Board Level Heat Sinks P/N: 832202B00000 TO-220 PRODUCT SPECIFICATIONS CUSTOMIZED HEATSINKS * Specialized Plating * Specialized Body Configurations * Contact Applications Engineering 200 400 600 800 1000 100 20 80 16 60 12 40 8 20 4 0 0 0 1 2 3 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 (Mounting Surface to Ambient) * No Hardware Device Attachment * Constant Spring Force Tension * Device Alignment Rails * RoHS Compliant 0 Thermal Resistance - oC/ Watt FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient -oC (Mounting Surface) * Devices: TO-220 * Size: 20.0 x 5.0 x 25.0 mm * Material: Aluminum, 0.8 mm thick * Type: Stamped * Finish: Black Anodized * PCB Mounting: Device Leads * IC Mounting: Integrated Spring * Package: Bulk