Fixed Metal (Oxide) Film Resistors, Surface Mount Type Fixed Metal (Oxide) Film Resistors, Surface Mount Type Type: ERG(X)1H (1 W) ERG(X)2H (2 W) Features Non-flammable High Reliability Explanation of Part Numbers Ex.1 : ERX type 1 2 3 4 5 E R X 2 H Product Code Metal Film ERX Resistors Power Rating at 70 C 1 2 1W 2W Z Style * Specification Surface Mount H Type 6 7 8 9 10 J 1 R 0 H Resistance Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal point is expressed by (Ex.) 1R0 : 1.0 Resistance Tolerance J G 5% 2% "Z", "Q" is added according to resistance. Resistance Resistance Value Range () Type Tolerance ERXHQ ERXHZ ERXH 5 % 22 m to 82 m 0.10 to 0.18 0.20 to 9.1 ERX1H 2 % -- 0.10 to 0.91 1.0 to 9.1 5 % 22 m to 82 m 0.10 to 0.20 0.22 to 9.1 ERX2H 2 % -- 0.10 to 0.91 1.0 to 9.1 Packaging Methods H Embossed Carrier Taping The above example 1 shows a metal film resistor SMD type, 2 W power rating, resistance value of 1.0 , tolerance 5 %, and embossed taping. Ex.2 : ERG type Product Code Metal Oxide ERG Film Resistors 1 2 3 4 5 6 7 8 9 10 E R G 2 H J 1 0 2 H Power Rating at 70 C 1 2 1W 2W Style * Specification Surface Mount H Type Resistance Tolerance J G 5% 2% Resistance Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal point is expressed by (Ex.) 102 : 1.0 k Packaging Methods Embossed Carrier Taping H The above example 2 shows a metal oxide film resistor SMD type, 2 W power rating, resistance value of 1.0 k, tolerance 5 %,and embossed taping. Construction Metal (Oxide) film L W P A Ceramic core H End cap Dimensions in mm (not to scale) B Dimensions (mm) Type P Terminal Insulation coating Ceramic case L W H A B ERG(X)1H 12.5 +1.0 -0.5 9.00.5 5.60.3 5.00.2 1.50.3 3.01.0 ERG(X)2H 15.0 +1.0 -0.5 12.00.5 6.40.3 5.80.2 1.50.3 4.01.0 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2008 Fixed Metal (Oxide) Film Resistors, Surface Mount Type Ratings Dielectric Withstanding Voltage (VAC) Power Rating at 70 C (1) (W) Type 1 ERG(X)1H 1000 2 ERG(X)2H 1000 Resistance (2) Range () Res. Tol. (2) (%) min. (3) T.C.R. [10 -6 /C (ppm/C)] max. J (5) 22 m 47 m 39 m 82 m 1000 500 G (2) J (5) 0.1 10 k 350 J (5) 22 m 47 m 39 m 82 m 1000 500 G (2) J (5) 0.1 10 k 350 Standard Resistance Value E12 E12 (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating Resistance Value. (2) Resistance tolerance and resistance range is of use besides range listed, please inquire. (3) As for the low resistance value range, "Q" or "Z" is given to the part number.(Refer to the explanation of part numbers.) 120 Rated Load (%) Power Derating Curve For resistors operated in ambient temperatures above 70 C, power rating shall be derated in accordance with the figure on the right. 100 -55 C 70 C 80 60 40 20 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 180 200 220 240 Ambient Temperature (C) Packaging Methods Standard Quantity Type Embossed Carrier Taping ERG(X)1H 2000 pcs./reel ERG(X)2H 1000 pcs./reel Embossed Carrier Taping P1 P2 P0 Sprocket hole T F W E D0 Taping Reel B C T A B D1 Compartment Tape running direction Chip component Type W F E A B P1 Dimensions 0.20 0.20 0.10 1H 6.2 13.7 8.0 (mm) 24.0 0.30 11.50.10 1.750.10 0.20 0.20 2H 7.0 16.2 12.0 0.10 P0 T Type P2 D0 D1 Dimensions 0.10 1H 5.7 (mm) 1.5 min. 2.00 0.10 4.00 0.10 1.50 +0.10 -0 2H 6.40.10 A Dimensions (mm) W Type A B 1H, 2H 380 3 80 2 C W T 13.0 1.0 25.5 1.0 29.5 1.0 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Fixed Metal (Oxide) Film Resistors, Surface Mount Type Recommended Land Pattern Resistor c Type Dimensions (mm) a b c ERG(X)1H 3.5 to 4.0 14.5 to 15.0 2.8 to 3.3 ERG(X)2H 4.0 to 4.5 17.0 to 17.5 3.1 to 3.6 a b Recommended Soldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 150 C to 180 C Above 200 C 235 C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 150 C to 180 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak 255 C max. 5 s Time Safety Precautions The following are precautions for individual products. Please also refer to the precautions com mon to Fixed Resistors shown on page ER3 of this catalog. 1. Transient voltage If there is a possibility that the transient phenomenon (significantly high voltage applied in a short time) may occur or that a high voltage pulse may be applied, make sure to evaluate and check the characteristics of Fixed Metal (Oxide) Film Resistors mounted on your product rather than only depending on the calculated power limit or steady-state conditions to complete the design or decide to use the resistors. 2. Do not apply excessive tension to the terminals. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Safety Precautions (Common precautions for Fixed Resistors) * When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use * These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric ap plianc es, offi ce equipment, information and com mu ni cation equipment) * These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials * These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. * Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . * Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. * Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007 - ER3 -