March 2007 Rev 3 1/10
STTH1R02
Ultrafast recovery diode
Main product characteristics
Features and benefits
Very low conduction losses
Negligible switching losses
Low forward and reverse recovery times
High junction temperature
Description
The STTH1R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.
Packaged in DO-41, DO-15, SMA, and SMB, this
device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection.
Order codes
IF(AV) 1.5 A
VRRM 200 V
Tj (max) 175° C
VF (typ) 0.7 V
trr (typ) 15 ns
Part Number Marking
STTH1R02 STTH1R02
STTH1R02RL STTH1R02
STTH1R02A R1A
STTH1R02Q STTH1R02Q
STTH1R02QRL STTH1R02Q
STTH1R02U 1R2S
KA
KK
AA
SMA
STTH1R02A
SMB
STTH1R02U
KK
AA
DO-41
STTH1R02
DO-15
STTH1R02Q
www.st.com
Characteristics STTH1R02
2/10
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.68 x IF(AV) + 0.08 IF2(RMS)
Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 200 V
IFRM Repetitive peak forward current
DO-41(1)
tp = 5 µs, F = 5 kHz
30 ADO-15(1)
SMA / SMB
IF(RMS) RMS forward current DO-41 / DO-15 50 A
SMA /SMB
IF(AV) Average forward current, δ = 0.5
DO-41 Tlead = 110° C
1.5 A
DO-15 Tlead = 110° C
SMA Tc = 110° C
SMB Tc = 110° C
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 60 A
Tstg Storage temperature range -65 to + 175 °C
TjMaximum operating junction temperature 175 °C
1. On infinite heatsink with 10 mm lead length
Table 2. Thermal parameters
Symbol Parameter Value Unit
Rth(j-l) Junction to lead Lead Length = 10 mm on infinite heatsink DO-41 45
°C/W
DO-15 45
Rth(j-c) Junction to case SMA 30
SMB 30
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
IR(1) Reverse leakage current Tj = 25° C VR = VRRM
3µA
Tj = 125° C 2 20
VF(2) Forward voltage drop
Tj = 25° C IF = 4.5 A 1.2
V
Tj = 25° C
IF = 1.5 A
0.89 1
Tj = 100° C 0.76 0.85
Tj = 150° C 0.70 0.80
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
STTH1R02 Characteristics
3/10
Table 4. Dynamic characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
trr Reverse recovery time
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25° C 23 30
ns
IF = 1 A, dIF/dt = -100 A/µs,
VR = 30 V, Tj = 25° C 15 20
IRM Reverse recovery current IF = 1.5 A, dIF/dt = -200 A/µs,
VR = 160 V, Tj = 125° C 34 A
tfr Forward recovery time IF = 1.5 A, dIF/dt = 100 A/µs
VFR = 1.1 x VFmax, Tj = 25° C 50 ns
VFP Forward recovery voltage IF = 1.5 A, dIF/dt = 100 A/µs,
Tj = 25° C 2.1 V
Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus
forward current (typical values)
0
5
10
15
20
25
30
35
40
45
50
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
I
M
(A)
T
d
=tp/T tp
IM
T
δ
=tp/T tp
IM
P = 2 WP = 2 W
P = 1 WP = 1 W
P = 5 WP = 5 W
δ
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
I
FM
(A)
Tj=25°C
Tj=150°C
VFM(V)
Figure 3. Forward voltage drop versus
forward current (maximum values)
Figure 4. Relative variation of thermal
impedance junction to case versus
pulse duration (SMA)
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
I
FM
(A)
Tj=25°C
Tj=150°C
VFM(V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
SMA
Scu=1cm²
tP(s)
Characteristics STTH1R02
4/10
Figure 5. Relative variation of thermal
impedance junction to case versus
pulse duration (SMB)
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration (DO-41)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
SMB
Scu=1cm²
tP(s)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
DO-41
Lleads=10mm
tP(s)
Figure 7. Relative variation of thermal
impedance junction to case versus
pulse duration (DO-15)
Figure 8. Junction capacitance versus
reverse applied voltage (typical
values)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
DO-15
Leads =10mm
tP(s)
1
10
100
1 10 100 1000
C(pF)
F=1MHz
Vosc=30mVRMS
Tj=25°C
VR(V)
Figure 9. Reverse recovery charges
versus dIF/dt (typical values)
Figure 10. Reverse recovery time versus dIF/dt
(typical values)
0
10
20
30
40
50
60
70
80
10 100 1000
Q
RR
(nC)
IF=1.5A
VR=160V
Tj=125°C
Tj=25°C
dIF/dt(A/µs)
0
10
20
30
40
50
60
70
80
10 100 1000
t
RR
(ns)
IF=1.5A
VR=160V
Tj=125°C
Tj=25°C
dIF/dt(A/µs)
STTH1R02 Characteristics
5/10
Figure 11. Peak reverse recovery curent
versus dIF/dt (typical values)
Figure 12. Dynamic parameters versus
junction temperature
0
1
2
3
4
5
6
7
8
10 100 1000
I
RM
(A)
IF=1.5A
VR=160V
Tj=125°C
Tj=25°C
dIF/dt(A/µs)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100 125 150
Q
RR
;I
RM
[T
j
]/Q
RR
;I
RM
[T
j
=125°C]
IRM
QRR
IF=1.5A
VR=160V
Tj(°C)
Figure 13. Thermal resistance, junction to
ambient, versus copper surface
under each lead - SMA (Epoxy FR4,
copper thickness = 35 µm)
Figure 14. Thermal resistance, junction to
ambient, versus copper surface
under each lead - SMB (Epoxy FR4,
copper thickness = 35 µm)
0
20
40
60
80
100
120
012345
R
th(j-a)
(°C/W)
SMA
SCU(cm²)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMB
SCU(cm²)
Figure 15. Thermal resistance, junction to
ambient, versus copper surface
under each lead - DO 15 (Epoxy
FR4, copper thickness = 35 µm)
Figure 16. Thermal resistance, junction to
ambient, versus copper surface
under each lead - DO-41 (Epoxy
FR4, copper thickness = 35 µm)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
DO-15
SCU(cm²)
0
10
20
30
40
50
60
70
80
90
100
012345678910
R
th(j-a)
(°C/W)
DO-41
S(cm²)
Ordering information scheme STTH1R02
6/10
2 Ordering information scheme
3 Package information
Epoxy meets UL94, V0
STTH 1 R 02 XX
Ultrafast switching diode
Average forward current
1 = 1 A
02 = 200 V
Blank = DO-41 in Ammopack
RL = DO-41 in Tape and reel
A = SMA in Tape and reel
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
U = SMB in Tape and reel
Model R
Repetitive peak reverse voltage
Package
Table 5. DO-41 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.1 5.20 0.160 0.205
B 2 2.71 0.080 0.107
C25.4 1
D 0.712 0.863 0.028 0.034
Table 6. DO-15 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266
B 2.95 3.53 0.116 0.139
C 26 31 1.024 1.220
D 0.71 0.88 0.028 0.035
ØD ØB
A
CC
D
B
A
CC
STTH1R02 Package information
7/10
Figure 17. SMA footprint (dimensions in mm)
Table 7. SMA dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.03 0.075 0.080
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.41 0.006 0.016
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
D 2.25 2.95 0.089 0.116
L 0.75 1.60 0.030 0.063
1.67
4.94
1.73 1.48 1.73
Package information STTH1R02
8/10
Figure 18. SMB footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 8. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.41 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.60 0.030 0.063
E
C
L
E1
D
A1
A2
b
1.64
6.10
2.23
2.30
2.23
STTH1R02 Ordering information
9/10
4 Ordering information
5 Revision history
Part Number Marking Package Weight Base qty Delivery mode
STTH1R02 STTH1R02 DO-41 0.34 g 2000 Ammopack
STTH1R02RL STTH1R02 DO-41 0.34 g 5000 Tape and reel
STTH1R02A R1A SMA 0.068 g 5000 Tape and reel
STTH1R02Q STTH1R02Q DO-15 0.49 g 1000 Ammopack
STTH1R02QRL STTH1R02Q DO-15 0.49 g 6000 Tape and reel
STTH1R02U 1R2S SMB 0.11 g 2500 Tape and reel
Date Revision Description of changes
03-May-2006 1 First issue
13-Oct-2006 2 Added DO-15 and SMB packages.
08-Mar-2007 3 Replaced Figure 8. Replaced ecu with copper thickness.
STTH1R02
10/10
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com