Kyocera's series of Multilayer Ceramic Chip Capacitors are
designed to meet a wide variety of needs. We offer a
complete range of products for both general and
specialized applications, including the general-purpose
CM series, the high-voltage CF series , the low profile CT
series, and the DN series for automotive uses.
Please contact your local AVX sales office or distributor for
specifications not covered in this catalog.
Our products are continually being improved. As a result, the
capacitance range of each series is subject to change without notice.
Please contact an AVX sales representative to confirm compatibility
with your application.
@
Structure
Tape and Reel
Bulk Cassette
External Termination
Electrodes
Internal Electrodes
(Pd, Pd/Ag, Ni or Cu)
Dielectric Ceramic Layer
Temperature compensation :Titanate family
High dielectric constant family :
Barium Titanate family
Relaxor family
Nickel Barrier Termination Products
Termination
Electrodes
Ni Plating
Sn Plating or
Sn/Pb Plating
Silver Palladium
Termination
(Pd/Ag)
Silver Palladium Termination Products
Features
• We maintain factories worldwide in order to supply our global customer
bases quickly and efficiently and to maintain our reputation as the
highest-volume producer in the industry.
• All our products are highly reliable due to their monolithic structure of
high-purity and superfine uniform ceramics and their integral internal
electrodes.
• By combining superior manufacturing technology and materials with high
dielectric constants, we produce extremely compact components with
exceptional specifications.
• Our stringent quality control in every phase of production from material
procurement to shipping ensures consistent manufacturing and superb
quality.
• Kyocera components are available in a wide choice of dimensions,
temperature characteristics, rated voltages, and terminations to meet
specific configurational requirements.
Multilayer
Ceramic Chip
Capacitors
CM
series DN/DR
series
CU
series CT
series CF
series
CX
series CA
series
CD
series
General Automotive
Low ESR Low loss
Arrays
Smoothing
High-Voltage
Low Profile
Multilayer Ceramic Chip Capacitors
@Multilayer Ceramic Chip Capacitors
Series Dieletric Options Typical Applications Features Terminations Available Size (EIA)
CM
CF
CT
∗DN/DR
CD
CU
CA
CX
C0G (NP0) 0201, 0402, 0603X5R 0805, 1206, 1210X7R General Purpose Wide Cap Range Nickel Barrier
Y5V 1812, 2220
NTC∗
C0G (NP0) High Voltage High Voltage 1206, 1210, 1808
& 500VDC, 630VDC Nickel Barrier
X7R Power Circuits 1000VDC, 2000VDC 1812, 2208, 2220
3000VDC, 4000VDC
C0G (NP0)
X5R PLCC 0402, 0805
X7R (Decoupling) Low Profile Nickel Barrier 1206, 1210
Y5V
C0G (NP0) Thermal shock
U (750) Automotive Resistivity Nickel Barrier 0603, 0805, 1206
X7R, X8R High Reliability
PDP Low Loss 1206, 1210
X5R PBX Nickel Barrier
Inverters Excellent DC bias 1812, 2220
C0G (NP0) RF Circuit Low ESR Nickel Barrier 0402, 0603
C0G (NP0) Digital Signal Reduction in
X7R Nickel Barrier 0508, 0612
Y5V Pass line Placing Costs
Power Supply 1210, 1812
Y5U Smoothing Nickel Barrier
Circuit 2220
Kyocera Ceramic Chip Capacitors are available for different applications as classified below:
∗ NTC: Negative Temperature coefficient types are available on request.
∗ DN, CX Series: Silver Palladium termination is available on request.
@Multilayer Ceramic Chip Capacitors
Ordering Information
KYOCERA PART NUMBER: CM 21 X7R 104 K 50 A T
SERIES CODE
CM = General Purpose CA = Capacitor Arrays
CF = High Voltage CD = Low Loss
CT = Low Profile CU = Low ESR
DN/DR = Automotive CX = Smoothing
SIZE CODE
SIZE EIA (EIAJ) SIZE EIA (EIAJ) SIZE EIA (EIAJ)
03 = 0201 (0603) 21 = 0805 (2012) 52 = 2208 (5720)
05 = 0402 (1005) 316 = 1206 (3216) 55 = 2220 (5750)
105 = 0603 (1608) 32 = 1210 (3225)
F12 = 0508 (1220) 42 = 1808 (4520)
F13 = 0612 (1632) 43 = 1812 (4532)
CODE EIA CODE
CG = C0G (NPO)
X5R = X5R
X7R = X7R
X8R = X8R
Y5V = Y5V
Y5U = Y5U
Negative dielectric types are available on request.
DIELECTRIC CODE
Capacitance expressed in pF. 2 significant digits plus
number of zeros.
For Values < 10pF, Letter R denotes decimal point,
eg. 100000pF = 104
0.1µF = 104
4700pF = 472
1.5pF = 1R5
0.5pF = R50
CAPACITANCE CODE
B=±0.1pF F = ±1% K = ±10%
C=±0.25pF G = ±2% M = ±20%
D=±0.5pF J = ±5% Z = -20 to +80%
TOLERANCE CODE
06 = 6.3VDC 100 = 100VDC 1000 = 1000VDC
10 = 10VDC 200 = 200VDC 2000 = 2000VDC
16 = 16VDC 250 = 250VDC 3000 = 3000VDC
25 = 25VDC 500 = 500VDC 4000 = 4000VDC
50 = 50VDC 630 = 630VDC
VOLTAGE CODE
A = Nickel Barrier C = Silver (∗option)
B = Silver Palladium (∗option)
TERMINATION CODE
B = Bulk
C = Bulk Cassette
T = 7" Reel Taping & 4mm Cavity pitch
L = 13" Reel Taping & 4mm Cavity pitch
H = 7" Reel Taping & 2mm Cavity pitch
N = 13" Reel Taping & 2mm Cavity pitch
PACKAGING CODE
@Multilayer Ceramic Chip Capacitors
Temperature Characteristics and Tolerance
High Dielectric Constant
Temperature Compensation Type
K = ±250ppm/°C, J = ±120ppm/°C, H = ±60ppm/°C, G = ±30ppm/°C
e.g. CG = 0±30ppm/°C, PH = −150±60ppm/°C
Note: All parts will be marked as "CG" but will conform to the above table.
Available Tolerances
Dielectric materials, capacitance values and tolerances are
available in the following combinations only:
Note:
∗1 NTC : Negative Temperature Compensation types are available on request as shown on
product pages.
∗2 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF,
2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF, 10pF.
∗3 B = ±0.1pF is available for 5pF and below on request.
∗4 F = ±1% or G = ±2% is available for C >10pF on request.
∗5 C = ±0.25pF is available for values 5pF< C < 10pF on request.
∗6 J = ±5% for X7R(X5R) is available on request.
EIA Dielectric Temperature Range ∆Cmax
X5R −55 to 85°C
X7R −55 to 125°C±15%
X8R −55 to 150°C
Y5U −30 to 85°C+22 to −56%
Y5V −30 to 85°C+22 to −82%
Electric Code 1B/C0G P∆R∆S∆T∆U∆SL
Value (pF) N150 N220 N330 N470 N750 +350 to −1000
0.5-2.7 CK PK RK SK TK UK SL
3.0-3.9 CJ PJ RJ SJ TJ UJ SL
4.0-9.0 CH PH RH SH TH UJ SL
≥10 CG PH RH SH TH UJ SL
EIA Dielectric Standard Tolerance Capacitance
COG
NTC ∗1
X5R
X7R
Y5U
Y5V
∗3C=±0.25pF ≤5pF
∗5D=±0.50pF ∗2<10pF
∗4J=±5% ≥10pF
K=±10%
M=±20% E12 Series
∗6K=±10% E6 Series
M=±20%
M=±20% E3 Series
Z=−20% to +80%
Z=−20% to +80% E3 Series
E Standard Number
E3 E6 E12 E24 (Option)
1.0 1.0 1.1
1.2 1.2 1.3
1.5 1.5 1.6
1.8 1.8 2.0
2.2 2.2 2.4
2.7 2.7 3.0
3.3 3.3 3.6
3.9 3.9 4.3
4.7 4.7 5.1
5.6 5.6 6.2
6.8 6.8 7.5
8.2 8.2 9.1
1.0
1.0
1.5
2.2
2.2
3.3
4.7
4.7
6.8
@CM Series
Nickel Barrier Terminations
Temperature Compensation Dielectrics
Features
Size (mm)
R50 0.5
1R0 1.0
1R5 1.5
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
100 10
120 12
15
18
22
27
33
39
47
56
68
82
101 100
121 120
150
180
220
270
330
390
470
560
680
820
102 1000
122 1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
103 10000
123 12000
15000
18000
22000
1.6±0.15
2.0±0.1
1.25±0.1
1.6±0.1
0.8±0.1
1.0±0.05
0.5±0.05
10 16 25 16 25 50 50 50 50 100 50 50 16 25 50 100 200 50 50 25 50 100 200 50 50 50 100 200 50 50 100 200 100 200
COG COG P to UCOG P to UCOG P to U
T∗•SL T∗•SL T∗•SL
AMMMAA
ABBBBCCCC CC
DD
FF
C
D
F
DD
D
F
A
CCC
C
G
GG
G
D
E
G
G
I
C
D
E
DD D
2.5±0.2
Temperature
Characteristics
Rated Voltage (VDC)
Capacitance (pF)
CM03 CM05 CM105 CM21 CM316 CM32 CM43 CM55
(0201) (0402) (0603) (0805) (1206) (1210) 3.2±0.2
3.2±0.2
E12 series:Standard, E24 series:Option P T∆:Option
Note : P8 = 8mm width paper tape
E8 = 8mm width plastic tape
E12 = 12mm width plastic tape
∗1 1kp for CM55
A B C D E
E G I J O K V
F G H I O V
Size
Thickness
(mm)
Taping(178 dia reel)
Taping(330 dia reel)
CM03 CM05 CM105 CM21, CM316, CM32
0.3±0.03 0.5±0.05 0.8±0.1 0.6±0.1 0.85±0.1 1.15±0.1 1.25±0.1 1.4max 1.6 max 1.6±0.15 2.0±0.2 2.5±0.2
15kp(P8) 10kp(P8) 4kp(P8) 4kp(P8) 4kp(P8) 3kp(E8) 3kp(E8) 3kp(E8) 2.5kp(E8) 2.5kp(E8) 2kp(E8) 1kp(E8)
——— 50kp(P8) 10kp(P8) 10kp(P8) 10kp(P8) 10kp(E8) 10kp(E8) 10kp(E8) 5kp(E8) 5kp(E8) 5kp(E8) ———
Size
Thickness
(mm)
Taping(178 dia reel)
Taping(330 dia reel)
CM43, CM55
1.15±0.1 1.4max 1.6±0.15 2.0max 2.0±0.2 2.5max 2.5±0.2
1.5kp(E12)
∗1 1.5kp(E12)
1kp(E12) 1kp(E12) 1kp(E12) 0.5kp(E12) 0.5kp(E12)
——— ——— ——— ——— ——— ——— ———
We offer a diverse product line ranging from ultra-compact (0.6×0.3
mm) to large (5.7×5.0 mm) components configured for a variety of
temperature characteristics, rated voltages, and packages. We offer the
choice and flexibility for almost any applications.
Application
This standard type is ideal for use in a wide range of applications, from
commercial to industrial equipment.
0.6±0.03
0.3±0.03
M
5.7
±0.4
5.0
±0.4
4.5
±0.3
3.2
±0.2
COG P to UCOG P to UCOG COG
T∗•SL T∗•SL
E
G
E
I
C
D
E
H
G
I
@CM Series
Nickel Barrier Terminations
X5R Dielectric
X5R E6 series : Standard, E12 series : Option
∗ Dimentional tolerances (L, W, T) is ±0.15mm for 105X5R334 to 105, 21X5R335 to 475. ±0.2mm for 316X5R685 to106
X7R E6 series : Standard, E12 series : Option
Y5V E3 series : Standard, E6 series : Option
∗ Tolerance (W, T) for CM316Y5V106 is ±0.20mm.
X7R Dielectric
Y5V Dielectric
151 150
220
330
470
680
102 1000
152 1500
2200
3300
4700
6800
103 10000
153 15000
22000
33000
47000
68000
104 100000
154 150000
220000
330000
470000
680000
105 1000000
155 1500000
2200000
3300000
4700000
6800000
106 10000000
16 16 25 50 10 16 25 50
100
10 16 25 50
100 200
10 16 25 50
100 200
10 16 25 50
100 200
16 25 50
100 200
16 25 50
100 200
A
M
AABBBBB
CCCCC
DDDD
D
FFF
F
F
D
DDD
EEE
I
I
D
E
D
E
I
D
G
O
G
G
EE
I
E
GG
G
OG
K
J
J
K
G
J
K
I
K
I
J
I
I
O
E
I
F
4.5±0.3
3.2±0.2
1.6±0.15
1.0±0.05
0.5±0.05 2.0±0.1
1.25±0.1
1.6±0.1
0.8±0.1 3.2±0.2
5.7±0.4
5.0±0.4
3.2±0.2
2.5±0.2
102 1000
2200
472 4700
103 10000
22000
473 47000
104 100000
220000
474 470000
105 1000000
2000000
475 4700000
106 10000000
226 22000000
47000000
107 100000000
6.3 10 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 10 10
A
MM B
C C C
DDD
FFF
C
D
B B B
A A A
2.0±0.1
1.25±0.1 3.2±0.2
1.6±0.15
3.2±0.2
2.5±0.2
1.6±0.1
0.8±0.1
1.0±0.05
0.5±0.05
C
E
I
DC
E
D
D
E
D
E
I I
O
CM03 CM05 CM105 CM21 CM316 CM32 CM43 CM55
(0201) (0402) (0603) (0805) (1206) (1210) (1812)
(2220)
Size (mm)
Rated Voltage (VDC)
Capacitance (pF)
Size (mm)
Rated Voltage (VDC)
Capacitance (pF)
CM03
CM05 CM105 CM21 CM316 CM32 CM43
(0201) (0402) (0603) (0805) (1206) (1210) (1812) CM55
(2220)
I
F
Size (mm)
151 150
220
330
470
680
102 1000
152 1500
2200
3300
4700
6800
103 10000
153 15000
22000
33000
47000
68000
104 100000
154 150000
220000
330000
470000
680000
105 1000000
155 1500000
2200000
3300000
4700000
6800000
106 10000000
156 15000000
22000000
10 16 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 10 16 25 10 25
A
MM AAABBBBB
CCCCC
DDDDD
D
E
I
D
E
I
D
E
I
D
E
I
D
E
O
O
V
H
V
G
FFFF
F
2.0±0.1
1.25±0.1
1.6±0.1
0.8±0.1
3.2±0.2
1.6±0.15
3.2±0.2
2.5±0.2
4.5±0.3
3.2±0.2
1.0±0.05
0.5±0.05
0.0±0.0
0.0±0.0
CM03
CM05 CM105 CM21 CM316 CM32
CM43
(0201)
(0402) (0603) (0805) (1206) (1210)
(1812)
Rated Voltage (VDC)
Capacitance (pF)
O
V
5.7
±0.4
5.0
±0.4
4.5
±0.3
3.2
±0.2
H
V
V
VK
KK
0.0±0.0
0.0
±0.0
KK
∗
∗
∗
∗
∗
∗
∗
∗
∗∗
∗
0.0±0.0
0.0±0.0
∗I
G
@Multilayer Ceramic Chip Capacitors
Electrical Characteristics
10
-10 -60 -40 -20 0 20 40 60 80 100 120
-5
0
5
∆Capacitance(%)
Temperature(°C)
at 1MHz, 1Vrms
C∆
P∆
R∆
S∆
T∆
U∆
Aging
(change of capacitance over time)
Capacitance-Temperature
(temperature compensation)
Impedance-Frequency
Capacitance-Temperature
(high dielectric constant)
Y5U
10
-30
10 100 1,000 100,00010,000
-20
-10
0
∆Capacitance(%)
Duration(hrs)
For temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms
C∆
X7R, X8R
Y5V
∗Initial value should be after 48hr of Heat treatment.
AC Voltage
DC Bias
For temperature compensation at 1MHz, 1Vrms
For high dielectric constant at 1kHz, 1Vrms
Rated at 25V : Y5U
Rated at 25V : C∆, X7R, Y5V
25
-10 12345
0
-5
5
10
15
20
∆Capacitance(%)
AC Voltage(Vrms)
For temperature compensation : 1MHz
1 Vrms/for high dielectric constant : 1kHz
Rated at 25V : Y5U
Rated at 25V : C∆, X7R, Y5V
Y5V X7R
Y5U C∆
Please verify individual characteristics at the design stage to ensure total suitability
20
−100 −60 −40 −20 0 20 40 60 80 100 120 130 140 150
−60
−80
−40
−20
0
∆Capacitance(%)
Temperature(°C)
at 1kHz, 1Vrms
Y5U
at 0VDC X7R at RV/2
X7R at 0VDC
Y5V at 0VDC
Y5V at RV/2
X8R at 0VDC
X8R at RV/2
Y5U, X7R, Y5V, X8R
Y5U at RV/2
20
−1000 5 10 15 20 25
−60
−80
−40
−20
0
∆C/C(%)
VDC
CH
W5R
Y5U
Y5V
100
0.001
0.1 1 10 100 1,000 10,000
0.01
0.1
10
1
Impedance
(
Ω
)
Frequency(MHz)
at 1Vrms
Y5V 10µF
Y5V 100µF
W5R(B)1Y5V 1µF
W5R(B)/Y5V 0.1µF
W5R(B
)
/Y5V 0.01µF
W5R(B)1000pF
CH 1000pF
CH 100pF
CH 10pF
CH 1pF
@Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test conditions and Specification for Temperature Compensation type(C∗ to U∗ • SL characteristics)
Test Items Specification (C: nominal capacitance) Test Conditions
Capacitance Value Within tolerance
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
Insulation resistance (IR) 10,000MΩ or 500MΩ•µF min, whichever is less
Dielectric Resistance No problem observed
Appearance No problem observed Microscope(10×magnification)
Termination strength ∗2 No problem observed
Bending strength ∗2 No mechanical damage at 1mm bent
Vibration Appearance No significant change is detected.
test ∆CWithin tolerance
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
Soldering Appearance No significant change is detected.
heat ∆C±2.5% or ±0.25pF max, whichever is larger.
resistance
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR 10,000MΩ or 500MΩ•µF min, whichever is smaller
Withstand voltage Resists without problem
Solderability Ni/Br termination: 90% min Soak the sample in 230°C±5°C
Ag/Pd termination: 75% min Sn62 solder for 4±1second
Temperature
Appearance No significant change is detected.
cycle
∗4∆C±2.5% or ±0.25pF max, whichever is larger.
QC≥30pF: Q≥1000
C<30pF: Q≥400+20C
IR 10,000MΩ or 500MΩ•µF min, whichever is samller
Withstand voltage Resists without problem
Humidity Appearance No significant change is detected.
test ∗6∆C±7.5% or ±0.75pF max, whichever is larger.
QC≥30pF: Q≥200
C<30pF: Q≥100+10C/3
IR 500MΩ or 25MΩ•µF min, whichever is smaller
High- Appearance No significant change is detected.
temperature ∆C±3% or ±0.3pF max, whichever is larger.
with
C≥30pF: Q≥350
Q10pF≤C<30pF: Q≥275+5C/2
loading
C<10pF: Q≥200+10C
IR 1,000MΩ or 50MΩ•µF min, whichever is smaller
C≤1000pF 1MHz±10% 0.5 to
C>1000pF 1kHz±10% 5Vrms
Order Temperature Time
180 to 100°C 2minutes
2150 to 200°C 2minutes
Measured after the rated voltage is applied for one
minute at normal room temperature and humidity. (∗5)
Apply a sideward force of 500g(5N) to a PCB-mounted
sample.
Glass epoxy PCB (t=1.6mm); fulcrum
Spacing: 90mm; for 10 seconds.
Vibration frequency: 10 to 55(Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/min
In X, Y and Z directions:
2 hours each Total 6 hours
Soak the sample in 270°C±5°C
solder for 10±0.5seconds(∗3)
and place in a room at normal temperature
and humidity; measure after 24±2hours.
(Preheating Conditions)
(Cycle)
Normal room temperature (3min)→
Lowest operation temperature (30min)→
Normal room temperature (3min)→
Highest operation temperature (30min)→
After five cycles(∗4), measure after
24±2hours.
Measure the test sample after storing it
24±2hours at a temperature of 40°C±2°C
and a relative humidity of 90-95% Rh.
for 500+24/−0hours.
After applying(∗1) twice of the rated voltage
at a temperature of 125±3 for
1000+48/−0hours, measure the sample
after storing 24±2hours.
(∗1) Apply 3 times of the rated voltage for 1 to 5 seconds.
∗1 For the CF series, use 1.5 times when the rated voltage is 500V; use a 1.2 times when the rated voltage exceeds 1000V.
The charge and discharge current of the capacitor must not exceed 50mA.
∗2 Except CT series
∗33±0.5 seconds for Silver Palladium terminations.
∗4 1000 cycles for Nickel Barrier termination DN series. (Alumina Substrate)
∗5 For the CF series over 1000V, apply 500V for 1minute at normal room temperature and humidity.
∗6 Exclude capacitors with rated voltage of over 200V.
@Multilayer Ceramic Chip Capacitors
Test Conditions and Standards
Test Items Specification
X7R/X5R Y5U Y5V Test Condition
Capacitance Value Within tolerance Do previous treatment(∗9, ∗15)
tanδ(%) 2.5%max, 3.5%max(∗2) 5.0%max(∗12)
5.0%max, 7.0%max(∗14)
0.4%max(∗13), 5.0%max(∗3) 9.0%max(∗4), 12.5%max(∗5)
Insulation resistance (IR) 10,000MΩ or 500MΩ•µF max, whichever is less
Dielectric Resistance ∗1 No problem observed
Appearance No problem observed Microscope(10×magnification)
Termination strength ∗6 No problem observed
Bending strength test ∗6 No problem observed at 1mm bent
Vibration Appearance No significant change is detected.
test ∆CWithin tolerance
tanδ(%) Satisfies the initial value.
Soldering Appearance No significant change is detected.
heat ∆CWithin ±7.5% Within ±20% Within ±20%
resistance
tanδ(%) Satisfies the initial value.
IR 10,000MΩ or 500MΩ•µF max, whichever is smaller
Withstand voltage Resists without problem
Solderability Ni/Br termination: 90% min Soak the sample in 230°C±5°C
Ag/Pd termination: 75%min Sn62 solder for 4±1second
Temperature
Appearance No significant change is detected.
cycle
∗8∆CWithin ±7.5% Within ±20% Within ±20%
tanδ(%) Satisfies the initial value.
IR 10,000MΩ or 500MΩ•µF max, whichever is smaller
Withstand voltage Resists without problem
Humidity Appearance No significant change is detected.
test∗12 ∆CWithin ±12.5% Within ±30% Within ±30%
tanδ(%) 200% max of 150% max of
initial value initial value
IR 500MΩ or 25MΩ•µF max, whichever is smaller
High- Appearance No significant change is detected.
temperature ∆CWithin ±12.5% Within ±30% Within ±30%
with
tanδ(%) 200% max of 150% max of
initial value initial value
loading
IR 1,000MΩ or 50MΩ•µF max, whichever is smaller
Order Temperature Time
180 to 100°C 2minutes
2150 to 200°C 2minutes
Capacitance Fire Vol
C≤10µF 1kHz±10% 1.0±0.1Vrms
C>10µF 120Hz±10% 0.5±0.1Vrms
Measured after the rated voltage is applied for 2minutes
at normal room temperature and humidity. (∗11)
Apply a sideward force of 500g(5N) to a PCB-mounted
sample.
Glass epoxy PCB (t=1.6mm); fulcrum
Spacing: 90mm; for 10 seconds.
Vibration frequency: 10 to 55(Hz)
Amplitude: 1.5mm
Sweeping condition: 10→55→10Hz/min
In X, Y and Z directions:
2 hours each Total 6 hours
Do previous treatment(∗9)
Soak the sample in 270°C±5°C
solder for 10±0.5seconds(∗7)
and place in a room at normal temperature
and humidity; measure after 48±4hours.
(Preheating Conditions)
Do previous treatment(∗9)
(Cycle)
Normal room temperature (3min)→
Lowest operation temperature (30min)→
Normal room temperature (3min)→
Highest operation temperature (30min)→
After five cycles(∗8), measure after
48±4hours.
Do previous treatment(∗10)
After storing it at a temperature of
40°C±2°C and a relative humidity of
90-95% for 500+24/−0hours, measure
the sample after storing 48±4hours.
Do previous treatment(∗10)
After applying twice (∗1) of the rated
voltage at the highest operating temperature
for 1000+48/−0hours, measure the sample
after storing 48±4hours.
(∗1) Apply 2.5 times of the rated voltage for 1 to 5 seconds.
Test conditions and Specification for High Dielectric Type (X5R, X7R, Y5V & Y5U)
initial value
*1 For CF series, use 1.5 times when the rated voltage is 250V and 500V; Use 1.2 times when the rated voltage
exceeds 630V. The charge/discharge current of the capacitor must not exceed 50mA.
*2
Apply to X5R 16V/25V type, X7R 10V/16V type, CM316X7R564 to 105(25V type).
*3 Apply to X5R 6.3V/10V type, CT05X7R123 to 223(10V type),X7R 6.3V type.
*4 Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type). Except 12.5% for CT21Y5V105/16V.
*5 Apply to Y5V 6.3V/10V type.
*6 Exclude CT series with thickness of less than 0.66mm.
*7 3±0.5 sec. for AgPd termination.
*8 1000 cycles for Nickel Barrier termination DN/DR series. (Alumina Substrate)
*9 Keep specimen at 150°C+0/−10°C for one hour, leave specimen at room ambient for 48±4 hours.
*10 Apply the same test condition for one hour, then leave the specimen at room ambient for 48±4 hours.
*11 For the CF series over 1000V, apply 500V for 1 minutes at room ambient.
*12 Exclude capacitors with rated voltage of over 200V.
*13 apply to CD series.
*14 Apply to 25V series of CM105 Y5V 154 over, CM21Y5V105 over, 316Y5V155 over.
*15 Measurement condition 1kHz, 1Vrms for Y5V, C < 47µF type.
@Multilayer Ceramic Chip Capacitors
Dimensions
Tape & Reel
Dimensions
•CX43 Type L : 4.7±0.4mm
•CT21, CT316 : (L) 3.2±0.2mm and (W)1.6±0.2mm
•T (Thickness) depends on capacitance value.
Standard thickness is shown on the appropriate product pages.
•DR series 105, 21 size (L)(W)(T) Tolerance ±0.15mm
•CA series (please refer product specifications)
Bulk Cassette
Size EIA CODE EIAJ CODE Dimensions (mm)
L W P min P max P to P min T max
03
05
105
21
316
32
42
43
52
55
0201 0603 0.6±0.03 0.3±0.03 0.10 0.20 0.20 0.33
0402 1005 1.0±0.05 0.5±0.05 0.10 0.35 0.30 0.55
0603 1608 1.6±0.10 0.8±0.10 0.20 0.60 0.50 0.90
0805 2012 2.0±0.10 1.25±0.10 0.20 0.75 0.70 1.35
1206 3216 3.2±0.20 1.60±0.15 0.30 0.85 1.40 1.80
1210 3225 3.2±0.20 2.50±0.20 0.30 1.00 1.40 2.70
1808 4520 4.5±0.30 2.00±0.20 0.15 0.85 2.00 2.20
1812 4532 4.5±0.30 3.20±0.20 0.30 1.10 2.00 2.70
2208 5720 5.7±0.40 2.00±0.20 0.15 0.85 4.20 2.20
2220 5750 5.7±0.40 5.00±0.40 0.30 1.40 2.50 2.80
External
Terminations
Electrode
External Dimensions
P
P
T
W
L
P~P
Size (mm) L W T P P to P
min max min
0603
0805
1206
1.6±0.07 0.8±0.07 0.8±0.07 0.10 0.60 0.50
2.0±0.1 1.25±0.1 0.6±0.1/1.25±0.1 0.25 0.75 0.80
3.2±0.1 1.6±0.1 0.6±0.1 0.25 0.85 1.50
@Multilayer Ceramic Chip Capacitors
Packaging Options
Tape and Reel
• Reel Reel (code : T)
Carrier Tape
Bulk Cassette
Package Quantity
A
R
EC
D
W
1
W
2
B
(Unit : mm)
(Unit : mm)
∗Carrier tape width 8mm. For size 42(1808) or over, Tape width 12mm and W1 : 14±1.5,
W2 : 20.5mm max
• Carrier tape
(Paper Carrier Tape)
• Package quantity (Shown on the appropriate product pages.)
Feed Hole Punched rectangular
hole to hold capacitor
1.1max
J
FHG
D
C
E
A
B
Feed Hole Rectangular hole to
accept capacitor
0.6max
2.8max
max 5°
J
FHG
D
C
E
A
B
(Plastic Carrier Tape)
(Unit : mm)
∗CM05 is optional
Slider
Shutter
Connection Area
110
36
12
Code
Type AB
Code
Reel
7-inch Reel
(CODE : T, H)
13-inch Reel
(CODE : L, N)
Code
Reel
7-inch Reel
(CODE : T, H)
13-inch Reel
(CODE : L, N)
ABCD
178±2.0 φ60min 13±0.5 21±0.8
330±2.0 φ100±1.0
EW
1W2R
10.0±1.5
2.0±0.5 16.5max 1.0
9.5±1.0
Code
Carrier Tape
Paper 8mm
Plastic 8mm
12mm
Code
Carrier Tape
Paper 8mm
Plastic 8mm
12mm
CDE F
∗
8.0±0.3 3.5±0.05 1.75±0.1 4.0±0.1
12.0±0.3 5.5±0.05 8.0±0.1
GHJ
2.0±0.05 4.0±0.1 1.5+0.1
−0
∗For 03, 05type, F : 2.0±0.05mm For 42type, 52type F : 4.0±0.1mm
∗For CX type, B : 5.2±0.2mm
Type Thickness (mm) Quantity per case
(pcs)
05 0.5 50,000
105 0.8 15,000
21 0.6 10,000
1.25 5,000
03 (0.6×0.3) 0.37±0.03 0.67±0.03
05 (1.0×0.5) 0.65±0.1 1.15±0.1
105 (1.6×0.8) 1.0±0.2 1.8±0.2
12 (2.0×1.25) 1.5±0.2 2.3±0.2
13 (3.2×1.6) 2.0±0.2 3.6±0.2
21 (2.0×1.25) 1.50±0.2 2.3±0.2
316 (3.2×1.6) 2.0±0.2 3.6±0.2
32 (3.2×2.5) 2.9±0.2 3.6±0.2
42 (4.5×2.0) 2.4±0.2 4.9±0.2
43 (4.5×3.2) 3.6±0.2 4.9±0.2∗
52 (5.7×2.0) 2.4±0.2 6.0±0.2
55 (5.7×5.0) 5.3±0.2 6.0±0.2
(Unit : mm)
@Multilayer Ceramic Chip Capacitors
Precautions
Circuit Design
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance
which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause
a short, open, smoking, or flaming to occur, etc.
2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical
devices; devices which are highly public orientated; and devices which demand a high standard of liability.
Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave
consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability
design different from that of general purpose capacitors.
3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications.
Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and
specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur.
The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this
effect becomes especially pronounced in high frequency circuits, please exercise caution.
When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for
usage. Also, please make certain temperature rises remain below 20ºC.
4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the
rated voltage when AC voltage is super-imposed to the DC voltage.
In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage.
Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations,
may cause the capacitor to smoke or flame.
5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage,
even though it is within the rated voltage, please inquire to the manufacturer.
In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is
within the rated voltage, it is possible capacitor reliability will deteriorate.
6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.
Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load
voltage at the time of operation.
7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in
the catalog and specifications.
In addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to Voltage
change. Please contact sales in such case.
8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective
product in order that the assembled product function appropriately.
Storage
1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has
been opened, reseal it or store it in a desiccator.
2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH.
3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is
exposed to such atmospheres, the terminals will oxidize and solderability will be effected.
4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases.
5. The solderability is assured for 12 months from our final inspection date (six months for silver palladium) if the above storage precautions are
followed.
6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.
@Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Dimensions for recommended typical land
Typical mounting problems
Ideal Solder Thickness
DN/DR Automotire Series
(Unit : mm)
When mounting the capacitor to the substrate, it is important to
consider carefully that the amount of solder (size of fillet) used has a
direct effect upon the capacitor once it is mounted.
a) The greater the amount of solder, the greater the stress to the
elements. As this may cause the substrate to break or crack, it is
important to establish the appropriate dimensions with regard to the
amount of solder when designing the land of the substrate.
b) In the situation where two or more devices are mounted onto a
common land, separate the device into exclusive pads by using
soldering resist
Land Pattern
Sample capacitor
Soldering resist
ba
c
Size L×Wabc
03 0.6×0.3 0.15 to 0.35 0.20 to 0.30 0.25 to 0.35
05 1.0×0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60
105 1.6×0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80
21 2.0×1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10
316 3.2×1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30
32 3.2×2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30
42 4.5×2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80
43 4.5×3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00
52 5.7×2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80
55 5.7×5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70
;;;
;;
;
Chip Capacitor
PCB
Solder
T/3 to T/2
T
Item Poor example Recommended example/Separated by solder resist
Multiple parts mount
Mount with
leaded parts
Wire soldering
after mounting
Overview
Solder resist
Leaded parts Leaded parts
Solder resist
Soldering iron
Wire Solder resist
Solder resist Solder resist
∗ CA series : Please refer product specifications.
Size L×Wabc
105 1.6×0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00
21 2.0×1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40
316 3.2×1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80
(Unit : mm)
@Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Mounting Design
Recommended chip position on PCB to minimize stress from PCB warpage
The chip could crack if the PCB warps during processing after the chip has been soldered.
Actual Mounting
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize warpage of the PCB from the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
4) When the positioning hook begins to wear, unstable force may be applied to the chip, resulting in cracking.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips.
Resin Mold
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low
shrinkage resin.
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such
gases may crack the chip capacitor or damage the device itself.
(Not recommended) (Ideal)
Crack
Support pin
@Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat
shock is unavoidable, limit the temperature difference (∆T) to within
130°C.
2) Please see our recommended soldering conditions.
Special Precautions for Using Soldering Irons
Preheat the capacitors to approx. 150°C.
Solder quickly on a hot plate using a soldering iron adjusted to 250 to
280°C.
Recommendable Temperature Profile
Reflow
Wave
Solding Iron
300
250
200
150
100
50
0
60 to 120sec. 3sec. max
Cool at normal
room temperature
∆T
300
250
200
150
100
50
0
Preheat
60seconds
Temperature Temperature
Peak temperature
230°C±5°C
15seconds maximum
60seconds
More than180°C,
40seconds maximum
Cool at normal room
temperature after
removing from
furnace.
Preheat
230°C
to
260°C
300
250
200
150
100
50
0
60 to 120sec. 3sec. max
Cooling
∆T
Temperature
Preheat
250°C
to
280°C
qIf a chip capacitor smaller than type CM316 is used with a wave soldering tank, use the Nickel-barrier
type to minimize solder leaching. This may not be necessary with a static soldering tank.)
wEnsure that the chip capacitor is preheated adequately.
eEnsure that the temperature difference (∆T) does not exceed 130°C.
rCooling after soldering should be as slow as possible.
Minimize soldering time.
Do not place the soldering iron on the chip.
PCB Mounting Precautions
If the PCB becomes excessively bent either before or after mounting of
the chip capacitor, the chip capacitor may crack or chip. Take
precautions to reduce PCB flexure.
