Features
n RoHS compliant*
n Protects one or two lines
n Unidirectional and bidirectional
configurations
n ESD protection 30 kV max.
Applications
n RS-232, RS-422 and RS-423 data lines
n Portable electronics
n Wireless bus protection
n Control and monitoring systems
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
CDSOT23-T03~T36C - TVS Diode Array Series
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
General Information
Portable communications, computing and video equipment manufacturers are challenging
the semiconductor industry to develop increasingly smaller electronic components.
Bourns oers Transient Voltage Suppressor Array diodes for surge and ESD protection
applications, in compact chip package SOT23 size format. The TransientVoltage Supressor
Array series oers a choice of voltage types ranging from 3 V to 36 V. Bourns® Chip Diodes
conform to JEDEC standards, are easy to handle on standard pick and place equipment
and their at conguration minimizes roll away.
The Bourns device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5
(Surge) requirements.
Parameter Symbol Value Unit
Operating Temperature TJ-55 to +150 ºC
Storage Temperature TSTG -55 to +150 ºC
Notes: 1. See Pulse Wave Form. 3. Only applies to unidirectional devices.
2. See Peak Pulse Power vs. Pulse Time. 4. Part numbers with a “C” sux are bidirectional devices, i.e., CDSOT23-T03C.
*RoHS COMPLIANT
LEAD FREE
*RoHS COMPLIANT
VERSIONS
AVAILABLE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter Symbol
CDSOT23-
UnitUni- Bi- Uni- Bi- Uni- Bi- Uni- Bi- Uni- Bi- Uni- Bi- Uni- Bi-
T03 T03C T05 T05C T08 T08C T12 T12C T15 T15C T24 T24C T36 T36C
Breakdown Voltage @ 1 mA VBR 4.0 6.0 8.5 13.3 16.7 26.7 40.0 V
Working Peak Voltage VWM 3.3 5.0 8.0 12.0 15.0 24.0 36.0 V
Maximum Clamping Voltage
VC @ IP = 1 A (1) VF7.0 9.8 13.4 19.0 24.0 43.0 51.0 V
Maximum Clamping Voltage
@ 8/20 µs VC = IPP (1) VF10.9 V
@ 43 A
13.5 V
@ 42 A
16.9 V
@ 34 A
25.9 V
@ 21 A
30.0 V
@ 17 A
49.0 V
@ 12 A
76.8 V
@ 9 A V
Maximum Leakage Current
@ VWM ID125 20 10 2 1 1 1 µA
Typical Capacitance - Unidirectional
@ 0 V, 1 MHz Cj(SD) 500 350 250 150 100 88 80 pF
Typical Capacitance - Bidirectional
@ 0 V, 1 MHz Cj(SD) 300 210 150 90 60 63 60 pF
ESD Protection (per IEC 61000-4-2)
Contact - Min.
Contact - Max.
Air - Min.
Air - Max.
ESD
±8
±30
±15
±30
kV
Peak Pulse Power (tp @ 8/20 µs) (2) PPP 500 W
Forward Voltage @ 100 mA,
300 µs - Square Wave (3) VF1.5 V
3
1
2
3
1
2
E2801L
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Product Dimensions
CDSOT23-T03~T36C - TVS Diode Array Series
This is a molded JEDEC SOT-323 package with 100 % Matte Sn
plating on the lead frame. It weighs approximately 0.6 g and has a
ammability rating of UL 94V-0.
Recommended Footprint
Dimensions
A0.95
(0.037)
B0.95
(0.037)
C2.00
(0.079)
D0.85
(0.033)
E0.85
(0.033)
A B
C
E
D
MILLIMETERS
(INCHES)
DIMENSIONS =
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
12
3
B
CD
HL
0 ° TO 8 °
I
GAUGE
PLANE
K
J
SEATING PLANE
SEE
DETAIL
A
DETAIL
A
G
E
F
A
MILLIMETERS
(INCHES)
DIMENSIONS =
Dimensions
A2.80 - 3.00
(0.110 - 0.118)
B0.95 BSC
(0.037)...........
C1.20 - 1.40
(0.047 - 0.055)
D2.10 - 2.49
(0.083 - 0.098)
E1.90 BSC
(0.075)...........
F0.30 - 0.50
(0.012 - 0.019)
G0.89 - 1.17
(0.035 - 0.046)
H0.05 - 0.015
(0.002 - 0.006)
I0.25 BSC
(0.010)...........
J0.46 - 0.64
(0.018 - 0.025)
K0.40 - 0.58
(0.016 - 0.023)
L0.08 - 0.20
(0.003 - 0.008)
Typical Part Marking
E1YWWL
2-DIGIT PRODUCT CODE:
E1 = CDSOT23-T03
E2 = CDSOT23-T05
E3 = CDSOT23-T08
E4 = CDSOT23-T12
E5 = CDSOT23-T15
E6 = CDSOT23-T24
E7 = CDSOT23-T36
G1 = CDSOT23-T03C
G2 = CDSOT23-T05C
G3 = CDSOT23-T08C
G4 = CDSOT23-T12C
G5 = CDSOT23-T15C
G6 = CDSOT23-T24C
G7 = CDSOT23-T36C
MANUFACTURING
DATE CODE:
Y = YEAR
WW = WEEK
L = LOT CODE
CDSOT23-T03~T36C - TVS Diode Array Series
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Performance Graphs
Peak Pulse Power vs. Pulse Time Pulse Waveform
How to Order
CD SOT23 - T 03 C
Common Code
Chip Diode
Package
• SOT23 = SOT23 Package
Model
T = Transient Voltage Suppressor
Working Peak Voltage
3 = 3 VRWM (Volts)
Sux
C = Bidirectional Diode
Power Derating Curve
Environmental Specications
Moisture Sensitivity Level ................................................................1
ESD Classication (HBM)............................................................. 3B
Block Diagram
10,000
1,000
100
10
10.01 10 10010,0001,000
PPP – Peak Pulse Current (kW)
td – Pulse Duration (µs)
0
20
40
60
80
100
0255075100 125150
% of Rated Power
TL Lead Temperature (°C)
20
40
60
80
100
120
0
030
252015105
IPP – Peak Pulse Current (% of IPP)
t – Time (µs)
Test Waveform Parameters
tt = 8 µs
td = 20 µs
500 W, 8/20 µs Waveform
Average Power
Peak Pulse Power
8/20 µs
tt
et
td = t|IPP/2
3
1
2
3
12
3
1 2
3
1
2
Unidirectional Bidirectional
10,000
1,000
100
10
10.01 10 10010,0001,000
PPP Peak Pulse Current (kW)
td Pulse Duration (µs)
0
20
40
60
80
100
0255075100 12
51
50
% of Rated Power
TL – Lead Temperature (°C)
20
40
60
80
100
120
0
030252015105
IPP Peak Pulse Current (% of IPP)
t Time (µs)
Test Waveform Parameters
tt = 8 µs
td = 20 µs
500 W, 8/20 µs Waveform
Average Power
Peak Pulse Power
8/20 µs
tt
et
td = t|IPP/2
The device block diagrams below include the pin names and basic
electrical connections associated with each channel.
.......
.......
....... ..............
....... ..............
PA
F
E
T
120 °
D2
DD
1
W1
C
Index Hole
P
0
P
1
W
B
10 pitches (min.)
Direction of Feed
10 pitches (min.)
End
Trailer Device Leader
Start
d
PA
F
E
Index
Hole
P
0
P
1
W
B
d
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in differ-
ent applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CDSOT23-T03~T36C - TVS Diode Array Series
Packaging Information
The surface mount product is packaged in an 12 mm x 8 mm tape and reel format per EIA-481 standard.
Devices are packed in accordance with EIA standard
RS-481-A.
DIMENSIONS: MM
(INCHES)
REV. 01/18
Item Symbol SOT23
Carrier Width A 2.25 ± 0.10
(0.088 ± 0.004)
Carrier Length B 2.34 ± 0.10
(0.092 ± 0.004)
Carrier Depth C1.22 ± 0.10
(0.048 ± 0.004)
Sprocket Hole d1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter D178
(7.008)
Reel Inner Diameter D1 50.0
(1.969) MIN.
Feed Hole Diameter D2 13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position E 1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position F3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch P 4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch P04.00 ± 0.10
(0.157 ± 0.004)
Embossment Center P12.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness T0.20 ± 0.10
(0.008 ± 0.004)
Tape Width W8.00 ± 0.20
(0.315 ± 0.008)
Reel Width W114.4
(0.567) MAX.
Quantity per Reel -- 3,000
Asia-Pacic:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com