
0.12
1.96
0.60±0.1
+0.08
0
+0.2
0
0.1
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
±0.05
0.80 dia.
+0.1
0.90 dia.
0
16.00±0.05
1.00±0.05
0.70±0.05
1.10±0.1
4.30±0.05
1.10±0.1
±0.05
18.00
16.00±0.05
±0.05
1.00 (0.65±0.05
2.00
)
4. SIL terminal Terminal pitch 1.0mm, stacking height 0.8mm, 17 contacts single type
±0.15
16.00
±0.05
0.40 ±0.1
1.00
±0.1
16.00
0.72 0
–0.05
0.72 dia.
dia.
0
–0.05 ±0.08
18.00
±0.07
C 0.25
0.80
2.20
(0.60)
0
–0.15
0.66 2.03
1.60
4.30±0.1
0.60±0.15
±0.08
0.40
1.60
0.50
19.50
20.00
0.50
17.70
±0.1
±0.1
X-Y cross section
5.50
1.55
0.60
0.80 (Operating
position)
0.12
1.96
0.60±0.1
+0.08
0
+0.2
0
0.1
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
±0.05
0.80 dia.
+0.1
0.90 dia.
0
16.00±0.05
1.00±0.05
0.70±0.05
1.10±0.1
4.30±0.05
1.10±0.1
±0.05
18.00
16.00±0.05
±0.05
1.00
2.00
(0.80 )
±0.05
49
AXK(1)
mm General tolerance ±0.2
5. SIL terminal Terminal pitch 1.0mm, stacking height 0.8mm, 18 contacts single type
(Operating position)
0.1
0.72 dia.
0
–0.05 0.72 dia.
0
–0.05
0.66 0
–0.15
0.40±0.08
C 0.25±0.07
5.50
1.55+0.2
0
0.60+0.08
0
0.60±0.1
0.12
1.96
1.60
2.03
1.00±0.1
0.40±0.05
0.50±0.1
(0.60) 4.30±0.1
0.50±0.1
1.60
0.60±0.15
18.70
20.50
21.00
17.00±0.15
17.00±0.1 (Contact portion)
19.00±0.08
0.80
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.90 dia.
+0.1
0
1.00±0.05
0.70±0.05
1.10±0.1
0.80
±0.05
dia.
4.30±0.05
1.10±0.1
17.00±0.05
19.00±0.05
(0.80±0.05) Note2)
1.00±0.05
2.00
17.00±0.05
6. SIL terminal Terminal pitch 1.0mm, stacking height 1.25mm, 10 contacts twin type
C0.2±0.07
9.0±0.15
0.4±0.05
1.0±0.1
11.1
12.5
13.0
0.35±0.1
0.65±0.1
±0.1
9.0
0
–0.05
0.7
±0.08
11.8
0
–0.05
0.7 dia.dia.
0.5–0.15
0
1.6
4.3±0.1
0.6±0.15
2.03
1.6
(0.6)
0.55±0.08
5.5
1.2
1.9
1.25 (Operating position)
(Straight portion)
2.2
0.6±0.1
1.05
0.12
+0.08
0
+0.2
0
0.1
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.88 dia.
+0.1
0
11.8±0.05
9.0±0.05
1.0±0.05
0.7±0.05
2.1±0.1
3.4±0.05
±0.05
0.78 dia.
±0.05
9.0 ±0.05
1.0 ±0.05
(0.65 )
2.0
7. SIL terminal Terminal pitch 1.0mm, stacking height 1.25mm, 10 contacts single type
C 0.2±0.07
9.0±0.15
0.4±0.05
1.0±0.1
11.1
12.5
13.0
0.35±0.1
0.65±0.1
±0.1
9.0
0
–0.05
0.7
±0.08
11.8
0
–0.05
0.7 dia.dia.
0.5–0.15
0
1.6
4.3±0.1
0.6±0.15
2.03
1.6
(0.6)
0.4±0.06
5.5
1.2
1.9
1.25 (Operating position)
(Straight portion)
2.2
0.6±0.1
1.05
0.12
+0.08
0
+0.2
0
0.1
Recommended PC board pattern
(T OP VIEW)
1. mounting pad layout
2. Surface contact pattern
0.88 dia.
+0.1
0
11.8±0.05
9.0±0.05
1.0±0.05
0.7±0.05
2.1±0.1
3.4±0.05
±0.05
0.78 dia.
±0.05
9.0 ±0.05
1.0 ±0.05
(0.80 )
2.0
50
AXK(1)
mm General tolerance ±0.2
8. SIL terminal Terminal pitch 1.0mm, stacking height 1.25mm, 12 contacts twin type
1.6
2.03
1.6
1.0±0.1
0.4±0.05
0.65±0.1 0.35±0.1
4.3±0.1
(0.6) 0.6±0.15
0.1
0.6±0.1
0.12
5.5
2.2
0.5 0
–0.15
1.05+0.08
0
0.7 0
–0.05
0.7
dia.
dia.
0
–0.05
C 0.2±0.07
1.25 (Operating position)
1.9+0.2
0
(Straight portion)
1.2
0.55±0.08
11.0±0.15
13.1
15.0
11.0±0.1 (Contact portion)
13.8±0.08
14.5
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.7±0.05 1.0±0.05
0.78
±0.05
dia.
0.88 dia.
+0.1
0
2.1±0.1
3.4±0.05
11.0±0.05
13.8±0.05
1.0±0.05
2.0
(0.65±0.05)
11.0±0.05
9. SIL terminal Terminal pitch 1.0mm, stacking height 1.45mm, 12 contacts twin type
1.6
2.03
1.6
1.0±0.1
0.4±0.05
0.65±0.1 0.35±0.1
4.3±0.1
(0.6) 0.6±0.15
0.1
0.6±0.1
0.12
5.5
0.5 0
–0.15
0.7 0
–0.05
C 0.2±0.07
0.7
dia. dia.
0
–0.05
(Straight portion)
1.2
13.8±0.08
11.0±0.1 (Contact portion)
11.0±0.15
15.0
14.5
13.1
1.25+0.08
0
1.45 (Operating position)
2.1
2.1+0.2
0
1.7
0.55±0.08
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.7±0.05
1.0±0.05
0.78
±0.05
dia.
0.88 dia.
+0.1
0
2.1±0.1
3.4±0.05
11.0±0.05
13.8±0.05
1.0±0.05
2.0
11.0±0.05
(0.65±0.05)
51
AXK(1)
mm General tolerance ±0.2
10. SIL terminal Terminal pitch 1.0mm, stacking height 1.45mm, 13 contacts single type
1.6
2.03
1.6
1.0±0.1
0.4±0.05
0.65±0.1 0.35±0.1
4.3±0.1
(0.6) 0.6±0.15
0.1
0.6±0.1
0.12
5.5
0.5 0
–0.15
0.7 0
–0.05
C 0.2±0.07
0.7
dia. dia.
0
–0.05
(Straight portion)
1.2
1.25+0.08
0
1.45 (Operating position)
2.1
0.4±0.06
2.1+0.2
0
1.7
12.0±0.1 (Contact portion)
14.8±0.08
12.0±0.15
14.1
15.5
16.0
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.7±0.05 1.0±0.05
0.78
±0.05
dia.
0.88 dia.
+0.1
0
2.1±0.1
3.4±0.05
14.8±0.05
12.0±0.05
1.0±0.05
(0.80±0.05)
2.0
12.0±0.05
11. SIL terminal Terminal pitch 1.1mm, stacking height 1.15mm, 18 contacts twin type
18.70±0.15
0.4±0.05
1.1±0.1
0.45±0.1
0.65±0.1
20.7
22.1
22.6
18.7 (Contact portion)
±0.1
0.55±0.08
Connection
portion
21.4±0.08
0
–0.05
0.72 dia.
0
–0.05
0.72 dia.
C 0.2±0.07
±0.08
0.47 (0.6)
±0.1
4.3
±0.15
0.6
2.03
1.6
1.6
(
Straight portion
)
5.5
1.5
+0.2
0
1.95
1.15 (Operating position)
±0.1
0.6 2.2
0.1
+0.08
0
0.95
0.12
Recommended PC board pattern
(T OP VIEW)
1. mounting pad layout
2. Surface contact pattern
18.7±0.05
21.4±0.05
0.8 dia.
±0.05
+0.1
0
0.9 dia.
1.1±0.05
0.7±0.05
±0.1
2.1
±0.05
3.4
18.7±0.05
(0.8±0.05 1.1±0.05
2.0
)
52
AXK(1)
mm General tolerance ±0.2
12. SIL terminal Terminal pitch 1.1mm, stacking height 1.35mm, 12 contacts twin type
C 0.2±0.07
12.1±0.1 (Contact portion)
1.6
2.03
4.3±0.1
(0.6)
15.5
0.72 0
–0.05
14.8±0.08
16.0
0.4±0.05
12.1±0.15
0.72
dia. dia.
0
–0.05
1.1±0.1
0.47±0.08
14.1
0.65±0.1
0.45±0.1
0.55±0.08
(Terminal coplanarity)
0.1
1.15+0.08
0
2.2
1.7
1.35 (Operating position)
2.15+0.2
0
0.12
1.5 (Straight portion)
1.6
0.6±0.15
0.6±0.1
5.5
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.9 dia.
+0.1
0
3.4±0.05 2.1±0.1
0.8
±0.05
dia.
0.7±0.05
12.1±0.05
1.1±0.05
14.8±0.05
(0.8±0.05)
2.0
1.1±0.05 12.1±0.05
13. SIL terminal Terminal pitch 1.1mm, stacking height 1.35mm, 18 contacts twin type
18.7±0.15
18.7±0.1 (Contact portion)
20.7
0.47±0.08
22.6
C 0.2±0.07
0.4±0.05
22.1
21.4±0.06
(0.6)
2.03
1.6
0.72 0
–0.05
0.45±0.1
0.65±0.1
1.1±0.1
0.72dia. dia.
0
–0.05
4.3±0.1
0.55±0.08
1.6
0.6±0.15
0.1
(Terminal coplanarity)
0.6±0.1
1.5 (Straight portion)
0.12
2.15 +0.2
0
1.35 (Operating position)
1.7
2.2
1.15+0.08
0
5.5
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
3.4±0.05
0.9 dia.
+0.1
0
0.8
±0.05
dia.
21.4±0.05
18.7±0.05
0.1±0.05
2.1±0.1
1.1±0.05
18.7±0.05
2.0
(0.8±0.05)
1.1±0.05
53
AXK(1)
mm General tolerance ±0.2
14. SIL terminal Terminal pitch 1.4mm, stacking height 0.6mm, 8 contacts twin type
0.85
11.48
13.5
0.1
0.1
0.6(Operating position)
1.8
2.03
1.8
1.6
5.5
(0.6)
1.5
1.75
0.6±0.05
9.8±0.15
0.6±0.08
0.15±0.08
12.5±0.08
C0.25±0.08
±0.08
0.7
-0.2
14.0 0
-0.15
4.9 0
4.3-0.1
0
0.72 dia.
-0.05
0
0.72 dia.
-0.05
0
1.4+0.2
0
0.4+0.08
0
X
Y
1.4±0.1
9.8±0.1(Contact portion)
1.5
(Straight portion)
X-Y cross section
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.9 dia.
+0.1
9.8±0.05
1.4±0.05
0.8±0.05
12.5±0.05
0.8 dia.
±0.05
3.1±0.05
0
2.4±0.1
3.5
±0.05
9.8
±0.05
1.4
±0.05
(0.95 )
15. SIL terminal Terminal pitch 1.4mm, stacking height 0.6mm, 14 contacts twin type
(Straight portion)
0.1
±0.15
18.2
±0.05
0.6
±0.1
1.4
0.85 20.15
21.9
0
–0.2
22.4
(0.6)
5.5
±0.1
4.9
±0.1
4.3 2.03
1.8
1.6
±0.1
18.2
±0.08
0.6 ±0.08
0.15
Connection
portion
±0.08
20.9
0
–0.05
0.72 dia.
0
–0.05
0.72 dia.
0.55±0.08
±0.08
C 0.25
+0.2
0
1.4
0.6 (Operating position)
1.5
1.75
+0.08
0
0.45
0.1
(Contact portion)
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
±0.05
18.2
±0.05
1.4±0.05
0.8
±0.05
20.9
±0.1
2.4
±0.05
3.1
±0.05
0.8 dia.
+0.1
0
0.9 dia.
±0.05
18.2
±0.05
1.4
±0.05
(0.95
3.5
)
16. SIL terminal Terminal pitch 1.4mm, stacking height 0.6mm, 15 contacts twin type
0.85
21.55
23.3
0.1
0.1
0.6(Operating position)
1.8
2.03
1.8
1.6
5.5
(0.6)
1.5
1.75
0.6±0.05
19.6±0.15
0.6±0.08
0.15±0.08
C0.25±0.08
0.7
-0.2
23.8 0
-0.15
4.9 0
4.3-0.1
0
0.72 dia.
-0.05
0
0.72 dia.
-0.05
0
1.4+0.2
0
0.45+0.08
0
X
Y
1.4±0.1
22.3±0.08
±0.08
±0.1
19.6
(Contact portion)
1.5
(Straight portion)
X-Y cross section
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.9 dia.
+0.1
1.4±0.05
0.8±0.05
22.3±0.05
0.8 dia.
±0.05
3.1±0.05
0
±0.05
19.6
±0.1
2.4
3.5
±0.05
1.4
±0.05
(0.95 )
±0.05
19.6
54
AXK(1)
18. SIL terminal Terminal pitch 3.5mm, stacking height 0.95mm, 2 contacts twin type
C0.25
7.0
0.4
0.2
1.8
5.6 0.95(Operating position)
3.4 1.0
0.5
2.6
1.2
(0.6)
0.21.5
1.56
2.06
R0.9
R4.8
3.5±0.08
4.7±0.1
1.2±0.1
0.6±0.08
0.15±0.08
5.9±0.08
0.65±0.08
±0.08
0.7±0.08
0.4
7.4-0.2
0
4.5+0.1
0
-0.2
0
5.5
4.9-0.1
0
0.72 dia.
-0.05
0
+0.2
0
1.95
0.1
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
0.9 dia.
+0.1
0.6±0.05
3.5±0.05
5.9±0.05
0
±0.05
0.8 dia.
2.4±0.1
3.1±0.05
3.5
1.0
(6.0)
3.25
mm General tolerance ±0.3
17. SIL terminal Terminal pitch 1.4mm, stacking height 0.65mm, 20 contacts twin type
(0.6)
28.55
30.3
0.85
5.5
4.9
4.3 2.03
1.8
1.6
0.6
1.4
26.6
30.8±0.15
–0.2
0
±0.1
±0.05
0
–0.1
0
–0.15
Y
X
26.6 (Contact portion)
0.6
0.15
29.3
0.72 dia. 0.72 dia.
C 0.25±0.08
0
–0.05
±0.08
–0.05
0
±0.08
±0.08
±0.1
0.55
0.1
±0.08
1.4
0.1
0.65 (Operating position)
0.5
1.5
(Straight portion)
1.5
1.7
0
+0.08
+0.2
0
X-Y cross section
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
3.1 2.4
0.8 dia.
29.3
0.9 dia.
0.8
1.4 26.6±0.05
±0.05
±0.05
+0.1
0
±0.05
±0.05
±0.05 ±0.1
26.6
1.4
(0.95 )
3.5
±0.05
±0.05
±0.05
AXK(1)
mm General tolerance ±0.3
19. DIL terminal Terminal pitch 1.0mm, stacking height 3.4mm, 20 contacts single type
(6.4)
8.6±0.2 3.3±0.1
3.85+0.2
–0.1
11.0
7.0
PC board for the
connector mounting
1.0±0.1
0.3±0.1
0.5±0.1
2.8 dia. (Suction face)
9.0
MAX 3.4
0.10
5.5±0.2
3.35±0.15
8.6±0.2
7.2
Mating PC board
Recommended PC board pattern
(T OP VIEW)
1. Mounting pad layout
2. Surface contact pattern
MIN 9.2
6.40±0.05
9.00±0.05
1.00±0.05
0.60±0.05
0.30±0.05
0.90±0.05
MIN 7.8
MAX 4.8
9.00±0.05
1.00±0.05
0.70±0.05
X
Y
Note) The plating for the contact side of the PC board should
be with a Ni underlay and Au overplating (Min. 0.2 µm).
Allowable discrepancy of the dimensions between the
connector and the PC board, when the abov e PC pattern
is accepted.
X direction: ±0.15
Y direction: ±0.4
CUSTOM PRODUCTS
Please consult us if you wish for specifications other than those given above.
DIL terminal 8 contacts DIL terminal 30 contacts DIL terminal 38 contacts
EMBOSSED T APE DIMENSIONS
Please refer to page 59.
NOTES
1.
As this connector is connected directly
to the PC board, the surface of the PC
board should be free from dust, dirt, and
corrosion.
2.
The attachment to the PC board
should be designed so as not to cause
warping due to connector reaction forces .
Also , please refer to the tolerances f or the
alignment between the connector and the
PC board that are indicated in the figure
showing the dimensions.
Regarding general notes, please
refer to pages 8 and 9.
12/1/2002 All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
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