(S) MOTOROLA Quad MECL-to-TTL Translator ELECTRICALLY TESTED PER: MIL-M-38510/06302 The 10525 is a quad translator for interfacing data and control signals between the MECL section and saturated logic section of digital systems. The 10525 incor- porates differential inputs and Schottky TTL totem pole outputs. Differential in- puts allow for use as an inverting/non-inverting translator or as a differential line receiver. The Vgp reference voltage is available on pin 1 for use in single-ended input biasing. The outputs of the 10525 go to a low logic level whenever the inputs are left floating. Power supply requirements are ground, + 5.0 Volts and 5.2 Volts. Propaga- tion delay of the 10525 is typically 4.5 ns. The 10525 has fanout of 10 TTL loads. The dc levels are MECL 10,000 in and Schottky TTL, or TTL out. This device has an input common mode noise rejection of + 1.0 volt. Anadvantage of this device is that MECL level information can be received, via balanced twisted pair lines, in the TTL equipment. This isolates the MECL logic from the noisy TTL environment. This device is useful in computers, instrumenta- tion, peripheral controllers, test equipment and digital communications systems. 230 mW Max/Pkg (No Load) tod = 4.5 ns typ (50% to 1.5 Vde out) tr, tf = 2.5 ns typ (1.0 V to 2.0V) PIN ASSIGNMENTS FUNCTION DIL FLATS Lec BURN-IN (CONDITION C) VBB 1 5 2 VeB AIN 2 6 3 2K Qto VEE AIN 3 7 4 VBB AOUT 4 8 5 360 Q to Voc BouT 5 9 7 360 Q to Veg Bin 6 10 8 2K Q to Veg BIN 7 "1 9 VeBB VEE 8 12 10 VEE Voc 9 13 12 Voc Cin 10 14 13 Ves CIN 1 15 14 2K Qto VEE Cout 12 16 15 360 2 to VEE Dout 13 1 17 360 Q to Voc Din 14 2 18 Ves DIN 15 3 19 2KQ2to GND GND 16 4 20 GND BURN - IN CONDITIONS: VtT = 2.0 V MAX/ - 2.2 V MIN VEE =~ 5.7 V MAX/~ 5.2 V MIN * Vgp to be used to supply bias to the 10525 only and bypassed (when used) with 0.01 uF to 0.1 uF capacitor. When the input pin with the bubble goes positive, the output goes negative. Military 10525 MPO nn AVAILABLE AS 1) JAN: JM 38510/06302 2) SMD: N/A 3) 883: 10525/BXAJC X = CASE OUTLINE AS FOLLOWS: PACKAGE: CERDIP: E CERFLAT: F Lec: 2 The letter M appears before the slash on LCC. Ves 1 a Gy] GND An GJ fs) Dn an EB Fa) BN Aour [ 3] Dour Bout [] 2] Coyt Bn CY rT cy By EI 5 cn Vee 2] Voc LOGIC DIAGRAM wo yyy VBB10525 Scope Input GENERATOR CHARACTERISTICS . +5.0V Ta Vins | Ys Scope Input A Scope Input = 50 Q to GND 25C | -0.890V] -1.690V 125C | -0.760V) -1.640V 55C | -0.990V] -1.720V 0.1 pF 280 Q = +20% TL +5.0% Pulse Generator o input TPIN ~ ft NOTES TP, ' OUT 1. ZouT = 500 x 2. tr = tf = 2.0 ns + 0.2 ns (20%-80%). CL = 25 pF = 3. tp = 40 ns + 1.0ns md mn test re _ md = VB GND VEE a q = a os uF + 20% ViLs $ Tt -5.2 V + 0.005V VIN VouT TLH NOTES 1. Perform test in accordance with test table; each output is tested separately. 2. Allinput and output cables are equal lengths of 50 Q coaxial cable. Wire length should be < 0.250 inch (6.35 mm) from TPyjy to input pin and TPoyT to output pin. 3. All diodes are 1N3064 or equivalent. Figure 1. Switching Test Circuit and WaveformsSOA O'Z - 0} 10}SISEJ 75 OOL & YBnosLy payeuiwe} ae syndjno paureyureWw si) Wdy seEUI] OOS UeY) Je}e0s6 MO] JTe aSIeASUB.] PUR PseOg yINdWO pajuUd eB UC payuNoWw JO 8400S ]S9}] B UI SI }INDIID ay] Paysi|qe}se ueaq sey WNquinbs yew8yy saye ajqQe}1S9} aU) Ul UMOYS SUO!T}EOyIOedS Op 8} Jee 0} PaUBisap Useq Sey INDIO SAAS YOL TOAW YoRy SOILSIUVSLOVYVHS IWOIWLDS TS vi ib l 2b Ore eb eb . . . Sp 6 19 S"p A sO so sO abeyon nding | STO, ec? 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S%= V1 10, HO; Stl, | SHIA | 88, | 99, | TM, | Hil, | Ha | HHA | Faq | Gq | Ala | Hila Wa Hi,: aunjesoduiay (sdwy iw) sol SAN[BA JUALIN 180 (S}10A) senjea aBeyOA ySeL 3TEV1L LIND LNSDSSINO ScSOl MOTOROLA MILITARY MECL DATA 3-80SIOA O'S - 0} JOJSISAJ TF OO} B YBnosy) payeulwe} ale syndino peureyulew si wid seaUy OOS UeU) Jeye0I6 MOY we aBSI@ASUBA) PUL PueOg JINDIo peyuud eB UO payuNnoWw Jo 184908 ]S9} B UI SIJINDID BL PAUSI|Ge|Se UeEq Sey LUNLIQINdS ;eWJEY) JEYye a\qer1Se} OL] Ul UMOYS SUONEOIOadS Op ot) JaaW 0} paUBIsap UAE SEY WNdIID SUAS YOL IOAW ye] SOLLSIHSLOVYVHS TWWOldLO3TS Si th WeLND 6 OL 8 TEL yu 6e 6E 6 ureig Ayddng 199) JOMOd BAINSOd St be queuing 8 91 8 | ey yu OP - tr: Or - Addng| 33 JOMOd Sh ub ae 4. a = a ue abeyon L 91 8 rey A | cet veh oh 2h eZb- | SEL soueiajay | F9A >) et l Zk Sbtilb vi OL pL OL . . abey0A 110 El SL Sb gp OL 8 7 Eh 92 'g 2 A sO $0 s0 indjno Mo} A tay tet EL Zk Sh LL rh OL vb Ob . . . aBeyon HLO El ct Sp Sp OL 8 Ted g'z 9'z A GS? ge se andino usiH# A ~nd HO; 10, aNd | 33a a6, hla Wa HLi, xew UI xew UIW xe UIA 1SIDJOWBIC AO'Z- = peor nding 6 uid = DDA dnoaBqns z dnouBqns L dnoaBqng yeuonoung sjuowuBbissy uid 420y9 obeyed 71g 10) ase paoueseje synoUlY 2, ss- 25 SZb+ 2, S%+ MO134d SNid OL GaliddV ADVLIOA 1LS3L suun syuwyy 40) 0818 d foquiAs Ooze + oe - ezt-| 660-] Luld | ost | zez-| aet- | eeo-j; zio+| 2s- | zs- | orse-| sszt-| zer- | ee0- | 9.$9-=L oe + 0@- pobL- | 920-] LUld | OS+ | cBS- | EOL- | 280- | ZE0+] as- 2S- | OOPE- | OOOL- | 2et- 9'0 - Do Sz = VE OSE + Og - 69'L- | 6BO- | LUld | OS+ | GBS- |] B2Zt- | SBO- | evor] aeE- ZG- | SZPL- | SOL'L- | SOL- 820- 9, St= VL 10; HO; St, | SHIA | aq | 99, | TM, | TH, | Ht, | HHI, | 33q | AO, | Wt, | HLA Ma HI, ounyesedwe, (sduryjiiw) se] SaN|BA JUEUND \seL (soa) sanjen aBeyoa ysa1 3TEVL LIA LNSDSSINO SeSOlL MOTOROLA MILITARY MECL DATA 3-81S}JOA O'Z - 0} JOISISO/ 75 COL & YBnou} peyeuiWe} ese Sindino peureyureW Ss} Wid} JeEUI| OOS UL] Jeyee/6 Mo} ATE eSueASUB.) PUB Preog yIND1/0 pejud & UO peyUNOW JO 1890S ]S9} P U! SI }INDID BU PaYsi|qe|se ueeq sey WNquinbe jeuUuE8Y) JeYye e/qe} 18} au) Ul UMOYS SUOIT}eoII96ds Op ay) }eoW 0} peUBIsep useq Sey NOD SELES YOL TOAW Y9eA SOLLSIHSLOVYVHD TVOINLOA 14 SL SL u6iH Gk bh LL OL 29'S '2 91'8 ye LL OL | ph be on | wm 961 961 Sit yueung ynduy | SH Lesh 9 '6'% a1 eg a1 a St . _ . _ . . queuing EL ZL Sp EL Zi 'Sy 8 LP OL vu | 004 oP 001 se 004 Ov yneng poug| 8! SL St er int 7 ta'e! eras erate . . . queuing Gt ph bt O12 9% a1 ve bh OL | ph bE Ob wil sb- O1- OL- Beyee7 induj | 08 B-9'E'Z| L'9'E-4 abeyee) jnduj SI queung 6 91 8 apse | PE Ob'9'% | wu 2g 2g 2s urea Aiddng | HOO) JOMOd BAIISOd 1nd Gnd 33, aaa Hla xeW uN xen UIW xen UIN {SIOJOWBIE AQT - = peOT INdyno 6 Uid = DOA dnosBqns z dnosBqns t dnosBqns jeuopoung sjuewubissy uld 49049 eBexoed 11g 10) die poouesejas SynoUld 2, $8- 9, Stl + 9, $2 + MO7144 SNid OL Gal iddV JDVIIOA LSAL syun sywly sayowelBd | joquss ozi+ oz- zt-| 660-| Luid | os+ | zez-| eat-| zeo-| zro+| as- | as- | orge-| sczt-| zer- | eeo- | 9.9S-=VL oz+ o7z- vot-| o20-] tulad | os+ | eez-| eor-| zeo-} zeo+| 2g- | zg- | oovr-| ooor-| zer- | ego- | D.szb=VE oz+ Oz- 69't- | 6e0-} tulg | o's+ | sez-| azt-| seo-| zzo+| 2g- | zs- | seet-| sove-| set- | evo- | 9.9e=L 10) HO, Sta | SHI, | GGq | 99, | TM, | TH, | HM, | HHI, | 33q | BO, | Wha | Hla Wa Hi, eunywsedwie] (sdunyinu) wal SOnjeA JULIND Ise, (SUA) Sanjep OBEYOA 180, STEVL LINK LNSDSSINO MOTOROLA MILITARY MECL DATA 3-82SHOA 0'Z - 0} JO]SIS@Z 75 OOL @ YBnosy) PeyeUWE} E2e s]NdinE peuUrE}UIeW S| Wd) Je@UI| OOG UY) 4872016 Mo} ste ESJeASUB] PUB Pseog jINDMO Pe|UUd B UO pejuNoWwW 40 194905 }S6} B U! SIJINDJ/O BY) PEYs!|qese UeSq Sey WNUAiINbe yeWEU) Jaye ajqQB) }Se} BUY UL UMOYS SUOITBOy10eds op el) JeeW 0} PeUBISep VEE Sey JINDUID SEUeS HOI TOZW Ye] SOILSIHSLOVYVHS TV9IHLI313 . SeSOL tat te oL 9 & Stbe | b'zi | vb or . . . . . . YBIHOMMOT] Ling Cl ze's'e | pL ola'z 8 OL Tel s+ 9'z su s9 ol oz oF 09 or Aejeg ucaebedoig 1 a1 te! tar fq! Sibt | 4 ce | bt or . . . . . . 07 01 UBIH EL Zh 'sp | ph OL 9'2 g Oo feel oe | 9 su s9 ot o ot o9 OL kejeg uoyebedoig| ty) Ie al ta GLtb | eb Zt | vt OL . . . 4H eb Zi 'Se | ph OL '9o'z 8 oL oe. | Ss 9'2 su SP es ee oul 1184 44 51 a+ al q SLLe | Eb ce | ot on . . . | EL ZL Sy vk OL 9 2 g OL Tet Sp 9'2 su S es ee ew) esiy Hy ind sta 3d, Sq a, LNOA NI, xewW WIN xew UW xeyw uA S19] OWBIEg | @inBiJ 98g = peo? WdNO 94 Uld = AND 6 Ud = 29, Li dnos6ans 04 dnoBans 6 dnoBans jeuopoung siuewuBissy uid yoeY4s eBexoed 1G 40) ese peduesejo. SNOUI 95 $S- 9, SEL + 9, $+ MO124d SNid OL G3ridd SDVLIOA LSAL syun syuyy Joyouleie loquiAg Oz + oz- eZb- | 660-| Luld | o'S+ | 2ez-| eat-| zeo- | zro+| 2s- | z2S- | orgt-| sszu-} zer- | e@o- | O,99-=VL oz+ 0@- vo't- | 920-] LUld | oG+ | eee-| Eot-| zeo- | zeo+] 2S- | as- | oovL-| oooL-| zet- | ego- | D,Szb=ML ozt+ O7- 69'1- | 68O-| EUld | OS+ | GBz-| ezt-| seO-| zor] as- | as- | szeL-| Gort-| ser- | ezo- | 9,.S=VL 10, HO, Sta | SHIA | BG,q | 99, | TH, | TH, | HMA | HHlq | Faq | Bq | Wa HL, Wa Hla einjyesodwia, (sduryintw) se, senjen queuing 1891 (su0,) senjea aBeyYon 1se1, 3TEVL LIN LNADS3INO MOTOROLA MILITARY MECL DATAE. te ann . MOTOROLA SC LOGIC nye o ff eaez2s2 ooazaso 7 f T- 76-20 PACKAGE OUTLINE DIMENSIONS A letter suffix to the MECL logic function part number is used to specify the package style (see drawings below). See appropriate selector guide for specific packaging available for a given device type. _____ & _______ L SUFFIX CERAMIC PACKAGE CASE 620-09 rc iV Hts L colle de Me & SUFFIX CERAMIC PACKAGE CASE 623-05 13 | _| (LW SUFFIX FOR MC10H181 ONLY) NOTES: 1. LEAD POSITIONAL TOLERANCE: [ols o.13 0008) 8] T]A@ [BO] Z OIMENSION 1 TO CENTER OF LEADS WHEN FORMED PARALLEL 4. PACKAGE CONTOUR OPTIONAL (ROUND OA SQUARE CORNERS). 4 DIMENSIONS A AND B ARE DATUMS. 5, DIMENSIONING AND TOLERANCING PER ANS! YL4SM, 1962. ye aii iT RADIUS OF TRUE a Di LTO CENTER OF * POSTION AT SEATING PARE AT RDG LEADS WHEN FORWED MATERIAL CONDITION. *ARALLE 2, PACKAGE INDEX: NOTCH IN LEAD NOTCH IN 2. LEADS WITHEN 0.13 mm CERAMIC OA INK DOT. (0.005) RADIUS OF TRUE 4. OIM L TO CENTER OF LEADS WHEN FORMED Fa ATA EATING PLANE PARALLEL pani CONDITION. (HEN FORMED PARALLEL. P SUFFIX PFA] L SUFFIX Felhe O adhe BE my BO als OE cle OD PSO eae * | 7 CERAMIC PACKAGE CASE 632-08 | 1 riot re ' c+ ht to - A Bo | # font sore K i a py ae 1 i F o -el6 n~ | | Yd elhe Dun Jun | \ T 3 0.25 (0.010) O 025 (0.010) N She tle NOTES: 1. EHMENS:ONING AND TOLERANCING PER ANSI 2 CONTROLLING DIMENSION: INCH. 3, DIMENSION C 10 CENTER OF LEAD WHEN 4, OM F MAY NARROW TO 0.76 (0.090] WHERE THE YIGSM, 1982. FORMED PARALLEL, LEAD ENTERS THE CERAMHC BODY, 1-26= -_ = MOTOROLA :SC - LOGIC PACKAGE OUTLINE DIMENSIONS (continued) nue 0 Pfuaez2s2 ooszssi 9 f 7-90-20 P SUFFIX PLASTIC PACKAGE CASE 646-06 AAAAAASL 4 t ? 1 TPT TY A ROTE 4 i | Ty ms oy +f J ume mod le NOTES: 1. LEADS WITHIN 0.13 mm 10.005] RAD-US OF TAUE POSITION AT SEATLNG PLANE AT MAXUM MATERTAL CONDITION. 2. CHMENSION "L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. OLMENSION B DOES NOT INCLUOE MOLD P SUFFIX PLASTIC PACKAGE CASE 648-08 -{} AAAAAAAY 16 1 t WU ay Lee al ii ape Vt ep 744025 10010) Tas) NOTES. 1. DIMENSION-NG AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING OIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4 OIMERSION 8 DOES NOT INCLUDE MOLD POSITION AT SEATING PLANE AT MAXCMUM MATERIAL CONDITION 2. GIMENSION LTO CENTER OF LEADS WHEN FORMED PARALLEL FLASH. FLASH. 4 ROUNDED CORNERS OPTIONAL. . ROUNDED CORNERS OPTIONAL. P SUFFIX (PW SUFFIX F SUFFIX PLASTIC PACKAGE FOR MC10Hi81 CERAMIC PACKAGE CASE 649-03 ONLY) CASE 650-05 L P Pnnaae A | ey w . | a a t | oO 8 1 ela Dun N mire io [Forsioce [ta [eo | N tt cf 1 | rt kK ~ lel tno rook, Mahe i {} caren Yota yl] Elm NOTES: NOTES: 1. DIMENS:ONING AND TOLERANCING PER +. LEADS WITHIN 0.13 em [0.0652 RAD-US OF TALE ANS! YIA6M, 1992. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND 6 ALLOW FOR UD MISALIGNMENT, ANO GLASS BENISCUS. 4 DIMENSION H SHALL BE MEASURED AT THE POINT OF EXIT OF THE LEAD FROM THE BODY. 5. LEAD NUMBER 1 IDENTIFIED BY TAS ON LEAD CA OOT ON COVER. 6. DIMENSION J INCLUDES SOLDEA LEAD FINISH. 7. LEAD NUMBERS SHOWN FOA REFERENCE ONLY. 1-27a Ep. MOTORCLA SC LOGIC PACKAGE OUTLINE DIMENSIONS (continued) nue 0 Pfese7252 ooazas2 o ff T-90-20 L SUFFIX CERAMIC PACKAGE CASE 693-02 P SUFFIX PLASTIC PACKAGE CASE 707-02 AAAAAAAAY 1 10 p a s pee A | TT is | [ Nae K FH Pag PT \ sume Paty tbe LX +}o2s0008 frfe | [Hozsco Jrfa@} NOTES: 1. CHAMFERAED CONTOUR OPTIONAL. 2. OFM L" TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS AKD TOLERANCES PEA ANSI YI4.5M, 1982. 4. CONTROLUNG DIMENSION: INCH. NOTES: HOTES: 1, POSITIONAL TOLERANCE OF LEADS (0), SHALL 8& T.LEADS WITHEN 0.13 mm (0.005) RAD OF TRUE WITHN 0.25mm(0.010) AT MAXIMUM MATERIAL POSITION AT SEATING PLANE AT MAXIMUM CONDITION, IN RELATION TO SEATING PLANE MATERIAL CONDITION. AND EACH OTHER. 2. OIMENSION LY TO CENTER OF LEADS WHEN 2. DIMENS:ON L TO CENTER OF LEADS WHEN. FORMED PARALLEL FORMED PARALLEL 3. D/MENSKON B DOES NOT INCLUDE MOLD FLASH. P SUFFIX L SUFFIX PLASTIC PACKAGE CERAMIC PACKAGE CASE 724-03 CASE 726-04 T OFTIOMAL LEAD CONAG. [8.1810 L+ r NOTES: 1. LEADS, TRUE POSITIONED WITHEN 0.25 mm {0.010) DIA. AT SEATING PLANE, AT MAXiMUM MATERIAL CONGHTION.. 2. DM L7 TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DiM AY & "B" INCLUDES MENISCUS. 4. F* DEMENSION IS FOA FULL LEADS. HALF LEADS ARE OPTIONAL AT LEAD POSITIONS 1, 9. 10, ANO 18, 1-28a ne & . a) MOTOROLA SC LOGIC PACKAGE OUTLINE DIMENSIONS (continued) 14e 0 Ppeaezas2 coseasa 2 i T-90-20 L SUFFIX CERAMIC PACKAGE CASE 732-03 NOTES: 1. LEADS WITHIN 0.25 om (0.010) OLA, TRUE POSITION AT SEATING PLANE, AT MAXIMUM P SUFFIX PLASTIC PACKAGE ' CASE 738-03 LAE DBA t 20 aw oO 0 8 Tt pe ro co al OT Ry 4 t a cl VU VAIN ef JURE eel. N We wal ghe F ode J PL Dan [+fozsoo1 [r]e | [Fozsoma [t]A@ | NOTES: 1. DIMENSIONING AND TOLERANCING PER ANS! YI4.5M, 1982. 2. CONTROLLING DIMENSION: INCH, 3. DIMENSION L TO CENTER OF LEAD WHEN 2 | phan oO a aol _- qe TIS ADATUM SURFACE. YI4SM, 1982, MOLD PROTRUS:ON, SIDE. ose Uh pelle tk M pl LEs [elozsioc Oris OLA O} ROTES: 1. DIMENSIONS AT AND "B" ARE DATUMS AND 2. OMENSONING AND TOLERANCING PER ANSI 2 CONTROLUNG O:M: AULUMETER. 4. DIMENSION "A" AND B DO NOTINCLUDE 5, MAXIMUM MOLO PROTRUSION 0.15 10.006] PER MATER'AL CONDITION. 2 QML TOCENTER OF LEADS WHEN FORMED FORMED PARALLEL. 2. DIM A AND B INCLUDES MENISCUS. Ss oe D SUFFIX L SUFFIX PLASTIC SOIC PACKAGE CERAMIC PACKAGE CASE 751-03 CASE 758-01 -A:} fH At 4 s Sau! Ere (= Fe a : coe wle_-D tr Gi DESIDE OF LEADS TES: 1, BAMENSON AIS OATUM. 7. POSITIONAL TOLERANCE FOR LEADS: 24 PLACES 2. Ce] is SEATING PLANE. 4, DIMENS?ON L TO CENTER OF LEADS WHEN FORMED PARALLEL. 5. DIMENSION!NG AND-TOLERANCING PER ANST 145, 1973. 1-29Bo ee a MOTOROLA SC LOGIC nue o ff ese72s2 ooszes 4 i T-90-20 7 r= YeRk 8 a a | ocean TROFSTSR q 0 t ef m Zz q n Ww qd H [ an [ho [ ek | Ly | a ; kk Fasano Toro ous) a VIEW D-0 _4 fo Afelcenon [PLOno[ wOro] on OHO! WOP@ 7 aft ssio0n @ [11 LO-vO[NO-FG) ae * * [e}orsiaon [tT] x@rO]L@-uG@ ST _ it mts f aL Le Eefsinen L_, Fame PproweTe-ra DETAR. TF lounam [TIN OlLO-4Gl NOTES: 1. OATUMS -L-, -M-, -N-. AND -P- DETERMINED WHERE TOP OF LEAD SHOULOEA EXIT PLASTIC 8ODY AT MOLD PARTING LINE. 2. DIM Gi, TRUE POSTION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION 1S 0.25 (0.010) PER SIDE. 4, DIMENSIONING AND TOLERANCING PER ANS} Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. sfomnenS fiaua sara FN SUFFIX PLASTIC PACKAGE CASE 776-02 DETAILS Gt [arsno@ [tT] LOuGpR@?rol L FN SUFFIX PLASTIC PACKAGE CASE 775-02 NOTES: 1. DUE TO SPACE LIMITATION, CASE 776-02 SHALL BE REPRESENTED BY A GENERAL (SMALLER) CASE OUTLINE - SAK A '# olasen @ ot sired peut DRAWING RATHER THAN SHOWING | a ALL 28 LEADS. annoan ko u Faso S Pvber i bus: 2. DATUMS -L.. -@-.-N-. AND -P- DETERM.NED Cm Le non a amaeaanen om 7 . aODY Al RNG UN q 2h. Pit rere 3. OM GI, TRUE POSITION TO BE MEASURED AT ro actu Pew a DATUM -T-, SEATING PLANE, q hy 4. DIM R AND U 00 NOT INCLUDE MOLD os i PROTRUSION. ALLOWASLE MOLD PROTRUSION my 7 i (NOTE na | fc kes t Ly tt Low YIASM, 1982. aah Wass Vase sua} 6. CONTROLUNG O-MENS'ON: INCH, A Feo SD eri, Ru Ty Dees VIEW D-D z oe Silougnn D LSP sa her. r$0taoon S tBu SNe BR [4iow307 cried sy Re 5. _ i H youagre Nhe SDs } | o + c Ur) te mel TT Shane: widen ale Kb Seeman ap Eine ET aasSrG] \ petan DETARS ipianoxn SPP aug Gi-+ 1-30nue o Pfosu72s2 ooazass & Ef 7-90-20 MECL Logic Surface Mount WHY SURFACE MOUNT? Surface Mount Technology is now being utilized to offer answers to many problems that have been created in the use of insertion technology. Limitations have been reached with insertion packages and PC board technology. Surface Mount Technology offers the opportunity to continue to advance the State- of-the-Art designs that cannot be accomplished with Insertion Technology. Surface Mount Packages allow more optimum device performance with the smaller Surface Mount configu- ration. Internal fead lengths, parasitic capacitance and inductance that placed limitations on chip performance have been reduced. The lower profile of Surface Mount Packages allows more boards to be utilized in a given amount of space. They are stacked closer together and utilize less total volume than insertion populated PC boards. Printed circuit costs are lowered with the reduction of the number of board layers required. The elimination or reduction of the number of plated through holes in the board, contribute significantly to lower PC board prices. Surface Mount assembly does not require the prepa- ration of components that are common on insertion tech- nology lines. Surface Mount components are sent directly to the assembly line, eliminating an intermediate step. Automatic placement equipment is available that can place Surface Mount components at the rate of a few thousand per hour to hundreds of thousands of com- ponents per hour. Surface Mount Technology is cost effective, allowing the manufacturer the opportunity to produce smaller units and offer increased functions with the same size product. MECL AVAILABILITY IN SURFACE MOUNT Motorola is now offering MECL 10K and MECL 10KH in the PLCC (Plastic Leaded Chip Carrier) packages. MECL in PLCC may be ordered in conventional plastic rails or on Tape and Reel. Refer to the Tape and Reel section for ordering details. TAPE AND REEL Motorola has now added the convenience of Tape and Reel packaging for our growing family of standard Inte- grated Circuit products. The packaging fully conforms to the latest ELA RS-481A specification. The antistatic embossed tape provides a secure cavity sealed with a peel-back cover tape. GENERAL INFORMATION @ Reel Size 13 inch (330 mm) Suffix: R2 Tape Width 16mm @ Units/Reel 1000 MECHANICAL POLARIZATION Typical View from tape side Linear direction of travel ORDERING INFORMATION Minimum Lot Size/Device Type = 3000 Pieces. @ No Partial Reel Counts Available. @ To order devices which are to be delivered in Tape and Reel, add the appropriate suffix to the device number being ordered. EXAMPLE: ORDERING CODE SHIPMENT METHOD MC10100FN Magazines (Rails) MC10100FNR2 13 inch Tape and Reel MC10H100FN Magazines (Rails) MC10H100FNR2 13 inch Tape and Reel MC12015D Magazines (Rails) MC12015DR2 13 inch Tape and Reel DUAL-IN-LINE PACKAGE TO PLCC PIN CONVERSION DATA The following tables give the equivalent /O pinouts of Dual-In-Line (DIL) packages and Plastic Leaded Chip Car- tier (PLCC) packages. Conversion Tables tepinoi |1]2/a|4]s]e[7|8|9[10/11]12)13/14| 15/16 20 PIN PLCC [2|3 7[8| 9 ]10]12}13| 14[15[17]18|19]20 gorin vi. {1|2|3{4{s|6| 7/8] 9{r0[19[12]13]14|15|16]17|18|19]29| 20 PIN PLoc |1/2|3]4| 5] 6] 7] 8|9[10]11]12| 13|14|15] 16] 17] 18] 19[20| 2apin oi |1{2{3]4]s]e]7[8| 9[s0/14]12113{14[15] 16] 17] 18] 19|20|21|22|2324| 3a PIN PLCC |2|3]4] | 6| 2| 9 |ro|s1|12] 13] 14! 16|17|18[ 19] 20]21]23]24|25|26|27)29| 1-31