MMBD4448HTM SURFACE MOUNT FAST SWITCHING DIODE ARRAY Features Mechanical Data * * * * * * * * Fast Switching Speed Small Surface Mount Package For General Purpose Switching Applications High Conductance Lead Free/RoHS Compliant (Note 1) "Green" Device (Notes 2 and 3) * * * * Case: SOT-26 Case Material: Molded Plastic, "Green" Molding Compound, Note 5. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish annealed over Copper leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Orientation: See Diagram Weight: 0.016 grams (approximate) SOT-26 Top View Internal Schematic Top View Ordering Information (Notes 3 & 4) Part Number MMBD4448HTM-7-F Notes: Case SOT-26 Packaging 3000/Tape & Reel 1. No purposefully added lead. 2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com. 3. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants 4. For packaging details, go to our website at http://www.diodes.com. Date Code Key Year 2002 Code N Month Code Jan 1 KAD YM Marking Information KAD = Product Type Marking Code YM = Date Code Marking Y =Year (ex: T = 2006) M = Month (ex: 9 = September) 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 P R S T U V W X Y Z A B C Feb 2 MMBD4448HTM Document number: DS30302 Rev. 8 - 2 Mar 3 Apr 4 May 5 Jun 6 1 of 4 www.diodes.com Jul 7 Aug 8 Sep 9 Oct O Nov N Dec D February 2011 (c) Diodes Incorporated MMBD4448HTM Maximum Ratings @TA = 25C unless otherwise specified Characteristic Non-Repetitive Peak Reverse Voltage Symbol VRM VRRM VRWM VR VR(RMS) IFM IO Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 5) Average Rectified Output Current (Note 5) Non-Repetitive Peak Forward Surge Current Value 100 Unit V 80 V V mA mA IFSM 57 500 250 4.0 1.0 Symbol PD RJA TJ, TSTG Value 350 357 -65 to +150 Unit mW C/W C @ t = 1.0s @ t = 1.0s A Thermal Characteristics Characteristic Power Dissipation (Note 5) Thermal Resistance Junction to Ambient Air (Note 5) Operating and Storage Temperature Range Electrical Characteristics @TA = 25C unless otherwise specified Characteristic Reverse Breakdown Voltage (Note 6) Symbol V(BR)R Min 80 0.62 Max Unit V 0.72 0.855 1.0 1.25 V Forward Voltage VF Reverse Current (Note 6) IR 100 50 30 25 nA A A nA Total Capacitance Reverse Recovery Time CT trr 3.5 4.0 pF ns 5. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com. 6. Short duration pulse test used to minimize self-heating effect. 1,000 PD, POWER DISSIPATION (mW) 300 250 200 150 100 50 0 0 25 50 75 100 125 150 IF, INSTANTANEOUS FORWARD CURRENT (mA) Notes: Test Condition IR = 2.5A IF = 5.0mA IF = 10mA IF = 100mA IF = 150mA VR = 70V VR = 75V, TJ = 150C VR = 25V, TJ = 150C VR = 20V VR = 6, f = 1.0MHz VR = 6V, IF = 5mA TA, AMBIENT TEMPERATURE ( C) Fig. 1 Power Derating Curve, Total Package (Note 5) MMBD4448HTM Document number: DS30302 Rev. 8 - 2 2 of 4 www.diodes.com 100 10 TA = -40C T A = 0C 1 TA = 25C T A = 75C TA = 125C 0.1 0.4 0.8 1.2 1.6 0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element February 2011 (c) Diodes Incorporated MMBD4448HTM 3.0 f = 1MHz CT, TOTAL CAPACITANCE (pF) IR, INSTANTANEOUS REVERSE CURRENT (nA) 10,000 1,000 100 10 1 2.5 2.0 1.5 1.0 0.5 0 0.1 60 80 100 20 40 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element 0 0 10 20 30 40 VR, DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element Package Outline Dimensions A SOT-26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 0 8 All Dimensions in mm B C H K M J L D Suggested Pad Layout C2 Z C2 C1 G Y Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C1 2.40 C2 0.95 X MMBD4448HTM Document number: DS30302 Rev. 8 - 2 3 of 4 www.diodes.com February 2011 (c) Diodes Incorporated MMBD4448HTM IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2011, Diodes Incorporated www.diodes.com MMBD4448HTM Document number: DS30302 Rev. 8 - 2 4 of 4 www.diodes.com February 2011 (c) Diodes Incorporated