Fixed Metal (Oxide) Film Resistors, Surface Mount Type
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1
2
1W
2W
Power Rating
at 70 °C
J
G
±5%
±2%
Resistance
Tolerance
Resistance Value
E
1
R
2
X
3
2
4
HZ
5 6
J
7 8
1
9
R
10
0 H
Packaging Methods
HEmbossed Carrier
Taping
Product Code
ERX Metal Film
Resistors
The first two digits
are significant
figures of resistance
and the third one
denotes number of
zeros following.
Decimal point is
expressed by
(Ex.) 1R0 : 1.0 액
ERX1H ±5% 22 m to 82 m 0.10 to 0.18 0.20 to 9.1
±2% — 0.10 to 0.91 1.0 to 9.1
ERX2H ±5% 22 m to 82 m 0.10 to 0.20 0.22 to 9.1
±2% — 0.10 to 0.91 1.0 to 9.1
TypeResistanceResistance Value Range (액)
Tolerance ERX첸HQ ERX첸HZ ERX첸H
“Z”, “Q” is added according to resistance.
Style · Specification
HSurface Mount
Type
B
L
P
W
H
A
1
2
1W
2W
Power Rating
at 70 °C
J
G
±5%
±2%
Resistance
Tolerance
Resistance Value
E
1
R
2
G
3
2
4
H
5 6
J
7 8
1
9
0
10
2 H
Product Code
ERG Metal Oxide
Film Resistors
The first two digits are significant figures
of resistance and the third one denotes
number of zeros following.
Decimal point is expressed by
(Ex.) 102 : 1.0 k액
Style · Specification
HSurface Mount
Type
Packaging Methods
HEmbossed Carrier
Taping
Fixed Metal (Oxide) Film Resistors, Sur face Mount Type
Type: ERG(X)1H (1 W)
ERG(X)2H (2 W)
The above example 1 shows a metal fi lm resistor SMD type, 2 W power rating, resistance value of 1.0 액, tolerance ±5 %, and embossed taping.
■Features
●Non-fl ammable
●High Reliability
■Explanation of Part Numbers
Ex.1 : ERX type
■Construction ■Dimensions in mm (not to scale)
End cap Metal (Oxide) fi lm Ceramic core
Terminal Insulation
coating
Ceramic case
–0.5
Type
Dimensions (mm)
PLWHAB
ERG(X)1H
12.5+1.0 9.0±0.5 5.6±0.3 5.0±0.2 1.5±0.3 3.0±1.0
ERG(X)2H
15.0+1. 0
12.0±0.5
6.4±0.3 5.8±0.2 1.5±0.3 4.0±1.0
–0.5
The above example 2 shows a metal oxide fi lm resistor SMD type, 2 W power rating, resistance value of 1.0 k액, tolerance ±5 %,and embossed taping.
Ex.2 : ERG type
Feb. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Fixed Metal (Oxide) Film Resistors, Surface Mount Type
–60 –40 –20 0 20 40 60 80 100 120 140 160 180 200 220 240
0
20
40
60
80
100
120
70 °C–55 °C
Ambient Temperature (°C)
Rated Load (%)
φA
φC
W
φB
T
FE
W
P
1
P
2
P
0
T
A
Tape running direction
Chip component
Sprocket hole
Compartment
φD
1
φD
0
B
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the fi gure on the right.
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=앀Power Rating ҂ Resistance Value.
(2) Resistance tolerance and resistance range is of use besides range listed, please inquire.
(3) As for the low resistance value range, “Q” or “Z” is given to the part number.(Refer to the explanation of part numbers.)
■Ratings
Type
Power
Rating
at 70 °C
(W)(1)
Dielectric
With stand ing
Voltage
(VAC)
Res.
Tol.
(%)(2)
Resistance
Range
(
액
)
(2) T.C.R.
[҂10–6/°C
(ppm/°C)]
Standard
Resistance
Value
min.(3) max.
ERG(X)1H 1 1000
J (±5) 22 m 39 m ±1000
E12
47 m 82 m ±500
G (±2)
J (±5) 0.1 10 k ±350
ERG(X)2H 2 1000
J (±5) 22 m 39 m ±1000
E12
47 m 82 m ±500
G (±2)
J (±5) 0.1 10 k ±350
Dimensions
(mm)
Type W F E A B P1
1H 24.0±0.30 11.5±0.10 1.75±0.10 6.2±0.20 13.7±0.20 8.0±0.10
2H 7.0±0.20 16.2±0.20 12.0±0.10
Dimensions
(mm)
Type P2P0
φ
D0
φ
D1T
1H 2.00±0.10 4.00±0.10 1.50+0.10 1.5 min. 5.7±0.10
2H 6.4±0.10
–0
Dimensions
(mm)
Type
φAφBφCW T
1H, 2H 380±3 80±2 13.0±1.0 25.5±1.0 29.5±1.0
■Packaging Methods
●Standard Quantity
Type Embossed Carrier Taping
ERG(X)1H 2000 pcs./reel
ERG(X)2H 1000 pcs./reel
● Taping Reel
●Embossed Carrier Taping
Feb. 2006
Fixed Metal (Oxide) Film Resistors, Surface Mount Type
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Resistor
c
a
b
Preheating
Peak
Heating
Temperature
Time
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions com mon to Fixed
Resistors shown on page ER3 of this catalog.
1. Transient voltage
If there is a possibility that the transient phe nom e non (signifi cantly high voltage ap plied in a short time) may
oc cur or that a high voltage pulse may be applied, make sure to evaluate and check the char ac ter is tics of
Fixed Metal (Oxide) Film Resistors mounted on your product rather than only depending on the calculated
pow er limit or steady-state conditions to complete the de sign or decide to use the resistors.
2. Do not apply excessive tension to the terminals.
Type Dimensions (mm)
abc
ERG(X)1H 3.5 to 4.0 14.5 to 15.0 2.8 to 3.3
ERG(X)2H 4.0 to 4.5 17.0 to 17.5 3.1 to 3.6
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak 255 °C max. 5 s
■Recommended Land Pattern
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Feb. 2006
– ER3 –
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion
equipment)
• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Se aling or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their
elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)
may be de formed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
