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Model XMC0204F1-03G
Rev D
PRELIMINARY
.200±.010
[5.08±0.25]
Orientation Mark
Denotes Pin 1
Dimensions are in Inches [Millimeters]
XMC0204F1-03G Mechanical Outline
4x .025±.004 Sq
[0.64±0.10]
.125±.010
[3.18±0.25]
.052±.005
[1.31±0.13]
Pin 2
Pin 3
Pin 1
Pin 4
Gnd
4x .015±.004
[0.38±0.10]
4x .015±.004
[0.38±0.10]
.140±.004
[3.56±0.10]
.065±.004
[1.65±0.10]
Pin 2
Pin 3
Pin 1
Pin 4
Gnd
Tolerances are Non-cumulative
Hybrid Coupler
3 dB, 90
Description
The XMC0204F1-03G is a low profile, high performance 3dB hybrid coupler in
a new easy to use, manufacturing friendly surface mount package. It is
designed for broad band S-band radar applications and high reliability
applications in the 2000 MHz to 4000 MHz range. It can be used in high
power applications up to 40 Watts.
Parts have been subjected to rigorous qualification testing and they are
manufactured using materials with coefficients of thermal expansion (CTE)
compatible with common substrates such as FR4, G-10, RF-35, RO4350 and
polyimide. Available in 6 of 6 ENIG (XMC0204F1-03G) RoHS compliant
finish.
Electrical Specifications **
Features:
2000 - 4000 MHz
S Band Radar
High Power
Very Low Loss
Tight Amplitude Balance
High Isolation
Production Friendly
Tape and Reel
ENIG Finish
Frequency
Isolation
Insertion
Loss
VSWR
Amplitude
Balance
MHz
dB Min
dB Max
Max : 1
dB Max
2000 - 4000
17
0.30
1.33
± 0.70
2700 - 4000
20
0.30
1.22
± 0.60
2700 - 3700
20
0.25
1.22
± 0.35
Phase
Power
JC
Operating
Temp.
Degrees
Avg. CW Watts
ºC/Watt
ºC
90 ± 4.0
40
64
-55 to +85
90 ± 4.0
40
64
-55 to +85
90 ± 4.0
40
64
-55 to +85
*Power Handling for commercial, non-life critical applications. See derating chart for other applications
**Specification based on performance of unit properly installed on Anaren Test Board 67406-0001 with small
signal applied. Specifications subject to change without notice. Refer to parameter definitions for details.
Mechanical Outline
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Hybrid Coupler Pin Configuration
The XMC0204F1-03G has an orientation marker to denote Pin 1. Once port one has been identified the other ports are
known automatically. Please see the chart below for clarification:
Configuration
Pin 1
Pin 2
Pin 3
Pin 4
Splitter
Input
Isolated
-3dB
90
-3dB
Splitter
Isolated
Input
-3dB
-3dB
90
Splitter
-3dB
90
-3dB
Input
Isolated
Splitter
-3dB
-3dB
90
Isolated
Input
*Combiner
A
90
A
Isolated
Output
*Combiner
A
A
90
Output
Isolated
*Combiner
Isolated
Output
A
90
A
*Combiner
Output
Isolated
A
A
90
*Note: “A” is the amplitude of the applied signals. When two quadrature signals with equal amplitudes are
applied to the coupler as described in the table, they will combine at the output port. If the amplitudes are
not equal, some of the applied energy will be directed to the isolated port.
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Insertion Loss and Power Derating Curves
Insertion Loss Derating:
The insertion loss, at a given frequency, of a group of
couplers is measured at 25C and then averaged. The
measurements are performed under small signal
conditions (i.e. using a Vector Network Analyzer). The
process is repeated at 85C and 150C. A best-fit line
for the measured data is computed and then plotted
from -55C to 150C.
Power Derating:
The power handling and corresponding power derating
plots are a function of the thermal resistance, mounting
surface temperature (base plate temperature),
maximum continuous operating temperature of the
coupler, and the thermal insertion loss. The thermal
insertion loss is defined in the Power Handling section of
the data sheet.
As the mounting interface temperature approaches the
maximum continuous operating temperature, the power
handling decreases to zero.
If mounting temperature is greater than 85C, Xinger
coupler will perform reliably as long as the input power
is derated to the curve above.
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Typical Performance (-55°C, 25°C & 85°C): 2000-4000 MHz
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for XMC0204F1-03G (Feeding Port 1)
-55ºC
25ºC
85ºC
105ºC
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for XMC0204F1-03G (Feeding Port 2)
-55ºC
25ºC
85ºC
105ºC
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for XMC0204F1-03G (Feeding Port 3)
-55ºC
25ºC
85ºC
105ºC
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for XMC0204F1-03G (Feeding Port 4)
-55ºC
25ºC
85ºC
105ºC
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Typical Performance (-55°C, 25°C & 85°C): 2000-4000 MHz
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000
-3.8
-3.7
-3.6
-3.5
-3.4
-3.3
-3.2
-3.1
-3
-2.9
-2.8
-2.7 Coupling (dB) XMC0204F1-03G (Feeding Port 1)
Frequency [MHz]
Coupling (dB)
-55oC
25oC
85oC
105oC
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000
-50
-40
-30
-20
-10
0
Frequency (MHz)
Isolation (dB)
Isolation for XMC0204F1-03G (Feeding Port 1)
-55ºC
25ºC
85ºC
105ºC
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000
-1
-0.8
-0.6
-0.4
-0.2
0Insertion Loss (dB) XMC0204F1-03G (Feeding Port 1)
Frequency [MHz]
Insertion Loss (dB)
-55oC
25oC
85oC
105oC
2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000
-4
-2
0
2
4
Frequency (MHz)
Phase Balance (deg)
Phase Balance for XMC0204F1-03G (Feeding Port 1)
-55ºC
25ºC
85ºC
105ºC
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Definition of Measured Specifications
Parameter
Definition
Mathematical Representation
VSWR
(Voltage Standing Wave
Ratio)
The impedance match of
the coupler to a 50
system. A VSWR of 1:1
is optimal.
VSWR =
min
max
V
V
Vmax = voltage maxima of a standing wave
Vmin = voltage minima of a standing wave
Return Loss
The impedance match of
the coupler to a 50
system. Return Loss is
an alternate means to
express VSWR.
Return Loss (dB)= 20log
1-VSWR 1VSWR
Insertion Loss
The input power divided
by the sum of the power
at the two output ports.
Insertion Loss(dB)= 10log
direct cpl
in
PP P
Isolation
The input power divided
by the power at the
isolated port.
Isolation(dB)= 10log
iso
in
P
P
Phase Balance
The difference in phase
angle between the two
output ports.
Phase at coupled port – Phase at direct port
Amplitude Balance
The power at each output
divided by the average
power of the two outputs.
10log
2PP P
directcpl
cpl
and 10log
2PP P
directcpl
direct
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PRELIMINARY
Notes on RF Testing and Circuit Layout
The XMC0204F1-03G Surface Mount Coupler requires the use of a test fixture for verification of RF performance.
This test fixture is designed to evaluate the coupler in the same environment that is recommended for installation.
Enclosed inside the test fixture, is a circuit board that is fabricated using the recommended footprint. The part being
tested is placed into the test fixture and pressure is applied to the top of the device using a pneumatic piston. A four
port Vector Network Analyzer is connected to the fixture and is used to measure the S-parameters of the part. Worst
case values for each parameter are found and compared to the specification. These worst case values are reported to
the test equipment operator along with a Pass or Fail flag. See the illustrations below.
3 dB
Test Board
Test Board
In Fixture
Test Station
Test Board
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The effects of the test fixture on the measured data must be minimized in order to accurately determine the
performance of the device under test. If the line impedance is anything other than 50 and/or there is a discontinuity
at the microstrip to SMA interface, there will be errors in the data for the device under test. The test environment can
never be “perfect”, but the procedure used to build and evaluate the test boards (outlined below) demonstrates an
attempt to minimize the errors associated with testing these devices. The lower the signal level that is being
measured, the more impact the fixture errors will have on the data. Parameters such as Return Loss and
Isolation/Directivity, which are specified as low as 27dB and typically measure at much lower levels, will present the
greatest measurement challenge.
The test fixture errors introduce an uncertainty to the measured data. Fixture errors can make the performance of the
device under test look better or worse than it actually is. For example, if a device has a known return loss of 30dB and
a discontinuity with a magnitude of –35dB is introduced into the measurement path, the new measured Return Loss
data could read anywhere between –26dB and –37dB. This same discontinuity could introduce an insertion phase
error of up to 1.
There are different techniques used throughout the industry to minimize the effects of the test fixture on the
measurement data. Anaren uses the following design and de-embedding criteria:
Test boards have been designed and parameters specified to provide trace impedances of 50
1. Furthermore, discontinuities at the SMA to microstrip interface are required to be less than
–35dB and insertion phase errors (due to differences in the connector interface discontinuities
and the electrical line length) should be less than 0.50 from the median value of the four
paths.
A “Thru” circuit board is built. This is a two port, microstrip board that uses the same SMA to
microstrip interface and has the same total length (insertion phase) as the actual test board. The
“Thru” board must meet the same stringent requirements as the test board. The insertion loss
and insertion phase of the “Thru” board are measured and stored. This data is used to
completely de-embed the device under test from the test fixture. The de-embedded data is
available in S-parameter form on the Anaren website (www.anaren.com).
Circuit Board Layout
The dimensions for the Anaren test board are shown below. The test board is printed on Rogers RO4350 material
that is 0.020” thick. Consider the case when a different material is used. First, the pad size must remain the same to
accommodate the part. But, if the material thickness or dielectric constant (or both) changes, the reactance at the
interface to the coupler will also change. Second, the linewidth required for 50 will be different and this will introduce
a step in the line at the pad where the coupler interfaces with the printed microstrip trace. Both of these conditions will
affect the performance of the part. To achieve the specified performance, serious attention must be given to the
design and layout of the circuit environment in which this component will be used.
If a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance
that is present on the Anaren RO4350 test board. When thinner circuit board material is used, the ground plane will
be closer to the pad yielding more capacitance for the same size interface pad. The same is true if the dielectric
constant of the circuit board material is higher than is used on the Anaren test board. In both of these cases,
narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will
compensate for the extra capacitive reactance. If a thicker circuit board or one with a lower dielectric constant is used,
The interface pad will have less capacitive reactance than the Anaren test board. In this case, a wider section of line
before the interface pad (or a larger interface pad) will introduce a shunt capacitance and when properly tuned will
match the performance of the Anaren test board.
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Notice that the board layout for the 3dB couplers is different from that of the 30dB couplers. The test board for the
3dB couplers has all four traces interfacing with the coupler at the same angle. The test board for the 30dB couplers
has two traces approaching at one angle and the other two traces at a different angle. The entry angle of the traces
has a significant impact on the RF performance and these parts have been optimized for the layout used on
the test boards shown below.
69772- PFHX_A
Ø.015
THRU HOLE
2x .065
.025 TYP 4x .040
(1.930)
.140
(2.290)
3 dB Test Board
Testing Sample Parts Supplied on Anaren Test Boards
If you have received a coupler installed on an Anaren produced microstrip test board, please remember to remove the
loss of the test board from the measured data. The loss is small enough that it is not of concern for Return Loss and
Isolation/Directivity, but it should certainly be considered when measuring coupling and calculating the insertion loss
of the coupler. An S-parameter file for a “Thru” board (see description of “Thru” board above) will be supplied upon
request. As a first order approximation, one should consider the following loss estimates:
Frequency Band
Avg. Ins. Loss of Test Board @ 25C
869-894 MHz
~0.092dB
925-960 MHz
~0.095dB
1805-1880 MHz
~0.166dB
1930-1990 MHz
~0.170dB
2110-2170 MHz
~0.186dB
2000-2500 MHz
~0.208dB
2500-3000 MHz
~0.240dB
3000-3500 MHz
~0.270dB
3500-4000 MHz
~0.312dB
The loss estimates in the table above come from room temperature measurements. It is important to note that the
loss of the test board will change with temperature. This fact must be considered if the coupler is to be evaluated at
other temperatures.
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Peak Power Handling
At Sealevel
High-Pot testing of these couplers during the qualification procedure resulted in a minimum breakdown
voltage of TBDKv (minimum recorded value). This voltage level corresponds to a breakdown resistance capable of
handling at least 12dB peaks over average power levels, for very short durations. The breakdown location
consistently occurred across the air interface at the coupler contact pads (see illustration below). The breakdown
levels at these points will be affected by any contamination in the gap area around these pads. These areas must be
kept clean for optimum performance.
At High Altitudes
Breakdown voltage at high altitude reduces significantly comparing with the one at sea level. As an
example, plot below illustrates reduction in breakdown voltage of 1700 V at sea level with increasing altitude. The plot
uses Paschen’s Law to predict breakdown voltage variation over the air pressure.
It is recommended that the user test for voltage breakdown under the maximum operating conditions and over worst
case modulation induced power peaking. This evaluation should also include extreme environmental conditions (such
as high humidity) and physical conditions such as alignment of part to carrier board, cleanliness of carrier board etc.
Test Plan
Xinger couplers are manufactured in large panels and then separated. All parts are RF small signal tested and DC
tested for shorts/opens at room temperature in the fixture described above . (See “Qualification Flow Chart” section
for details on the accelerated life test procedures.)
Breakdown Voltage (Volts)
Altitude (ft)
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PRELIMINARY
Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
Internal circuit temperature.
Unit mounting interface temperature.
Unit thermal resistance
Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
The unit has reached a steady state operating condition.
Maximum mounting interface temperature is 85oC.
Conduction Heat Transfer through the mounting interface.
No Convection Heat Transfer.
No Radiation Heat Transfer.
The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
Unit material stack-up.
Material properties.
Circuit geometry.
Mounting interface temperature.
Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta (T) divided by thermal resistance (R). The
dissipated power (Pdis) can also be calculated as a function of the total input power (Pin) and the thermal insertion loss
(ILtherm):
)(10110 WP
R
T
Ptherm
IL
indis
(1)
Power flow and nomenclature for an “X” style coupler is shown in Figure 1.
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Pin 1
Pin 4
Input Port
Coupled Port Direct Port
Isolated Port
PIn POut(RL) POut(ISO)
POut(CPL) POut(DC)
Figure 1
The coupler is excited at the input port with Pin (watts) of power. Assuming the coupler is not ideal, and that there are
no radiation losses, power will exit the coupler at all four ports. Symbolically written, Pout(RL) is the power that is
returned to the source because of impedance mismatch, Pout(ISO) is the power at the isolated port, Pout(CPL) is the
power at the coupled port, and Pout(DC) is the power at the direct port.
At Anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and
direct ports:
Note: in this document, insertion loss is taken to be a positive number. In many places, insertion loss is written as a
negative number. Obviously, a mere sign change equates the two quantities.
)dB(
PP P
log10IL
)DC(out)CPL(out
in
10
(2)
In terms of S-parameters, IL can be computed as follows:
)dB(SSlog10IL 2
41
2
3110
(3)
We notice that this insertion loss value includes the power lost because of return loss as well as power lost to the
isolated port.
For thermal calculations, we are only interested in the power lost “inside” the coupler. Since Pout(RL) is lost in the
source termination and Pout(ISO) is lost in an external termination, they are not be included in the insertion loss for
thermal calculations. Therefore, we define a new insertion loss value solely to be used for thermal calculations:
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)(log10
)()()()(
10 dB
PPPP P
IL
RLoutISOoutDCoutCPLout
in
therm
(4)
In terms of S-parameters, ILtherm can be computed as follows:
)(log10 2
41
2
31
2
21
2
1110 dBSSSSILtherm
(5)
The thermal resistance and power dissipated within the unit are then used to calculate the average total input power
of the unit. The average total steady state input power (Pin) therefore is:
)(
1011011010
W
R
T
P
Pthermtherm ILIL
dis
in
(6)
Where the temperature delta is the circuit temperature (Tcirc) minus the mounting interface temperature (Tmnt):
)( CTTT o
mntcirc
(7)
The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit.
Multiple material combinations and bonding techniques are used within the Xinger product family to optimize RF
performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit
temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot
be used as a boundary condition for power handling calculations.
Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the
end users responsibility to ensure that the Xinger coupler mounting interface temperature is maintained within the
limits defined on the power derating plots for the required average power handling. Additionally appropriate solder
composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the
mounting interface and RF port temperatures are kept to a minimum.
The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes
of the power handling of the coupler.
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To ensure proper electrical and thermal performance there
must be a ground plane with 100% solder connection
underneath the part orientated as shown with text facing up
.141
[3.58]
4x .015
[0.38]
4x 50
Transmission
Line
.065
[1.65]
Dimensions are in inches [Millimeters]
Mounting
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines
leading to and from all of the RF ports. Also, there
must be a very good ground plane underneath the
part to ensure proper electrical performance. If
either of these two conditions is not satisfied,
electrical performance may not meet published
specifications.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom
ground layers of the PCB. This minimizes ground
inductance and improves ground continuity. All of
the Xinger hybrid and directional couplers are
constructed from ceramic filled PTFE composites
which possess excellent electrical and mechanical
stability having X and Y thermal coefficient of
expansion (CTE) of 17-25 ppm/oC.
When a surface mount hybrid coupler is mounted to
a printed circuit board, the primary concerns are;
ensuring the RF pads of the device are in contact
with the circuit trace of the PCB and insuring the
ground plane of neither the component nor the PCB
is in contact with the RF signal.
Mounting Footprint
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high
volume usage.
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger Couplers are
available in ENIG finish. Dry packaging will be effective
for a least one year if stored at less than 40 °C and 90%
RH (see IPC/JEDEC J-STD-033). For more than one
year, shelf life and storage are similar to parts with Tin
Lead Finish.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25ppm/°C. This coefficient
minimizes solder joint stresses due to similar expansion
rates of most commonly used board substrates such as
RF35, RO4003, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is possible
depending upon operational temperature requirements.
The solder surfaces of the coupler are all copper plated
with either an immersion tin or tin-lead exterior finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
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Figure 2: Solder Paste Application
Coupler Positioning: The surface mount coupler can
be placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 3
and 4) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.069 gram
coupler.
Figure 3: Component Placement
Figure 4: Mounting Features Example
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. Low and high
temperature thermal reflow profiles are shown in Figures 5
and 6, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
Solder Joint Composition
The percentage by mass of gold in Xinger Couplers with
ENIG plating is low enough that it does not pose a gold
embrittlement risk.
Table below illustrates the configurations evaluated
assuming the ENIG plating thickness is min 7µin,
thickness of solder is 2000µin and thickness of Tin lead
plating is 200µin
Xinger
Finish
PCB Pad
Finish
Solder
Composition
%
Gold,Wt
1
ENIG
Tin-lead
Eutectic tin-lead
<3%
2
ENIG
ENIG
Eutectic tin-lead
<3%
3
ENIG
Tin-lead
Tin-silver
<3%
4
ENIG
ENIG
Tin-silver
<3%
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model XMC0204F1-03G
Rev D
Figure 5 – Low Temperature Eutectic Solder ( 63/37) Reflow Thermal Profile
Figure 6 – High Temperature SnAg or SAC Solder Reflow Thermal Profile
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model XMC0204F1-03G
Rev D
PRELIMINARY
Qualification Flow Chart
Visual Inspection
n=45
Mechanical Inspection
n=40
Solderability Test
n=5
Initial RF Test
n=40
Solder Units to Test Board
n=20
Post Solder Visual Inspection
n=20
Initial RF Test Board Mounted
Over Temp
n=20
Visual Inspection
n=40
Automated TT&R Operation
n=45
Thermal Shock
n=40
Post Shock RF Test
n=40
Moisture Resistance
n=40
Reflow /Resistance to
Solder Heat
n=20 (loose)
Bake Units
n=40
Micro section
n = 2
Visual Inspection
n=40
Life Test
n=3
Final RF Test
n=3
RF Test
n = 20 (loose), n = 20
(mounted over temp)
Voltage Breakdown
n=10
Visual Inspection
n=10
RF Test
n=10
Micro section
n = 1 loose control, n = 1
mounted control, n = 3
board mounted, n = 3
loose
Visual Inspection
n=45
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model XMC0204F1-03G
Rev D
Packaging and Ordering Information
Parts are available in reels. Packaging follows EIA 481-D for reels. Parts are oriented in tape and reel as shown
below. Tape and reel is available in two sizes of 250 pcs or 4000 pcs per reel..
SECTION A-A
.472
[12.00]
.069
[1.75]
A
A
.217
[5.50]
.315
[8.00]
.079
[2.00]
.157
[4.00]
.012
[0.30]
.071
[1.80] Direction of
Part Feed
(Loading)
.213
[5.40]
.138
[3.50]
RR CC
XXFX-XXS
X3C
Ø.059
[Ø1.50]
Dimensions are in Inches [Millimeters]
B
ØA ØC
REEL DIMENSIONS (inches [mm])
TABLE 1
ØA 13.0 [330.0]
B .945 [24.0]
ØC 4.017 [102.03]
ØD 0.512 [13.0]
