Data Sheet 04.95
Microcomputer Components
SAB 80C517/80C537
8-Bit CMOS Single-Chip Microcontroller
Semiconductor Group 1 04.95
High-Performance SAB 80C517/80C537
8-Bit CMOS Single-Chip Microcontroller
Advanced Information
SAB 80C517 Microcontroller with factory mask-programmable ROM
SAB 80C537 Microcontroller for external ROM
Versions for 12 MHz and 16 MHz Fast 32-bit division, 16-bit 2 multiplication,
operating frequency 32-bit normalize and shift by peripheral
8 K × 8 ROM (SAB 80C517 only) MUL/DIV unit (MDU)
256 × 8 on-chip RAM Eight data pointers for external memory
Superset of SAB 80C51 architecture: addressing
1µs instruction cycle time at 12 MHz Fourteen interrupt vectors, four priority
750 ns instruction cycle time at 16 MHz levels selectable
256 directly addressable bits 8-bit A/D converter with 12 multiplexed
Boolean processor inputs and programmable ref. voltages
64 Kbyte external data and program Two full duplex serial interfaces
memory addressing Fully upward compatible with SAB 80C515
Four 16-bit timer/counters Extended power saving modes
Powerful 16-bit compare/capture unit Nine ports: 56 I/O lines, 12 input lines
(CCU) with up to 21 high-speed or PWM Two temperature ranges available:
output channels and 5 capture inputs 0 to 70 oC
Versatile "fail-safe" provisions – 40 to 85 oC
Plastic packages: P-LCC-84,
P-MQFP-100-2
SAB 80C517/80C537
SAB 80C517/80C537
Semiconductor Group 2
The SAB 80C517/80C537 is a high-end member of the Siemens SAB 8051 family of
microcontrollers. It is designed in Siemens ACMOS technology and based on the SAB 8051
architecture. ACMOS is a technology which combines high-speed and density characteristics
with low-power consumption or dissipation.
While maintaining all the SAB 80C515 features and operating characteristics the
SAB 80C517 is expanded in its arithmetic capabilities, "fail-safe" characteristics, analog signal
processing and timer capabilities. The SAB 80C537 is identical with the SAB 80C517 except
that it lacks the on-chip program memory. The SAB 80C517/SAB 80C537 is supplied in a
84 pin plastic leaded chip carrier package (P-LCC-84) and in a 100-pin plastic quad metric flat
package (P-MQFP-100-2).
Ordering Information
Type Ordering Code Package Description
8-bit CMOS Microcontroller
SAB 80C517-N Q67120-C397 P-LCC-84 with factory mask-programma-
ble ROM, 12 MHz
SAB 80C517-M TBD P-MQFP-100-2
SAB 80C537-N Q67120-C452 P-LCC-84 for external memory, 12 MHz
SAB 80C537-M TBD P-MQFP-100-2
SAB 80C517-N-T40/85 Q67120-C483 P-LCC-84 with factory mask-programma-
ble ROM, 12 MHz,
ext. temperature – 40 to 85 °C
SAB 80C517-M-T40/85 TBD P-MQFP-100-2
SAB 80C537-N-T40/85 Q67120-C484 P-LCC-84 for external ROM, 12 MHz,
ext. temperature – 40 to 85 °C
SAB 80C537-M-T40/85 TBD P-MQFP-100-2
SAB 80C517-N16 Q67120-C723 P-LCC-84 with mask-programmable
ROM,16 MHz ext. temperature
– 40 to 110 °C
SAB 80C517-M16 TBD P-MQFP-100-2
SAB 80C537-N16 Q67120-C722 P-LCC-84 for external memory, 16 MHz
SAB 80C537-M16 TBD P-MQFP-100-2
SAB 80C517-N16-T40/85 Q67120-C724 P-LCC-84 with mask-programmable ROM,
16 MHz
ext. temperature – 40 to 85 °C
SAB 80C517-16-N-T40/85 Q67120-C725 P-LCC-84 with factory mask-programma-
ble ROM, 12 MHz
SAB 80C517/80C537
Semiconductor Group 3
Logic Symbol
SAB 80C517/80C537
Semiconductor Group 4
Pin Configuration
(P-LCC-84)
SAB 80C517/80C537
Semiconductor Group 5
Pin Configuration
(P-MQFP-100-2)
SAB 80C517/80C537
Semiconductor Group 6
Pin Definitions and Functions
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
P4.0 – P4.7 1– 3, 5 – 9 64 - 66,
68 - 72 I/O Port 4
is a bidirectional I/O port with internal
pull-up resistors. Port 4 pins that have
1 s written to them are pulled high by
the internal pull-up resistors, and in that
state can be used as inputs. As inputs,
port 4 pins being externally pulled low
will source current (IIL, in the DC
characteristics) because of the internal
pull-up resistors.
This port also serves alternate compare
functions. The secondary functions are
assigned to the pins of port 4 as
follows:
CM0 (P4.0): Compare Channel 0
CM1 (P4.1): Compare Channel 1
CM2 (P4.2): Compare Channel 2
CM3 (P4.3): Compare Channel 3
CM4 (P4.4): Compare Channel 4
CM5 (P4.5): Compare Channel 5
CM6 (P4.6): Compare Channel 6
CM7 (P4.7): Compare Channel 7
PE/SWD 467 I Power saving modes enable/
Start Watchdog Timer
A low level on this pin allows the
software to enter the power down, idle
and slow down mode. In case the low
level is also seen during reset, the
watchdog timer function is off on
default.
Use of the software controlled power
saving modes is blocked, when this pin
is held on high level. A high level during
reset performs an automatic start of the
watchdog timer immediately after reset.
When left unconnected this pin is pulled
high by a weak internal pull-up resistor.
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 7
Pin Definitions and Functions (cont’d)
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
RESET 10 73 I RESET
A low level on this pin for the duration of
one machine cycle while the oscillator is
running resets the SAB 80C517. A small
internal pull-up resistor permits
power-on reset using only a capacitor
connected to VSS.
VAREF 11 78 Reference voltage for the A/D con-
verter.
VAGND 12 79 Reference ground for the A/D
converter.
P7.7 -P7.0 13 - 20 80 - 87 I Port 7
is an 8-bit unidirectional input port. Port
pins can be used for digital input, if
voltage levels meet the specified input
high/low voltages, and for the lower
8-bit of the multiplexed analog inputs of
the A/D converter, simultaneously.
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 8
Pin Definitions and Functions (cont’d)
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
P3.0 - P3.7 21 - 28 90 - 97 I/O Port 3
is a bidirectional I/O port with internal
pull-up resistors. Port 3 pins that have
1 s written to them are pulled high by
the internal pull-up resistors, and in that
state can be used as inputs. As inputs,
port 3 pins being externally pulled low
will source current (IIL, in the DC
characteristics) because of the internal
pull-up resistors. Port 3 also contains
the interrupt, timer, serial port 0 and
external memory strobe pins that are
used by various options. The output
latch corresponding to a secondary
function must be programmed to a one
(1) for that function to operate.
The secondary functions are assigned
to the pins of port 3, as follows:
–R× D0 (P3.0): receiver data input
(asynchronous) or data input/output
(synchronous) of serial interface
–T× D0 (P3.1): transmitter data
output (asynchronous) or clock
output (synchronous) of serial
interface 0
INT0 (P3.2): interrupt 0 input/timer 0
gate control
INT1 (P3.3): interrupt 1 input/timer 1
gate control
T0 (P3.4): counter 0 input
T1 (P3.5): counter 1 input
WR (P3.6): the write control signal
latches the data byte from port 0 into
the external data memory
RD (P3.7): the read control signal
enables the external data
memory to port 0
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 9
Pin Definitions and Functions (cont’d)
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
P1.7 - P1.0 29 - 36 98 - 100,
1, 6 - 9 I/O Port 1
is a bidirectional I/O port with internal
pull-up resistors. Port 1 pins that have
1 s written to them are pulled high by
the internal pull-up resistors, and in that
state can be used as inputs. As inputs,
port 1 pins being externally pulled low
will source current (IIL, in the DC
characteristics) because of the internal
pull-up resistors. It is used for the low
order address byte during program
verifi-cation. It also contains the
interrupt, timer, clock, capture and
compare pins that are used by various
options. The output latch must be
programmed to a one (1) for that
function to operate (except when used
for the compare functions).
The secondary functions are assigned
to the port 1 pins as follows:
INT3/CC0 (P1.0): interrupt 3 input/
compare 0 output / capture 0 input
INT4/CC1 (P1.1): interrupt 4 input /
compare 1 output /capture 1 input
INT5/CC2 (P1.2): interrupt 5 input /
compare 2 output /capture 2 input
INT6/CC3 (P1.3): interrupt 6 input /
compare 3 output /capture 3 input
INT2/CC4 (P1.4): interrupt 2 input /
compare 4 output /capture 4 input
T2EX (P1.5): timer 2 external reload
trigger input
CLKOUT (P1.6): system clock
output
T2 (P1.7): counter 2 input
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 10
Pin Definitions and Functions (cont’d)
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
XTAL2 39 12 XTAL2
Input to the inverting oscillator amplifier
and input to the internal clock generator
circuits.
XTAL1 40 13 XTAL1
Output of the inverting oscillator
amplifier. To drive the device from an
external clock source, XTAL2 should
be driven, while XTAL1 is left
unconnected. There are no
requirements on the duty cycle of the
external clock signal, since the input to
the internal clocking circuitry is devided
down by a divide-by-two flip-flop.
Minimum and maximum high and low
times as well as rise/fall times specified
in the AC characteristics must be
observed.
P2.0 - P2.7 41 - 48 14 - 21 I/O Port 2
is a bidirectional I/O port with internal
pull-up resistors. Port 2 pins that have
1 s written to them are pulled high by
the internal pull-up resistors, and in that
state can be used as in-puts. As inputs,
port 2 pins being externally pulled low
will source current (IIL, in the DC
characteristics) because of the internal
pull-up resistors. Port 2 emits the high-
order address byte during fetches from
external program memory and during
accesses to external data memory that
use 16-bit addresses (MOVX @DPTR).
In this application it uses strong
internal pull-up resistors when issuing
1 s. During accesses to external data
memory that use 8-bit addresses
(MOVX @Ri), port 2 issues the
contents of the P2 special function
register.
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 11
Pin Definitions and Functions (cont’d)
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
PSEN 49 22 O The Program Store Enable
output is a control signal that enables
the external program memory to the
bus during external fetch operations. It
is activated every six oscillator periodes
except during external data memory
accesses. Remains high during internal
pro-gram execution.
ALE 50 23 O The Address Latch Enable
output is used for latching the address
into external memory during normal
operation. It is activated every six
oscillator periodes except during an
external data memory access
EA 51 24 I External Access Enable
When held at high level, instructions
are fetchedfrom the internalROM
when the PC is less than 8192. When
held at low level, the SAB 80C517
fetches all instructions from external
program memory. For the SAB 80C537
this pin must be tied low
P0.0 - P0.7 52 - 59 26 - 27,
30 - 35 I/O Port 0
is an 8-bit open-drain bidirectional I/O
port. Port 0 pins that have 1 s written to
them float, and in that state can be
used as high-impedance inputs. Port 0
is also the multiplexed low-order
address and data bus during accesses
to external program or data memory. In
this application it uses strong internal
pull-up resistors when issuing 1 s.
Port 0 also outputs the code bytes
during program verification in the
SAB 83C517. External pull-up resistors
are required during program
verification.
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 12
Pin Definitions and Functions (cont’d)
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
P5.7 - P5.0 61 - 68 37 - 44 I/O Port 5
is a bidirectional I/O port with internal
pull-up resistors. Port 5 pins that have
1 s written to them are pulled high by
the internal pull-up resistors, and in that
state can be used as inputs. As inputs,
port 5 pins being externally pulled low
will source current (IIL, in the DC
characteristics) because of the internal
pull-up resistors. This port also serves
the alternate function "Concurrent
Compare". The secondary functions
are assigned to the port 5 pins as
follows:
CCM0 (P5.0): concurrent compare 0
CCM1 (P5.1): concurrent compare 1
CCM2 (P5.2): concurrent compare 2
CCM3 (P5.3): concurrent compare 3
CCM4(P5.4): concurrent compare 4
CCM5 (P5.5): concurrent compare 5
CCM6 (P5.6): concurrent compare 6
CCM7(P5.7): concurrent compare 7
OWE 69 45 I Oscillator Watchdog Enable
A high level on this pin enables the
oscillator watchdog. When left
unconnected this pin is pulled high by a
weak internal pull-up resistor. When
held at low level the oscillator watchdog
function is off.
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 13
Pin Definitions and Functions (cont’d)
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
P6.0 - P6.7 70 - 77 46 - 50,
54 - 56 I/O Port 6
is a bidirectional I/O port with internal
pull-up resistors. Port 6 pins that have
1 s written to them are pulled high by
the internal pull-up resistors, and in that
state can be used as inputs. As inputs,
port 6 pins being externally pulled low
will source current (IIL, in the
DC characteristics) because of the
internal pull-up resistors. Port 6 also
contains the external A/D converter
control pin and the transmit and receive
pins for serial channel 1. The output
latch corresponding to a secondary
function must be programmed to a one
(1) for that function to operate.
The secondary functions are assigned
to the pins of port 6, as follows:
ADST (P6.0): external A/D converter
start pin
–R× D1 (P6.1): receiver data input of
serial interface 1
–T× D1 (P6.2): transmitter data output
of serial interface 1
P8.0 - P8.3 78 - 81 57 - 60 I Port 8
is a 4-bit unidirectional input port. Port
pins can be used for digital input, if
voltage levels meet the specified input
high/low voltages, and for the higher
4-bit of the multiplexed analog inputs of
the A/D converter, simultaneously
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 14
Pin Definitions and Functions (cont’d)
Symbol Pin Number I/O *) Function
P-LCC-84 P-MQFP-100-2
RO 82 61 O Reset Output
This pin outputs the internally
synchronized reset request signal. This
signal may be generated by an external
hardware reset, a watchdog timer reset
or an oscillator watch-dog reset. The
reset output is active low.
V
SS
37,60, 83 10, 62 Circuit ground potential
VCC 38,84 11, 63 Supply Terminal for all operating
modes
N.C. 2 - 5, 25,
28 - 29,
36,
51 - 53,
74 - 77;
88 - 89
Not connected
*I = Input
O = Output
SAB 80C517/80C537
Semiconductor Group 15
Figure 1
Block Diagram
SAB 80C517/80C537
Semiconductor Group 16
Functional Description
The SAB 80C517 is based on 8051 architecture. It is a fully compatible member of the Siemens
SAB 8051/80C51 microcontroller family being a significantly enhanced SAB 80C515. The
SAB 80C517 is therefore 100 % compatible with code written for the SAB 80C515.
CPU
Having an 8-bit CPU with extensive facilities for bit-handling and binary BCD arithmetics the
SAB 80C517 is optimized for control applications. With a 12 MHz crystal, 58% of the
instructions execute in 1µs.
Being designed to close the performance gap to the 16-bit microcontroller world, the
SAB 80C517’s CPU is supported by a powerful 32-/16-bit arithmetic unit and a more flexible
addressing of external memory by eight 16-bit datapointers.
Memory Organisation
According to the SAB 8051 architecture, the SAB 80C517 has separate address spaces for
program and data memory. Figure 2 illustrates the mapping of address spaces.
Figure 2
Memory Mapping
SAB 80C517/80C537
Semiconductor Group 17
Program Memory
The SAB 80C517 has 8 KByte of on-chip ROM, while the SAB 80C537 has no internal ROM.
The program memory can externally be expanded up to 64 Kbyte. Pin EA controls whether
program fetches below address 2000H are done from internal or external memory.
Data Memory
The data memory space consists of an internal and an external memory space.
External Data Memory
Up to 64 KByte external data memory can be addressed by instructions that use 8-bit or 16-bit
indirect addressing. For 8-bit addressing MOVX instructions utilizing registers R0 and R1 can
be used. A 16-bit external memory addressing is supported by eight 16-bit datapointers.
Multiple Datapointers
As a functional enhancement to standard 8051 controllers, the SAB 80C517 contains eight
16-bit datapointers. The instruction set uses just one of these datapointers at a time. The
selection of the actual datapointers is done in special function register DPSEL (data pointer
select, addr. 92H). Figure 3 illustrates the addressing mechanism.
Internal Data Memory
The internal data memory is divided into three physically distinct blocks:
the lower 128 bytes of RAM including four banks of eight registers each
the upper 128 byte of RAM
the 128 byte special function register area.
A mapping of the internal data memory is also shown in figure 2. The overlapping address
spaces are accessed by different addressing modes. The stack can be located anywhere in the
internal data memory.
SAB 80C517/80C537
Semiconductor Group 18
Figure 3
Addressing of External Data Memory
SAB 80C517/80C537
Semiconductor Group 19
Special Function Registers
All registers, except the program counter and the four general purpose register banks, reside
in the special function register area. The 81 special function registers include arithmetic
registers, pointers, and registers that provide an interface between the CPU and the on-chip
peripherals. There are also 128 directly addressable bits within the SFR area. The special
function registers are listed in table 1. In this table they are organized in groups which refer to
the functional blocks of the SAB 80C517. Block names and symbols are listed in alphabetical
order.
Table 1
Special Function Register
Address Register Name Register Contents
after Reset
CPU ACC
B
DPH
DPL
DPSEL
PSW
SP
Accumulator
B-Register
Data Pointer, High Byte
Data Pointer, Low Byte
Data Pointer Select Register
Program Status Word Register
Stack Pointer
0E0H1)
0F0H1)
83H
82H
92H
0D0H1)
81H
00H
00H
00H
00H
XXXX.X000B 3)
00H
07H
A/D-
Converter ADCON0
ADCON1
ADDAT
DAPR
A/D Converter Control Register 0
A/D Converter Control Register 1
A/D Converter Data Register
D/AConverter Program Register
0D8H 1)
0DCH
0D9H
0DAH
00H
XXXX.0000B 3)
00H
00H
Interrupt
System IEN0
CTCON 2)
IEN1
IEN2
IP0
IP1
IRCON
TCON 2)
T2CON 2)
Interrupt Enable Register 0
Com. Timer Control Register
Interrupt Enable Register 1
Interrupt Enable Register 2
Interrupt Priority Register 0
Interrupt Priority Register 1
Interrupt Request Control Register
Timer Control Register
Timer 2 Control Register
0A8H1)
0E1H
0B8H1)
9AH
0A9H
0B9H
0C0H1)
88H1)
0C8H
00H
0XXX.0000B
00H
XXXX.00X0B3)
00H
XX00 0000B
00H
00H
00H
1) Bit-addressable special function registers
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) X means that the value is indeterminate and the location is reserved
SAB 80C517/80C537
Semiconductor Group 20
Table 1
Special Function Register (cont’d)
Address Register Name Register Contents
after Reset
MUL/DIV
Unit ARCON
MD0
MD1
MD2
MD3
MD4
MD5
Arithmetic Control Register
Multiplication/Division Register 0
Multiplication/Division Register 1
Multiplication/Division Register 2
Multiplication/Division Register 3
Multiplication/Division Register 4
Multiplication/Division Register 5
0EFH
0E9H
0EAH
0EBH
0ECH
0EDH
0EEH
0XXX.XXXXB3)
XXH3)
XXH3)
XXH3)
XXH3)
XXH3)
XXH3)
1) Bit-addressable special function registers
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) X means that the value is indeterminate and the location is reserved
SAB 80C517/80C537
Semiconductor Group 21
Table 1
Special Function Register (cont’d)
Address Register Name Register Contents
after Reset
Compare/
Capture-
Unit (CCU)
CCEN
CC4EN
CCH1
CCH2
CCH3
CCH4
CCL1
CCL2
CCL3
CCL4
CMEN
CMH0
CMH1
CMH2
CMH3
CMH4
CMH5
CMH6
CMH7
CML0
CML1
CML2
CML3
CML4
CML5
CML6
CML7
CMSEL
CRCH
CRCL
CTCON
CTRELH
CTRELL
TH2
TL2
T2CON
Comp./Capture Enable Reg.
Comp./Capture Enable 4 Reg.
Comp./Capture Reg. 1, High Byte
Comp./Capture Reg. 2, High Byte
Comp./Capture Reg. 3, High Byte
Comp./Capture Reg. 4, High Byte
Comp./Capture Reg. 1, Low Byte
Comp./Capture Reg. 2, Low Byte
Comp./Capture Reg. 3, Low Byte
Comp./Capture Reg. 4, Low Byte
Compare Enable Register
Compare Register 0, High Byte
Compare Register 1, High Byte
Compare Register 2, High Byte
Compare Register 3, High Byte
Compare Register 4, High Byte
Compare Register 5, High Byte
Compare Register 6, High Byte
Compare Register 7, High Byte
Compare Register 0, Low Byte
Compare Register 1, Low Byte
Compare Register 2, Low Byte
Compare Register 3, Low Byte
Compare Register 4, Low Byte
Compare Register 5, Low Byte
Compare Register 6, Low Byte
Compare Register 7, Low Byte
Compare Input Select
Com./Rel./Capt. Reg. High Byte
Com./Rel./Capt. Reg. Low Byte
Com. Timer Control Reg.
Com. Timer Rel. Reg., High Byte
Com. Timer Rel. Reg., Low Byte
Timer 2, High Byte
Timer 2, Low Byte
Timer 2 Control Register
0C1H
0C9H
0C3H
0C5H
0C7H
0CFH
0C2H
0C4H
0C6H
0CEH
0F6H
0D3H
0D5H
0D7H
0E3H
0E5H
0E7H
0F3H
0F5H
0D2H
0D4H
0D6H
0E2H
0E4H
0E6H
0F2H
0F4H
0F7H
0CBH
0CAH
0E1H
0DFH
0DEH
0CDH
0CCH
0C8H 1)
00H
X000.0000B3)
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
00H
0XXX.0000B3)
00H
00H
00H
00H
00H
1) Bit-addressable special function registers
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) X means that the value is indeterminate and the location is reserved
SAB 80C517/80C537
Semiconductor Group 22
Table 1
Special Function Register (cont’d)
Address Register Name Register Contents
after Reset
Ports P0
P1
P2
P3
P4
P5
P6
P7
P8
Port 0
Port 1
Port 2
Port 3
Port 4
Port 5
Port 6,
Port 7, Analog/Digital Input
Port 8, Analog/Digital Input, 4-bit
80H1)
90H1)
0A0H1)
0B0H1)
0E8H1)
0F8H1)
0FAH
0DBH
0DDH
FFH
FFH
FFH
FFH
FFH
FFH
FFH
XXH 3)
XXH3)
Pow.Sav.
Modes PCON Power Control Register 87H00H
Serial
Channels ADCON0 2)
PCON 2)
S0BUF
S0CON
S0RELL 4)
S0RELH 4)
S1BUF
S1CON
S1REL
S1RELH 4)
A/D Converter Control Reg.
Power Control Register
Serial Channel 0 Buffer Reg.
Serial Channel 0 Control Reg.
Serial Channel 0, Reload Reg.,
low byte
Serial Channel 0, Reload Reg.,
high byte
Serial Channel 1 Buffer Reg.,
Serial Channel 1 Control Reg.
Serial Channel 1 Reload Reg.,
low byte
Serial Channel 1, Reload Reg.,
high byte
0D8H1)
87H
99H
98H1)
0AAH
0BAH
9CH
9BH
9DH
0BBH
00H
00H
XXH3)
00H
0D9H
XXXX.XX11B3)
0XXH3)
0X00.000B3)
00H
XXXX.XX11B3)
Timer 0/
Timer 1 TCON
TH0
TH1
TL0
TL1
TMOD
Timer Control Register
Timer 0, High Byte
Timer 1, High Byte
Timer 0, Low Byte
Timer 1, Low Byte
Timer Mode Register
88H1)
8CH
8DH
8AH
8BH
89H
00H
00H
00H
00H
00H
00H
Watchdog IEN0 2)
IEN1 2)
IP0 2)
IP1 2)
WDTREL
Interrupt Enable Register 0
Interrupt Enable Register 1
Interrupt Priority Register 0
Interrupt Priority Register 1
Watchdog Timer Reload Reg.
0A8H1)
0B8H1)
0A9H
0B9H
86H
00H
00H
00H
XX00.0000B3)
00H
1) Bit-addressable special function registers.
2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks.
3) X means that the value is indeterminate and the location is reserved.
4) These registers are available in the CA step and later steps.
SAB 80C517/80C537
Semiconductor Group 23
A/D Converter
The SAB 80C517 contains an 8-bit A/D Converter with 12 multiplexed input channels which
uses the successive approximation method. It takes 7 machine cycles to sample an analog
signal (during this sample time the input signal should be held constant); the total conversion
time (including sample time) is 13 machine cycles (13 µs at 12 MHz oscillator frequency).
Conversion can be programmed to be single or continuous; at the end of a conversion an
interrupt can be generated.
A unique feature is the capability of internal reference voltage programming. The internal
reference voltages VIntAREF and VIntAGND for the A/D converter are both programmable to one
of 16 steps with respect to the external reference voltages. This feature permits a conversion
with a smaller internal reference voltage range to gain a higher resolution. In addition, the
internal reference voltages can easily be adapted by software to the desired analog input
voltage range (see table 2).
Table 2
Adjustable Internal Reference Voltages
Step DAPR (.3-.0)
DAPR (.7-.4) VIntAGND VIntAREF
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
0.0
0.3125
0.625
0.9375
1.25
1.5625
1.875
2.1875
2.5
2.8125
3.125
3.4375
3.75
5.0
1.25
1.5625
1.875
2.1875
2.5
2.8125
3.125
3.4375
3.75
4.0625
4.375
4.68754
SAB 80C517/80C537
Semiconductor Group 24
Figure 4
Block Diagram A/D Converter
SAB 80C517/80C537
Semiconductor Group 25
Compare/Capture Unit (CCU)
The compare capture unit is a complex timer/register array for applications that require high
speed I/O, pulse width modulation and more timer/counter capabilities. The CCU contains
one 16-bit timer/counter (timer 2) with 2-bit prescaler, reload capability and a max. clock
frequency of fOSC/12 (1 MHz with a 12 MHz crystal).
one 16-bit timer (compare timer) with 8-bit prescaler, reload capability and a max. clock
frequency of fOSC/2 (6 MHz with a 12 MHz crystal).
thirteen 16-bit compare registers.
five of which can be used as 16-bit capture registers.
up to 21 output lines controlled by the CCU.
seven interrupts which can be generated by CCU-events.
Figure 5 shows a block diagram of the CCU. Eight compare registers (CM0 to CM7) can
individually be assigned to either timer 2 or the compare timer. Diagrams of the two timers are
shown in figures 6 and 7. The four compare/capture registers and the compare/reload/capture
register are always connected to timer 2. Dependent on the register type and the assigned
timer two compare modes can be selected. Table 3 illustrates possible combinations and the
corresponding output lines.
Table 3
CCU Configuration
Assigned Timer Compare Register Compare Output at Possible Modes
Timer 2 CRCH/CRCL
CC1H/CC1L
CC2H/CC2L
CC3H/CC3L
CC4H/CC4L
CC4H/CC4L
:
CC4H/CC4L
CM0H/CM0L
:
CM7H/CM7L
P1.0/INT3/CC0
P1.0/INT4/CC1
P1.0/INT5/CC2
P1.0/INT6/CC3
P1.0/INT2/CC4
P5.0/CCM0
:
P5.7/CCM7
P4.0/CM0
:
P4.7/CM7
Comp. mode 0, 1 + Reload
Comp. mode 0, 1
Comp. mode 0, 1
Comp. mode 0, 1
Comp. mode 0, 1
Comp. mode 1
:
Comp. mode 1
Comp. mode 1
:
Comp. mode 1
Compare timer CM0H/CM0L
:
:
CM7H/CM7L
P4.0/CM0
:
:
P4.7/CM7
Comp. mode 0
(with add. latches)
:
:
Comp. mode 0
(with shadow latches)
SAB 80C517/80C537
Semiconductor Group 26
Figure 5
Block Diagram of the Compare/Capture Unit
SAB 80C517/80C537
Semiconductor Group 27
Compare
In the compare mode, the 16-bit values stored in the dedicated compare registers are
compared to the contents of the timer 2 register or the compare timer register. If the count value
in the timer registers matches one of the stored values, an appropriate output signal is
generated and an interrupt is requested. Two compare modes are provided:
Mode 0: Upon a match the output signal changes from low to high. It goes back to low level
when the timer overflows.
Mode 1: The transition of the output signal can be determined by software. A timer overflow
signal doesn’t affect the compare-output.
Compare registers CM0 to CM7 use additional compare latches when operated in mode 0.
Figure 8 shows the function of these latches. The latches are implemented to prevent from loss
of compare matches which may occur when loading of the compare values is not correlated
with the timer count. The compare latches are automatically loaded from the compare registers
at every timer overflow.
Capture
This feature permits saving of the actual timer/counter contents into a selected register upon
an external event or a software write operation. Two modes are provided to latch the current
16-bit value of timer 2 registers into a dedicated capture register.
Mode 0: Capture is performed in response to a transition at the corresponding port pins CC0
to CC3.
Mode 1: Write operation into the low-order byte of the dedicated capture register causes the
timer 2 contents to be latched into this register.
Reload of Timer 2
A 16-bit reload can be performed with the 16-bit CRC register, which is a concatenation of the
8-bit registers CRCL and CRCH. There are two modes from which to select:
Mode 0: Reload is caused by a timer overflow (auto-reload).
Mode 1: Reload is caused in response to a negative transition at pin T2EX (P1.5), which also
can request an interrupt.
Timer/Counters 0 and 1
These timer/counters are fully compatible with timer/counter 0 or 1 of the SAB 8051 and can
operate in four modes:
Mode 0: 8-bit timer/counter with 32:1 prescaler
Mode 1: 16-bit timer/counter
Mode 2: 8-bit timer/counter with 8-bit auto reload
Mode 3: Timer/counter 0 is configured as one 8-bit timer; timer/counter 1 in this mode holds
its count.
External inputs INT0 and INT1 can be programmed to function as a gate for timer/counters 0
and 1 to facilitate pulse width measurements.
SAB 80C517/80C537
Semiconductor Group 28
Figure 6
Block Diagram of Timer 2
SAB 80C517/80C537
Semiconductor Group 29
Figure 7
Block Diagram of the Compare Timer
SAB 80C517/80C537
Semiconductor Group 30
Figure 8
Compare-Mode 0 with Registers CM0 to CM7
SAB 80C517/80C537
Semiconductor Group 31
Interrupt Structure
The SAB 80C517 has 14 interrupt vectors with the following vector addresses and request
flags.
Each interrupt vector can be individually enabled/disabled. The response time to an interrupt
request is more than 3 machine cycles and less than 9 machine cycles.
External interrupts 0 and 1 can be activated by a low-level or a negative transition (selectable)
at their corresponding input pin, external interrupts 2 and 3 can be programmed for triggering
on a negative or a positive transition. The external interrupts 2 to 6 are combined with the
corresponding alternate functions compare (output) and capture (input) on port 1.
For programming of the priority levels the interrupt vectors are combined to pairs or triples.
Each pair or triple can be programmed individually to one of four priority levels by setting or
clearing one bit in special function register IP0 and one in IP1. Figure 9 shows the interrupt
request sources, the enabling and the priority level structure.
Table 4
Interrupt Sources and Vectors
Source (Request Flags) Vector Address Vector
IE0
TF0
IE1
TF1
RI0/TI0
TF2 + EXF2
IADC
IEX2
IEX3
IEX4
IEX5
IEX6
RI1/TI1
CTF
0003H
000BH
0013H
001BH
0023H
002BH
0043H
004BH
0053H
005BH
0063H
006BH
0083H
009BH
External interrupt 0
Timer 0 overflow
External interrupt 1
Timer 1 overflow
Serial channel 0
Timer 2 overflow/ext. reload
A/D converter
External interrupt 2
External interrupt 3
External interrupt 4
External interrupt 5
External interrupt 6
Serial channel 1
Compare timer overflow
SAB 80C517/80C537
Semiconductor Group 32
Figure 9
Interrupt Structure
SAB 80C517/80C537
Semiconductor Group 33
Figure 9 (cont’d)
Interrupt Structure
SAB 80C517/80C537
Semiconductor Group 34
Multiplication/Division Unit
This on-chip arithmetic unit provides fast 32-bit division, 16-bit multiplication as well as shift and
normalize features. All operations are integer operations.
The MDU consists of six registers used for operands and results and one control register.
Operation of the MDU can be divided in three phases:
Figure 10
Operation of the MDU
To start an operation, register MD0 to MD5 (or ARCON) must be written to in a certain
sequence according to table 5 or 6. The order the registers are accessed determines the type
of the operation. A shift operation is started by a final write operation to register ARCON (see
also the register description).
Operation Result Remainder Execution Time
32-bit/16-bit
16-bit/16-bit 32-bit
16-bit 16-bit
16-bit 6 tcy 1)
4 t cy
16-bit 16-bit 32-bit 4 tcy
32-bit normalize 6 tcy 2)
32-bit shift left/right 6 t cy 2)
1) 1tcy = 1 µs @ 12 MHz oscillator frequency.
2) The maximal shift speed is 6 shifts/cycle.
SAB 80C517/80C537
Semiconductor Group 35
Table 5
Programming the MDU for Multiplication and Division
Table 6
Shift Operation with the CCU
Abbreviations
D'end : Dividend, 1st operand of division
D'or : Divisor, 2nd operand of division
M'and : Multiplicand, 1st operand of multiplication
M'or : Multiplicator, 2nd operand of multiplication
Pr : Product, result of multiplication
Rem : Remainder
Quo : Quotient, result of division
...L : means, that this byte is the least significant of the 16-bit or 32-bit operand
...H : means, that this byte is the most significant of the 16-bit or 32-bit operand
Operation 32-Bit/16-Bit 16-Bit/16-Bit 16-Bit * 16-Bit
First Write
Last Write
First Read
Last Read
MD0 D'endL
MD1 D'end
MD2 D'end
MD3 D'endH
MD4 D'orL
MD5 D'orH
MD0 QuoL
MD1 Quo
MD2 Quo
MD3 QuoH
MD4 RemL
MD5 RemH
MD0 D'endL
MD1 D'end
D'end
MD4 D'endH
D'orL
MD5 D'orH
MD0 QuoL
MD1 QuoH
MD4 RemL
MD5 RemH
MD0 M'andL
MD4 M'orL
MD1 M'andH
MD5 M'orH
MD0 PrL
MD1
MD2
MD3 PrH
Operation Normalize, Shift Left, Shift Right
First Write
Last Write
First Read
Last Read
MD0 least significant byte
MD1
MD2
MD3 most significant byte
ARCON start of conversion
MD0 least significant byte
MD1
MD2
MD3 most significant byte
SAB 80C517/80C537
Semiconductor Group 36
I/O Ports
The SAB 80C517 has seven 8-bit I/O ports and two input ports (8-bit and 4-bit wide).
Port 0 is an open-drain bidirectional I/O port, while ports 1 to 6 are quasi-bidirectional I/O ports
with internal pull-up resistors. That means, when configured as inputs, ports 1 to 6 will be pulled
high and will source current when externally pulled low. Port 0 will float when configured as
input.
Port 0 and port 2 can be used to expand the program and data memory externally. During an
access to external memory, port 0 emits the low-order address byte and reads/writes the data
byte, while port 2 emits the high-order address byte. In this function, port 0 is not an open-drain
port, but uses a strong internal pullup FET. Port 1, 3, 4, 5 and port 6 provide several alternate
functions. Please see the "Pin Description" for details.
Port pins show the information written to the port latches, when used as general purpose port.
When an alternate function is used, the port pin is controlled by the respective peripheral unit.
Therefore the port latch must contain a "one" for that function to operate. The same applies
when the port pins are used as inputs. Ports 1, 3, 4 and 5 are bit- addressable.
The SAB 80C517 has two dual-purpose input ports. The twelve port lines at port 7 and port 8
can be used as analog inputs for the A/D converter. If input voltages at P7 and P8 meet the
specified digital input levels (VIL and VIH)the port can also be used as digital input port.
SAB 80C517/80C537
Semiconductor Group 37
Power Saving Modes
The SAB 80C517 provides – due to Siemens ACMOS technology – three modes in which
power consumption can be significantly reduced.
The Slow Down Mode
The controller keeps up the full operating functionality, but is driven with the eighth part of its
normal operating frequency. Slowing down the frequency greatly reduces power
consumption.
The Idle Mode
The CPU is gated off from the oscillator, but all peripherals are still supplied by the clock and
able to work.
The Power Down Mode
Operation of the SAB 80C517 is stopped, the oscillator is turned off. This mode is used to
save the contents of the internal RAM with a very low standby current.
All of these modes are entered by software. Special function register PCON (power control
register, address is 87H) is used to select one of these modes.
Hardware Enable for Power Saving Modes
A dedicated Pin (PE/SWD) of the SAB 80C517 allows to block the power saving modes. Since
this pin is mostly used in noise-critical application it is combined with an automatic start of the
Watchdog Timer (see there for further description).
PE/SWD = VIH (logic high level): Using of the power saving modes is not possible. The
instruction sequences used for entering of these modes
will not affect the normal operation of the device.
PE/SWD = VIL (logic low level): All power saving modes can be activated by software.
When left unconnected, PinPE/SWD is pulled to high level
by a weak internal pullup. This is done to provide system
protection on default.
The logic-level applied to pin PE/SWD can be changed during program execution to allow or to
block the use of the power saving modes without any effect on the on-chip watchdog circuitry.
Power Down Mode
The power down mode is entered by two consecutive instructions directly following each other.
The first instruction has to set the flag PDE (power down enable) and must not set PDS (power
down set). The following instruction has to set the start bit PDS. Bits PDE and PDS will
automatically be cleared after having been set.
The instruction that sets bit PDS is the last instruction executed before going into power down
mode. The only exit from power down mode is a hardware reset.
The status of all output lines of the controller can be looked up in table 7.
SAB 80C517/80C537
Semiconductor Group 38
Table 7
Status of External Pins During Idle and Power Down
Idle Mode
During idle mode all peripherals of the SAB 80C517 are still supplied by the oscillator clock.
Thus the user has to take care which peripheral should continue to run and which has to be
stopped during Idle.
The procedure to enter the Idle mode is similar to entering the power down mode.
The two bits IDLE and IDLS must be set by to consecutive instructions to minimize the chance
of unintentional activating of the idle mode.
There are two ways to terminate the idle mode:
The idle mode can be terminated by activating any enabled interrupt. This interrupt will be
serviced and normally the instruction to be executed following the RETI instruction will be
the one following the instruction that sets the bit IDLS.
The other way to terminate the idle mode, is a hardware reset. Since the oscillator is still
running, the hardware reset must be held active only for two machine cycles for a complete
reset.
Normally the port pins hold the logical state they had at the time idle mode was activated. If
some pins are programmed to serve their alternate functions they still continue to output during
idle mode if the assigned function is on. The control signals ALE and PSEN hold at logic high
levels (see table 7).
Outputs Last instruction executed from
internal code memory Last instruction executed from
external code memory
Idle Power down Idle Power Down
ALE High Low High Low
PSEN High Low High Low
Port 0 Data Data Float Float
Port 1 Data/alternate
outputs Data/last output Data/alternate
outputs Data/last output
Port 2 Data Data Address Data
Port 3 Data/alternate
outputs Data/last output Data/alternate
outputs Data/last output
Port 4 Data/alternate
outputs Data/last output Data/alternate
outputs Data/last output
Port 5 Data/alternate
outputs Data/last output Data/alternate
outputs Data/last output
Port 6 Data/alternate
outputs Data/last output Data/alternate
outputs Data/last output
SAB 80C517/80C537
Semiconductor Group 39
Table 8
Baud Rate Generation
Function Serial Interface 0 Serial Interface 1
Mode Mode 0
8-Bit
synchronous
channel
Baud rate *) 1 MHz @ fOSC = 12 MHz
Baud rate
derived
from
fOSC
Mode Mode 1 Mode B
8-Bit
UART Baud rate *) 1 – 62.5 K 4800, 9600 1.5 – 375 K
Baud rate
derived
from
Timer 1 BD 8-bit baud rate generator
Mode Mode 2 Mode 3 Mode A
9-Bit
UART Baud rate *) 187.5 K/
375 K 1 – 62.5 K 1.5 – 375 K
Baud rate
derived
from
fOSC/2 Timer 1 8-bit baud rate generator
*)Baud rate values are given for 12 MHz oscillator frequency.
SAB 80C517/80C537
Semiconductor Group 40
Serial Interface 0
Serial Interface 0 can operate in 4 modes:
Mode 0: Shift register mode:
Serial data enters and exits through RXD0. TXD0 outputs the shift clock 8 data bits
are transmitted/received (LSB first). The baud rate is fixed at 1/12 of the oscillator
frequency.
Mode 1: 8-bit UART, variable baud rate:
10-bit are transmitted (through RXD0) or received (through RXD0): a start bit (0),
8 data bits (LSB first), and a stop bit (1). On reception, the stop bit goes into RB80
in special function register S0CON. The baud rate is variable.
Mode 2: 9-bit UART, fixed baud rate:
11-bit are transmitted (through TXD0) or received (through RXD0): a start bit (0),
8 data bits (LSB first), a programmable 9th, and a stop bit (1). On transmission, the
9th data bit (TB80 in S0CON) can be assigned to the value of 0 or 1. For example,
the parity bit (P in the PSW) could be moved into TB80 or a second stop bit by
setting TB80 to 1. On reception the 9th data bit goes into RB80 in special function
register S0CON, while the stop bit is ignored. The baud rate is programmable to
either 1/32 or 1/64 of the oscillator frequency.
Mode 3: 9-bit UART, variable baud rate:
11-bit are transmitted (through TXD0) or received (through RXD0): a start bit (0),
8 data bits (LSB first), a programmable 9th, and a stop bit (1). In fact, mode 3 is the
same as mode 2 in all respects except the baud rate. The baud rate in mode 3 is
variable.
Variable Baud Rates for Serial Interface 0
Variable baud rates for modes 1 and 3 of serial interface 0 can be derived from either timer 1
or from the oscillator via a special prescaler ("BD").
Timer 1 may be operated in mode 1 (to generate slow baud rates) or mode 2. The dedicated
baud rate generator "BD" provides the two standard baud rates 4800 or 9600 baud with 0.16%
deviation. Table 8 shows possible configurations and the according baud rates.
SAB 80C517 devices with stepping code "CA" or later provide a dedicated baud rate generator
for the serial interface 0. This baud rate genertaor is a free running 10-bit timer with
programmable reload registers.
Mode 1.3 baud rate =
The default value after reset in the reload registers S0RELL and S0RELH prvide a baud rate
of 4.8 kBaud (SMOD = 0) or 9.6 kBaud (SMOD = 1) at 12 MHz oscillator frequency. This
guarantees full compatibility to the SAB 80C517 older steppings.
2SMOD fOSC
×
64 210 S0REL


×
--------------------------------------------------------
SAB 80C517/80C537
Semiconductor Group 41
Serial Interface 1
Serial interface 1 can operate in two asynchronous modes:
Mode A: 9-bit UART, variable baud rate.
11 bits are transmitted (through TXD0) or received (through RXD0): a start bit (0),
8 data bits (LSB first), a programmable 9th, and a stop bit (1). On transmission, the
9th data bit (TB81 in S1CON) can be assigned to the value of 0 or 1. For example,
the parity bit (P in the PSW) could be moved into TB81 or a second stop bit by
setting TB81 to 1. On reception the 9th data bit goes into RB81 in special function
register S1CON, while the stop bit is ignored.
Mode B: 8-bit UART, variable baud rate.
10 bits are transmitted (through TXD1) or received (through RXD1): a start bit (0),
8 data bits (LSB first), and a stop bit (1). On reception, the stop bit goes into RB81
in special function register S1CON.
Variable Baud Rates for Serial Interface 1
Variable baud rates for modes A and B of serial interface 1 can be derived from a dedicated
baud rate generator.
The baud rate clock (baud rate = ) is generated by a 8-bit free
running timer with programmable reload register. SAB 80C517 devices with stepping code
"CA" or later provide a 10-bit free running timer for baud rate generation.
Mode A, B baud rate =
Watchdog Units
The SAB 80C517 offers two enhanced fail safe mechanisms, which allow an automatic recov-
ery from hardware failure or software upset:
programmable watchdog timer (WDT), variable from 512 ms up to about 1.1 s time out
period @12 MHz. Upward compatible to SAB 80515 watchdog.
oscillator watchdog (OWD), monitors the on-chip oscillator and forces the microcontroller to
go into reset state, in case the on-chip oscillator fails.
Programmable Watchdog Timer
The WDT can be activated by hardware or software.
Hardware initialization is done when pin PE/SWD (Pin 4) is held high during RESET. The
SAB 80C517 then starts program execution with the WDT running. Pin PE/SWD doesn’t allow
dynamic switching of the WDT.
Software initialization is done by setting bit SWDT. A refresh of the watchdog timer is done by
setting bits WDT and SWDT consecutively.
A block diagram of the watchdog timer is shown in figure 11.
When a watchdog timer reset occurs, the watchdog timer keeps on running, but a status flag
WDTS is set. This flag can also be manipulated by software.
baud rate clock
16
----------------------------------------
fOSC
32 210 Reload Value


×
------------------------------------------------------------------------
SAB 80C517/80C537
Semiconductor Group 42
Figure 11
Block Diagram of the Programmable Watchdog Timer
Oscillator Watchdog
The oscillator watchdog monitors the on-chip quartz oscillator. A detected oscillator failure
(fOSC < appr. 300 kHz) causes a hardware reset. The reset state is held until the on-chip
oscillator is working again. The oscillator watchdog feature is enabled by a high level at pin
OWE (pin 69). An oscillator watchdog reset sets status flag OWDS which can be examined and
modified by software. Figure 12 shows a block diagram of the oscillator watchdog.
Figure 12
Functional Block Diagram of the Oscillator Watchdog
SAB 80C517/80C537
Semiconductor Group 43
Instruction Set Summary
The SAB 80C517/80C537 has the same instruction set as the industry standard 8051 micro-
controller.
A pocket guide is available which contains the complete instruction set in functional and hexa-
decimal order. Furtheron it provides helpful information about Special Function Registers, In-
terrupt Vectors and Assembler Directives.
Literature Information
Title Ordering No.
Microcontroller Family SAB 8051 Pocket Guide B158-H6497-X-X-7600
SAB 80C517/80C537
Semiconductor Group 44
Absolute Maximum Ratings
Ambient temperature under bias
SAB 80C517/83C537.................................................................................. 0 to 70 oC
SAB 80C517/83C537-T40/85.................................................................................... 40 to 85 oC
Storage temperature TST ............................................................................ – 65 to 150 oC
Voltage on VCC pins with respect to ground (VSS) ...................................... – 0.5 V to 6.5 V
Voltage on any pin with respect to ground (VSS)......................................... – 0.5 to VCC+0.5 V
Input current on any pin during overload condition..................................... – 10mA to +10mA
Absolute sum of all input currents during overload condition.....................|100mA|
Power dissipation........................................................................................ 2 W
Note Stresses above those listed under "Absolute Maximum Ratings" may cause permanent
damage of the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for longer
periods may affect device reliability. During overload conditions (
VIN > VCC or VIN < VSS)
theVoltage on
VCC
pins with respect to ground (
VSS
) must not exeed the values definded
by the absolute maximum ratings.
DC Characteristics
V
CC = 5 V ± 10 %;
V
SS = 0 V;
T
A= 0 to 70 oC for the SAB 80C517/83C537
T
A = 40 to 85 oC for the SAB 80C517-/83C537-T40/85
Parameter Symbol Limit Values Unit Test Condition
min. max.
Input low voltage (except EA) VIL – 0.5 0.2 VCC
– 0.1 V–
Input low voltage (EA)VIL1 – 0.5 0.2 VCC
– 0.3 V–
Input high voltage VIH 0.2 VCC
+ 0.9 VCC+ 0.5 V
Input high voltage to XTAL2 VIH1 0.7 VCC VCC + 0.5 V
Input high voltage to RESET VIH2 0.6 VCC VCC + 0.5 V
Output low voltage
(ports 1, 2, 3, 4, 5, 6) VOL 0.45 V IOL = 1.6 mA1)
Notes see page 47.
SAB 80C517/80C537
Semiconductor Group 45
DC Characteristics (cont’d)
Parameter Symbol Limit Values Unit Test Condition
min. max.
Output low voltage
(ports ALE, PSEN, RO) VOL1 0.45 V IOL = 3.2mA 1)
Output high voltage
(ports 1, 2, 3, 4, 5, 6) VOH 2.4
0.9 VCC
V
VIOH =–80 µA
IOH =–10 µA
Output high voltage
(port 0 in external bus mode,
ALE, PSEN, RO)
VOH1 2.4
0.9 VCC
V
VIOH = 800 µA2)
IOH =–80 µA2)
Logic 0 input current
(ports 1, 2, 3, 4, 5, 6) IIL 10 – 70 µAVIN = 0.45 V
Input low current to RESET
for reset IIL2 10 –100 µAVIN = 0.45 V
Input low current (XTAL2) IIL3 – 15 µAVIN = 0.45 V
Input low current
(OWE, PE/SWD) I IL4 ––20µAV
IN = 0.45 V
Logical 1-to-0 transition current
(ports 1, 2, 3, 4, 5, 6) ITL – 65 650 µAVIN = 2 V
Input leakage current
(port 0, EA, ports 7, 8) ILI ± 1 µA0.45 < VIN <VCC10)
Pin capacitance CIO –10pFf
C
= 1 MHz
TA= 25 oC
Power supply current:
Active mode, 12 MHz 6)
Idle mode, 12 MHz 6)
Slow down mode, 12 MHz 6)
Active mode, 16 MHz 6)
Idle mode, 16 MHz 6)
Slow down mode, 16MHz6)
Power down Mode
ICC
ICC
IPD
40
15
15
52.3
19
19
50
mA
mA
mA
mA
mA
mA
µA
VCC = 5 V,4)
VCC = 5 V,5)
VCC = 5 V,5)
VCC = 5 V,4)
VCC = 5 V,5)
VCC = 5 V,5)
VCC = 2...5.5 V 3)
Notes see page 47.
SAB 80C517/80C537
Semiconductor Group 46
A/D Converter Characteristics
VCC = 5 V ± 10 %; V SS = 0 V
VAREF = VCC ± 5%; VAGND = VSS ± 0.2 V; VIntAREF - VIntAGND 1V
TA= 0 to 70 oC for the SAB 80C517/83C537
TA= 40 to 85 oC for the SAB 80C517/83C537-T40/875
Parameter Symbol Limit values Unit Test
Condition
min. typ. max.
Analog input voltage VAINPUT VAGND
0.2 VAREF
+ 0.2 V9)
Analog input
capacitance CI–2560pF
7)
Load time tL––2
t
CY µs7)
Sample time
(incl. load time) tS––7
t
CY µs7)
Conversion time
(incl. sample time) tC––13
t
CY µs7)
Total unadjusted error TUE ± 2 LSB VAREF = VCC
VAGND = VSS 11)
Internal reference error VIntREFERR ± 30 mV 8)
VAREF supply current IREF ––5mA
8)
Notes see page 47.
SAB 80C517/80C537
Semiconductor Group 47
Notes for pages 44, 45 and 46:
1) Capacitive loading on ports 0 and 2 may cause spurious noise pulses to be superimposed
on the VOL of ALE and ports 1, 3, 4, 5 and 6. The noise is due to external bus capacitance
discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during
bus operation.
In the worst case (capacitive loading > 100 pF), the noise pulse on ALE line may exceed
0.8 V. In such cases it may be desirable to qualify ALE with a schmitt-trigger, or use an
address latch with a schmitt- trigger strobe input.
2) Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily
fall below the 0.9 VCC specification when the address lines are stabilizing.
3) Power down IPD is measured with all output pins disconnected;
EA = RESET = VCC; Port 0 = Port 7 = Port 8 = VCC; XTAL1 = N.C.; XTAL2 = VSS;
VAGND= N.C.; VAREF = VCC; PE/SWD = OWE = VSS.
4) ICC (active mode) is measured with all output pins disconnected; XTAL2 driven with clock
signal according to the figure below; XTAL1 = N.C.;
EA = OWE = PE/SWD = VCC; Port 0 = Port 7 = Port 8 = VCC;
RESET = VSS. ICC would be slightly higher if a crystal oscillator is used.
5) ICC (idle mode,) is measured with all output pins disconnected and with all peripherals
disabled; XTAL2 driven with clock signal according to the figure below; XTAL1 = N.C.;
RESET = OWE = VCC; Port 0 = Port 7 = Port 8 = VCC; EA = PE/SWD = VSS.
ICC (slow down mode) is measured with all output pins disconnected and with all peripherals
disabled; XTAL2 driven with clock signal according to the figure below; XTAL = N.C.;
Port 7 = Port 8 = VCC; EA = PE/SWD = VSS.
6) ICC (max.) at other frequencies is given by: active mode: ICC max = 3.1 *fOSC + 3.0
idle mode: ICC max = 1.0 *fOSC + 3.0
Where fOSC is the oscillator frequency in MHz. ICC values are given in mA and measured at
VCC = 5 V (see also notes 4 and 5).
7) The output impedance of the analog source must be low enough to assure full loading of the
sample capacitance (CI) during load time (TL). After charging of the internal capacitance (CI)
in the load time (TL) the analog input must be held constant for the rest of the sample time
(TS).
8) The differential impedance RD of the analog reference voltage source must be less than
1k at reference supply voltage.
9) Exceeding the limit values at one or more input channels will cause additional current which
is sinked sourced at these channels. This may also affect the accuracy of other channels
which are operated within the specification.
10) Only valid for not selected analog inputs.
11) No missing code.
SAB 80C517/80C537
Semiconductor Group 48
Clock of Waveform for ICC Tests in Active, Idle Mode and Slow Down Mode
SAB 80C517/80C537
Semiconductor Group 49
AC Characteristics
VCC = 5 V ± 10 %; VSS = 0 V TA= 0 to 70 oC for the SAB 80C517/83C537
TA= 40 to 85 oC for the SAB 80C517/83C537-T40/85
(CLfor port 0, ALE and PSEN outputs = 100 pF;
C
L for all other outputs = 80 pF))
Parameter Symbol Limit Values Unit
12 MHz Clock Variable Clock
1/tCLCL =3.5 MHz to 12 MHz
min max. min. max.
Program Memory Characteristics
ALE pulse width tLHLL 127 2 tCLCL – 40 ns
Address setup to ALE tAVLL 53 tCLCL – 30 ns
Address hold after ALE tLLAX 48 tCLCL – 35 ns
ALE to valid
instruction in tLLIV 233 4tCLCL – 100 ns
ALE to PSEN tLLPL 58 tCLCL – 25 ns
PSEN pulse width tPLPH 215 3 tCLCL – 35 ns
PSEN to valid
instruction in tPLIV 150 3tCLCL – 100 ns
Input instruction hold
after PSEN tPXIX 0–0 ns
Input instruction float
after PSEN *) tPXIX*) –63 t
CLCL – 20 ns
Address valid after
PSEN *) tPXAV*) 75 tCLCL – 8 ns
Address to valid
instruction in tAVIV 302 0 5tCLCL – 115 ns
Address float to PSEN tAZPL ––– ns
*) Interfacing the SAB 80C517 to devices with float times up to 75 ns is permissible.
This limited bus contention will not cause any damage to port 0 drivers.
SAB 80C517/80C537
Semiconductor Group 50
AC Characteristics (cont’d)
Parameter Symbol Limit Values Unit
12 MHz Clock Variable Clock
1/tCLCL =3.5 MHz to 12 MHz
min max. min. max.
External Data Memory Characteristics
RD pulse width tRLRH 400 6 tCLCL – 100 ns
WR pulse width tWLWH 400 6 tCLCL – 100 ns
Address hold after ALE tLLAX2 132 2 tCLCL – 30 ns
RD to valid instr in tRLDV 252 5 tCLCL 165 ns
Data hold after RD tRHDX 0–0 ns
Data float after RD tRHDZ –97 2t
CLCL –70 ns
ALE to valid data in tLLDV 517 8 tCLCL 150 ns
Address to valid data in tAVDV 585 9 tCLCL 165 ns
ALE to WR or RD tLLWL 200 300 3 tCLCL – 50 3 tCLCL + 50 ns
WR or RD high to ALE
high tWHLH 43 123
t
CLCL –40 t
CLCL +40 ns
Address valid to WR tAVWL 203 4 tCLCL 130 ns
Data valid to WR
transition tQVWX 33 tCLCL 50 ns
Data setup before WR tQVWX 433 7 tCLCL 150 ns
Data hold after WR tWHQX 33 tCLCL 50 ns
Address float after RD tRLAZ –0– 0 ns
SAB 80C517/80C537
Semiconductor Group 51
AC Characteristics
V CC = 5 V ± 10 %; VSS = 0 VTA= 0 to 70 oC for the SAB 80C517-16/83C537-16
TA= 40 to 85 oC for the SAB 80C517-16/83C537-16-T40/85
(CLfor port 0, ALE and PSEN outputs = 100pF; CLfor all outputs = 80 pF)
Parameter Symbol Limit Values Unit
16 MHz Clock Variable Clock
1/tCLCL =3.5 MHz to 16 MHz
min max. min. max.
Program Memory Characteristics
ALE pulse width tLHLL 85 2 tCLCL – 40 ns
Address setup to ALE tAVLL 33 tCLCL – 30 ns
Address hold after ALE tLLAX 28 tCLCL – 35 ns
ALE to valid instr. in tLLIV 150 4tCLCL– 100 ns
ALE to PSEN tLLPL 38 tCLCL – 25 ns
PSEN pulse width tPLPH 153 3 tCLCL – 35 ns
PSEN to valid instr. in tPLIV –88 3t
CLCL – 100 ns
Input instruction hold
after PSEN tPXIX 00–ns
Input instruction float *)
after PSEN tPXIZ –43 t
CLCL – 20 ns
Address valid after
PSEN *) tPXAV 55 tCLCL – 8 ns
Address to valid instr. in tAVIV 198 0– 5tCLCL – 115 ns
Address float to PSEN tAZPL 00–ns
*) Interfacing the SAB 80C517 to devices with float times up to 55 ns is permissible.
This limited bus contention will not cause any damage to port 0 drivers.
SAB 80C517/80C537
Semiconductor Group 52
AC Characteristics (cont’d)
Parameter Symbol Limit Values Unit
16 MHz Clock Variable Clock
1/tCLCL =3.5 MHz to 16 MHz
min max. min. max.
External Data Memory Characteristics
RD pulse width tRLRH 275 6 tCLCL – 100 ns
WR pulse width tWLWH 275 6 tCLCL – 100 ns
Address hold after ALE tLLAX2 90 2 tCLCL – 35 ns
RD to valid data in tRLDV 148 5 tCLCL 165 ns
Data hold after RD tRHDX 0–0 ns
Data float after RD tRHDZ –55 2t
CLCL –70 ns
ALE to valid data in tLLDV 350 8 tCLCL 150 ns
Address to valid data in tAVDV 398 9 tCLCL 165 ns
ALE to WR or RD tLLWL 138 238 3 tCLCL – 50 3 tCLCL + 50 ns
WR or RD high to ALE
high tWHLH 23 103 tCLCL –40 t
CLCL + 40 ns
Address valid to WR tAVWL 120 4 tCLCL 130 ns
Data valid to WR
transition tQVWX 13 tCLCL 50 ns
Data setup before WR tQVWH 288 7 tCLCL 150 ns
Data hold after WR tWHQX 13 tCLCL 50 ns
Address float after RD tRLAZ –0– 0 ns
SAB 80C517/80C537
Semiconductor Group 53
Program Memory Read Cycle
Data Memory Read Cycle
SAB 80C517/80C537
Semiconductor Group 54
Data Memory Write Cycle
SAB 80C517/80C537
Semiconductor Group 55
AC Characteristics (cont'd)
AC Characteristics (cont'd)
Parameter Symbol Limit Values Unit
Variable Clock
Frequ. = 3.5 MHz to 12 MHz
min max.
External Clock Drive
Oscillator period tCLCL 83.3 285 ns
Oscillator frequency 1/tCLCL 3.5 12 MHz
High time tCHCX 20 ns
Low time tCLCX 20 ns
Rise time tCLCH –20ns
Fall time tCHCL –20ns
Parameter Symbol Limit Values Unit
Variable Clock
Frequ. = 1 MHz to 16 MHz
min max.
External Clock Drive
Oscillator period tCLCL 62.5 285 ns
Oscillator frequency 1/tCLCL 3.5 16 MHz
High time tCHCX 25 ns
Low time tCLCX 25 ns
Rise time tCLCH –20ns
Fall time tCHCL –20ns
SAB 80C517/80C537
Semiconductor Group 56
External Clock Cycle
SAB 80C517/80C537
Semiconductor Group 57
AC Characteristics (cont’d)
AC Characteristics (cont’d)
Parameter Symbol Limit Values Unit
12 MHz Clock Variable Clock
1/tCLCL =3.5 MHz to 12 MHz
min. max. min. max.
System Clock Timing
ALE to CLKOUT tLLSH 543 7tCLCL – 40 ns
CLKOUT high time tSHSL 127 2tCLCL – 40 ns
CLKOUT low time tSLSH 793 10tCLCL – 40 ns
CLKOUT low to ALE
high tSLLH 43 123 tCLCL – 40 tCLCL +40 ns
Parameter Symbol Limit Values Unit
16 MHz Clock Variable Clock
1/tCLCL = 3.5 MHz to 16 MHz
min. max. min. max.
System Clock Timing
ALE to CLKOUT tLLSH 398 7tCLCL – 40 ns
CLKOUT high time tSHSL 85 2tCLCL – 40 ns
CLKOUT low time tSLSH 585 10tCLCL – 40 ns
CLKOUT low to ALE
high tSLLH 23 103 tCLCL – 40 tCLCL +40 ns
SAB 80C517/80C537
Semiconductor Group 58
System Clock Timing
SAB 80C517/80C537
Semiconductor Group 59
ROM Verification Characteristics
TA= 25˚C ± 5˚C; VCC = 5 V ± 10%; VSS = 0 V
ROM Verification
For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs and begins
to float when a 100 mV change from the loaded VOH/VOL level occurs. IOL/IOH ≥ ± 20 mA.
Parameter Symbol Limit values Unit
min max.
ROM Verification
Address to valid data tAVQV –48 tCLCL ns
ENABLE to valid data tELQV –48 tCLCL ns
Data float after ENABLE tEHQZ 048 tCLCL ns
Oscillator frequency 1/tCLCL 4 6 MHz
SAB 80C517/80C537
Semiconductor Group 60
Recommended Oscillator Circuits
AC Testing
Input, Output Waveforms
Float Waveforms
AC Inputs during testing are driven at VCC – 0.5 V for a logic 1 and 0.45 V for a logic ’0’. Timing measure-
ments are made at VIHmin for a logic ’1’ and VILmax for a logic ’0’.