@ Multilayer Ceramic Chip Capacitors Kyocera's series of Multilayer Ceramic Chip Capacitors are designed to meet a wide variety of needs. We offer a complete range of products for both general and specialized applications, including the general-purpose CM series, the high-voltage CF series , the low profile CT series, and the DN series for automotive uses. Features * We maintain factories worldwide in order to supply our global customer bases quickly and efficiently and to maintain our reputation as the highest-volume producer in the industry. * All our products are highly reliable due to their monolithic structure of high-purity and superfine uniform ceramics and their integral internal electrodes. * By combining superior manufacturing technology and materials with high dielectric constants, we produce extremely compact components with exceptional specifications. * Our stringent quality control in every phase of production from material procurement to shipping ensures consistent manufacturing and superb quality. * Kyocera components are available in a wide choice of dimensions, temperature characteristics, rated voltages, and terminations to meet specific configurational requirements. CX series CM Smoothing CA series Arrays series Multilayer Ceramic Chip Capacitors General CU series Low ESR CT series Low Profile CF DN/DR series Automotive CD series Low loss series High-Voltage Structure External Termination Electrodes Nickel Barrier Termination Products Internal Electrodes (Pd, Pd/Ag, Ni or Cu) Tape and Reel Termination Electrodes Ni Plating Dielectric Ceramic Layer Temperature compensation :Titanate family High dielectric constant family : Barium Titanate family Relaxor family Silver Palladium Termination Products Sn Plating or Sn/Pb Plating Silver Palladium Termination (Pd/Ag) Bulk Cassette Please contact your local AVX sales office or distributor for specifications not covered in this catalog. Our products are continually being improved. As a result, the capacitance range of each series is subject to change without notice. Please contact an AVX sales representative to confirm compatibility with your application. @ Multilayer Ceramic Chip Capacitors Kyocera Ceramic Chip Capacitors are available for different applications as classified below: Series Dieletric Options Typical Applications Features CM C0G (NP0) X5R X7R Y5V NTC General Purpose Wide Cap Range CF C0G (NP0) X7R High Voltage & Power Circuits High Voltage 500VDC, 630VDC 1000VDC, 2000VDC 3000VDC, 4000VDC CT C0G (NP0) X5R X7R Y5V PLCC (Decoupling) DN/DR C0G (NP0) U (750) X7R, X8R CD Terminations Available Size (EIA) Nickel Barrier 0201, 0402, 0603 0805, 1206, 1210 1812, 2220 Nickel Barrier 1206, 1210, 1808 1812, 2208, 2220 Low Profile Nickel Barrier 0402, 0805 1206, 1210 Automotive Thermal shock Resistivity High Reliability Nickel Barrier 0603, 0805, 1206 X5R PDP PBX Inverters Low Loss Excellent DC bias Nickel Barrier 1206, 1210 1812, 2220 CU C0G (NP0) RF Circuit Low ESR Nickel Barrier 0402, 0603 CA C0G (NP0) X7R Y5V Digital Signal Pass line Reduction in Placing Costs Nickel Barrier 0508, 0612 CX Y5U Power Supply Circuit Smoothing Nickel Barrier 1210, 1812 2220 NTC: Negative Temperature coefficient types are available on request. DN, CX Series: Silver Palladium termination is available on request. @ Multilayer Ceramic Chip Capacitors Ordering Information KYOCERA PART NUMBER: CM SERIES CODE CM CF CT DN/DR = = = = General Purpose High Voltage Low Profile Automotive CA CD CU CX = = = = Capacitor Arrays Low Loss Low ESR Smoothing SIZE CODE SIZE 03 05 105 F12 F13 = = = = = EIA (EIAJ) 0201 (0603) 0402 (1005) 0603 (1608) 0508 (1220) 0612 (1632) SIZE 21 = 316 = 32 = 42 = 43 = EIA (EIAJ) 0805 (2012) 1206 (3216) 1210 (3225) 1808 (4520) 1812 (4532) SIZE EIA (EIAJ) 52 = 2208 (5720) 55 = 2220 (5750) DIELECTRIC CODE CODE EIA CODE CG = C0G (NPO) X5R = X5R X7R = X7R X8R = X8R Y5V = Y5V Y5U = Y5U Negative dielectric types are available on request. CAPACITANCE CODE Capacitance expressed in pF. 2 significant digits plus number of zeros. For Values < 10pF, Letter R denotes decimal point, eg. 100000pF = 104 0.1F = 104 4700pF = 472 1.5pF = 1R5 0.5pF = R50 TOLERANCE CODE B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Z = -20 to +80% VOLTAGE CODE 06 10 16 25 50 = = = = = 6.3VDC 10VDC 16VDC 25VDC 50VDC 100 200 250 500 630 = = = = = 100VDC 200VDC 250VDC 500VDC 630VDC 1000 2000 3000 4000 = = = = TERMINATION CODE A = Nickel Barrier B = Silver Palladium (option) C = Silver (option) PACKAGING CODE B C T L H N = = = = = = Bulk Bulk Cassette 7" Reel Taping 13" Reel Taping 7" Reel Taping 13" Reel Taping & 4mm Cavity pitch & 4mm Cavity pitch & 2mm Cavity pitch & 2mm Cavity pitch 1000VDC 2000VDC 3000VDC 4000VDC 21 X7R 104 K 50 A T @ Multilayer Ceramic Chip Capacitors Temperature Characteristics and Tolerance High Dielectric Constant EIA Dielectric Cmax Temperature Range X5R -55 to 85C X7R -55 to 125C 15% X8R -55 to 150C Y5U -30 to 85C +22 to -56% Y5V -30 to 85C +22 to -82% Temperature Compensation Type Electric Code Value (pF) 1B/C0G P N150 R N220 S N330 T N470 U N750 SL +350 to -1000 0.5-2.7 CK PK RK SK TK UK SL 3.0-3.9 CJ PJ RJ SJ TJ UJ SL 4.0-9.0 CH PH RH SH TH UJ SL 10 CG PH RH SH TH UJ SL K = 250ppm/C, J = 120ppm/C, H = 60ppm/C, G = 30ppm/C e.g. CG = 030ppm/C, PH = -15060ppm/C Note: All parts will be marked as "CG" but will conform to the above table. E Standard Number Available Tolerances Dielectric materials, capacitance values and tolerances are available in the following combinations only: EIA Dielectric COG NTC 1 Standard Tolerance 3 C=0.25pF 5 D=0.50pF 4 J=5% K=10% M=20% X5R X7R Y5U Y5V 6 K=10% M=20% M=20% Z=-20% to +80% Z=-20% to +80% E3 Capacitance 5pF 2 E6 E12 E24 (Option) 1.0 1.0 1.1 1.2 1.2 1.3 1.5 1.5 1.6 1.8 1.8 2.0 2.2 2.2 2.4 2.7 2.7 3.0 3.3 3.3 3.6 3.9 3.9 4.3 4.7 4.7 5.1 5.6 5.6 6.2 6.8 6.8 7.5 8.2 8.2 9.1 1.0 1.0 <10pF 1.5 10pF E12 Series E6 Series 2.2 2.2 3.3 E3 Series 4.7 E3 Series Note: 1 NTC : Negative Temperature Compensation types are available on request as shown on product pages. 2 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF, 2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF, 10pF. 3 B = 0.1pF is available for 5pF and below on request. 4 F = 1% or G = 2% is available for C >10pF on request. 5 C = 0.25pF is available for values 5pF< C < 10pF on request. 6 J = 5% for X7R(X5R) is available on request. 4.7 6.8 @ CM Series Nickel Barrier Terminations Features Application We offer a diverse product line ranging from ultra-compact (0.6x0.3 mm) to large (5.7x5.0 mm) components configured for a variety of temperature characteristics, rated voltages, and packages. We offer the choice and flexibility for almost any applications. This standard type is ideal for use in a wide range of applications, from commercial to industrial equipment. Temperature Compensation Dielectrics Size (mm) CM03 R50 1R0 1R5 100 120 101 121 102 122 103 123 0.5 1.0 1.5 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000 12000 15000 18000 22000 1.00.05 0.50.05 (0402) (0201) 0.30.03 Temperature Characteristics Rated Voltage (VDC) Capacitance (pF) CM05 0.60.03 COG U T *SL P to COG CM105 CM21 (0603) (0805) 1.60.1 0.80.1 U T *SL P to COG 2.00.1 1.250.1 CM316 (1206) U T *SL P to COG 3.20.2 1.60.15 CM32 (1210) U T *SL P to COG 3.20.2 CM43 4.5 0.3 3.2 0.2 2.50.2 5.0 0.4 U T *SL COG P to COG 5.7 0.4 CM55 COG 10 16 25 16 25 50 50 50 50 100 50 50 16 25 50 100 200 50 50 25 50 100 200 50 50 50 100 200 50 50 100 200 100 200 M M M A A A A A B B B B C C C C C C C C D F D E D D D H D C C C C D D D D G D I C G F F G G E F I D E G E G G I E G E12 series:Standard, E24 series:Option P T:Option Size CM03 CM05 CM105 CM21, CM316, CM32 M A B C D E F G H I O V 0.30.03 0.50.05 0.80.1 0.60.1 0.850.1 1.150.1 1.250.1 1.4max 1.6 max 1.60.15 2.00.2 2.50.2 Taping(178 dia reel) 15kp(P8) 10kp(P8) 4kp(P8) 4kp(P8) 4kp(P8) 3kp(E8) 3kp(E8) 3kp(E8) 2.5kp(E8) 2.5kp(E8) 2kp(E8) 1kp(E8) Taping(330 dia reel) ------ 50kp(P8) 10kp(P8) 10kp(P8) 10kp(P8) 10kp(E8) 10kp(E8) 10kp(E8) 5kp(E8) 5kp(E8) 5kp(E8) ------ Thickness (mm) Size Thickness (mm) Taping(178 dia reel) Taping(330 dia reel) CM43, CM55 E G I J O K V 1.150.1 1.4max 1.60.15 2.0max 2.00.2 2.5max 2.50.2 1kp(E12) 1kp(E12) 1kp(E12) ------ ------ ------ 1.5kp(E12) 1 1.5kp(E12) ------ Note : P8 = 8mm width paper tape E8 = 8mm width plastic tape E12 = 12mm width plastic tape 1 1kp for CM55 ------ 0.5kp(E12) 0.5kp(E12) ------ ------ @ CM Series Nickel Barrier Terminations X5R Dielectric Size (mm) Rated Voltage (VDC) Capacitance (pF) 151 102 152 103 153 104 154 105 155 106 156 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 47000 68000 100000 150000 220000 330000 470000 680000 1000000 1500000 2200000 3300000 4700000 6800000 10000000 15000000 22000000 CM03 0.00.0 (0201) 0.00.0 10 16 M M CM05 1.00.05 0.50.05 (0402) 10 16 25 50 A A A A CM105 16 25 B B B 2.00.1 (0805) 0.80.1 6.3 10 B CM21 1.60.1 (0603) 50 6.3 10 16 25 C CM316 CM32 3.20.2 (1206) 1.250.1 50 6.3 10 16 25 3.20.2 (1210) 2.50.2 1.60.15 50 10 16 CM43 (1812) 4.50.3 3.20.2 25 10 25 B C C C D D D C D D F D F F F D D D D E F E E E E G I O I I I V H O V V O X5R E6 series : Standard, E12 series : Option Dimentional tolerances (L, W, T) is 0.15mm for 105X5R334 to 105, 21X5R335 to 475. 0.2mm for 316X5R685 to106 X7R Dielectric Size (mm) Rated Voltage (VDC) Capacitance (pF) 151 102 152 103 153 104 154 105 155 106 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 47000 68000 100000 150000 220000 330000 470000 680000 1000000 1500000 2200000 3300000 4700000 6800000 10000000 CM03 (0201) 0.00.0 0.00.0 CM05 CM105 (0402) 1.00.05 (0603) CM21 1.60.1 0.80.1 0.50.05 CM316 (0805) 2.00.1 1.250.1 CM32 (1206) 3.20.2 1.60.15 CM43 3.20.2 (1210) 4.50.3 (1812) CM55 5.70.4 (2220) 5.00.4 3.20.2 2.50.2 16 16 25 50 10 16 25 50 100 10 16 25 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 M D A A A D B B B B B F C C C C G C E D G F D D D F F I E D D I F D D F D D I E E G G I O I I H V E G G G I I O K E E E E I G J K J K I J O G J K K V K V K X7R E6 series : Standard, E12 series : Option Y5V Dielectric Size (mm) Rated Voltage (VDC) Capacitance (pF) 102 472 103 473 104 474 105 475 106 226 107 1000 2200 4700 10000 22000 47000 100000 220000 470000 1000000 2000000 4700000 10000000 22000000 47000000 100000000 CM03 0.00.0 CM05 (0201) 0.0 0.0 6.3 10 M M 1.00.05 0.50.05 (0402) 10 16 25 50 A A A A Y5V E3 series : Standard, E6 series : Option Tolerance (W, T) for CM316Y5V106 is 0.20mm. CM105 (0603) 1.60.1 0.80.1 10 16 25 50 B B B B CM21 2.00.1 1.250.1 (0805) 10 16 25 50 C C C C D F D F D F D F CM316 (1206) 3.20.2 1.60.15 10 16 25 50 C D E I D D E C D E I CM43 CM32 (1210) 10 3.20.2 (1812) 3.2 0.2 2.50.2 16 25 I I 10 4.5 0.3 CM55 (2220) 5.0 0.4 10 E O 5.7 0.4 K K @ Multilayer Ceramic Chip Capacitors Electrical Characteristics Capacitance-Temperature (temperature compensation) Aging (change of capacitance over time) For temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms at 1MHz, 1Vrms 10 Capacitance(%) 10 Capacitance(%) 5 C P R S T U 0 -5 C X7R, X8R Y5U 0 -10 Y5V -20 Initial value should be after 48hr of Heat treatment. -10 -60 -40 -20 0 20 40 60 80 100 -30 10 120 100 1,000 Capacitance-Temperature (high dielectric constant) Y5U, X7R, Y5V, X8R at 1kHz, 1Vrms X8R at 0VDC X7R at RV/2 Y5U at 0VDC Impedance() Capacitance(%) X7R at 0VDC 0 -40 100,000 Impedance-Frequency 20 -20 10,000 Duration(hrs) Temperature(C) X8R at RV/2 -60 Y5U at RV/2 100 W W5 5R( R(B B) )10 /Y5 00p V0 .01 F W5 F 10 R(B )/Y 5V 0.1 F 1 W5 R(B )1Y 5V 1 Y F 0.1 5V 10 F Y5 Y5V at 0VDC CH CH CH 10 10 pF 1p F 0p F 10 00 pF V1 0.01 -80 at 1Vrms CH 00 F Y5V at RV/2 -100 -60 -40 -20 0 20 40 60 80 100 120 130 140 0.001 0.1 150 1 Temperature(C) 1,000 10,000 AC Voltage For temperature compensation at 1MHz, 1Vrms For high dielectric constant at 1kHz, 1Vrms 20 25 CH 0 For temperature compensation : 1MHz 1 Vrms/for high dielectric constant : 1kHz Rated at 25V : Y5U Rated at 25V : C, X7R, Y5V 20 Capacitance(%) W5R -20 C/C(%) 100 Frequency(MHz) DC Bias Rated at 25V : Y5U Rated at 25V : C, X7R, Y5V 10 Y5U -40 -60 Y5V 15 Y5V X7R 10 5 0 -80 Y5U C -5 -100 0 5 10 15 20 25 -10 VDC Please verify individual characteristics at the design stage to ensure total suitability 1 2 3 AC Voltage(Vrms) 4 5 @ Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test conditions and Specification for Temperature Compensation type(C to U * SL characteristics) Test Items Specification (C: nominal capacitance) Capacitance Value Within tolerance C1000pF 1MHz10% 0.5 to Q C30pF: Q1000 C<30pF: Q400+20C C>1000pF 1kHz10% 5Vrms Insulation resistance (IR) 10,000M or 500M*F min, whichever is less Measured after the rated voltage is applied for one minute at normal room temperature and humidity. (5) Dielectric Resistance No problem observed (1) Apply 3 times of the rated voltage for 1 to 5 seconds. Appearance No problem observed Microscope(10xmagnification) Termination strength 2 No problem observed Apply a sideward force of 500g(5N) to a PCB-mounted sample. Bending strength 2 No mechanical damage at 1mm bent Glass epoxy PCB (t=1.6mm); fulcrum Spacing: 90mm; for 10 seconds. Appearance No significant change is detected. C Within tolerance Q C30pF: Q1000 C<30pF: Q400+20C Vibration frequency: 10 to 55(Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/min In X, Y and Z directions: 2 hours each Total 6 hours Appearance No significant change is detected. C 2.5% or 0.25pF max, whichever is larger. Q C30pF: Q1000 C<30pF: Q400+20C IR 10,000M or 500M*F min, whichever is smaller Withstand voltage Resists without problem Vibration test Soldering heat resistance Temperature cycle 4 Humidity test 6 Hightemperature with loading 2 3 4 5 6 Soak the sample in 270C5C solder for 100.5seconds(3) and place in a room at normal temperature and humidity; measure after 242hours. (Preheating Conditions) Order 1 2 Temperature 80 to 100C 150 to 200C Time 2minutes 2minutes Ni/Br termination: 90% min Ag/Pd termination: 75% min Soak the sample in 230C5C Sn62 solder for 41second Appearance No significant change is detected. C 2.5% or 0.25pF max, whichever is larger. Q C30pF: Q1000 C<30pF: Q400+20C (Cycle) Normal room temperature (3min) Lowest operation temperature (30min) Normal room temperature (3min) Highest operation temperature (30min) IR 10,000M or 500M*F min, whichever is samller Withstand voltage Resists without problem Appearance No significant change is detected. C 7.5% or 0.75pF max, whichever is larger. Q C30pF: Q200 C<30pF: Q100+10C/3 IR 500M or 25M*F min, whichever is smaller Appearance No significant change is detected. C 3% or 0.3pF max, whichever is larger. Q C30pF: Q350 10pFC<30pF: Q275+5C/2 C<10pF: Q200+10C IR 1,000M or 50M*F min, whichever is smaller Solderability 1 Test Conditions For the CF series, use 1.5 times when the rated voltage is 500V; use a 1.2 times when the rated voltage exceeds 1000V. The charge and discharge current of the capacitor must not exceed 50mA. Except CT series 30.5 seconds for Silver Palladium terminations. 1000 cycles for Nickel Barrier termination DN series. (Alumina Substrate) For the CF series over 1000V, apply 500V for 1minute at normal room temperature and humidity. Exclude capacitors with rated voltage of over 200V. After five cycles(4), measure after 242hours. Measure the test sample after storing it 242hours at a temperature of 40C2C and a relative humidity of 90-95% Rh. for 500+24/-0hours. After applying(1) twice of the rated voltage at a temperature of 1253 for 1000+48/-0hours, measure the sample after storing 242hours. @ Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test conditions and Specification for High Dielectric Type (X5R, X7R, Y5V & Y5U) Test Items X7R/X5R Capacitance Value 2.5%max, 3.5%max(2) 0.4%max(13), 5.0%max(3) Test Condition Do previous treatment(9, 15) Capacitance Fire Vol C10F 1kHz10% 1.00.1Vrms 5.0%max, 7.0%max(14) C>10F 120Hz10% 0.50.1Vrms 9.0%max(4), 12.5%max(5) 5.0%max(12) Insulation resistance (IR) 10,000M or 500M*F max, whichever is less Measured after the rated voltage is applied for 2minutes at normal room temperature and humidity. (11) Dielectric Resistance 1 No problem observed (1) Apply 2.5 times of the rated voltage for 1 to 5 seconds. Appearance No problem observed Microscope(10xmagnification) No problem observed Apply a sideward force of 500g(5N) to a PCB-mounted sample. Bending strength test 6 No problem observed at 1mm bent Glass epoxy PCB (t=1.6mm); fulcrum Spacing: 90mm; for 10 seconds. Vibration Appearance No significant change is detected. test C Within tolerance tan(%) Satisfies the initial value. Appearance No significant change is detected. Termination strength Soldering heat resistance 6 Temperature cycle 8 Humidity test 12 Hightemperature with loading Vibration frequency: 10 to 55(Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/min In X, Y and Z directions: 2 hours each Total 6 hours tan(%) Satisfies the initial value. IR 10,000M or 500M*F max, whichever is smaller Withstand voltage Resists without problem Do previous treatment(9) Soak the sample in 270C5C solder for 100.5seconds(7) and place in a room at normal temperature and humidity; measure after 484hours. (Preheating Conditions) Order Temperature Time 1 80 to 100C 2minutes 2 150 to 200C 2minutes Ni/Br termination: 90% min Ag/Pd termination: 75%min Soak the sample in 230C5C Sn62 solder for 41second No significant change is detected. Do previous treatment(9) (Cycle) Normal room temperature (3min) Lowest operation temperature (30min) Normal room temperature (3min) Highest operation temperature (30min) C Solderability Appearance C Within 7.5% Within 7.5% Within 20% Within 20% Within 20% Within 20% tan(%) Satisfies the initial value. IR 10,000M or 500M*F max, whichever is smaller Withstand voltage Resists without problem Appearance No significant change is detected. C Within 12.5% Within 30% Within 30% tan(%) 200% max of initial value IR 500M or 25M*F max, whichever is smaller Appearance No significant change is detected. C tan(%) IR *2 *3 *4 *5 *6 *7 *8 *9 Y5V Within tolerance tan(%) *1 Specification Y5U Within 12.5% 150% max of initial value Within 30% 200% max of initial value Within 30% 150% max of initial valueinitial value After five cycles(8), measure after 484hours. Do previous treatment(10) After storing it at a temperature of 40C2C and a relative humidity of 90-95% for 500+24/-0hours, measure the sample after storing 484hours. Do previous treatment(10) After applying twice (1) of the rated voltage at the highest operating temperature for 1000+48/-0hours, measure the sample after storing 484hours. 1,000M or 50M*F max, whichever is smaller For CF series, use 1.5 times when the rated voltage is 250V and 500V; Use 1.2 times when the rated voltage exceeds 630V. The charge/discharge current of the capacitor must not exceed 50mA. Apply to X5R 16V/25V type, X7R 10V/16V type, CM316X7R564 to 105(25V type). Apply to X5R 6.3V/10V type, CT05X7R123 to 223(10V type),X7R 6.3V type. Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type). Except 12.5% for CT21Y5V105/16V. Apply to Y5V 6.3V/10V type. Exclude CT series with thickness of less than 0.66mm. 30.5 sec. for AgPd termination. 1000 cycles for Nickel Barrier termination DN/DR series. (Alumina Substrate) Keep specimen at 150C+0/-10C for one hour, leave specimen at room ambient for 484 hours. *10 *11 *12 *13 *14 *15 Apply the same test condition for one hour, then leave the specimen at room ambient for 484 hours. For the CF series over 1000V, apply 500V for 1 minutes at room ambient. Exclude capacitors with rated voltage of over 200V. apply to CD series. Apply to 25V series of CM105 Y5V 154 over, CM21Y5V105 over, 316Y5V155 over. Measurement condition 1kHz, 1Vrms for Y5V, C < 47F type. @ Multilayer Ceramic Chip Capacitors Dimensions Dimensions W L T P P~P P External Terminations Electrode External Dimensions Tape & Reel Size EIA CODE Dimensions (mm) EIAJ CODE L W P min P max P to P min T max 03 0201 0603 0.60.03 0.30.03 0.10 0.20 0.20 0.33 05 0402 1005 1.00.05 0.50.05 0.10 0.35 0.30 0.55 105 0603 1608 1.60.10 0.80.10 0.20 0.60 0.50 0.90 21 0805 2012 2.00.10 1.250.10 0.20 0.75 0.70 1.35 316 1206 3216 3.20.20 1.600.15 0.30 0.85 1.40 1.80 32 1210 3225 3.20.20 2.500.20 0.30 1.00 1.40 2.70 42 1808 4520 4.50.30 2.000.20 0.15 0.85 2.00 2.20 43 1812 4532 4.50.30 3.200.20 0.30 1.10 2.00 2.70 52 2208 5720 5.70.40 2.000.20 0.15 0.85 4.20 2.20 55 2220 5750 5.70.40 5.000.40 0.30 1.40 2.50 2.80 * CX43 Type L : 4.70.4mm * CT21, CT316 : (L) 3.20.2mm and (W)1.60.2mm * T (Thickness) depends on capacitance value. Standard thickness is shown on the appropriate product pages. * DR series 105, 21 size (L)(W)(T) Tolerance 0.15mm * CA series (please refer product specifications) Bulk Cassette P Size (mm) L W P to P T min max min 0603 1.60.07 0.80.07 0.80.07 0.10 0.60 0.50 0805 2.00.1 1.250.1 0.60.1/1.250.1 0.25 0.75 0.80 1206 3.20.1 1.60.1 0.60.1 0.25 0.85 1.50 @ Multilayer Ceramic Chip Capacitors Packaging Options Tape and Reel Reel (code : T) * Reel W2 E C (Unit : mm) Code Reel A B 7-inch Reel (CODE : T, H) 1782.0 60min 13-inch Reel (CODE : L, N) 3302.0 1001.0 Code Reel E W1 C D 130.5 210.8 W2 R 16.5max 1.0 B D R 7-inch Reel (CODE : T, H) A 13-inch Reel (CODE : L, N) W1 10.01.5 2.00.5 9.51.0 Carrier tape width 8mm. For size 42(1808) or over, Tape width 12mm and W1 : 141.5, W2 : 20.5mm max Carrier Tape * Carrier tape (Paper Carrier Tape) Code A B 03 (0.6x0.3) 0.370.03 0.670.03 05 (1.0x0.5) 0.650.1 1.150.1 105 (1.6x0.8) 1.00.2 1.80.2 12 (2.0x1.25) 1.50.2 2.30.2 13 (3.2x1.6) 2.00.2 3.60.2 21 (2.0x1.25) 1.500.2 2.30.2 316 (3.2x1.6) 2.00.2 3.60.2 32 (3.2x2.5) 2.90.2 3.60.2 42 (4.5x2.0) 2.40.2 4.90.2 43 (4.5x3.2) 3.60.2 4.90.2 52 (5.7x2.0) 2.40.2 6.00.2 55 (5.7x5.0) 5.30.2 6.00.2 Type Punched rectangular hole to hold capacitor E Feed Hole J (Unit : mm) C D A B F H G 1.1max (Plastic Carrier Tape) Rectangular hole to accept capacitor 2.8max E Feed Hole J C D A max 5 B F H 0.6max G * Package quantity (Shown on the appropriate product pages.) For CX type, B : 5.20.2mm Code Carrier Tape Paper Plastic Bulk Cassette (Unit : mm) 12 36 Slider 8mm 8mm 12mm Code Carrier Tape Paper Plastic (Unit : mm) C D 8.00.3 3.50.05 F E 4.00.1 1.750.1 12.00.3 5.50.05 8.00.1 G H J 2.00.05 4.00.1 1.5+0.1 -0 8mm 8mm 12mm For 03, 05type, F : 2.00.05mm For 42type, 52type F : 4.00.1mm Package Quantity Shutter 110 Type Thickness (mm) Quantity per case (pcs) 05 0.5 50,000 105 0.8 15,000 0.6 10,000 1.25 5,000 21 Connection Area CM05 is optional @ Multilayer Ceramic Chip Capacitors Precautions Circuit Design 1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause a short, open, smoking, or flaming to occur, etc. 2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical devices; devices which are highly public orientated; and devices which demand a high standard of liability. Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability design different from that of general purpose capacitors. 3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitor's insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this effect becomes especially pronounced in high frequency circuits, please exercise caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 20C. 4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the rated voltage when AC voltage is super-imposed to the DC voltage. In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations, may cause the capacitor to smoke or flame. 5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is within the rated voltage, it is possible capacitor reliability will deteriorate. 6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage. Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage at the time of operation. 7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in the catalog and specifications. In addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to Voltage change. Please contact sales in such case. 8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective product in order that the assembled product function appropriately. Storage 1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5. The solderability is assured for 12 months from our final inspection date (six months for silver palladium) if the above storage precautions are followed. 6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas. @ Multilayer Ceramic Chip Capacitors Surface Mounting Information Dimensions for recommended typical land (Unit : mm) Size Land Pattern Sample capacitor c b a Soldering resist When mounting the capacitor to the substrate, it is important to consider carefully that the amount of solder (size of fillet) used has a direct effect upon the capacitor once it is mounted. a) The greater the amount of solder, the greater the stress to the elements. As this may cause the substrate to break or crack, it is important to establish the appropriate dimensions with regard to the amount of solder when designing the land of the substrate. b) In the situation where two or more devices are mounted onto a common land, separate the device into exclusive pads by using soldering resist LxW a b c 03 0.6x0.3 0.15 to 0.35 0.20 to 0.30 0.25 to 0.35 05 1.0x0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60 105 1.6x0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80 21 2.0x1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10 316 3.2x1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30 32 3.2x2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30 42 4.5x2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80 43 4.5x3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00 52 5.7x2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80 55 5.7x5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70 CA series : Please refer product specifications. DN/DR Automotire Series (Unit : mm) Size LxW a b c 105 1.6x0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00 21 2.0x1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40 316 3.2x1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80 Ideal Solder Thickness T/3 to T/2 Chip Capacitor ; ;;; ;; T Solder PCB Typical mounting problems Item Poor example Recommended example/Separated by solder resist Solder resist Multiple parts mount Solder resist Mount with leaded parts Leaded parts Leaded parts Soldering iron Solder resist Wire soldering after mounting Wire Solder resist Overview Solder resist @ Multilayer Ceramic Chip Capacitors Surface Mounting Information Mounting Design The chip could crack if the PCB warps during processing after the chip has been soldered. Recommended chip position on PCB to minimize stress from PCB warpage (Not recommended) (Ideal) Actual Mounting 1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking. 2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf. 3) To minimize warpage of the PCB from the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture. Crack Support pin 4) When the positioning hook begins to wear, unstable force may be applied to the chip, resulting in cracking. 5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case. 6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips. Resin Mold 1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. 2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. 3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself. @ Multilayer Ceramic Chip Capacitors Surface Mounting Information Soldering Method 1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, limit the temperature difference (T) to within 130C. 2) Please see our recommended soldering conditions. Recommendable Temperature Profile Reflow Peak temperature 230C5C 15seconds maximum PCB Mounting Precautions If the PCB becomes excessively bent either before or after mounting of the chip capacitor, the chip capacitor may crack or chip. Take precautions to reduce PCB flexure. Preheat the capacitors to approx. 150C. Solder quickly on a hot plate using a soldering iron adjusted to 250 to 280C. Preheat Cool at normal room temperature after removing from furnace. 250 200 Temperature Special Precautions for Using Soldering Irons 300 150 100 More than180C, 40seconds maximum 50 0 60seconds 60seconds Minimize soldering time. Wave 300 Preheat Cool at normal room temperature 250 Temperature T 200 150 230C to 260C 100 50 0 60 to 120sec. 3sec. max q If a chip capacitor smaller than type CM316 is used with a wave soldering tank, use the Nickel-barrier type to minimize solder leaching. This may not be necessary with a static soldering tank.) w Ensure that the chip capacitor is preheated adequately. e Ensure that the temperature difference (T) does not exceed 130C. r Cooling after soldering should be as slow as possible. Solding Iron 300 Preheat Cooling 250 Temperature T 200 150 250C to 280C 100 50 0 60 to 120sec. Do not place the soldering iron on the chip. 3sec. max