6
HOW TO ORDER
CB
Type
CB: SMD Lead Free
CL
04
Size
01: 1206
02: 1210
03: 1812
04: 2220
05: 2824
95: 2840
16: 4030
17: 5040
18: 6054
2
Dielectric
2 = PET-HT
8 = PPS
7 = PEN
G
Voltage
B = 16V
C = 25V
D = 50/63V
E = 100V
G = 250V
I = 400V
K = 630V
0104
Capacitance
1st digit: 0
2nd & 3rd: the 2nd
significant figures of the
capacitance value.
4th digit: the number of
zeros to be added to the
capacitance value.
K
Tolerance
EIA Code
G(1) = 2%
J = 5%
K = 10%
--
Suffix Packaging
-- = bulk
BA = tape & reel
diameter: 180mm
BC = tape & reel
diameter: 330mm
Example of an order: How to order a chip film PET-HT 100nF ±10% 250V bulk packaging.
(1): Tolerance G available only for PPS Series.
Film Chip Capacitors
How to Order, Dimensions and Construction
Size Code Equivalent size Length (L) Width (W) Termination Return
01 1206 3.30±0.30 (0.130±0.012) 1.60±0.30 (0.063±0.012) 0.50±0.30 (0.020±0.012)
02 1210 3.30±0.30 (0.130±0.012) 2.50±0.30 (0.098±0.012) 0.50±0.30 (0.020±0.012)
03 1812 4.50±0.50 (0.177±0.020) 3.20±0.50 (0.126±0.020) 0.60±0.40 (0.024±0.157)
04 2220 5.80±0.50 (0.228±0.020) 5.00±0.50 (0.197±0.020) 0.80±0.60 (0.032±0.024)
05 2824 7.20±0.50 (0.283±0.020) 6.10±0.50 (0.240±0.020) 0.80±0.60 (0.032±0.024)
95 2840 7.20±0.50 (0.283±0.020) 10.0±0.80 (0.343±0.031) 0.80±0.60 (0.032±0.024)
16 4030 10.5±0.60 (0.413±0.024) 7.60±0.80 (0.299±0.031) 0.80±0.60 (0.032±0.024)
17 5040 12.8±0.60 (0.504±0.024) 10.2±0.80 (0.401±0.031) 0.80±0.60 (0.032±0.024)
18 6054 15.3±0.60 (0.602±0.024) 13.7±0.80 (0.539±0.031) 0.80±0.60 (0.032±0.024)
CASE DIMENSIONS: millimeters (inches)
W
L
H
T
STACKED FILM CONSTRUCTION
Our SMD Film capacitors (CB series) are using stacked tech-
nology with metallized plastic film, which forms the basis for
the capacitive element. Combined with the nacked design
choice, it gives our products an again better self-healing
capability as well as a very good capacitance per volume
ratio. This also means that internal construction of the multi-
layer stack, usually hidden in encapsulated film capacitors
design, is visible at the cut edges in the surface mount con-
figuration. In a typical film capacitor stack, hundreds of film
layers are compacted during manufacture. Under a micro-
scope these have the appearance of pages in a book.
Subsequent manufacturing and pcb assembly processes
allow a small amount of relaxation in these layers. In some
cases, small gaps between layers may become visible. These
are referred to as microgaps, and their occurrence is a stan-
dard feature of this technology. Even if it can be considered
an cosmetic issue, presence of these gaps has no effect at all
on mechanical or electrical performance or reliability. (Detailed
report is available upon request.)
7
Film Chip Capacitors
Electrical Properties and Test Conditions – CB Series
Test Description Performance
Capacitance C Measurement frequency 1 KHz 20°C Shall be within tolerance of the rated value
Dissipation Factor DF Measurement frequency 1 KHz 20°C DF < 100.10-4
Insulation Resistance IR Voltage applied: IR > 1000 Mohms for C < = 0.33µF
10V for Vr < 100V IR x C > 400sec. For C > 0.33µF
100V for Vr > = 100V
Dielectric Strength Surge Voltage = 1.4Vr applied There shall be no direct breakdown
for 1mm between terminals
Mounting Board = 1.6mm (0.063") thick epoxy C = within ± 2% of initial value
glass laminated or alumine substrate DF = < = 50.10-4 at 1 KHz
IR = within initial limit
Adhesion Force of 5 N applied for 10 secs. No visible damage
Board Bending Test Bending of 1 mm(0.039") C = within ± 2% of initial value
for 90 mm (3.543") length No visible damage
Thermal Shock 500 cycles –55/+125°C C = within ± 5% of initial value
ESR = no more than 3 times initial value
IR = not less than 50% of the initial limit
Damp Heat 40°C 93% RH / no voltage / 56 days C = within ± 7% of initial value
Steady State Delta DF = < 50.10-4 at 1 KHz
IR = not less than 50% of the initial limit
Accelerated Damp Heat 85ºC 85% RH 1.5V-500H C = within ± 7% of initial value
(Load Humidity) Delta DF = < = 70.10-4 at 1 KHz
IR = not less than 50% of the initial limit
Life Test 85ºC / 1.25Vr / 1000H C = within ± 8% of initial value
Delta DF = < 50.10-4 at 1 KHz
IR = not less than 50% of the initial limit
Life Test 105°C / Vr/1,000 Hours C = within ± 7% of initial value
125°C / Vr/1,000 Hours Delta DF = < 50.10-4 at 1 KHz
IR = not less than 50% of the initial limit
Charge/Discharge 10,000 cycle / Vr C = within ± 5% of initial value
DF = < 50.10-4 at 1 KHz
IR = not less than 50% of the initial limit
STANDARDIZATION
Reference Standard is CECC 32201
9
Film Chip Capacitors
Packaging – CB Series
TAPE & REEL DIMENSIONS
2.00 (0.079)
± 0.05 (0.002)
4.00 (0.157)
± 0.10 (0.004) 1.75 (0.069)
± 0.15 (0.006)
1.50 (0.059)
W
K0
Direction of unreeling
P1
+0.10
-0
⭋
13.0 (0.512)
± 0.50 (0.020)
W2
W1
A
TAPE & REEL CHARACTERISTICS
In accordance with IEC 286 and EIA 481, the material used:
Carrier tape: Antistatic Material
Cover tape: Polyester
Reel: Recyclable Material
Parts in bulk or on reel are packed in hermetically sealed
plastic bags.
RECOMMENDATIONS
Once the sealed bag is opened, the capacitors must be
stored in a dry atmosphere until soldering.
Recommended storage conditions are:
PET & PEN: < 30°C and R.H.<60% for a maximum of
168 hours
PPS: < 30°C and R.H.<60% for a maximum of
4 weeks
The use-by date is 3 years if kept in origin plastic bags.
In case of storage outside the conditions recommended
above the capacitors must be dried prior to soldering.
Recommended drying conditions are:
48 hours minimum at 60°C and RH < 10%.
