(1,27 mm) .050"
MECF SERIES
Choice of
two card
thicknesses
Polarized
MECF–20–01–L–DV
MECF–05–01–L–DV–WT
Alignment
Pins
Rugged
Weld Tab
option
Up to
98 I/Os
WWW.SAMTEC.COM
MECF POSITIONS
PER ROW CARD
THICKNESS OPTION
PLATING
OPTION DV
–L
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
F-213-1
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MECF-DV
Insulator Material:
–01=Black Liquid
Crystal Polymer
–02=Natural Liquid
Crystal Polymer
Contact Material:
BeCu
Plating:
Sn or Au over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
2.5 A per contact
@ 95°C ambient
Voltage Rating:
280 V A C
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (05-30)
(0,15 mm) .006" max (40-50)
–05, –08, –20,
–30, –40, –50
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Mates with:
(1,60 mm) .062" card,
(2,36 mm) .093" card
SPECIFICATIONS
MICRO EDGE CARD SOCKET
Note: Other Gold plating
options available.
Contact Samtec.
–01
= (1,60 mm) .062"
thick card
–02
= (2,36 mm) .093"
thick card
POSITIONS
PER ROW POLARIZED
POSITIONS
(No Contact)
–05 3, 4
–08 5, 6
–20 15, 16
–30 21, 22
–40 31, 32
–50 41, 42
(1,27)
.050
(1,32)
.052
DIA
(1,10)
.043 (0,64)
.025
SQ
(1,55)
.061
(8,50)
.335
(2,54) .100
02
01
(8,78)
.346
(5,60)
.220 (6,30)
.248
(7,50)
.295
A
B
(1,72)
.068
D
02
01
C
POSITIONS
PER ROW ABCD
–05 (10,46) .412 (8,64) .340 (14,53) .572 (12,45) .490
–08 (14,27) .562 (12,45) .490 (18,34) .722 (16,26) .640
–20 (29,51) 1.162 (27,69) 1.090 (33,58) 1.322 (31,50) 1.240
–30 (42,21) 1.662 (40,39) 1.590 (46,28) 1.822 (44,20) 1.740
–40 (54,91) 2.162 (53,09) 2.090 (58,98) 2.322 (56,90) 2.240
–50 (67,61) 2.662 (65,79) 2.590 (71,68) 2.822 (69,60) 2.740
–WT OPTION
–01 –02
–WT
= Weld T abs
(Standard on
–02 card thickness,
optional on –01
card thickness)
–K
= (5,00 mm) .197" DIA
(–01 card thickness)
(5,70 mm) .224" DIA
(–02 card thickness)
Polyimide fi lm
pick & place pad
(–TR only)
–TR
= Tape & Reel
packaging
APPLICATION
SPECIFIC
Non-polarized
Call Samtec.
Note: While optimized for
50Ω applications, this
connector with alternative
signal/ground patterns may
also perform well in certain
75Ω applications. Contact
Samtec for further information.
MECF-DV Rated @ 3dB Insertion Loss*
Single-Ended Signaling 14.5 GHz / 29 Gbps
Differential Pair Signaling 14.5 GHz / 29 Gbps
*Test board losses de-embedded from perf ormance data.
Complete test data av ailab le at www.samtec.com?MECF-D V or
contact sig@samtec.com