MIC2871 1.2A High-Brightness Flash LED Driver with Single-Wire Serial Interface Features General Description * Up to 1.2A Flash LED Driving Current * Highly Efficient, Synchronous Boost Driver (up to 94%) * 5% LED Current Accuracy * Control through Single-Wire Serial Interface or External Control Pins * Input Voltage Range: 2.7V to 5.5V * True Load Disconnect * Configurable Safety Time-Out Protection * Output Overvoltage Protection (OVP) * LED Short Detection and Protection * 1 A Shutdown Current * Available in 14-Pin 3 mm x 2 mm LDFN Package The MIC2871 is a high-current, high-efficiency flash LED driver. The LED driver current is generated by an integrated inductive boost converter with a 2 MHz switching frequency, which allows the use of a very small inductor and output capacitor. These features make the MIC2871 an ideal solution for high-resolution camera phone LED flashlight driver applications. Applications * Camera Phones/Mobile Handsets * Cell Phones/Smartphones * LED Light for Image Capture/Auto-Focus/ White Balance * Handset Video Light (Torch Light) * Digital Cameras * Portable Applications 2018 Microchip Technology Inc. The MIC2871 operates in either Flash or Torch modes that can be controlled through the single-wire serial interface and/or external control pins. Default flash and torch brightness can be adjusted via an external resistor. A robust single-wire serial interface allows simple control by the host processor to support typical camera functions. such as auto-focus, white balance, and image capture (Flash mode). The MIC2871 is available in a 14-pin 3 mm x 2 mm LDFN package with a junction temperature range of -40C to +125C. DS20006079A-page 1 MIC2871 Package Type MIC2871 14-Pin 3 mm x 2 mm LDFN (MK) (Top View) AGND1 1 14 FRSET DC 2 13 PGND2 LED 3 12 NC FEN1 4 11 FEN2 AGND2 5 10 SW VIN 6 9 NC PGND1 7 8 OUT ePAD (EP) Typical Application Schematic L1 1 H VBAT GND SINGLE-WIRE SERIAL I/F C1 2.2 F/10V VIN SW AGND2 EPAD AGND1 DC FLASH ENABLE #1 FEN1 FLASH ENABLE #2 FEN2 OUT LED PGND1 PGND2 FRSET LED1 FLASH WHITE LED C4 4.7 F R4 20.5 k AGND2 U1 MIC2871YMK DS20006079A-page 2 2018 Microchip Technology Inc. MIC2871 Functional Block Diagram SW DIE TEMP LBVD VIN 2.75V/ 2.30V 155C/ 140C UVLO FEN1 OTP SAFETY TIMER VIN BODY SWITCH OUT SYSTEM CONTROL LOGIC + ANTI-CROSS CONDUCTION FEN2 PGND1 PGND SINGLEWIRE SERIAL INTERFACE DC LED 1.7V 2MHz OSCILLATOR AGND PGND2 LED SCP OUT Z OUT Z OVP 5.37V/5.31V LED V/I SAFETY TIMER SAFETY TIMER AGND2 2018 Microchip Technology Inc. FRSET AGND1 DS20006079A-page 3 MIC2871 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Input Voltage (VIN)...................................................................................................................................... -0.3V to +6.0V General I/O Voltage (VFEN1, VFEN2)............................................................................................................... -0.3V to VIN VOUT and VLED Voltage.............................................................................................................................. -0.3V to +6.0V Single-Wire I/O Voltage (VDC) ........................................................................................................................ -0.3V to VIN VFRSET Voltage .............................................................................................................................................. -0.3V to VIN VSW Voltage ............................................................................................................................................... -0.3V to +6.0V ESD Rating(1) ........................................................................................................................... 2 kV, HBM and 200V, MM Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Note 1: Devices are ESD-sensitive. Handling precautions are recommended. Human body model, 1.5 k in series with 100 pF. Operating Ratings(1) Input Voltage (VIN)..................................................................................................................................... +2.7V to +5.5V Enable Input Voltage (VFEN1, VFEN2) ................................................................................................................. 0V to VIN Single-Wire I/O Voltage (VDC) ............................................................................................................................ 0V to VIN Power Dissipation (PD)....................................................................................................................... Internally Limited(2) Note 1: 2: The device is not ensured to function outside the operating range. The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) - TA)/JA. TABLE 1-1: ELECTRICAL CHARACTERISTICS(Note 1) Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 1 H; COUT = 4.7 F; RFRSET = 20.5 k; IOUT = 100 mA; TA = +25C. Boldface values indicate -40C TJ +125C. Parameter Symbol Min. Typ. Max. Units Test Conditions Power Supply Supply Voltage Range VIN 2.7 -- 5.5 V -- Start-up Voltage VSTART -- 2.65 2.95 V -- UVLO Threshold (falling) VUVLO_F -- 2.30 2.5 V -- Standby Current ISTB -- 230 -- A VDC = HIGH, boost regulator and LED current driver are both off Shutdown Current ISD -- 1 2 A VDC = 0V VOVP 5.2 5.37 5.55 V -- VOVPHYS -- 60 -- mV -- Overvoltage Protection (OVP) Threshold OVP Hysteresis OVP Blanking Time tBLANK_OVP -- 23 -- s -- DMAX 82 86 90 % -- Switch Current Limit ISW 3.5 4.5 5.5 A VIN = VOUT = 2.7V Minimum Duty Cycle DMIN 4 6.4 9 % -- -- 100 -- m Maximum Duty Cycle Switch-On Resistance Note 1: RDS(ON)_P RDS(ON)_N ISW = 100 mA ISW = 100 mA Specification for packaged product only. DS20006079A-page 4 2018 Microchip Technology Inc. MIC2871 TABLE 1-1: ELECTRICAL CHARACTERISTICS(Note 1) (CONTINUED) Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 1 H; COUT = 4.7 F; RFRSET = 20.5 k; IOUT = 100 mA; TA = +25C. Boldface values indicate -40C TJ +125C. Symbol Min. Typ. Max. Units Switch Leakage Current Parameter ISW -- 0.01 1 A Oscillator Frequency FSW -- 2 -- MHz -- -- -10 -- 10 % -- Overtemperature Shutdown Threshold TSD -- 155 -- C -- Overtemperature Shutdown Hysteresis TSDHYS -- 15 -- C -- Safety Time-out Shutdown TTO -- 1.25 -- s Default timer setting Oscillator Frequency Variation Test Conditions VDC = 0V, VSW = 5.5V Safety Timer Current Threshold ITO -- 250 -- mA Default current threshold setting Safety Timer Current Resolution -- -- 50 -- mA -- Safety Timer Current Threshold Accuracy -- -- 25 -- mA -- Low-Battery Voltage Detection Threshold VLBVD -- 3.6 -- V Low-Battery Voltage Detection Threshold Accuracy -- -- 50 -- mV LED Short-Circuit Detection Voltage Threshold VSHORT -- 1.7 -- V LED Short-Circuit Detection Test Current ITEST 1 2 3 mA Default LBVD threshold setting -- VOUT - VLED -- Current Sink Channels Channel Current Accuracy Current Sink Voltage Dropout Note 1: -- -5 -- 5 % 3.5V < VIN < 4.2V, ILED = 1A VLED -- 160 -- mV Boost regulator on, ILED = 1A Specification for packaged product only. 2018 Microchip Technology Inc. DS20006079A-page 5 MIC2871 TABLE 1-1: ELECTRICAL CHARACTERISTICS(Note 1) (CONTINUED) Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 1 H; COUT = 4.7 F; RFRSET = 20.5 k; IOUT = 100 mA; TA = +25C. Boldface values indicate -40C TJ +125C. Parameter Symbol Min. Typ. Max. FEN1/FEN2 High-Level Voltage VFEN_H 1.5 -- -- FEN1/FEN2 Low-Level Voltage VFEN_L -- -- 0.4 FEN1/FEN2 Pull-Down Current IFEN_PD -- 1 5 Units Test Conditions FEN1, FEN2 Control Pins Note 1: Flash on V Flash off A VFEN1 = VFEN2 = 5.5V Specification for packaged product only. TABLE 1-2: ELECTRICAL CHARACTERISTICS - SINGLE-WIRE INTERFACE(1) Electrical Specifications: unless otherwise specified, VIN = 3.6V; L = 1 H; COUT = 4.7 F; IOUT = 100 mA; TA = 25C. Boldface values indicate -40C TJ +125C. Parameter Symbol Min. Typ. Max. Units Test Conditions Low-Level Input Voltage VL -- -- 0.4 V High-Level Input Voltage VH 1.5 -- -- V -- IDC_PD -- 2.5 5 A VDC = 5.5V On Time TON 0.1 -- 72 s -- Off Time TOFF 0.1 -- 72 s -- Latch Time TLAT 97 -- 324 s -- End Time TEND 405 -- -- s -- DC Pull-Down Current Note 1: -- Design guidance only. DS20006079A-page 6 2018 Microchip Technology Inc. MIC2871 TEMPEARTURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions Maximum Junction Temperature Range TJ -40 -- 150 C -- Operating Junction Temperature Range TJ -40 -- 125 C -- Storage Temperature TS -40 -- 150 C -- Lead Temperature -- -- -- 260 C Soldering, 10s JA -- 65.83 -- JC -- 38.9 -- Temperature Ranges Package Thermal Resistance Thermal Resistance 3x2 LDFN-14LD Note 1: C/W -- -- The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150C rating. Sustained junction temperatures above +150C can impact the device reliability. 2018 Microchip Technology Inc. DS20006079A-page 7 MIC2871 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 100 EFFICIENCY (%) 90 80 ILED = 1.0A ILED = 1.2A ILED = 640mA 70 ILED = 400mA ILED = 250mA 60 ILED = 100mA L = 1H COUT = 4.7F 50 2.6 3.0 3.4 3.8 4.2 4.6 5.0 INPUT VOLTAGE (V) Shutdown Current vs. FIGURE 2-4: Input Voltage. TORCH MODE LED CURRENT (mA) FIGURE 2-1: Temperature. WLED Power Efficiency vs. 270 265 260 255 250 245 240 L = 1H COUT = 4.7F ILED = 250mA RFRSET 20k FRSET ==20kO 235 230 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C) FIGURE 2-2: Temperature. Standby Current vs. FIGURE 2-5: Temperature. Torch Mode LED Current vs. FIGURE 2-3: vs. Input Voltage. Boost Switching Frequency FIGURE 2-6: Temperature. Flash Mode LED Current vs. DS20006079A-page 8 2018 Microchip Technology Inc. MIC2871 TORCH MODE ILED(MAX) ACCURACY (%) FLASH MODE ILED(MAX) (mA) 1200 1000 800 600 400 200 L = 1 H COUT = 4.7F 0 0 10 20 30 40 50 60 0.4 0.2 0.0 RFRSET = 17k RFRSET=17kO -0.2 -0.4 R RFRSET=20kO FRSET = 20k -0.6 RFRSET = 30k RFRSET=30kO -0.8 RFRSET = 39k RFRSET=39kO -1.0 RFRSET = 62k RFRSET=62kO -1.2 R RFRSET=51kO FRSET = 51k -1.4 3.5 FRSET ) ) FRSETRESISTOR RESISTOR(k(k? FIGURE 2-7: FRSET Resistor. 3.7 3.9 4.1 4.3 Input Voltage (V) Flash Mode ILED(MAX) vs. FIGURE 2-10: Torch Mode ILED(MAX) Accuracy vs. Input Voltage. TORCH MODE ILED(MAX) (mA) 300 VFEN1/VFEN2 (5V/div) 250 ILED = 1.0A VIN = 3.0V L = 1 H 200 VOUT (2V/div) 150 VLED (1V/div) 100 50 ILED (1A/div) L = 1 H COUT = 4.7F 0 0 10 FLASH MODE ILED(MAX) ACCURACY (%) FIGURE 2-8: FRSET Resistor. 3.5 3.0 20 30 40 FRSET )) FRSET RESISTOR RESISTOR (k (k? 50 60 Torch Mode ILED(MAX) vs. Time (100 s/div) FIGURE 2-11: Flash Mode Turn-On Sequence (Boost Mode). RFRSET = 17k RFRSET=17kO ILED = 1.0A VIN = 4.2V L = 1 H VFEN1/VFEN2 (5V/div) 2.5 2.0 1.5 VOUT (2V/div) 1.0 0.5 0.0 -0.5 -1.0 -1.5 VLED (1V/div) R RFRSET=20kO FRSET = 20k RFRSET = 30k RFRSET=30kO RFRSET = 39k RFRSET=39kO ILED (1A/div) RFRSET = 51k RFRSET=51kO RFRSET = 62k RFRSET=62kO 3.5 3.7 3.9 4.1 INPUT VOLTAGE (V) FIGURE 2-9: Flash Mode ILED(MAX) Accuracy vs. Input Voltage. 2018 Microchip Technology Inc. 4.3 Time (100 s/div) FIGURE 2-12: Flash Mode Turn-On Sequence (Linear Mode). DS20006079A-page 9 MIC2871 ILED = 1.0A VIN = 3.6V L = 1 H VFEN1/VFEN2 (5V/div) VFEN1/VFEN2 (5V/div) VOUT (2V/div) VLED (1V/div) VOUT (2V/div) VLED (1V/div) VOUT - VLED (2V/div) IL (100 mA/div) ILED (1A/div) Time (40 s/div) Time (200 ms/div) FIGURE 2-13: 1250 ms. VIN = 3.6V L = 1 H LED IS SHORTED BY 620 Flash Safety Timer at FIGURE 2-15: Protection. LED Short-Circuit VFEN1/VFEN2 (5V/div) FIGURE 2-14: 156 ms. DS20006079A-page 10 Flash Safety Timer at 2018 Microchip Technology Inc. MIC2871 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MIC2871 Pin Number Pin Name 1 AGND1 Analog Ground: LED current return path. 2 DC Single-wire serial interface control input. 3 LED LED Current Sink Pin: Connect the LED anode to OUT and cathode to this pin. 4 FEN1 5 AGND2 6 VIN 7 PGND1 8 OUT Pin Function Flash Mode Enable Pin: Toggling FEN1 from LOW to HIGH enables MIC2871 into the Flash mode. FEN1 is logic-OR with FEN2. If this pin is left floating, it is pulled down internally by a built-in 1 A current source when the device is enabled. Analog Ground: Reference ground of the FRSET pin. Supply Input Pin: Connect a low-ESR ceramic capacitor of at least 2.2 F to AGND2. Power Ground: Inductor current return path. Boost Converter Output Pin: This is connected to the anode of the LED. Connect a low-ESR ceramic capacitor of at least 4.7 F to PGND1. 9, 12 NC No Connect: Connect this pin to AGND or leave it floating. 10 SW Inductor Connection Pin: It is connected to the internal power MOSFETs. 11 FEN2 13 PGND2 Power Ground. 14 FRSET Flash Mode Current-Level Programming Pin: Connect a resistor from this pin to AGND2 to set the maximum current in the Flash mode. This pin may be grounded if the default Flash mode current (1A) is desired. This pin cannot be left floating and the recommended resistance range is from 17 k to 60 k. EP ePAD 2018 Microchip Technology Inc. Additional Flash Mode Enable Pin: FEN2 is logic-OR with FEN1. If this pin is left floating, it is pulled down internally by a built-in 1 A current source when the device is enabled. Exposed Heat Sink Pad: Connect to ground for best thermal performance. DS20006079A-page 11 MIC2871 4.0 FUNCTIONAL DESCRIPTION 4.7 4.1 VIN This is the current sink pin for the LED. The LED anode is connected to the OUT pin and the LED cathode is connected to this pin. The input supply provides power to the internal MOSFETs' gate drive and controls circuitry for the switch mode regulator. The operating input voltage range is from 2.7V to 5.5V. A 2.2 F low-ESR ceramic input capacitor should be connected from VIN to AGND2 as close to the MIC2871 as possible to ensure a clean supply voltage for the device. The minimum voltage rating of 10V is recommended for the input capacitor. 4.2 SW The MIC2871 has internal low-side and synchronous MOSFET switches. The switch node (SW) between the internal MOSFET switches connects directly to one end of the inductor and provides the current paths during switching cycles. The other end of the inductor is connected to the input supply voltage. Due to the high-speed switching on this pin, the switch node should be routed away from sensitive nodes wherever possible. 4.3 AGND1 This is the ground path of the LED current sink. It should be connected to the AGND2, but not via an exposed pad on the PCB. The current loop of the Analog Ground should be separated from that of the Power Ground (PGND1 and PGND2). AGND1 and AGND2 should be connected to PGND1 and PGND2 at a single point. 4.4 AGND2 This is the ground path for the internal biasing and control circuitry. AGND2 should be connected to the PCB pad for the package exposed pad. AGND2 should be connected to the AGND1 directly without going through the exposed pad. The current loop of the analog ground should be separated from that of the Power Ground (PGND1 and PGND2). The AGND2 and AGND1 should be connected to PGND1 and PGND2 at a single point. 4.5 PGND1 and PGND2 The Power Ground pins are the ground path for the high current in the boost switch and they are internally connected together. The current loop for the Power Ground should be as small as possible and separate from the Analog Ground (AGND) loop as applicable. 4.6 OUT This is the boost converter output pin which is connected to the anode of the LED. A low-ESR ceramic capacitor of 4.7 F or larger should be connected from OUT to PGND1, as close as possible to the MIC2871. The minimum voltage rating of 10V is recommended for the output capacitor. DS20006079A-page 12 4.8 LED DC The DC is a single multiplexed device enable, and serial data control pin used for functional control and communication in GPIO limited applications. When the DC pin is used as a hardware device enable pin, a logic high signal on the DC pin enables the device, and a logic low signal on the DC pin disables the device. When the DC pin is used as the single-wire serial interface digital control pin, a combination of bit edges and the period between edges is used to communicate a variable length data word across the single wire. Each word is transmitted as a series of pulses, each pulse incrementing an internal data counter. A stop sequence consisting of an inactive period is used to latch the data word internally. The data word received is then used to set the value of the corresponding register for controlling the specific function. The MIC2871 supports five writable registers for controlling Flash mode, Torch mode, safety timer duration, safety timer threshold current and low-battery threshold. An address/data frame is used to improve protection against erroneous writes where communications are in error. When the DC is in a low state and no data is detected for an extended period of time, the MIC2871 will automatically go into a low-power Shutdown state, simultaneously resetting all internal registers to their default states. 4.9 FEN1 and FEN2 FEN1 and FEN2 are hardware enable pins for Flash mode. FEN1 is logic-OR with FEN2. A logic low-to-high transition on either the FEN1 pin or FEN2 pin can initiate the MIC2871 in Flash mode. If FEN1 or FEN2 is left floating, it is pulled down internally by a built-in 1 A current source when the device is enabled. Flash mode is terminated when both FEN1 and FEN2 are pulled low or left floating, and the Flash register is cleared. 4.10 FRSET The Flash mode maximum LED current level is programmed through the FRSET pin. A resistor connected from the FRSET pin to AGND2 sets the maximum current in the Flash mode. This pin can be grounded if the default Flash mode current of 1A is desired. For the best current accuracy, a 0.1% or smaller tolerance resistor for setting the maximum Flash mode LED current is recommended. This pin cannot be left floating and the minimum resistance is limited to 17 k. The maximum Flash mode current to maximum Torch mode current ratio is internally fixed as 4 to1. 2018 Microchip Technology Inc. MIC2871 5.0 APPLICATION INFORMATION The MIC2871 can drive a high-current Flash WLED in either Flash mode or Torch mode. 5.1 Boost Converter The internal boost converter is turned on/off automatically when the LED driver is activated/deactivated without any exception. The boost converter is an internally compensated Current mode PWM boost converter running at 2 MHz. It is for stepping up the supply voltage to a high enough value at the OUT pin to drive the LED current. If the supply voltage is high enough, the synchronous switch of the converter is then fully turned on. In this case, all the excessive voltage is dropped over the linear LED driver. 5.2 The maximum current level in the Flash mode is 1.2A. This current level can be adjusted through an external resistor connected to the FRSET pin according to Equation 5-1: CURRENT LEVEL ADJUSTMENT ILED(MAX) = 20500 RFRSET Alternatively, the default value of 1A is used when the FRSET pin is grounded. The Flash mode current can be initiated at this preset FRSET brightness level by asserting the FEN1 or FEN2 pin high, or by setting the Flash Control register (Address 1) for the desired Flash duration, subjected to the safety time-out setting. The Flash mode current is terminated when the FEN1 and FEN2 pins are brought low and the Flash register is cleared. Flash mode current can be adjusted to a fraction of the maximum Flash mode current level by selecting the desired percentage in the Flash Control register through the single-wire serial interface. The Flash current is the product of the maximum Flash current setting and the percentage selected in the Flash register. 5.3 The torch current is the product of the maximum torch current setting and the percentage selected in the Torch register. 5.4 Torch Mode By default, the maximum Torch mode level is one-fourth (1/4) of the maximum Flash mode current. The Torch mode operation is activated by setting the Torch Control register (Address 2) for the desired duration. The Torch mode current is terminated when the Torch register is cleared or when the configurable safety timer expires. 2018 Microchip Technology Inc. Configurable Safety Timer The Flash safety time-out feature automatically shuts down the LED current, after the safety timer duration is expired, if the programmed LED current exceeds a certain current threshold. Both the current threshold and the timer duration are programmable via the Safety Timer registers (Addresses 3 and 5). 5.5 Flash Mode EQUATION 5-1: Like the Flash mode current, the Torch mode current can be tuned to a fraction of the maximum Torch mode level by selecting the desired torch current level percentage in the Torch Control register (Address 2) through the single-wire serial interface. Low-Battery Voltage Detection (LBVD) When the VIN voltage drops below the LBVD threshold (default = 3.6V) in flash or torch mode, the LED current driver is disabled. The LED driver can be resumed by toggling the corresponding input control signal. The LBVD threshold is adjustable through the LBVD Control register (Address 4). 5.6 Overvoltage Protection When the output voltage rises above the over voltage protection threshold (OVP), MIC2871 is latched off automatically to avoid permanent damage to the IC. To clear the latched off condition, either power cycle the MIC2871 or assert the DC pin low. 5.7 Short-Circuit Detection Each time before enabling the LED driver, the MIC2871 performs the short-circuit test by driving the Flash LED with a small (2 mA typical) current for 200 s. If (VOUT - VLED) < 1.7V at the end of the short-circuit test, the LED is considered to be shorted and MIC2871 will ignore the Flash and/or Torch mode command. Note that the short-circuit test is carried out every time prior to Flash and Torch mode, but the result is not latched. 5.8 Thermal Shutdown When the internal die temperature of MIC2871 reaches +155C, the LED driver is disabled until the die temperature falls below +140C. DS20006079A-page 13 MIC2871 5.9 Single-Wire Interface The single-wire interface allows the use of a single multiplexed enable and data pin (DC) for control, and communication in GPIO limited applications. The interface is implemented using a simple mechanism, allowing any open-drain or directly driven GPIO to control the MIC2871. The MIC2871 uses the single-wire interface for simple command and control functions. The interface provides fast access to write-only registers with protection features to avoid potentially erroneous data writes and improve robustness. When the DC is in a low state and no data is detected for an extended period of time, the MIC2871 will automatically go into a low-power shutdown state, simultaneously resetting internal registers to their default states. 5.10 Shutdown mode can be entered at any time by pulling down DC for TEND, discarding any current communication and resetting the internal registers. If a communication is received before the shutdown period, but after the TLAT period, the communication is discarded. This state is also used to create an internal error state to avoid erroneously latching data where the communication process cannot be serviced in time. Additionally, each register has a maximum value associated with it. If the number of bits clocked in exceeds the maximum value for the register, the data is assumed to be in error and the data is discarded. Overview The single-wire interface relies on a combination of bit edges, and the period between edges, in order to communicate across a single wire. Each word is transmitted as a series of pulses, with each pulse incrementing an internal data counter. A stop sequence consisting of an inactive period is used to latch the data word internally. An address and data framing format is used to improve protection against erroneous writes by enforcing address and data field lengths, as well as the timing duration between them. Timing is designed such that when communicating with a device using a low-cost on-chip oscillator, the worst-case minimum and maximum conditions can be easily met within the wide operating range of the oscillator. Using this method ensures that the device can always detect the delay introduced by the communication master. 5.11 Idle mode is entered automatically at the end of a communication frame by holding DC high for TEND, by enabling the device by bringing DC high when in shutdown mode, or when an error is detected by the single-wire interface logic. Idle States and Error Conditions In Shutdown mode, the MIC2871 is in a Reset condition, with all functions off, while consuming minimal power. Register settings are reset to their default state when coming out of Shutdown state. In Idle mode, all register settings persist and all MIC2871 functions continue in their current state. Table 5-1 summarizes the difference between the two IDLE modes: TABLE 5-1: <TEND - TLAT IDLE VH VL TEND TLAT VH VL TEND TLAT SHUTDOWN IDLE VH VL TLAT TEND IDLE FIGURE 5-1: Abort, Shutdown and Idle Timing Waveforms. DIFFERENCES BETWEEN IDLE MODES DC ISUPPLY (all functions off) Shutdown Idle Low High 1 A 230 A Register State Default Persist Start-up Time 1 s 100 ns DS20006079A-page 14 2018 Microchip Technology Inc. MIC2871 5.12 Communication Details The serial interface requires delimiters to indicate the Start-of-Frame (SOF), data as a series of pulses and End-of-Frame (EOF) indicated by a lack of activity. The Start-of-Frame is the first high-to-low transition of the DC when in Idle mode. The first rising edge resets the internal data counter to 0. Only a correctly formatted address/data combination will be treated as a valid frame and processed by the MIC2871. Any other input, such as a single data word followed by TEND, or three successive data words, will be discarded by the target hardware as an erroneous entry. Additionally, any register write to either an invalid register or with invalid register data will also be discarded. 5.13 1 COUNT VH VL TOFF TON TLAT TON + TOFF < TLAT AUTOMATIC LATCH AFTER TLAT EXPIRES START FIGURE 5-2: Data Word Pulse Timing. A pulse is delimited by the signal first going below VL and then above VH within the Latch Time-out, TLAT. During this transition, the minimum on (TON) and off (TOFF) periods are observed to improve tolerance to glitches. Each rising edge increments the internal Data register. Data is automatically latched into the internal Shadow Address and Data registers after an inactivity period of >TLAT. To send register write commands, the address and data are entered in series as two data words using the above pattern, with the second word starting after the first latch period has expired. After the second word is entered, the IDLE command should be issued by leaving the DC pins high for TEND. MIC2871 Registers The MIC2871 supports five writable registers for controlling the Torch and Flash modes of operation, as shown in Table 5-2. Note that register addressing starts at 1. Writing any value above the maximum value shown for each register will cause an invalid data error and the frame will be discarded. TABLE 5-2: FIVE WRITABLE REGISTERS OF MIC2871 Address Name Max. Value Description 1 FEN/FCUR 31 Flash Enable/Current 2 TEN/TCUR 31 Touch Enable/Current 3 STDUR 7 Safety Timer Duration 4 LB_TH 9 Low-Battery Voltage Detection Threshold 5 ST_TH 5 Safety Timer Threshold After receiving the stop sequence, the internal registers' decode and update cycle is started, with the Shadow register values being transferred to the decoder. Figure 5-3 shows an example of entering a write of Data 5 to Address 3. ADDRESS/DATA FRAME START LATCH START TLAT 0 1 2 3 < TEND LATCH END REGISTER WRITE TLAT 0 1 2 3 4 5 > TEND FIGURE 5-3: Communication Timing Example of Entering Write for Data 5 to Address 3. 2018 Microchip Technology Inc. DS20006079A-page 15 MIC2871 5.13.1 FLASH CURRENT REGISTER (FEN/FCUR: DEFAULT 0) The Flash Current register enables and sets the Flash mode current level. Valid values are 0 to 31; Values 0-15 will set the Flash current without enabling the Flash (such that it can be triggered externally), Values 16-31 will set the Flash current and enable the Flash. The Flash Current register maps into the internal FEN and FCUR registers, as shown in Table 5-3. Table 5-3 describes the relationship between the Flash current, as a percentage of maximum current, and the FCUR register setting. TABLE 5-3: FLASH CURRENT REGISTER MAPPING INTO INTERNAL FEN/FCUR REGISTERS AND RELATIONSHIP BETWEEN FLASH CURRENT AS % OF MAX. CURRENT AND FCUR REGISTER SETTING Value FEN/FCUR<4:0> Dec. Binary FEN<4> FCUR<3:0> % of IMAX 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 00000 00001 00010 00011 00100 00101 00110 00111 01000 01001 01010 01011 01100 01101 01110 01111 10000 10001 10010 10011 10100 10101 10110 10111 11000 11001 11010 11011 11100 11101 11110 11111 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 100.00 88.96 79.04 70.72 63.04 56.00 49.92 44.64 39.68 35.52 31.68 28.16 25.12 22.40 20.00 17.92 100.00 88.96 79.04 70.72 63.04 56.00 49.92 44.64 39.68 35.52 31.68 28.16 25.12 22.40 20.00 17.92 DS20006079A-page 16 5.13.2 TORCH CURRENT REGISTER (TEN/TCUR: DEFAULT 0) The Torch Current register enables and sets the Torch mode current level. Valid values are 0 to 31; Values 0-15 will set the torch current without enabling the torch (such that it can be triggered by setting the internal TEN register value to 1), Values 16-31 will set the torch current and enable the torch. A value of 0 at the internal TEN register will disable the torch. The Torch Current register maps into the internal TEN and TCUR registers, as shown in Table 5-4. The table also describes the relationship between the torch current as a percentage of maximum current, and the TCUR register setting. TABLE 5-4: TORCH CURRENT REGISTER MAPPING INTO INTERNAL TEN/TCUR REGISTERS AND RELATIONSHIP BETWEEN TORCH CURRENT AS % OF MAX. CURRENT AND TCUR REGISTER SETTING Value TEN/TCUR<4:0> Dec. Binary TEN<4> TCUR<3:0> % of IMAX 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 00000 00001 00010 00011 00100 00101 00110 00111 01000 01001 01010 01011 01100 01101 01110 01111 10000 10001 10010 10011 10100 10101 10110 10111 11000 11001 11010 11011 11100 11101 11110 11111 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 100.00 88.96 79.04 70.72 63.04 56.00 49.92 44.64 39.68 35.52 31.68 28.16 25.12 22.40 20.00 17.92 100.00 88.96 79.04 70.72 63.04 56.00 49.92 44.64 39.68 35.52 31.68 28.16 25.12 22.40 20.00 17.92 2018 Microchip Technology Inc. MIC2871 5.13.3 SAFETY TIMER DURATION REGISTER (STDUR: DEFAULT 7) The Safety Timer Duration register sets the duration of the Flash and Torch modes when the LED current exceeds the programmed threshold current. Valid values are 0 for the minimum timer duration to 7 for the maximum duration. TABLE 5-5: SAFETY TIMER DURATION REGISTER SETTING AND SAFETY TIMER DURATION Value Dec. Binary STDUR<2:0> (binary) 0 000 000 156.25 1 001 001 312.5 2 010 010 468.75 3 011 011 625 4 100 100 781.25 5 101 101 937.5 6 110 110 1093.75 7 111 111 1250 5.13.4 Time-out (ms) LOW-BATTERY THRESHOLD REGISTER (LB_TH: DEFAULT 7) 5.13.5 SAFETY TIMER THRESHOLD CURRENT REGISTER (ST_TH: DEFAULT 4) The Safety Timer Threshold Current register determines the amount of LED current flowing through the external LED before the internal LED safety timer is activated. Setting ST_TH to 0 disables the safety timer function, and setting the register to Values 1 to 5 set the safety time threshold current to 100 mA to 300 mA in 50 mA steps. TABLE 5-7: SAFETY TIMER THRESHOLD CURRENT REGISTER SETTING AND SAFETY TIMER THRESHOLD CURRENT Value ST_TH<2:0> Safety Timer Threshold Current (mA) Dec. Binary 0 000 000 Disabled 1 001 001 100 mA 2 010 010 150 mA 3 011 011 200 mA 4 100 100 250 mA 5 101 101 300 mA The LB_TH register sets the supply threshold voltage below which the internal low-battery flag is asserted and Flash functions are inhibited. Table 5-6 shows the threshold values that correspond to the register settings. Setting 0 is reserved for disabling the function, and settings between 1 and 9 inclusively enable and set the LB_TH value, between 3.0V and 3.8V with 100 mV resolution. TABLE 5-6: LOW-BATTERY THRESHOLD REGISTER SETTING AND SUPPLY THRESHOLD VOLTAGE Value LB_TH<3:0> VBAT Threshold (V) 0000 0000 Disabled 1 0001 0001 3.0 2 0010 0010 3.1 3 0011 0011 3.2 4 0100 0100 3.3 5 0101 0101 3.4 6 0110 0110 3.5 7 0111 0111 3.6 8 1000 1000 3.7 9 1001 1001 3.8 Dec. Binary 0 2018 Microchip Technology Inc. DS20006079A-page 17 MIC2871 6.0 COMPONENT SELECTION 6.1 Inductor Inductor selection is a balance between efficiency, stability, cost, size, and rated current. Because the boost converter is compensated internally, the recommended inductance of L is limited from 1 H to 2.2 H to ensure system stability. It is usually a good balance between these considerations. A large inductance value reduces the peak-to-peak inductor ripple current; hence, the output ripple voltage and the LED ripple current. This also reduces both the DC loss and the transition loss at the same inductor's DC Resistance (DCR). However, the DCR of an inductor usually increases with the inductance in the same package size. This is due to the longer windings required for an increase in inductance. Because the majority of the input current passes through the inductor, the higher the DCR, the lower the efficiency is, and more significantly, at higher load currents. On the other hand, an inductor with a smaller DCR, but the same inductance, usually has a larger size. The saturation current rating of the selected inductor must be higher than the maximum peak inductor current to be encountered and should be at least 20% to 30% higher than the average inductor current at maximum output current. 6.2 6.3 Output Capacitor Output capacitor selection is also a trade-off between performance, size and cost. Increasing the output capacitor will lead to an improved transient response, however, the size and cost also increase. The output capacitor is preferred in the range of 2.2 F to 10 F, with ESR from 10 m to 50 m. X5R or X7R type ceramic capacitors are recommended for better tolerance over temperature. The Y5V and Z5U type ceramic capacitors are not recommended due to their wide variation in capacitance over temperature and increased resistance at high frequencies. The rated voltage of the output capacitor should be at least 20% higher than the maximum operating output voltage over the operating temperature range. 6.4 FRSET Resistor Because the FRSET resistor is used for setting the maximum LED current, a resistor type with 0.1% tolerance is recommended for a more accurate maximum LED current setting. Input Capacitor A ceramic capacitor of 2.2 F or larger with low-ESR is recommended to reduce the input voltage ripple to ensure a clean supply voltage for the device. The input capacitor should be placed as close as possible to the MIC2871 VIN pin with a short trace for good noise performance. X5R or X7R type ceramic capacitors are recommended for better tolerance over temperature. The Y5V and Z5U type temperature rating ceramic capacitors are not recommended due to their large reduction in capacitance over temperature and increased resistance at high frequencies. These reduce their ability to filter out high-frequency noise. The rated voltage of the input capacitor should be at least 20% higher than the maximum operating input voltage over the operating temperature range. DS20006079A-page 18 2018 Microchip Technology Inc. MIC2871 7.0 POWER DISSIPATION CONSIDERATION As with all power devices, the ultimate current rating of the output is limited by the thermal properties of the device package and the PCB on which the device is mounted. There is a simple 's law type relationship between thermal resistance, power dissipation and temperature, which are analogous to an electrical circuit: RXY VX VY RYZ Now replacing the variables in Equation 7-1, we can find the Junction Temperature (TJ) from the power dissipation, ambient temperature, and the known thermal resistance of the PCB (CA) and the package (JC). EQUATION 7-2: TJ = PDISS (JC + CA) + TA As can be seen in the diagram, the total thermal resistance is: JA = JC + CA. Hence, this can also be written as in Equation 7-3: VZ EQUATION 7-3: ISOURCE FINDING THE JUNCTION TEMPERATURE (TJ) VZ TOTAL THERMAL RESISTANCE TJ = PDISS (JA) + TA Where: FIGURE 7-1: Circuit. Series Electrical Resistance From this simple circuit, we can calculate VX if we know the ISOURCE, VZ and resistor values, RXY and RYZ, using Equation 7-1: EQUATION 7-1: CALCULATING VX VX = ISOURCE (RXY + RYZ) + VZ JC TC PDISS FIGURE 7-2: Circuit. CA Because effectively all of the power losses (minus the inductor losses) in the converter are dissipated within the MIC2871 package, PDISS can be calculated thus: EQUATION 7-4: Thermal circuits can be considered using this same rule and can be drawn similarly by replacing current sources with power dissipation (in watts), resistance with thermal resistance (in C/W) and voltage sources with temperature (in C). TJ JA = Thermal resistance between junction and ambient, which is typically 65.83C/W for 3 mm x 2 mm LDFN package CALCULATING PDISS Linear Mode: PDISS = [POUT 1 - 1 ] - IOUT2 DCR I Boost Mode: PDISS = [POUT 1 - 1 ] - OUT 2 DCR 1 - D Duty Cycle in Boost Mode: D = VOUT - VIN VOUT Where: = Efficiency taken from efficiency curves DCR = Inductor DCR TA TA Series Thermal Resistance 2018 Microchip Technology Inc. DS20006079A-page 19 MIC2871 Where the real board area differs from 1" square, CA (the PCB thermal resistance) values for various PCB copper areas can be taken from Figure 7-3. Figure 7-3 is taken from "Designing with Low Dropout Voltage Regulators" available from the Microchip web site ("LDO Application Hints"). Figure 7-3 shows the total area of a round or square pad, centered on the device. The solid trace represents the area of a square, single-sided, horizontal, solder-masked, copper PC board trace heat sink, measured in square millimeters. No airflow is assumed. The dashed line shows PC board's trace heat sink covered in black oil-based paint and with 1.3m/sec (250 feet per minute) airflow. This approaches a "best case" pad heat sink. Conservative design dictates using the solid trace data, which indicates a maximum pad size of 5000 mm2 is needed. This is a pad that is 71 mm by 71 mm (2.8 inches per side). FIGURE 7-3: Graph to Determine PC Board Area for a Given PCB Thermal Resistance. DS20006079A-page 20 2018 Microchip Technology Inc. MIC2871 8.0 PCB LAYOUT GUIDELINES PCB layout is critical to achieve reliable, stable and efficient performance. A ground plane is required to control EMI and minimize the inductance in power and signal return paths. The following guidelines should be followed to ensure proper operation of the device: 8.1 IC (Integrated Circuit) * Place the IC close to the point-of-load (in this case, the flash LED). * Use fat traces to route the input and output power lines. * Analog grounds (AGND1 and AGND2) and power grounds (PGND1 and PGND2) should be kept separate and connected at a single location. * The exposed pad (ePAD) on the bottom of the IC must be connected to the analog ground AGND2 of the IC. * 8 to 12 thermal vias must be placed on the PCB pad for exposed pad and connected it to the ground plane to ensure a good PCB thermal resistance can be achieved. 8.2 8.4 Output Capacitor * Use wide and short traces to connect the output capacitor to the OUT and PGND1 pins. * Place several vias to the ground plane close to the output capacitor ground terminal. * Use either X5R or X7R temperature rating ceramic capacitors. Do not use Y5V or Z5U type ceramic capacitors. 8.5 Flash LED * Use wide and short trace to connect the LED anode to the OUT pin. * Use wide and short trace to connect the LED cathode to the LED pin. * Make sure that the LED's PCB land pattern can provide sufficient PCB pad heat sink to the flash LED. 8.6 FRSET Resistor The FRSET resistor should be placed close to the FRSET pin and connected to AGND2. VIN Decoupling Capacitor * The VIN decoupling capacitor must be placed close to the VIN pin of the IC and preferably connected directly to the pin and not through any via. The capacitor must be located right at the IC. * The VIN decoupling capacitor should be connected to analog ground (AGND2). * The VIN terminal is noise sensitive and the placement of capacitor is very critical. 8.3 Inductor * Keep both the inductor connections to the switch node (SW) and input power line short and wide enough to handle the switching current. Keep the areas of the switching current loops small to minimize the EMI problem. * Do not route any digital lines underneath or close to the inductor. * Keep the switch node (SW) away from the noise sensitive pins. * To minimize noise, place a ground plane underneath the inductor. 2018 Microchip Technology Inc. DS20006079A-page 21 MIC2871 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 14-Lead LDFN* Example XXXX NNN 2871 017 Legend: XX...X Y YY WW NNN e3 * Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. , , Pin one index is identified by a dot, delta up or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar () symbol may not be to scale. DS20006079A-page 22 2018 Microchip Technology Inc. MIC2871 9.2 Package Details The following sections give the technical details of the packages. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. 2018 Microchip Technology Inc. DS20006079A-page 23 MIC2871 NOTES: DS20006079A-page 24 2018 Microchip Technology Inc. MIC2871 APPENDIX A: REVISION HISTORY Revision A (October 2018) * Converted Micrel document MIC2871 to Microchip data sheet DS20006079A. * Minor text changes throughout document. 2018 Microchip Technology Inc. DS20006079A-page 25 MIC2871 NOTES: DS20006079A-page 26 2018 Microchip Technology Inc. MIC2871 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device XX X - Temperature Package XX MIC2871: Temperature: Y Package: MK = 14-Pin 3 mm x 2 mm LDFN Media Type: T5 TR 500/Reel 5,000/Reel = = a) MIC2871YMK-T5: MIC2871, -40C to +125C Temp. Range, 14-Pin LDFN, 500/Reel b) MIC2871YMK-TR: MIC2871, -40C to +125C Temp. Range, 14-Pin LDFN, 5,000/Reel Media Type Device: = Examples: 1.2A High-Brightness Flash LED Driver with Single-Wire Serial Interface -40C to +125C 2018 Microchip Technology Inc. Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006079A-page 27 MIC2871 NOTES: DS20006079A-page 28 2018 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-3692-8 == ISO/TS 16949 == 2018 Microchip Technology Inc. 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