SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 D D D D D D D D D D TLV2460 DBV PACKAGE (TOP VIEW) Rail-to-Rail Output Swing Gain Bandwidth Product . . . 6.4 MHz 80 mA Output Drive Capability Supply Current . . . 500 A/channel Input Offset Voltage . . . 100 V Input Noise Voltage . . . 11 nV/Hz Slew Rate . . . 1.6 V/s Micropower Shutdown Mode (TLV2460/3/5) . . . 0.3 A/Channel Universal Operational Amplifier EVM Available in Q-Temp Automotive HighRel Automotive Applications Configuration Control/Print Support Qualification to Automotive Standards OUT 1 6 VDD+ GND 2 5 SHDN IN+ 3 4 IN - description The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for portable applications. The input common-mode voltage range extends beyond the supply rails for maximum dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters. The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/s of slew rate with only 500 A of supply current, providing good ac performance with low power consumption. Three members of the family offer a shutdown terminal, which places the amplifier in an ultralow supply current mode (IDD = 0.3 A/ch). While in shutdown, the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with an input noise voltage of 11 nV/Hz and input offset voltage of 100 V. This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for high-density circuits. The family is specified over an expanded temperature range (TA = - 40C to 125C) for use in industrial control and automotive systems, and over the military temperature range (TA = -55C to 125C) for use in military systems. SELECTION GUIDE DEVICE VDD [V] VIO [V] IDD/ch [A] IIB [pA] GBW [MHz] SLEW RATE [V/s] Vn, 1 kHz [nV/Hz] IO [mA] SHUTDOWN RAIL-RAIL TLV246x(A) 2.7-6 150 550 1300 6.4 1.6 11 25 Y I/O TLV277x(A) 2.5-5.5 360 1000 2 5.1 10.5 17 6 Y O TLV247x(A) 2.7-6 250 600 2.5 2.8 1.5 15 20 Y I/O TLV245x(A) 2.7-6 20 23 500 0.22 0.11 52 10 Y I/O TLV225x(A) 2.7-8 200 35 1 0.2 0.12 19 3 -- -- TLV226x(A) 2.7-8 300 200 1 0.71 0.55 12 3 -- -- Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1998-2004, Texas Instruments Incorporated !"#$%&'#! ( )*$$+!' &( #" ,*-.)&'#! /&'+0 $#/*)'( )#!"#$% '# (,+)")&'#!( ,+$ '1+ '+$%( #" + &( !('$*%+!'( ('&!/&$/ 2&$$&!'30 $#/*)'#! ,$#)+((!4 /#+( !#' !+)+((&$.3 !).*/+ '+('!4 #" &.. ,&$&%+'+$(0 ! ,$#/*)'( )#%,.&!' '# 5 &.. ,&$&%+'+$( &$+ '+('+/ *!.+(( #'1+$2(+ !#'+/0 ! &.. #'1+$ ,$#/*)'( ,$#/*)'#! ,$#)+((!4 /#+( !#' !+)+((&$.3 !).*/+ '+('!4 #" &.. ,&$&%+'+$(0 WWW.TI.COM 1 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS PACKAGED DEVICES SOT-23 SYMBOL (DBV) TA VIOmax AT 25C 0C to 70C 2000 V TLV2460CD TLV2461CD TLV2460CDBV TLV2461CDBV VAOC VAPC TLV2460CP TLV2461CP 2000 V TLV2460ID TLV2461ID TLV2460IDBV TLV2461IDBV VAOI VAPI TLV2460IP TLV2461IP 1500 V TLV2460AID TLV2461AID SMALL OUTLINE (D) -40C to 125C -- -- PLASTIC DIP (P) -- -- TLV2460AIP TLV2461AIP This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR). Chip forms are tested at TA = 25C only. TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) 2000 V 1500 V -40C to 125C SMALL OUTLINE (PW) CERAMIC DIP (JG) CERAMIC FLATPACK (U) CHIP CARRIER (FK) TLV2460QD TLV2461QD TLV2460QPW TLV2461QPW -- -- -- -- -- -- TLV2460AQD TLV2461AQD TLV2460AQPW TLV2461AQPW -- -- -- -- -- -- 2000 V -- -- -- -- TLV2460MJG TLV2461MJG TLV2460MU TLV2461MU TLV2460MFK TLV2461MFK 1500 V -- -- -- -- TLV2460AMJG TLV2461AMJG TLV2460AMU TLV2461AMU TLV2460AMFK TLV2461AMFK -55C to 125C This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460QDR). TLV2462C/I/AI and TLV2463C/I/AI AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) MSOP (DGK) 0C to 70C 2000 V TLV2462CD TLV2463CD TLV2462CDGK -- 2000 V TLV2462ID TLV2463ID 1500 V TLV2462AID TLV2463AID -40 C to -40C 125C MSOP (DGS) SYMBOL PLASTIC DIP (N) PLASTIC DIP (P) xxTIAAI -- TLV2463CDGS -- xxTIAAK -- TLV2463CN TLV2462CP -- TLV2462IDGK -- xxTIAAJ -- TLV2463IDGS -- xxTIAAL -- TLV2463IN TLV2462IP -- -- -- -- -- -- -- -- -- -- TLV2463AIN TLV2462AIP -- SYMBOL This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462CDR). Chip forms are tested at TA = 25C only. 2 WWW.TI.COM SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) SMALL OUTLINE (PW) CERAMIC DIP (JG) CERAMIC DIP (J) CERAMIC FLATPACK (U) CHIP CARRIER (FK) 2000 V TLV2462QD TLV2463QD TLV2462QPW TLV2463QPW -- -- -- -- -- -- -- -- 1500 V TLV2462AQD TLV2463AQD TLV2462AQPW TLV2463AQPW -- -- -- -- -- -- -- -- -40C to 125C 2000 V -- -- -- -- TLV2462MJG -- -- TLV2463MJ TLV2462MU TLV2462MFK TLV2463MFK 1500 V -- -- -- -- TLV2462AMJG -- -- TLV2463AMJ TLV2462AMU TLV2462AMFK TLV2463AMFK -55C to 125C This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR). TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C 0C to 70C 2000 V TLV2464CD TLV2465CD TLV2464CN TLV2465CN TLV2464CPW TLV2465CPW 2000 V TLV2464ID TLV2465ID TLV2464IN TLV2465IN TLV2464IPW TLV2465IPW 1500 V TLV2464AID TLV2465AID TLV2464AIN TLV2465AIN TLV2464AIPW TLV2465AIPW -40C to 125C SMALL OUTLINE (D) PLASTIC DIP (N) TSSOP (PW) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number(e.g., TLV2464CDR). Chip forms are tested at TA = 25C only. TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25C SMALL OUTLINE (D) 2000 V 1500 V - 40C to 125C SMALL OUTLINE (PW) CERAMIC DIP (J) CHIP CARRIER (FK) TLV2464QD TLV2465QD TLV2464QPW TLV2465QPW -- -- -- -- TLV2464AQD TLV2465AQD TLV2464AQPW TLV2465AQPW -- -- -- -- 2000 V -- -- -- -- TLV2464MJ TLV2465MJ TLV2464MFK TLV2465MFK 1500 V -- -- -- -- TLV2464AMJ TLV2465AMJ TLV2464AMFK TLV2465AMFK -55C to 125C This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2464QDR). WWW.TI.COM 3 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TLV246x PACKAGE PINOUTS(1) TLV2460 DBV PACKAGE (TOP VIEW) OUT GND IN+ 1 2 3 6 5 4 VDD+ SHDN IN - TLV2461 D, P, JG, OR PW PACKAGE (TOP VIEW) NC IN - IN + GND 1 8 2 7 3 6 4 5 TLV2460 D, P, JG, OR PW PACKAGE (TOP VIEW) TLV2461 DBV PACKAGE (TOP VIEW) NC VDD+ OUT NC OUT GND IN+ 1 5 VDD+ 2 3 4 IN - NC IN - IN + GND 1 8 2 7 3 6 4 5 VDD+ 2OUT 2IN - 2IN+ 7 3 6 4 5 SHDN VDD+ OUT NC 1OUT 1IN - 1IN+ GND 1SHDN 1 2 3 4 5 10 9 8 7 6 VDD+ 2OUT 2IN - 2IN+ 2SHDN TLV2463 D, N, J, OR PW PACKAGE TLV2464 D, N, PWP, J, OR PW PACKAGE TLV2465 D, N, PWP, J, OR PW PACKAGE (TOP VIEW) (TOP VIEW) (TOP VIEW) 1OUT 1IN - 1IN+ GND NC 1SHDN NC 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VDD+ 2OUT 2IN - 2IN+ NC 2SHDN NC 1OUT 1IN - 1IN+ VDD+ 2IN+ 2IN - 2OUT 1 14 2 13 3 4 5 12 11 10 6 9 7 8 4OUT 4IN - 4IN+ GND 3IN+ 3IN - 3OUT 1OUT 1IN - 1IN+ VDD+ 2IN+ 2IN - 2OUT 1/2SHDN NC - No internal connection (1) SOT-23 may or may not be indicated TYPICAL PIN 1 INDICATORS Pin 1 Printed or Molded Dot 4 8 2 TLV2463 DGS PACKAGE (TOP VIEW) TLV2462 D, DGK, P, JG, OR PW PACKAGE (TOP VIEW) 1OUT 1IN - 1IN + GND 1 Pin 1 Stripe Pin 1 Bevel Edges WWW.TI.COM Pin 1 Molded "U" Shape 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 4OUT 4IN - 4IN+ GND 3IN + 3IN- 3OUT 3/4SHDN SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TLV246x PACKAGE PINOUTS (continued)(1) TLV2461 U PACKAGE (TOP VIEW) 5 17 VDD IN- 5 17 VDD NC 6 16 NC NC 6 16 NC IN+ 7 15 OUT IN+ 7 NC 8 14 NC NC 8 1IN+ 4 18 2IN- NC 5 17 NC GND 6 16 2IN+ 2OUT 18 2IN- NC 5 17 NC GND 6 16 2IN+ 15 OUT NC 7 15 NC 14 NC NC 8 14 NC 10 11 12 13 NC NC NC NC NC 20 19 4 18 4IN+ NC 5 17 NC VDD+ 6 16 GND 4OUT 1 NC 2 1IN+ 1OUT 3 4IN- 4OUT 20 19 4 TLV2465 FK PACKAGE (TOP VIEW) NC V DD 1 20 19 9 1OUT NC 2 1 10 11 12 13 1IN- 1OUT 3 2 TLV2464 FK PACKAGE (TOP VIEW) 2OUT 1IN- TLV2463 FK PACKAGE (TOP VIEW) 3 1IN+ GND NC 9 NC 10 11 12 13 NC NC 9 NC IN- GND 4 18 NC V DD 20 19 NC 1 NC NC 2 18 NC 1OUT 3 NC VDD+ 2OUT 2IN- 2IN+ 1IN- NC 20 19 NC SHDN 1 NC NC 2 NC NC 3 10 9 8 7 6 TLV2462 FK PACKAGE (TOP VIEW) 4 3 2 1 20 19 1IN+ 4 18 4IN+ VDD+ 5 17 GND NC 6 16 NC 7 15 3IN+ 8 14 3IN- 8 14 NC 2IN+ 8 14 3IN+ 2IN- 3OUT 3/4SHDN 10 11 12 13 3OUT 9 NC 10 11 12 13 2SHDN 9 NC 10 11 12 13 NC 9 1/2SHDN NC 2OUT 15 NC 3IN- 7 2OUT NC 2IN- 15 NC NC 7 1SHDN NC 2IN+ NC NC 1 2 3 4 5 NC NC NC 1OUT VDD 1IN- OUTPUT 1IN+ NC GND TLV2461 FK PACKAGE (TOP VIEW) NC NC TLV2460 FK PACKAGE (TOP VIEW) 10 9 8 7 6 4IN- 1 2 3 4 5 NC NC IN- IN+ GND NC NC SHDN VDD OUTPUT NC 1IN- 10 9 8 7 6 NC 1 2 3 4 5 NC NC IN- IN+ GND TLV2462 U PACKAGE (TOP VIEW) NC TLV2460 U PACKAGE (TOP VIEW) NC - No internal connection (1) SOT-23 may or may not be indicated WWW.TI.COM 5 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.2 V to VDD + 0.2 V Input current, II (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 mA Total input current, II (into VDD +) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 mA Total output current, IO (out of GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 mA Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C I and Q suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to 125C M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 125C Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values, except differential voltages, are with respect to GND. DISSIPATION RATING TABLE FOR C and I SUFFIX PACKAGE JC (C/W) JA (C/W) TA 25C 25 C POWER RATING TA < 125 125C C POWER RATING D (8) 38.3 176 710 mW 142 mW D (14) 26.9 122.6 1022 mW 204.4 mW D (16) 25.7 114.7 1090 mW 218 mW DBV (5) 55 324.1 385 mW 77.1 mW DBV (6) 55 294.3 425 mW 84.9 mW DGK 54.2 259.9 481 mW 96.2 mW DGS 54.1 257.7 485 mW 97 mW N (14, 16) 32 78 1600 mW 320.5 mW P (8) 41 104 1200 mW 240.4 mW PW (14) 29.3 173.6 720 mW 144 mW PW (16) 28.7 161.4 774 mW 154.9 mW NOTE: Thermal resistances are not production tested and are for informational purposes only. DISSIPATION RATING TABLE FOR Q and M SUFFIX PACKAGE TA 25C 25 C POWER RATING DERATING FACTOR ABOVE TA = 25C TA = 70 70C C POWER RATING FK 1375 mW 11.0 mW/C 880 mW 715 mW 275 mW JG 1050 mW 8.4 mW/C 672 mW 546 mW 210 mW TA = 85 85C C POWER RATING TA = 125 125C C POWER RATING U 675 mW 5.4 mW/C 432 mW 350 mW 135 mW This is the inverse of the traditional junction-to-ambient thermal resistance (RJA). Thermal resistances are not production tested and are for informational purposes only. 6 WWW.TI.COM SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 recommended operating conditions MIN Single supply Supply voltage, VDD Split supply 2.7 6 3 0 V C C 0 VDD 70 I-suffix and Q-suffix -40 125 M-suffix -55 125 C-suffix VIH VIL Shutdown on/off voltage level UNIT 1.35 Common-mode input voltage range, VICR Operating free-air temperature, TA MAX 2 0.7 V V Relative to voltage on the GND terminal of the device. electrical characteristics at specified free-air temperature, VDD = 3 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN 25C VIO VIO Input offset voltage VDD = 3 V, VIC = 1.5 V, VO = 1.5 V, RS = 50 IIB Input bias current TLV246xA 500 Full range VDD = 3 V, VIC = 1.5 V, VO = 1.5 V, RS = 50 2.8 Full range 20 Full range 75 25C 4.4 Full range 25 TLV246xI/Q/M Full range 75 High-level output voltage VIC = 1.5 V, IOL = 2.5 mA Low-level output voltage 2.9 IOL = 10 mA 2.5 0.1 Full range 0.2 Full range Full range Short-circuit output current 0.5 AVD Output current Large-signal differential voltage amplification 50 20 25C Sinking Full range Measured 1 V from rail RL = 10 k k, VO(PP) = 1 V 40 mA 20 40 25C 25C 90 Full range 89 mA 105 ri(d) Differential input resistance 25C 109 Full range is 0C to 70C for the C suffix, -40C to 125C for the I and Q suffixes, and -55C to 125C for the M suffix. WWW.TI.COM V 0.3 25C Sourcing V 2.7 25C VIC = 1.5 V, nA 2.8 25C Full range nA 14 TLV246xC 25C IO V/C TLV246xI/Q/M Full range V V 7 TLV246xC IOH = - 10 mA IOS 1500 UNIT 1700 25C VOL 2000 2 IOH = - 2.5 mA VOH 500 2200 25C Temperature coefficient of input offset voltage Input offset current MAX Full range 25C IIO TYP dB 7 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 electrical characteristics at specified free-air temperature, VDD = 3 V (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS ci(c) Common-mode input capacitance f = 10 kHz zo Closed-loop output impedance f = 100 kHz, CMRR kSVR Common-mode rejection ratio Supply voltage rejection ratio ((V VDD //V VIO) TA MIN TYP 25C AV = 10 25C 25C 66 VICR = 0 to 3 V, RS = 50 TLV246xC Full range 64 TLV246xI/Q/M Full range 60 VDD = 2.7 V to 6 V, No load VIC = VDD /2, VDD = 3 V to 5 V, No load VIC = VDD /2, 25C 80 Full range 75 25C 85 Full range 80 25C IDD Supply current (per channels) VO = 1.5 V, No load IDD(SHDN) Supply current in shutdown (TLV2460, TLV2463, TLV2465) SHDN < 0.7 V, Per channel in shutdown MAX 7 pF 33 80 dB 85 dB 95 0.5 Full range 0.575 0.9 25C UNIT 0.3 Full range 2.5 mA A A Full range is 0C to 70C for the C suffix, -40C to 125C for the I and Q suffixes, and -55C to 125C for the M suffix. operating characteristics at specified free-air temperature, VDD = 3 V (unless otherwise noted) PARAMETER SR Slew rate at unity gain Vn Equivalent input noise voltage In Equivalent input noise current THD + N t(on) Total harmonic distortion plus noise Amplifier turnon time TEST CONDITIONS VO(PP) = 0.8 V, RL = 10 k CL = 160 pF, TA 25C Full range Amplifier turnoff time ts m Settling time 1.6 16 25C 11 f = 1 kHz 25C VO(PP) = 2 V, RL = 10 k, f = 1 kHz AV = 1, RL = 10 k AV = 1 AV = 10 AV = 1, RL = 10 k Channel 1 only, Channel 2 on f = 10 kHz, CL = 160 pF RL = 10 k, 0.13 25C 25 C pA /Hz 0.08% 7.6 25C 7.65 s 333 25C 25 C 328 ns 329 25C 5.2 V(STEP)PP = 2 V, AV = -1, CL = 10 pF, RL = 10 k 0.1% V(STEP)PP = 2 V, AV = -1, CL = 56 pF, RL = 10 k 0.1% 1.77 0.01% 1.98 RL = 10 k, CL = 160 pF WWW.TI.COM nV/Hz 0.02% MHz 1.47 0.01% 1.78 25C 25C 44 25C 7 Full range is 0C to 70C for the C suffix, -40C to 125C for the I and Q suffixes, and -55C to 125C for the M suffix. 8 UNIT 0.006% AV = 100 Both channels Channel 1 only, Channel 2 on MAX V/s 0.8 25C Phase margin at unity gain Gain margin 0.9 f = 1 kHz Channel 2 only, Channel 1 on Gain-bandwidth product TYP f = 100 Hz Both channels t(off) MIN ss dB SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 electrical characteristics at specified free-air temperature, VDD = 5 V (unless otherwise noted) PARAMETER VIO VIO IIO IIB Input offset voltage Temperature coefficient of input offset voltage Input offset current Input bias current TEST CONDITIONS TA 25C MIN VDD = 5 V, VIC = 2.5, VO = 2.5 V, RS = 50 25C TLV246xA VDD = 5 V, VIC = 2.5 V, VO = 2.5 V, RS = 50 500 Full range 25C 2 25C 0.3 15 Full range 60 TLV246xC Full range 30 TLV246xI/Q/M Full range 60 High-level output voltage 1.3 Full range IOL = 2.5 mA Low-level output voltage 4.7 0.1 Full range 0.2 Short-circuit output current 0.3 Output current VIC = 2.5 V, VO = 1 V to 4 V 92 Full range 90 Differential input resistance ci(c) Common-mode input capacitance f = 10 kHz zo Closed-loop output impedance f = 100 kHz, kSVR 80 25C ri(d) Supply voltage rejection ratio ((V VDD //V VIO) 60 25C Large-signal differential voltage amplification Common-mode rejection ratio Full range RL = 10 k, 25C 7 pF 25C 29 25C 71 TLV246xC Full range 69 TLV246xI/Q/M Full range 60 VDD = 2.7 V to 6 V, No load VIC = VDD /2, 25C 80 Full range 75 VDD = 3 V to 5 V, No load VIC = VDD /2, 25C 85 Full range 80 No load, 25C Supply current (per channel) VO = 2.5 V, IDD(SHDN) Supply current in shutdown (TLV2460, TLV2463, TLV2465) SHDN < 0.7 V, Per channels in shutdown dB VICR = 0 V to 5 V, RS = 50 IDD mA 109 109 25C AV = 10 mA 100 Measured at 1 V from rail AVD CMRR 145 60 25C Sinking V 0.2 Full range Full range nA V 4.8 25C Sourcing 14 4.9 25C IOL = 10 mA nA 4.8 25C VIC = 2.5 V, 7 Full range Full range V V V/C V/C TLV246xI/Q/M 25C VIC = 2.5 V, 1500 UNIT 1700 25C IO 2000 TLV246xC IOH = - 10 mA IOS 500 2200 25C VOL MAX Full range IOH = - 2.5 mA VOH TYP 85 dB 85 dB 95 dB 0.55 Full range 25C Full range 0.65 1 1 3 mA A A Full range is 0C to 70C for the C suffix, -40C to 125C for the I and Q suffixes, and -55C to 125C for the M suffix. WWW.TI.COM 9 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 operating characteristics at specified free-air temperature, VDD = 5 V (unless otherwise noted) PARAMETER SR Slew rate at unity gain Vn Equivalent input noise voltage In THD + N t(on) t(off) TEST CONDITIONS VO(PP) = 2 V, RL = 10 k CL = 160 pF, TA 25C Full range 0.9 1.6 14 f = 1 kHz 25C 11 Equivalent input noise current f = 100 Hz 25C 0.13 Total harmonic distortion plus noise VO(PP) = 4 V, RL = 10 k, f = 10 kHz Amplifier turnon time Amplifier turnoff time AV = 1, RL = 10 k AV = 1, RL = 10 k AV = 1 AV = 10 Settling time Gain margin 7.6 25C 25 C 7.65 Both channels 333 25 C 25C 328 f = 10 kHz, CL = 160 pF RL = 10 k, V(STEP)PP = 2 V, AV = -1, CL = 10 pF, RL = 10 k 0.1% V(STEP)PP = 2 V, AV = -1, CL = 56 pF, RL = 10 k 0.1% 3.13 0.01% 3.33 RL = 10 k, CL = 160 pF WWW.TI.COM s ns 329 25C 6.4 MHz 1.53 0.01% 1.83 ss 25C 25C 45 25C 7 Full range is 0C to 70C for the C suffix, -40C to 125C for the I and Q suffixes, and -55C to 125C for the M suffix. 10 pA /Hz 0.04% 7.25 Phase margin at unity gain nV/Hz 0.01% Channel 2 only, Channel 1 on Channel 1 only, Channel 2 on UNIT 0.004% 25C 25 C AV = 100 Both channels Channel 1 only, Channel 2 on MAX V/s 0.8 25C Gain-bandwidth product m TYP f = 100 Hz Channel 2 only, Channel 1 on ts MIN dB SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS Table of Graphs FIGURE VIO IIB Input offset voltage vs Common-mode input voltage 1, 2 Input bias current vs Free-air temperature 3, 4 IIO VOH Input offset current vs Free-air temperature 3, 4 High-level output voltage vs High-level output current 5, 6 VOL VO(PP) Low-level output voltage vs Low-level output current 7, 8 Peak-to-peak output voltage vs Frequency 9, 10 Open-loop gain vs Frequency 11, 12 Phase vs Frequency 11, 12 Differential voltage amplification vs Load resistance 13 Capacitive load vs Load resistance 14 Zo CMRR Output impedance vs Frequency 15, 16 Common-mode rejection ratio vs Frequency 17 kSVR Supply-voltage rejection ratio vs Frequency 18, 19 AVD IDD Supply current vs Supply voltage 20 vs Free-air temperature 21 Amplifier turnon characteristics 22 Amplifier turnoff characteristics 23 Supply current turnon 24 Supply current turnoff SR 25 Shutdown supply current vs Free-air temperature Slew rate vs Supply voltage 26 27 vs Frequency 28, 29 vs Common-mode input voltage 30, 31 Vn Equivalent input noise voltage THD Total harmonic distortion vs Frequency 32, 33 THD+N Total harmonic distortion plus noise vs Peak-to-peak signal amplitude 34, 35 vs Frequency 11, 12 m Phase margin vs Load capacitance 36 vs Free-air temperature 37 vs Supply voltage 38 vs Free-air temperature 39 Gain bandwidth product Large signal follower 40, 41 Small signal follower 42, 43 Inverting large signal 44, 45 Inverting small signal 46, 47 WWW.TI.COM 11 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 1 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0 VDD = 5 V TA = 25C 0.8 VIO - Input Offset Voltage - mV VIO - Input Offset Voltage - mV 0.8 1 VDD = 3 V TA = 25C 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 0.5 1 1.5 2 2.5 -1 3 0 VICR - Common-Mode Input Voltage - V 1 Figure 1 VDD = 3 V VI = 1.5 V 4.5 IIB 4 3.5 3 2.5 2 1.5 1 0.5 IIO -15 5 25 45 65 85 105 125 TA - Free-Air Temperature - C 5 6 VDD = 5 V VI = 2.5 V 5 IIB 4 3 2 1 IIO 0 -1 -55 -35 -15 5 25 45 65 85 TA - Free-Air Temperature - C Figure 3 12 4 INPUT BIAS AND INPUT OFFSET CURRENT vs FREE-AIR TEMPERATURE I IB and I IO - Input Bias and Input Offset Current - nA I IB and I IO - Input Bias and Input Offset Current - nA 5 -0.5 -55 -35 3 Figure 2 INPUT BIAS AND INPUT OFFSET CURRENT vs FREE-AIR TEMPERATURE 0 2 VICR - Common-Mode Input Voltage - V Figure 4 WWW.TI.COM 105 125 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 3 5 VDD = 5 VDC 4.5 2.5 VOH - High-Level Output Voltage - V VOH - High-Level Output Voltage - V VDD = 3 VDC TA = -55C 2 1.5 TA = 125C TA = 85C TA = 25C 1 TA = -40C 0.5 TA = -55C 4 3.5 3 2.5 2 TA = 125C TA = 85C TA = 25C 1.5 TA = -40C 1 0.5 0 0 10 20 30 40 50 60 70 0 80 0 IOH - High-Level Output Current - mA 20 40 60 Figure 5 100 120 140 160 180 200 Figure 6 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 3 4.5 VDD = 3 VDC VDD = 5 VDC 4 2.5 VOL - Low-Level Output Voltage - V VOL - Low-Level Output Voltage - V 80 IOH - High-Level Output Current - mA TA = -40C 2 TA = 25C 1.5 TA = 85C TA = 125C 1 0.5 0 10 20 30 40 50 60 TA = -40C 3 TA = 25C 2.5 TA = 85C TA = 125C 2 1.5 1 TA = -55C 0.5 TA = -55C 0 3.5 70 IOL - Low-Level Output Current - mA 0 0 20 40 60 80 100 120 140 160 IOL - Low-Level Output Current - mA Figure 7 Figure 8 WWW.TI.COM 13 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY 5.5 VDD = 3 V AV = -10 THD = 1% RL = 10 k 2.5 VO(PP) - Peak-to-Peak Output Voltage - V VO(PP) - Peak-to-Peak Output Voltage - V 3 2 1.5 1 0.5 0 10k 100k 1M VDD = 5 V AV = -10 THD = 1% RL = 10 k 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 10k 10M 100k f - Frequency - Hz 1M f - Frequency - Hz Figure 9 Figure 10 OPEN-LOOP GAIN AND PHASE vs FREQUENCY 100 VDD = 1.5 V RL = 10 k CL = 0 TA = 25C 90 80 60 0 -20 -40 AVD 50 -60 40 -80 -100 30 Phase 20 -120 10 -140 0 -160 -10 -180 -20 10 100 1k 10k 100k f - Frequency - Hz Figure 11 14 20 WWW.TI.COM 1M -200 10M Phase Open-Loop Gain - dB 70 40 10M SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS OPEN-LOOP GAIN AND PHASE vs FREQUENCY 100 VDD = 2.5 V RL = 10 k CL = 0 TA = 25C 90 80 60 20 0 -20 -40 AVD 50 -60 40 -80 -100 30 Phase 20 -120 10 -140 0 -160 -10 -20 10 Phase Open-Loop Gain - dB 70 40 -180 100 1k 100k 10k 1M -200 10M f - Frequency - Hz Figure 12 DIFFERENTIAL VOLTAGE AMPLIFICATION vs LOAD RESISTANCE CAPACITIVE LOAD vs LOAD RESISTANCE 10000 TA = 25C 160 140 CL - Capacitive Load - pF A VD - Differential Voltage Amplification - V/mV 180 120 VDD = 2.5 V 100 VDD = 1.5 V 80 60 40 Phase Margin < 30 1000 Phase Margin > 30 VDD = 5 V Phase Margin = 30 TA = 25C 20 0 100 1k 10k 100k 1M RL - Load Resistance - 100 10 100 1k 10k RL - Load Resistance - Figure 14 Figure 13 WWW.TI.COM 15 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS OUTPUT IMPEDANCE vs FREQUENCY 1000 OUTPUT IMPEDANCE vs FREQUENCY 1000 VDD = 1.5 V TA = 25C 100 Zo - Output Impedance - Zo - Output Impedance - 100 10 AV = 100 1 AV = 10 0.1 VDD = 2.5 V TA = 25C AV = 1 10 AV = 100 1 AV = 10 0.1 AV = 1 0.01 100 1k 10k 100k 1M 0.01 100 10M 1k f - Frequency - Hz 10k Figure 15 Figure 16 COMMON-MODE REJECTION RATIO vs FREQUENCY CMRR - Common-Mode Rejection Ratio - dB 90 85 80 VDD = 5 V VIC = 2.5 V 75 VDD = 3 V VIC = 1.5 V 70 65 60 10 100 1k 10k 100k f - Frequency - Hz Figure 17 16 100k f - Frequency - Hz WWW.TI.COM 1M 10M 1M 10M SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS SUPPLY-VOLTAGE REJECTION RATIO vs FREQUENCY SUPPLY-VOLTAGE REJECTION RATIO vs FREQUENCY 90 +kSVR VDD = 1.5 V TA = 25C 100 k SVR - Supply Voltage Rejection Ratio - dB k SVR - Supply Voltage Rejection Ratio - dB 110 90 -kSVR 80 70 60 +kSVR 50 -kSVR 40 10 100 1k 10k 100k 1M +kSVR 80 -kSVR 70 60 +kSVR 50 -kSVR 40 10 10M VDD = 2.5 V TA = 25C 100 1k f - Frequency - Hz 10k 100k 1M 10M f - Frequency - Hz Figure 18 Figure 19 SUPPLY CURRENT vs SUPPLY VOLTAGE SUPPLY CURRENT vs FREE-AIR TEMPERATURE 0.8 0.80 IDD = 125C I DD - Supply Current - mA I DD - Supply Current - mA 0.75 IDD = 85C 0.7 0.6 0.5 0.40 IDD = 25C 0.30 IDD = -55C VDD = 5 V VI = 2.5 V 0.65 0.60 0.55 VDD = 3 V VI = 1.5 V 0.50 0.45 0.40 IDD = -40C 0.20 0.70 0.35 0.10 2.5 3 3.5 4 4.5 5 5.5 6 VDD - Supply Voltage - V 0.30 -55 -35 -15 5 25 45 65 85 105 125 TA - Free-Air Temperature - C Figure 20 Figure 21 WWW.TI.COM 17 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS AMPLIFIER WITH A SHUTDOWN PULSE TURNON CHARACTERISTICS AMPLIFIER WITH A SHUTDOWN PULSE TURNOFF CHARACTERISTICS 5 5 4 Shutdown Pin 3 2 1 0 Amplifier Output 3 2 1 0 -5 VDD = 5 V RL = 10 k AV = 1 TA = 25C Shutdown Pin 3 VSD - Shutdown Voltage - V VSD - Shutdown Voltage - V 4 VDD = 5 V RL = 10 k AV = 1 TA = 25C -3 -1 2 1 0 Amplifier Output 3 2 1 1 3 5 9 7 0 -5 11 -3 -1 t - Time - s 1 t - Time - s Figure 23 Figure 22 SUPPLY CURRENT WITH A SHUTDOWN PULSE TURNON CHARACTERISTICS 1 5.5 0.8 4.5 0.6 3.5 Supply Current 0.4 2.5 0.2 1.5 VDD = 5 V VI = 2.5 V AV = 1 TA = 25C 0 -0.2 -0.4 -0.2 0 0.2 t - Time - s Figure 24 18 WWW.TI.COM 0.4 0.5 -0.5 0.6 VSD - Shutdown Voltage - V I DD - Supply Current - mA Shutdown Pin 3 5 7 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS TURNOFF SUPPLY CURRENT WITH A SHUTDOWN PULSE 1 5.5 4.5 0.6 0.4 3.5 Supply Current 2.5 0.2 1.5 0 0.5 -0.2 -0.4 -0.2 0 0.2 VSD - Shutdown Voltage - V Shutdown Pin 0.8 I DD - Supply Current - mA VDD = 5 V VI = 2.5 V AV = 1 TA = 25C -0.5 0.6 0.4 t - Time - s Figure 25 SLEW RATE vs SUPPLY VOLTAGE 3 1.8 2.5 1.75 1.7 VDD = 5 V VI = 2.5 V 2 SR - Slew Rate - V/ s I DD - Shutdown Supply Current - A SHUTDOWN SUPPLY CURRENT vs FREE-AIR TEMPERATURE 1.5 1 VDD = 3 V VI = 1.5 V 0.5 0 SR+ 1.65 1.6 1.55 1.5 1.45 1.4 -0.5 -1 -55 -35 1.35 -15 5 25 45 65 85 105 125 TA - Free-Air Temperature - C SR- 1.3 2.5 VO(PP) = 2 V CL = 160 pF AV = 1 RL = 10 k TA = 25C 3 3.5 4 4.5 5 5.5 6 VDD - Supply Voltage - V Figure 27 Figure 26 WWW.TI.COM 19 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY 18 VDD = 3 V AV = 10 VI = 1.5 V TA = 25C 17 Vn - Equivalent Input Noise Voltage - nV/ Hz Vn - Equivalent Input Noise Voltage - nV/ Hz 18 16 15 14 13 12 11 10 100 1k 10k VDD = 5 V AV = 10 VI = 2.5 V TA = 25C 17 16 15 14 13 12 11 10 100 100k 1k f - Frequency - Hz Figure 28 EQUIVALENT INPUT NOISE VOLTAGE vs COMMON-MODE INPUT VOLTAGE 20 20 VDD = 3 V AV = 10 f = 1 kHz TA = 25C 15 Vn - Equivalent Input Noise Voltage - nV/ Hz Vn - Equivalent Input Noise Voltage - nV/ Hz 100k Figure 29 EQUIVALENT INPUT NOISE VOLTAGE vs COMMON-MODE INPUT VOLTAGE 14 13 12 11 10 0 0.5 1 1.5 2 2.5 3 VICR - Common-Mode Input Voltage - V VDD = 5 V AV = 10 f = 1 kHz TA = 25C 15 14 13 12 11 10 0 1 2 3 4 VICR - Common-Mode Input Voltage - V Figure 30 20 10k f - Frequency - Hz Figure 31 WWW.TI.COM 5 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS TOTAL HARMONIC DISTORTION vs FREQUENCY 1 VDD = 1.5 V VO(PP) = 2 V RL = 10 k THD - Total Harmonic Distortion - % THD - Total Harmonic Distortion - % 0.5 TOTAL HARMONIC DISTORTION vs FREQUENCY AV = 100 0.1 AV = 10 0.010 0.001 AV = 1 10 100 1k 10k 0.1 AV = 100 AV = 10 0.010 AV = 1 0.001 100k VDD = 2.5 V VO(PP) = 4 V RL = 10 k 10 100 1k f - Frequency - Hz Figure 32 THD+N - Total Harmonic Distortion + Noise - % THD+N - Total Harmonic Distortion + Noise - % TOTAL HARMONIC DISTORTION PLUS NOISE vs PEAK-TO-PEAK SIGNAL AMPLITUDE 1 RL = 250 RL = 2 k 0.1 RL = 10 k 0.010 RL = 100 k 0.001 1 1.2 1.4 1.6 1.8 2 100k Figure 33 TOTAL HARMONIC DISTORTION PLUS NOISE vs PEAK-TO-PEAK SIGNAL AMPLITUDE VDD = 3 V AV = 1 TA = 25C 10k f - Frequency - Hz 2.2 2.4 2.6 2.8 3 3.2 Peak-to-Peak Signal Amplitude - V 1 RL = 250 RL = 2 k 0.1 RL = 10 k 0.010 RL = 100 k VDD = 5 V AV = 1 TA = 25C 0.001 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 Peak-to-Peak Signal Amplitude - V Figure 34 Figure 35 WWW.TI.COM 21 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS PHASE MARGIN vs LOAD CAPACITANCE PHASE MARGIN vs FREE-AIR TEMPERATURE 90 80 RL = 10 k CL = 160 pF 55 70 m - Phase Margin - degrees m - Phase Margin - degrees 60 VDD = 2.5 V TA = 25C RL = 10 k Rnull = 50 60 50 40 Rnull = 20 30 20 Rnull = 0 50 VDD = 2.5 V 45 VDD = 1.5 V 40 35 10 0 100 10 1k 30 -55 -35 100k 10k CL - Load Capacitance - pF -15 Figure 36 45 65 85 105 125 GAIN BANDWIDTH PRODUCT vs FREE-AIR TEMPERATURE 5 5 CL = 160 pF RL = 10 k f = 10 kHz TA = 25C 4.75 Gain Bandwidth Product - MHz Gain Bandwidth Product - MHz 25 Figure 37 GAIN BANDWIDTH PRODUCT vs SUPPLY VOLTAGE 4.75 5 TA - Free-Air Temperature - C 4.5 4.25 4 3.75 4.5 RL = 10 k CL = 160 pF VDD = 2.5 V 4.25 4 3.75 3.5 VDD = 1.5 V 3.25 3.5 2.5 3 3.5 4 4.5 5 5.5 6 VDD - Supply Voltage - V -15 5 25 45 65 85 TA - Free-Air Temperature - C Figure 38 22 3 -55 -35 Figure 39 WWW.TI.COM 105 125 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS LARGE SIGNAL FOLLOWER LARGE SIGNAL FOLLOWER 2.2 3.7 2 3.3 VO - Voltage - V Input VO - Voltage - V Input 1.8 Output 1.6 1.4 VDD = 3 V VI(PP) = 1 V VI = 1.5 V RL = 10 k CL = 160 pF AV = 1 TA = 25C 1.2 1 0.8 -2 0 2 4 6 Input 2.9 Output 2.5 VDD = 5 V VI(PP) = 2 V VI = 2.5 V RL = 10 k CL = 160 pF AV = 1 TA = 25C 2.1 Output 1.7 8 10 12 14 16 1.3 -2 18 0 2 4 6 t - Time - s 8 10 12 14 16 18 Figure 41 SMALL SIGNAL FOLLOWER SMALL SIGNAL FOLLOWER 1.6 2.6 1.55 2.55 VO - Voltage - V VO - Voltage - V Output t - Time - s Figure 40 Input 1.5 Output 1.45 1.4 -0.2 Input Input 2.5 Output 2.45 VDD = 3 V VI(PP) = 100 mV CL = 160 pF AV = 1 VI = 1.5 V TA = 25C RL = 10 k 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 t - Time - s 2.4 -0.2 VDD = 5 V VI(PP) = 100 mV VI = 2.5 V RL = 10 k 0 0.2 0.4 0.6 CL = 160 pF AV = 1 TA = 25C 0.8 1 1.2 1.4 1.6 1.8 t - Time - s Figure 42 Figure 43 WWW.TI.COM 23 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 TYPICAL CHARACTERISTICS INVERTING LARGE SIGNAL INVERTING LARGE SIGNAL 4 2.3 Input 2.1 Input 3.5 VDD = 3 V VI(PP) = 1 V VI = 1.5 V RL = 10 k CL = 160 pF AV = -1 TA = 25C 1.7 1.5 1.3 VO - Voltage - V VO - Voltage - V 1.9 1.1 VDD = 5 V VI(PP) = 2 V VI = 2.5 V RL = 10 k CL = 160 pF AV = -1 TA = 25C 3 2.5 2 Output 0.9 Output 1.5 0.7 0.5 -0.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 -0.2 1.6 1.8 0 0.2 0.4 t - Time - s 0.6 Figure 44 1.6 1.8 2.6 Input Input 1.55 2.55 VDD = 3 V VI(PP) = 100 mV VI = 1.5 V RL = 10 k CL = 160 pF AV = -1 TA = 25C 1.5 VO - Voltage - V VO - Voltage - V 1.2 1.4 INVERTING SMALL SIGNAL 1.6 1.45 VDD = 5 V VI(PP) = 100 mV VI = 2.5 V RL = 10 k CL = 160 pF AV = -1 TA = 25C 2.5 2.45 Output 0 0.2 0.4 0.6 0.8 Output 1 1.2 1.4 1.6 1.8 t - Time - s 2.4 -0.2 0 0.2 0.4 0.6 0.8 1 t - Time - s Figure 46 24 1 Figure 45 INVERTING SMALL SIGNAL 1.4 -0.2 0.8 t - Time - s Figure 47 WWW.TI.COM 1.2 1.4 1.6 1.8 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 PARAMETER MEASUREMENT INFORMATION Rnull _ + RL CL Figure 48 APPLICATION INFORMATION driving a capacitive load When the amplifier is configured in this manner, capacitive loading directly on the output will decrease the device's phase margin leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater than 10 pF, it is recommended that a resistor be placed in series (RNULL) with the output of the amplifier, as shown in Figure 49. A minimum value of 20 should work well for most applications. RF RG RNULL _ Input Output + CLOAD Figure 49. Driving a Capacitive Load offset voltage The output offset voltage, (VOO) is the sum of the input offset voltage (VIO) and both input bias currents (IIB) times the corresponding gains. The following schematic and formula can be used to calculate the output offset voltage: RF IIB- RG + - VI IIB+ V OO +V IO 1) R R F G VO + RS "I IB) R S 1) R R F G "I IB- R F Figure 50. Output Offset Voltage Model WWW.TI.COM 25 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 APPLICATION INFORMATION general configurations When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see Figure 51). RG RF - VO + VI R1 C1 f V O + V I 1) R R F G -3dB + 1 2pR1C1 1 1 ) sR1C1 Figure 51. Single-Pole Low-Pass Filter If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this task. For best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth. Failure to do this can result in phase shift of the amplifier. C1 + _ VI R1 R1 = R2 = R C1 = C2 = C Q = Peaking Factor (Butterworth Q = 0.707) R2 f C2 RG RF RG = Figure 52. 2-Pole Low-Pass Sallen-Key Filter 26 WWW.TI.COM -3dB + ( 1 2pRC RF 1 2- Q ) SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 APPLICATION INFORMATION shutdown function Three members of the TLV246x family (TLV2460/3/5) have a shutdown terminal for conserving battery life in portable applications. When the shutdown terminal is tied low, the supply current is reduced to 0.3 A/channel, the amplifier is disabled, and the outputs are placed in a high impedance mode. To enable the amplifier, the shutdown terminal can either be left floating or pulled high. When the shutdown terminal is left floating, care should be taken to ensure that parasitic leakage current at the shutdown terminal does not inadvertently place the operational amplifier into shutdown. The shutdown terminal threshold is always referenced to VDD/2. Therefore, when operating the device with split supply voltages (e.g. 2.5 V), the shutdown terminal needs to be pulled to VDD- (not GND) to disable the operational amplifier. The amplifier's output with a shutdown pulse is shown in Figures 22, 23, 24, and 25. The amplifier is powered with a single 5-V supply and configured as a noninverting configuration with a gain of 5. The amplifier turnon and turnoff times are measured from the 50% point of the shutdown pulse to the 50% point of the output waveform. The times for the single, dual, and quad are listed in the data tables. circuit layout considerations To achieve the levels of high performance of the TLV246x, follow proper printed-circuit board design techniques. A general set of guidelines is given in the following. D Ground planes - It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize the stray capacitance. D Proper power supply decoupling - Use a 6.8-F tantalum capacitor in parallel with a 0.1-F ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1-F ceramic capacitor should always be used on the supply terminal of every amplifier. In addition, the 0.1-F capacitor should be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors. D Sockets - Sockets can be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation. D Short trace runs/compact part placements - Optimum high performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at the input of the amplifier. D Surface-mount passive components - Using surface-mount passive components is recommended for high performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. WWW.TI.COM 27 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 APPLICATION INFORMATION general power dissipation considerations For a given JA, the maximum power dissipation is shown in Figure 53 and is calculated by the following formula: P D + Where: T -T MAX A q JA PD = Maximum power dissipation of THS246x IC (watts) TMAX = Absolute maximum junction temperature (150C) TA = Free-ambient air temperature (C) JA = JC + CA JC = Thermal coefficient from junction to case CA = Thermal coefficient from case to ambient air (C/W) MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 2 Maximum Power Dissipation - W 1.75 PDIP Package Low-K Test PCB JA = 104C/W 1.5 1.25 TJ = 150C MSOP Package Low-K Test PCB JA = 260C/W SOIC Package Low-K Test PCB JA = 176C/W 1 0.75 0.5 0.25 SOT-23 Package Low-K Test PCB JA = 324C/W 0 -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 TA - Free-Air Temperature - C NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 53. Maximum Power Dissipation vs Free-Air Temperature 28 WWW.TI.COM SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 APPLICATION INFORMATION macromodel information Macromodel information provided was derived using Microsim Parts Release 8, the model generation software used with Microsim PSpice . The Boyle macromodel (see Note 2) and subcircuit in Figure 54 are generated using the TLV246x typical electrical and operating characteristics at TA = 25C. Using this information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases): D D D D D D D D D D D D Maximum positive output voltage swing Maximum negative output voltage swing Slew rate Quiescent power dissipation Input bias current Open-loop voltage amplification Unity-gain frequency Common-mode rejection ratio Phase margin DC output resistance AC output resistance Short-circuit output current limit NOTE 2: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, "Macromodeling of Intergrated Circuit Operational Amplifiers", IEEE Journal of Solid-State Circuits, SC-9, 353 (1974). 99 EGND + R2 3 VDD + - + ISS RSS CSS VD - 53 RP 10 2 IN - J1 FB 6 7 + 9 VLIM + VB 8 GA GCM J2 - - DC RO1 OUT IN + 1 11 12 RD1 92 54 + RD2 VE + DLP 91 + VLP - - - + 90 HLIM - 4 5 DLN DE C1 DP GND RO2 C2 VLN RD1 3 11 2.8964E3 RD2 3 12 2.8964E3 R01 8 5 5.6000 R02 7 99 6.2000 RP 3 4 8.9127 RSS 10 99 10.610E6 VB 9 0 DC 0 VC 3 53 DC .7836 VE 54 4 DC .7436 VLIM 7 8 DC 0 VLP 91 0 DC 117 VLN 0 92 DC 117 .MODEL DX D (IS=800.00E-18) .MODEL DY D (IS=800.00E-18 Rs = 1m Cjo=10p) .MODEL JX1 NJF (IS=1.0000E-12 BETA=6.3239E-3 + VTO= -1) .MODEL JX2 NJF (IS=1.0000E-12 BETA=6.3239E-3 + VTO= -1) .ENDS .SUBCKT TLV246X 1 2 3 4 5 C1 11 12 2.46034E-12 C2 6 7 10.0000E-12 CSS 10 99 443.21E-15 DC 5 53 DY DE 54 5 DY DLP 90 91 DX DLN 92 90 DX DP 4 3 DX EGND 99 0 POLY (2) (3,0) (4,0) 0 .5 .5 FB 7 99 POLY (5) VB VC VE VLP + VLN 0 21.600E6 -1E3 1E3 22E6 -22E6 GA 6 0 11 12 345.26E-6 GCM 0 6 10 99 15.4226E-9 ISS 10 4 DC 18.850E-6 HLIM 90 0 VLIM 1K J1 11 2 10 JX1 J2 12 1 10 JX2 R2 6 9 100.00E3 Figure 54. Boyle Macromodels and Subcircuit PSpice and Parts are trademarks of MicroSim Corporation. WWW.TI.COM 29 SLOS220J - JULY 1998 - REVISED FEBRUARY 2004 macromodel information (continued) rp 3 71 8.9127 rss 10 99 10.610E6 rs1 6 4 1G rs2 6 4 1G rs3 6 4 1G rs4 6 4 1G s1 71 4 6 4 s1x s2 70 5 6 4 s1x s3 10 74 6 4 s1x s4 74 4 6 4 s2x vb 9 0 dc 0 vc 3 53 dc .7836 ve 54 4 dc .7436 vlim 7 8 dc 0 vlp 91 0 dc 117 vln 0 92 dc 117 .model dx D(Is=800.00E-18) .model dy D(Is=800.00E-18 Rs=1m Cjo=10p) .model jx1 NJF(Is=1.0000E-12 Beta=6.3239E-3 Vto=-1) .model jx2 NJF(Is=1.0000E-12 Beta=6.3239E-3 Vto=-1) .model s1x VSWITCH(Roff=1E8 Ron=1.0 Voff=2.5 Von=0.0) .model s2x VSWITCH(Roff=1E8 Ron=1.0 Voff=0 Von=2.5) .ends .subckt TLV_246Y 1 2 3 4 5 6 c1 11 12 2.4603E-12 c2 72 7 10.000E-12 css 10 99 443.21E-15 dc 70 53 dy de 54 70 dy dlp 90 91 dx dln 92 90 dx dp 4 3 dx egnd 99 0 poly(2) (3,0) (4,0) 0 .5 .5 fb 7 99 poly(5) vb vc ve vlp vln 0 21.600E6 -1E3 1E3 22E6 -22E6 ga 72 0 11 12 345.26E-6 gcm 0 72 10 99 15.422E-9 iss 74 4 dc 18.850E-6 hlim 90 0 vlim 1K j1 11 2 10 jx1 j2 12 1 10 jx2 r2 72 9 100.00E3 rd1 3 11 2.8964E3 rd2 3 12 2.8964E3 ro1 8 70 5.6000 ro2 7 99 6.2000 Figure 54. Boyle Macromodels and Subcircuit (Continued) 30 WWW.TI.COM PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-0051201QHA ACTIVE CFP U 10 1 TBD Call TI Call TI 5962-0051201QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-0051202Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-0051202QHA ACTIVE CFP U 10 1 TBD Call TI Call TI 5962-0051202QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-0051203Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-0051203QHA ACTIVE CFP U 10 1 TBD Call TI Call TI 5962-0051203QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-0051204Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-0051204QHA ACTIVE CFP U 10 1 TBD Call TI Call TI 5962-0051204QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-0051205Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-0051205QHA ACTIVE CFP U 10 1 TBD Call TI Call TI 5962-0051205QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-0051206Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-0051206QHA ACTIVE CFP U 10 1 TBD Call TI Call TI 5962-0051206QPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-0051207Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-0051207QCA ACTIVE CDIP J 14 1 TBD Call TI Call TI 5962-0051208Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-0051208QCA ACTIVE CDIP J 14 1 TBD TLV2460AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM N / A for Pkg Type TLV2460AIP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2460AIPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2460AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TLV2460AMJGB ACTIVE CDIP JG 8 1 TBD Addendum-Page 1 A42 Samples (Requires Login) 5962-0051201Q2A A42 (3) N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Orderable Device Status (1) Package Type Package Drawing Pins TLV2460AMUB ACTIVE CFP U 10 Package Qty Eco Plan 1 (2) Lead/ Ball Finish TBD A42 MSL Peak Temp Samples (Requires Login) N / A for Pkg Type TLV2460AQD OBSOLETE SOIC D 8 TBD Call TI Call TI TLV2460AQDR ACTIVE SOIC D 8 2500 TBD Call TI Call TI TLV2460AQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460AQPW ACTIVE TSSOP PW 8 150 TBD CU NIPDAU Level-1-220C-UNLIM TLV2460AQPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460AQPWR ACTIVE TSSOP PW 8 2000 TBD CU NIPDAU Level-1-220C-UNLIM TLV2460AQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2460CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2460ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460IDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460IDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) TLV2460IDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460IDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2460IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2460MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TLV2460MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type TLV2460MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type TLV2460MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type TLV2460QD ACTIVE SOIC D 8 75 TBD Call TI Call TI TLV2460QDR ACTIVE SOIC D 8 2500 TBD Call TI Call TI TLV2460QPW ACTIVE TSSOP PW 8 150 TBD CU NIPDAU Level-1-220C-UNLIM TLV2460QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2460QPWR ACTIVE TSSOP PW 8 2000 TBD CU NIPDAU Level-1-220C-UNLIM TLV2460QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461AIP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2461AIPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Addendum-Page 3 (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Orderable Device Status (1) Package Type Package Drawing TLV2461AMFKB ACTIVE LCCC FK TLV2461AMJGB ACTIVE CDIP TLV2461AMUB ACTIVE CFP TLV2461AQD ACTIVE TLV2461AQDG4 Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 20 1 TBD JG 8 1 TBD A42 N / A for Pkg Type U 10 1 TBD A42 N / A for Pkg Type SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461AQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461AQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM POST-PLATE N / A for Pkg Type TLV2461AQPWR ACTIVE TSSOP PW 8 2000 TBD CU NIPDAU Level-1-220C-UNLIM TLV2461AQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2461CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2461ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) Addendum-Page 4 (3) CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) TLV2461IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) TLV2461IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2461MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TLV2461MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type TLV2461MUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type TLV2461QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2461QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type TLV2461QPWR ACTIVE TSSOP PW 8 2000 TBD CU NIPDAU Level-1-220C-UNLIM TLV2461QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 5 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) TLV2462AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462AIP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2462AIPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2462AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TLV2462AMJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type TLV2462AMJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type TLV2462AMUB ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type TLV2462AQD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462AQDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462AQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462AQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462AQPWR ACTIVE TSSOP PW 8 2000 TBD CU NIPDAU Level-1-220C-UNLIM TLV2462AQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462CDGK ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462CDGKG4 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462CDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462CDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 6 (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) TLV2462CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) TLV2462CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2462CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2462ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462IDGK ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462IDGKG4 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462IDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462IDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM TLV2462IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2462IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2462MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TLV2462MJGB ACTIVE CDIP JG 8 1 TBD TLV2462MUB ACTIVE CFP U 10 1 TBD TLV2462QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462QPW ACTIVE TSSOP PW 8 150 TBD CU NIPDAU Level-1-220C-UNLIM Addendum-Page 7 (3) A42 N / A for Pkg Type A42 N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) TLV2462QPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2462QPWR ACTIVE TSSOP PW 8 2000 TBD CU NIPDAU Level-1-220C-UNLIM TLV2462QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463AIDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463AIDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TLV2463AMJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type TLV2463AMJB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type TLV2463AQD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463AQDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463AQDR ACTIVE SOIC D 14 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463AQDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463AQPWR ACTIVE TSSOP PW 14 2000 TBD CU NIPDAU Level-1-250C-UNLIM TLV2463AQPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463CDGS ACTIVE MSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463CDGSG4 ACTIVE MSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463CDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463CDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 8 (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM TLV2463CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM TLV2463CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2463CNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2463ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463IDGS ACTIVE MSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463IDGSG4 ACTIVE MSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463IDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463IDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2463INE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2463MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TLV2463MJB ACTIVE CDIP J 14 1 TBD TLV2463QD ACTIVE SOIC D 14 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463QDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463QDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463QDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2463QPWR ACTIVE TSSOP PW 14 2000 TBD CU NIPDAU Level-1-250C-UNLIM TLV2463QPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464AID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 9 Samples (Requires Login) TLV2463CDR A42 (3) N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TLV2464AIDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464AIDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464AIDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464AIN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2464AINE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2464AIPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464AIPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464AIPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464AIPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2464CNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2464CPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464CPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464CPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464CPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 10 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TLV2464ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2464INE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2464IPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464IPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2464IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465AIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465AIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465CD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465CPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465ID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 11 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TLV2465IDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465IDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2465INE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV2465IPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2465IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 12 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLV2460, TLV2460A, TLV2460AM, TLV2460M, TLV2461, TLV2461A, TLV2461AM, TLV2461M, TLV2462, TLV2462A, TLV2462AM, TLV2462M, TLV2463, TLV2463A, TLV2463AM, TLV2463M, TLV2464A : * Catalog: TLV2460A, TLV2460, TLV2461A, TLV2461, TLV2462A, TLV2462, TLV2463A, TLV2463 * Automotive: TLV2460-Q1, TLV2460A-Q1, TLV2460A-Q1, TLV2460-Q1, TLV2461-Q1, TLV2461A-Q1, TLV2461A-Q1, TLV2461-Q1, TLV2462-Q1, TLV2462A-Q1, TLV2462A-Q1, TLV2462-Q1, TLV2463-Q1, TLV2463A-Q1, TLV2463A-Q1, TLV2463-Q1, TLV2464A-Q1 * Enhanced Product: TLV2462A-EP, TLV2462A-EP, TLV2464A-EP * Military: TLV2460M, TLV2460AM, TLV2461M, TLV2461AM, TLV2462M, TLV2462AM, TLV2463M, TLV2463AM NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications Addendum-Page 13 PACKAGE MATERIALS INFORMATION www.ti.com 24-Jun-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLV2460AIDR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2460AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2460AQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLV2460CDBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2460CDBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2460CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2460IDBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2460IDBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2460IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2460IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2460QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLV2461AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2461AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2461AQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLV2461CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2461CDBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TLV2461CDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2461CDBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Jun-2011 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV2461CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2461IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2461IDBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TLV2461IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV2461IDBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3 TLV2461IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2461IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2461QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLV2462AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2462AQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLV2462CDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TLV2462CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2462IDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TLV2462IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TLV2462QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TLV2463AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLV2463AQPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLV2463CDGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TLV2463CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLV2463IDGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TLV2463QPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLV2464AIDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLV2464AIPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLV2464CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLV2464CPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLV2464IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TLV2464IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLV2465AIPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLV2465CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TLV2465CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 TLV2465IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TLV2465IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Jun-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2460AIDR SOIC D 8 2500 346.0 346.0 29.0 TLV2460AIDR SOIC D 8 2500 340.5 338.1 20.6 TLV2460AQPWR TSSOP PW 8 2000 346.0 346.0 29.0 TLV2460CDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV2460CDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV2460CDR SOIC D 8 2500 340.5 338.1 20.6 TLV2460IDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TLV2460IDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 TLV2460IDR SOIC D 8 2500 346.0 346.0 29.0 TLV2460IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2460QPWR TSSOP PW 8 2000 346.0 346.0 29.0 TLV2461AIDR SOIC D 8 2500 346.0 346.0 29.0 TLV2461AIDR SOIC D 8 2500 340.5 338.1 20.6 TLV2461AQPWR TSSOP PW 8 2000 346.0 346.0 29.0 TLV2461CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV2461CDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0 TLV2461CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2461CDBVT SOT-23 DBV 5 250 182.0 182.0 20.0 TLV2461CDR SOIC D 8 2500 340.5 338.1 20.6 TLV2461IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 24-Jun-2011 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV2461IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0 TLV2461IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TLV2461IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0 TLV2461IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2461IDR SOIC D 8 2500 346.0 346.0 29.0 TLV2461QPWR TSSOP PW 8 2000 346.0 346.0 29.0 TLV2462AIDR SOIC D 8 2500 340.5 338.1 20.6 TLV2462AQPWR TSSOP PW 8 2000 346.0 346.0 29.0 TLV2462CDGKR MSOP DGK 8 2500 358.0 335.0 35.0 TLV2462CDR SOIC D 8 2500 340.5 338.1 20.6 TLV2462IDGKR MSOP DGK 8 2500 358.0 335.0 35.0 TLV2462IDR SOIC D 8 2500 340.5 338.1 20.6 TLV2462QPWR TSSOP PW 8 2000 346.0 346.0 29.0 TLV2463AIDR SOIC D 14 2500 346.0 346.0 33.0 TLV2463AQPWR TSSOP PW 14 2000 346.0 346.0 29.0 TLV2463CDGSR MSOP DGS 10 2500 358.0 335.0 35.0 TLV2463CDR SOIC D 14 2500 346.0 346.0 33.0 TLV2463IDGSR MSOP DGS 10 2500 358.0 335.0 35.0 TLV2463QPWR TSSOP PW 14 2000 346.0 346.0 29.0 TLV2464AIDR SOIC D 14 2500 333.2 345.9 28.6 TLV2464AIPWR TSSOP PW 14 2000 346.0 346.0 29.0 TLV2464CDR SOIC D 14 2500 333.2 345.9 28.6 TLV2464CPWR TSSOP PW 14 2000 346.0 346.0 29.0 TLV2464IDR SOIC D 14 2500 333.2 345.9 28.6 TLV2464IPWR TSSOP PW 14 2000 346.0 346.0 29.0 TLV2465AIPWR TSSOP PW 16 2000 346.0 346.0 29.0 TLV2465CDR SOIC D 16 2500 346.0 346.0 33.0 TLV2465CPWR TSSOP PW 16 2000 346.0 346.0 29.0 TLV2465IDR SOIC D 16 2500 346.0 346.0 33.0 TLV2465IPWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 4 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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