PD - 91482C IRF9530N HEXFET(R) Power MOSFET l l l l l l Advanced Process Technology Dynamic dv/dt Rating 175C Operating Temperature Fast Switching P-Channel Fully Avalanche Rated D VDSS = -100V RDS(on) = 0.20 G ID = -14A S Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry. TO-220AB Absolute Maximum Ratings ID @ TC = 25C ID @ TC = 100C IDM PD @TC = 25C VGS EAS IAR EAR dv/dt TJ TSTG Parameter Max. Continuous Drain Current, VGS @ -10V Continuous Drain Current, VGS @ -10V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting torque, 6-32 or M3 screw -14 -10 -56 79 0.53 20 250 -8.4 7.9 -5.0 -55 to + 175 Units A W W/C V mJ A mJ V/ns C 300 (1.6mm from case ) 10 lbf*in (1.1N*m) Thermal Resistance Parameter RJC RCS RJA Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient Typ. Max. Units --- 0.50 --- 1.9 --- 62 C/W 5/13/98 http://store.iiic.cc/ IRF9530N Electrical Characteristics @ TJ = 25C (unless otherwise specified) RDS(on) VGS(th) gfs Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Qg Qgs Qgd td(on) tr td(off) tf Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Min. -100 --- --- -2.0 3.2 --- --- --- --- --- --- --- --- --- --- --- Typ. --- -0.11 --- --- --- --- --- --- --- --- --- --- 15 58 45 46 IDSS Drain-to-Source Leakage Current LD Internal Drain Inductance --- 4.5 LS Internal Source Inductance --- 7.5 Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance --- --- --- 760 260 170 V(BR)DSS V(BR)DSS/TJ IGSS Max. Units Conditions --- V VGS = 0V, ID = -250A --- V/C Reference to 25C, ID = -1mA 0.20 VGS = -10V, ID = -8.4A -4.0 V VDS = V GS, ID = -250A --- S VDS = -50V, ID = -8.4A -25 VDS = -100V, VGS = 0V A -250 VDS = -80V, VGS = 0V, TJ = 150C 100 VGS = 20V nA -100 VGS = -20V 58 ID = -8.4A 8.3 nC VDS = -80V 32 VGS = -10V, See Fig. 6 and 13 --- VDD = -50V --- ID = -8.4A ns --- RG = 9.1 --- RD = 6.2, See Fig. 10 Between lead, --- 6mm (0.25in.) nH G from package --- and center of die contact --- VGS = 0V --- pF VDS = -25V --- = 1.0MHz, See Fig. 5 D S Source-Drain Ratings and Characteristics IS ISM VSD trr Qrr ton Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Forward Turn-On Time Min. Typ. Max. Units Conditions D MOSFET symbol --- --- -14 showing the A G integral reverse --- --- -56 p-n junction diode. S --- --- -1.6 V TJ = 25C, IS = -8.4A, VGS = 0V --- 130 190 ns TJ = 25C, I F = -8.4A --- 650 970 nC di/dt = -100A/s Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 ) Starting TJ = 25C, L = 7.0mH ISD -8.4A, di/dt -490A/s, VDD V(BR)DSS, TJ 175C Pulse width 300s; duty cycle 2%. RG = 25, IAS = -8.4A. (See Figure 12) http://store.iiic.cc/ IRF9530N 100 100 VGS - 15V - 10V - 8.0V - 7.0V - 6.0V - 5.5V - 5.0V BOT TOM - 4.5V VGS - 15V - 10V - 8.0V - 7.0V - 6.0V - 5.5V - 5.0V BOTTOM - 4.5V TOP -ID , D rain-to-S ource C urrent (A ) -ID , D rain-to-S ou rc e C urre nt (A ) TO P 10 -4.5 V 1 2 0 s P U LS E W ID TH T c = 2 5C A 0.1 0.1 1 10 10 -4.5V 1 2 0 s P U LS E W ID T H T C = 1 75 C 0.1 100 0.1 -VD S , D rain-to-S ourc e V oltage (V ) 2.5 R DS(on) , Drain-to-Source On Resistance (Normalized) -I D , D rain-to-S ource C urrent (A) T J = 2 5 C 10 TJ = 1 7 5 C 1 V DS = -5 0 V 2 0 s P U L S E W ID TH 5 6 7 8 A 10 9 A 100 Fig 2. Typical Output Characteristics 100 4 10 -VD S , D rain-to-S ource V oltage (V ) Fig 1. Typical Output Characteristics 0.1 1 ID = -14A 2.0 1.5 1.0 0.5 0.0 -60 -40 -20 -VG S , Ga te -to-Source Volta ge (V) Fig 3. Typical Transfer Characteristics http://store.iiic.cc/ VGS = -10V 0 20 40 60 80 100 120 140 160 180 TJ , Junction Temperature ( C) Fig 4. Normalized On-Resistance Vs. Temperature IRF9530N V GS C iss C rs s C o ss C , Capacitance (pF) 1600 1200 = = = = 20 0V , f = 1MHz C g s + C g d , C d s S H O R TE D C gd C ds + C g d -VGS , Gate-to-Source Voltage (V) 2000 C iss 800 C oss C rss 400 0 10 10 5 FOR TEST CIRCUIT SEE FIGURE 13 0 0 100 10 20 30 40 50 60 QG , Total Gate Charge (nC) -VD S , D rain-to-S ourc e V oltage (V ) Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 100 1000 OPERATION IN THIS AREA LIMITED BY RDS(on) T J = 15 0C -II D , Drain Current (A) -I S D , Reverse D rain Current (A ) VDS =-80V VDS =-50V VDS =-20V 15 A 1 ID = -8.4A 10 100 T J = 25 C 1 10us 100us 10 1ms V G S = 0V 0.1 0.4 0.6 0.8 1.0 1.2 1.4 A 1 1 1.6 10ms 10 100 -VDS , Drain-to-Source Voltage (V) -VS D , S ourc e-to-D rain V oltage (V ) Fig 7. Typical Source-Drain Diode Forward Voltage TC = 25 C TJ = 175 C Single Pulse Fig 8. Maximum Safe Operating Area http://store.iiic.cc/ 1000 IRF9530N 14 RD VDS -ID , Drain Current (A) 12 VGS D.U.T. RG 10 + 8 VDD -10V Pulse Width 1 s Duty Factor 0.1 % 6 Fig 10a. Switching Time Test Circuit 4 2 td(on) tr t d(off) tf VGS 10% 0 25 50 75 100 125 150 175 TC , Case Temperature ( C) 90% Fig 9. Maximum Drain Current Vs. Case Temperature VDS Fig 10b. Switching Time Waveforms Thermal Response (Z thJC ) 10 1 D = 0.50 0.20 0.10 P DM 0.05 0.1 0.01 0.00001 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJC + TC 0.0001 0.001 0.01 0.1 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case http://store.iiic.cc/ 1 IRF9530N 700 D .U .T RG A IA S -2 0 V tp VD D D R IV E R 0 .0 1 15V Fig 12a. Unclamped Inductive Test Circuit EAS , Single Pulse Avalanche Energy (mJ) L VDS ID -3.4A -5.9A BOTTOM -8.4A TOP 600 500 400 300 200 100 0 25 IAS 50 75 100 125 150 Starting TJ , Junction Temperature ( C) Fig 12c. Maximum Avalanche Energy Vs. Drain Current tp V (BR)DSS Fig 12b. Unclamped Inductive Waveforms Current Regulator Same Type as D.U.T. 50K QG 12V .3F -10V QGS .2F QGD D.U.T. +VDS VGS VG -3mA IG Charge ID Current Sampling Resistors Fig 13a. Basic Gate Charge Waveform http://store.iiic.cc/ Fig 13b. Gate Charge Test Circuit 175 IRF9530N Peak Diode Recovery dv/dt Test Circuit + D.U.T* Circuit Layout Considerations * Low Stray Inductance * Ground Plane * Low Leakage Inductance Current Transformer + - - + * dv/dt controlled by RG * ISD controlled by Duty Factor "D" * D.U.T. - Device Under Test RG VGS * + - VDD Reverse Polarity of D.U.T for P-Channel Driver Gate Drive P.W. D= Period P.W. Period [VGS=10V ] *** D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt Re-Applied Voltage Body Diode [VDD] Forward Drop Inductor Curent Ripple 5% *** VGS = 5.0V for Logic Level and 3V Drive Devices Fig 14. For P-Channel HEXFETS http://store.iiic.cc/ [ ISD ] IRF9530N Package Outline TO-220AB Outline Dimensions are shown in millimeters (inches) 2.87 (.11 3) 2.62 (.10 3) 10 .54 (.4 15) 10 .29 (.4 05) 3 .7 8 (.149 ) 3 .5 4 (.139 ) -A - -B 4.69 ( .18 5 ) 4.20 ( .16 5 ) 1 .32 (.05 2) 1 .22 (.04 8) 6.47 (.25 5) 6.10 (.24 0) 4 1 5.24 (.60 0) 1 4.84 (.58 4) 1.15 (.04 5) M IN 1 2 1 4.09 (.55 5) 1 3.47 (.53 0) 4.06 (.16 0) 3.55 (.14 0) 3X 3X L E A D A S S IG NM E NT S 1 - GATE 2 - D R A IN 3 - S O U RC E 4 - D R A IN 3 1 .4 0 (.0 55 ) 1 .1 5 (.0 45 ) 0.93 (.03 7) 0.69 (.02 7) 0 .3 6 (.01 4) 3X M B A M 0.55 (.02 2) 0.46 (.01 8) 2 .92 (.11 5) 2 .64 (.10 4) 2.54 (.10 0) 2X N O TE S : 1 D IM E N S IO N IN G & TO L E R A N C ING P E R A N S I Y 1 4.5M , 1 9 82. 2 C O N TR O L LIN G D IM E N S IO N : IN C H 3 O U T LIN E C O N F O R M S TO JE D E C O U T LIN E TO -2 20 A B . 4 H E A TS IN K & LE A D M E A S U R E M E N T S D O N O T IN C LU DE B U R R S . Part Marking Information TO-220AB : IS TH IS A ISN AIR N F1 IR0F1 E X AEMXPA LMEP :L ETH 1 00 1 0 W ITWH ITAHS SAESMS BE LMYB L Y C EO D9EB 19MB 1 M L O TL OCTO D A INRTE N A TIO IN TE N ARTIO N A LN A L E C IE TIFR IE R R E CRTIF IR F IR 10F110 0 10 L O GL O G O 9 2 4962 4 6 9B 9B 1M 1M A S SAESMS BE LMYB L Y C EO D E L O TL O TC O D A NB U EMRB E R P A RPTA RNTU M D A TE C EO D E D A TE COD (Y Y W W (Y Y W W ) ) Y Y Y=Y Y=E AYRE A R W WW W = W= EW E KE E K WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-ku, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 5/98 http://store.iiic.cc/ Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ http://store.iiic.cc/