TS68040DESC02ZAA - E2V Technologies (UK), Ltd.

Features

•26-42 MIPS Integer Performance

•3.5-5.6 MFLOPS Floating-Point-Performance

•IEEE 754-Compatible FPU

•Independent Instruction and Data MMUs

•4K bytes Physical Instruction Cache and 4K bytes Physical Data Cache Accessed

Simultaneously

•32-bit, Nonmultiplexed External Address and Data Buses with Synchronous Interface

•User-Object-Code Compatibility with All Earlier TS68000 Microprocessors

•Multimaster/Multiprocessor Support via Bus Snooping

•Concurrent Integer Unit, FPU, MMU, Bus Controller, and Bus Snooper Maximize

Throughput

•4G bytes Direct Addressing Range

•Software Support Including Optimizing C Compiler and UNIX®System V Port

•IEEE P 1149-1 Test Mode (JTAG)

•f = 25 MHz, 33 MHz; VCC =5V±5%;P

D=7W

•The Use of the TS88915T Clock Driver is Suggested

Description

The TS68040 is Atmel’s third generation of 68000-compatible, high-performance, 32-

bit microprocessors. The TS68040 is a virtual memory microprocessor employing

multiple, concurrent execution units and a highly integrated architecture to provide

very high performance in a monolithic HCMOS device. On a single chip, the TS68040

integrates a 68030-compatible integer unit, an IEEE 754-compatible floating-point unit

(FPU), and fully independent instruction and data demand-paged memory manage-

ment units (MMUs), including 4K bytes independent instruction and data caches. A

high degree of instruction execution parallelism is achieved through the use of multi-

ple independent execution pipelines, multiple internal buses, and a full internal

Harvard architecture, including separate physical caches for both instruction and data

accesses. The TS68040 also directly supports cache coherency in multimaster appli-

cations with dedicated on-chip bus snooping logic.

The TS68040 is user-object-code compatible with previous members of the TS68000

Family and is specifically optimized to reduce the execution time of compiler-gener-

ated code. The 68040 HCMOS technology, provides an ideal balance between speed,

power, and physical device size.

Figure 1 is a simplified block diagram of the TS68040. Instruction execution is pipe-

lined in both the integer unit and FPU. Independent data and instruction MMUs control

the main caches and the address translation caches (ATCs). The ATCs speed up log-

ical-to-physical address translations by storing recently used translations. The bus

snooper circuit ensures cache coherency in multimaster and multiprocessing

applications.

Screening

• MIL-STD-883

• DESC. Drawing 5962-93143

• Atmel Standards

Third-

Generation

32-bit

Microprocessor

TS68040

Rev. 2116A–HIREL–09/02

2TS68040

2116A–HIREL–09/02

Figure 1. Block Diagram

R suffix

PGA 179

Ceramic Pin Grid Array

Cavity Down

F suffix

CQFP 196

Gullwing Shape Lead

Ceramic Quad Fla Pack

INSTRUCTION

CACHE

DATA

CACHE

DATA MEMORY UNIT

INSTRUCTION MEMORY UNIT

INSTRUCTION

ATC

DATA

ATC

INSTRUCTION

FETCH

DECODE

EFFECTIVE

ADDRESS

CALCULATE

EXECUTE

EFFECTIVE

ADDRESS

FETCH

INSTRUCTION

MMU/CACHE/SNOOP

CONTROLLER

BUS

CONTROL

SIGNALS

DATA

BUS

ADDRESS

BUS

DATA

MMU/CACHE/SNOOP

CONTROLLER

OPERAND DATA BUS

INSTRUCTION DATA BUS

INSTRUCTION

ADDRESS

DATA

ADDRESS

WRITE

BACK

INTEGER

UNIT

CONVERT

EXECUTE

WRITE

BACK

FLOATING-

POINT

UNIT

TS68040

2116A–HIREL–09/02

Introduction The TS68040 is an enhanced, 32-bit, HCMOS microprocessor that combines the inte-

ger unit processing capabilities of the TS68030 microprocessor with independent

4K bytes data and instruction caches and an on-chip FPU. The TS68040 maintains the

32-bit registers available with the entire TS68000 Family as well as the 32-bit address

and data paths, rich instruction set, and versatile addressing modes. Instruction execu-

tion proceeds in parallel with accesses to the internal caches, MMU operations, and bus

controller activity. Additionally, the integer unit is optimized for high-level language

environments.

The TS68040 FPU is user-object-code compatible with the TS68882 floating-point

coprocessor and conforms to the ANSI/IEEE Standard 754 for binary floating-point arith-

metic. The FPU has been optimized to execute the most commonly used subset of the

TS68882 instruction set, and includes additional instruction formats for single and dou-

ble-precision rounding of results. Floating-point instructions in the FPU execute

concurrently with integer instructions in the integer unit.

The MMUs support multiprocessing, virtual memory systems by translating logical

addresses to physical addresses using translation tables stored in memory. The MMUs

store recently used address mappings in two separate ATCs-on-chip. When an ATC

contains the physical address for a bus cycle requested by the processor, a translation

table search is avoided and the physical address is supplied immediately, incurring no

delay for address translation. Each MMU has two transparent translation registers avail-

able that define a one-to-one mapping for address space segments ranging in size from

16M bytes to 4G bytes each.

Each MMU provides read-only and supervisor-only protections on a page basis. Also,

processes can be given isolated address spaces by assigning each a unique table

structure and updating the root pointer upon a task swap. Isolated address spaces pro-

tect the integrity of independent processes.

The instruction and data caches operate independently from the rest of the machine,

storing information for fast access by the execution units. Each cache resides on its own

internal address bus and internal data bus, allowing simultaneous access to both. The

data cache provides write through or copyback write modes that can be configured on a

page-by-page basis.

The TS68040 bus controller supports a high-speed, non multiplexed, synchronous

external bus interface, which allows the following transfer sizes: byte, word (2 bytes),

long word (4 bytes), and line (16 bytes). Line accesses are performed using burst trans-

fers for both reads and writes to provide high data transfer rates.

4TS68040

2116A–HIREL–09/02

Pin Assignments

PGA 179

Figure 2. Bottom View

Table 1. Power Supply Affectation to PGA Body

GND VCC

PLL S8

Internal Logic C6, C7, C9, C11,C13, K3, K16, L3, M16, R4, R11, R13,

S10,T4,S9,R6,R10

C5, C8, C10, C12, C14, H3, H16, J3, J16, L16, M3, R5,

R12, R8

Output Drivers B2, B4, B6, B8, B10, B13, B15, B17, D2, D17, F2, F17,

H2, H17, L2, L17, N2, N17, Q2, Q17, S2, S15, S17

B5, B9, B14, C2, C17, G2, G17, M2, M17, R2, R17,

S16

TS68040

2116A–HIREL–09/02

CQFP 196

Figure 3. Pin Assignments

Table 2. Power Supply Affectation to CQFP Body

GND VCC

PLL 127

Internal Logic 4, 9, 10, 19, 32, 45, 73, 88, 113, 119, 121, 122, 124,

125, 129, 130, 141, 159, 172

3, 18, 31, 40, 46, 60, 72, 87, 114, 126, 137, 158, 173,

186

Output Drivers 7, 15, 22, 28, 35, 42, 49, 50, 51, 57, 63, 69, 76, 77, 83,

84, 91, 97, 98, 99, 105, 106, 146, 147, 148, 149, 155,

162, 163, 169, 176, 182, 183, 189, 195, 196

12, 25, 38, 54, 66, 80, 94, 102, 152, 166, 179, 192

6TS68040

2116A–HIREL–09/02

Signal Description Figure 4 and Table 3 describe the signals on the TS68040 and indicate signal functions.

The test signals, TRST, TMS, TCK, TDI, and TDO, comply with subset P-1149.1 of the

IEEE testability bus standard.

Figure 4. Functional Signal Groups

TS68040

2116A–HIREL–09/02

Table 3. Signal Index

Signal Name Mnemonic Function

Address Bus A31-A0 32-bit address bus used to address any of 4G bytes

Data Bus D31-D0 32-bit data bus used to transfer up to 32 bits of data per bus transfer

Transfer Type TT1, TT0 Indicates the general transfer type: normal, MOVE 16, alternate logical function

code, and acknowledge

Transfer Modifier TM2, TM0 Indicates supplemental information about the access

Transfer Line Number TLN1, TLN0 Indicates which cache line in a set is being pushed or loaded by the current line

transfer

User Programmable Attributes UPA1,

UPA0

User-defined signals, controlled by the corresponding user attribute bits from the

address translation entry

Read Write R/W Identifies the transfer as a read or write

Transfer Size SIZ1, SIZ0 Indicates the data transfer size. These signals, together with A0 and A1, define the

active sections of the data bus

Bus Lock LOCK Indicates a bus transfer is part of a read-modify-write operation, and that the

sequence of transfers should not be interrupted

BusLockEnd LOCKE Indicates the current transfer is the last in a locked sequence of transfer

Cache Inhibit Out CIOUT Indicates the processor will not cache the current bus transfer

Transfer Start TS Indicates the beginning of a bus transfer

Transfer in Progress TIP Asserted for the duration of a bus transfer

Transfer Acknowledge TA Asserted to acknowledge a bus transfer

Transfer Error Acknowledge TEA Indicates an error condition exists for a bus transfer

Transfer Cache Inhibit TCI Indicates the current bus transfer should not be cached

Transfer Burst Inhibit TBI Indicates the slave cannot handle a line burst access

Data Latch Enable DLE Alternate clock input used to latch input data when the processor is operating in

DLE mode

Snoop Control SC1, SC0 Indicates the snooping operation required during an alternate master access

Memory Inhibit MI Inhibits memory devices from responding to an alternate master access during

snooping operations

Bus Request BR Asserted by the processor to request bus mastership

Bus Grant BG Asserted by an arbiter to grant bus mastership to the processor

Bus Busy BB Asserted by the current bus master to indicate it has assumed ownership of the bus

Cache Disable CDIS Dynamically disables the internal caches to assist emulator support

MMU Disable MDIS Disables the translation mechanism of the MMUs

Reset In RSTI Processor reset

Reset Out RSTO Asserted during execution of the RESET instruction to reset external devices

Interrupt Priority Level IPL2-IPL0 Provides an encoded interrupt level to the processor

Interrupt Pending IPEND Indicates an interrupt is pending

Autovector AVEC Used during an interrupt acknowledge transfer to request internal generation of the

vector number

Processor Status PST3-PST0 Indicates internal processor status

8TS68040

2116A–HIREL–09/02

Scope This drawing describes the specific requirements for the microprocessor TS68040 -

25 MHz and 33 MHz, in compliance with MIL-STD-883 class B or Atmel standard

screening.

Applicable

Documents

MIL-STD-883 1. MIL-STD-883: test methods and procedures for electronics.

2. MIL-I-38535: general specifications for microcircuits.

3. DESC 5962-93143.

Requirements

General The microcircuits are in accordance with the applicable document and as specified

herein.

Design and Construction

Terminal Connections See Figure 2 and Figure 3.

Lead Material and Finish Lead material and finish shall be as specified in MIL-STD-883 (see enclosed “MIL-STD-

883 C and Internal Standard”on page 46).

Package The macro circuits are packaged in hermetically sealed ceramic packages which con-

form to case outlines of MIL-STD-1835-or as follow:

•CMGA 10-179-PAK pin grid array, but see “179 pins –PGA”on page 43.

•Similar to CQCC1-F196C-U6 ceramic uniform lead chip carrier package with

ceramic nonconductive tie-bar but use Atmel’s internal drawing, see “196 pins –Tie

Bar CQFP Cavity Up (on request)”on page 44.

•Gullwing shape CQFP see “196 pins –Gullwing CQFP cavity up”on page 45.

Bus Clock BCLK Clock input used to derive all bus signal timing

Processor Clock PCLK Clock input used for internal logic timing. The PCLK frequency is exactly 2X the

BCLK frequency

Test Clock TCK Clock signal for the IEEE P1149.1 test access port (TAP)

Test Mode Select TMS Selects the principle operations of the test-support circuitry

Test Data Input TDI Serial data input for the TAP

Test Data Output TDO Serial data output for the TAP

Test Reset TRST Provides an asynchronous reset of the TAP controller

Power Supply VCC Power supply

Ground GND Ground connection

Table 3. Signal Index (Continued)

Signal Name Mnemonic Function

TS68040

2116A–HIREL–09/02

The precise case outlines are described at the end of the specification (See “Package

Mechanical Data”on page 43.) and into MIL-STD-1835.

Electrical Characteristics

Absolute Maximum Ratings Stresses above the absolute maximum rating may cause permanent damage to the

device. Extended operation at the maximum levels may degrade performance and affect

reliability.

Note: 1. This device is not tested at TC = +125°C. Testing is performed by setting the junction temperature Tj = +125°C and allowing

the case and ambient temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.

Note: 1. This device is not tested at TC = +125°C. Testing is performed by setting the junction temperature TJ=+125°C and allowing

the case and ambient temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.

Table 4. Absolute Maximum Ratings

Symbol Parameter Condition Min Max Unit

VCC Supply Voltage Range -0.3 7.0 V

VIInput Voltage Range -0.3 7.0 V

PDPower Dissipation Large buffers enabled 7.7 W

Small buffers enabled 6.3 W

TCOperating Temperature -55 TJ°C

Tstg Storage Temperature Range -65 +150 °C

TJJunction Temperature(1) +125 °C

Tlead Lead Temperature Max.10 sec soldering +300 °C

Table 5. Recommended Conditions of Use

Unless otherwise stated, all voltages are referenced to the reference terminal

Symbol Parameter Min Typ Max Unit

VCC Supply Voltage Range +4.75 +5.25 V

VIL

Logic Low Level Input Voltage Range GND

-0.3 0.8 V

VIH Logic High Level Input Voltage Range +2.0 VCC +0.3 V

VOH High Level Output Voltage 2.4 V

VOL Low Level Output Voltage 0.5 V

Clock Frequency -25 MHz Version 25 MHz

-33 MHz Version 33 MHz

TCCase Operating Temperature Range(1) -55 TJmax °C

TJMaximum Operating Junction Temperature +125 °C

10 TS68040

2116A–HIREL–09/02

Thermal Considerations

General Thermal

Considerations

This section is only given as user information.

As microprocessors are becoming more complex and requiring more power, the need to

efficiently cool the device becomes increasingly more important. In the past, the

TS68000 Family, has been able to provide a 0-70°C ambient temperature part for

speeds less than 40 MHz. However, the TS68040, which has a 50 MHz arithmetic logic

unit (ALU) speed, is specified with a maximum power dissipation for a particular mode, a

maximum junction temperature, and a thermal resistance from the die junction to the

case. This provides a more accurate method of evaluating the environment, taking into

consideration both the air-flow and ambient temperature available. This also allows a

user the information to design a cooling method which meets both thermal performance

requirements and constraints of the board environment.

This section discusses the device characteristics for thermal management, several

methods of thermal management, and an example of one method of cooling the

TS68040.

Thermal Device

Characteristics

The TS68040 presents some inherent characteristics which should be considered when

evaluating a method of cooling the device. The following paragraphs discuss these

die/package and power considerations.

Die and Package The TS68040 is being placed in a cavity-down alumina-ceramic 179-pin PGA that has a

specified thermal resistance from junction to case of 1°C/W. This package differs from

previous TS68000 Family PGA packages which were cavity up. This cavity-down design

allows the die to be attached to the top surface of the package, which increases the abil-

ity of the part to dissipate heat through the package surface or an attached heat sink.

The maximum perimeter that the TS68040 allows for a heat sink on its surface without

interfering with the capacitor pads is 1.48" x 1.48". The specific dimensions and design

of the particular heat sink will need to be determined by the system designer considering

both thermal performance requirements and size requirements.

Power Considerations The TS68040 has a maximum power rating, which varies depending on the operating

frequency and the output buffer mode combination being used. The large buffer output

mode dissipates more power than the small, and the higher frequencies of operation

dissipate more power than the lower frequencies. The following paragraphs discuss

trade-offs in using the different output buffer modes, calculation of specific maximum

power dissipation for different modes, and the relationship of thermal resistances and

temperatures.

TS68040

2116A–HIREL–09/02

Output Buffer Mode The 68040 is capable of resetting to enable for a combination of either large buffers or

small buffers on the outputs of the miscellaneous control signals, data bus, and address

bus/transfer attribute pins. The large buffers offer quicker output times, which allow for

an easier logic design. However, they do so by driving about 11 times as much current

as the small buffers (refer to TS68040 Electrical specifications for current output). The

designer should consider whether the quicker timings present enough advantage to jus-

tify the additional consideration to the individual signal terminations, the die power

consumption, and the required cooling for the device. Since the TS68040 can be pow-

ered-up in one of eight output buffer modes upon reset, the actual maximum power

consumption for TS68040 rated at a particular maximum operating frequency is depen-

dent upon the power up mode. Therefore, the TS68040 is rated at a maximum power

dissipation for either the large buffers or small buffers at a particular frequency (refer to

TS68040 Electrical specifications). This allows the possibility of some of the thermal

management to be controlled upon reset. The following equation provides a rough

method to calculate the maximum power consumption for a chosen output buffer mode:

PD=P

DSB +(P

DLB -P

DSB)·(PINSLB/PINSCLB)(1)

where:

PD= Max. power dissipation for output buffer mode

selected

PDSB = Max. power dissipation for small buffer mode

(all outputs)

PDLB = Max. power dissipation for large buffer mode

(all outputs)

PINSLB = Number of pins large buffer mode

PINSCLB = Number of pins capable of the large buffer

mode

Table 6 shows the simplified relationship on the maximum power dissipation for eight

possible configurations of output buffer modes.

Table 6. Maximum Power Dissipation for Output Buffer Mode Configurations

Output Configuration Maximum Power Dissipation

Data Bus

Address Bus and

Transfer Attrib.

Misc. Control

Signals PD

Small Buffer Small Buffer Small Buffer PDSB

Small Buffer Small Buffer Large Buffer PDSB +(P

DLB -P

DSB)·13%

Small Buffer Large Buffer Small Buffer PDSB +(P

DLB -P

DSB)·52%

Small Buffer Large Buffer Large Buffer PDSB +(P

DLB -P

DSB)·65%

Large Buffer Small Buffer Small Buffer PDSB +(P

DLB -P

DSB)·35%

Large Buffer Small Buffer Large Buffer PDSB +(P

DLB -P

DSB)·48%

Large Buffer Large Buffer Small Buffer PDSB +(P

DLB -P

DSB)·87%

Large Buffer Large Buffer Large Buffer PDSB +(P

DLB -P

DSB)·100%

12 TS68040

2116A–HIREL–09/02

To calculate the specific power dissipation of a specific design, the termination method

of each signal must be considered. For example, a signal output that is not connected

would not dissipate any additional power if it were configured in the large buffer rather

than the small buffer mode.

Relationships Between

Thermal Resistances and

Temperatures

Since the maximum operating junction temperature has been specified to be 125°C.

The maximum case temperature, TC, in °C can be obtained from:

TC=T

J-P

D·ΦJC (2)

where:

TC= Maximum case temperature

TJ= Maximum junction temperature

PD= Maximum power dissipation of the device

ΦJC = Thermal resistance between the junction of the die and the case

In general, the ambient temperature, TA,in°C is a function of the following formula:

TA=T

J-P

D·ΦJC -P

D·ΦCA (3)

Where the thermal resistance from case to ambient, ΦCA, is the only user-dependent

parameter once a buffer output configuration has been determined. As seen from equa-

tion (3), reducing the case to ambient thermal resistance increases the maximum

operating ambient temperature. Therefore, by utilizing such methods as heat sinks and

ambient air cooling to minimize the ΦCA, a higher ambient operating temperature and/or

a lower junction temperature can be achieved.

However, an easier approach to thermal evaluation uses the following formulas:

TA=T

J-P

D·ΦJA (4)

or alternatively,

TJ=T

A-P

D·ΦJA (5)

where:

ΦJA = thermal resistance from the junction to the ambient (ΦJC +ΦCA).

This total thermal resistance of a package, ΦJA, is a combination of its two components,

ΦJC and ΦCA. These components represent the barrier to heat flow from the semicon-

ductor junction to the package (case) surface (ΦJC) and from the case to the outside

ambient (ΦJC). Although ΦJC is device related and cannot be influenced by the user, ΦCA

is user dependent. Thus, good thermal management by the user can significantly

reduce ΦCA achieving either a lower semiconductor junction temperature or a higher

ambient operating temperature.

Thermal Management

Techniques

To attain a reasonable maximum ambient operating temperature, a user must reduce

the barrier to heat flow from the semiconductor junction to the outside ambient (ΦJA).

The only way to accomplish this is to significantly reduce ΦCA by applying such thermal

management techniques as heat sinks and ambient air cooling.

The following paragraphs discuss some results of a thermal study of the TS68040

device without using any thermal management techniques; using only air-flow cooling,

using only a heat sink, and using heat sink combined with air-flow cooling.

TS68040

2116A–HIREL–09/02

Thermal Characteristics in

Still Air

A sample size of three TS68040 packages was tested in free-air cooling with no heat

sink. Measurements showed that the average ΦJA was 22.8°C/W with a standard devia-

tion of 0.44°C/W. The test was performed with 3W of power being dissipated from within

the package. The test determined that ΦJA will decrease slightly for the increasing power

dissipation range possible. Therefore, since the variance in ΦJA within the possible

power dissipation range is negligible, it can be assumed for calculation purposes that

ΦJA is valid at all power levels. Using the formulas introduced previously, Table 7 shows

the results of a maximum power dissipation of 3 and 5W with no heat sink or air-flow

(refer to Table 6 to calculate other power dissipation values).

As seen by looking at the ambient temperature results, most users will want to imple-

ment some type of thermal management to obtain a more reasonable maximum

ambient temperature.

Thermal Characteristics in

Forced Air

A sample size of three TS68040 packages was tested in forced air cooling in a wind tun-

nel with no heat sink. This test was performed with 3W of power being dissipated from

within the package. As previously mentioned, since the variance in ΦJA within the possi-

ble power range is negligible, it can be assumed for calculation purposes that ΦJA is

constant at all power levels. Using the previous formulas, Table 8 shows the results of

the maximum power dissipation at 3 and 5W with air-flow and no heat sink (refer to

Table 6 to calculate other power dissipation values).

Table 7. Thermal Parameters With No Heat Sink or Air-flow

Defined Parameters Measured Calculated

PDTJΦJC ΦJA ΦCA =ΦJA -ΦJC TC=T

J-P

D*ΦJC TA=T

J-P

D*ΦJA

3 Watts 125°C1°C/W 21.8°C/W 20.8°C/W 122°C 59.6°C

5 Watts 125°C1°C/W 21.8°C/W 20.8°C/W 120°C16°C

Table 8. Thermal Parameters With Forced Air Flow and No Heat Sink

Thermal Mgmt.

Technique Defined Parameters Measured Calculated

Air-flow velocity PDTJΦJC ΦJA ΦCA TCTA

100 LFM 3W 125°C1°C/W 11.7°C/W 10.7°C/W 122°C 89.9°C

250 LFM 3W 125°C1°C/W 10°C/W 9°C/W 122°C95°C

500 LFM 3W 125°C1°C/W 8.9°C/W 7.9°C/W 122°C 98.3°C

750 LFM 3W 125°C1°C/W 8.5°C/W 7.5°C/W 122°C 99.5°C

1000 LFM 3W 125°C1°C/W 8.3°C/W 7.3°C/W 122°C 100.1°C

100 LFM 5W 125°C1°C/W 11.7°C/W 10.7°C/W 120°C 66.5°C

250 LFM 5W 125°C1°C/W 10°C/W 9°C/W, 120°C75°C

500 LFM 5W 125°C1°C/W 8.9°C/W 7.9°C/W 120°C 80.5°C

750 LFM 5W 125°C1°C/W 8.5°C/W 7.5°C/W 120°C 82.5°C

1000 LFM 5W 125°C1°C/W 8.3°C/W 7.3°C/W 120°C 83.5°C

14 TS68040

2116A–HIREL–09/02

By reviewing the maximum ambient operating temperatures, it can be seen that by

using the all-small-buffer configuration of the TS68040 with a relatively small amount of

air flow (100 LFM), a 0-70°C ambient operating temperature can be achieved. However,

depending on the output buffer configuration and available forced-air cooling, additional

thermal management techniques may be required.

Thermal Characteristics with

a Heat Sink

In choosing a heat sink the designer must consider many factors: heat sink size and

composition, method of attachment, and choice of a wet or dry connection. The follow-

ing paragraphs discuss the relationship of these decisions to the thermal performance of

the design noticed during experimentation.

The heat sink size is one of the most significant parameters to consider in the selection

of a heat sink. Obviously a larger heat sink will provide better cooling. However, it is less

obvious that the most benefit of the larger heat sink of the pin fin type used in the exper-

imentation would be at still air conditions. Under forced-air conditions as low as 100

LFM, the difference between the ΦCA becomes very small (0.4°C/W or less). This differ-

ence continues to decrease as the forced air flow increases. The particular heat sink

used in our testing fit the perimeter package surface area available within the capacitor

pads on the TS68040 (1.48" x 1.48") and showed a nice compromise between height

and thermal performance needs. The heat sink base perimeter area was 1.24" x 1.30"

and its height was 0.49". It was a pin-fin-type (i.e. bed of nails) design composed of Al

alloy. The heat sink is shown in Figure 5 can be obtained through Thermalloy Inc. by ref-

erencing part number 2338B.

Figure 5. Heat Sink Example

TS68040

2116A–HIREL–09/02

All pin fin heat sinks tested were made from extrusion Al products. The planar face of

the heat sink mating to the package should have a good degree of planarity; if it has any

curvature, the curvature should be convex at the central region of the heat sink surface

to provide intimate physical contact to the PGA surface. All heat sinks tested met this

criteria. Nonplanar, concave curvature the central regions of the heat sink will result in

poor thermal contact to the package. A specification needs to be determined for the pla-

narity of the surface as part of any heat sink design.

Although there are several ways to attach a heat sink to the package, it was easiest to

use a demountable heat sink attach called “E-Z attach for PGA packages”developed by

Thermalloy (see Figure 6). The heat sink is clamped to the package with the help of a

steel spring to a plastic frame (or plastic shoes Besides the height of the heat sink and

plastic frame, no additional height added to the package. The interface between the

ceramic package and the heat sink was evaluated for both dry and wet (i.e., thermal

grease) interfaces in still air. The thermal grease reduced the ΦCA quite significantly

(about 2.5 °C/W) in still air. Therefore, it was used in all other testing done with the heat

sink. According to other testing, attachment with thermal grease provided about the

same thermal performance as if a thermal epoxy were used.

Figure 6. Heat Sink with Attachment

A sample size of one TS68040 package was tested in still air with the heat sink and

attachment method previously described. This test was performed with 3W of power

being dissipated from within the package. Since the variance in ΦJA within the possible

power range is negligible, it can be assumed for calculation purposes that ΦJA is con-

stant at all power levels. Table 9 shows the result assuming a maximum power

dissipation of the part at 3 and 5W (refer to Table 6 to calculate other power dissipation

values).

16 TS68040

2116A–HIREL–09/02

Thermal Characteristics with

a Heat Sink

and Forced Air

A sample size of three TS68040 packages was tested in forced-air cooling in a wind tun-

nel with a heat sink. This test was performed with 3W of power being dissipated from

within the package. As mentioned previously, the variance in ΦJA within the possible

power range is negligible; it can be assumed for calculation purposes that ΦJA is valid at

all power levels. Table 10 shows the results, assuming a maximum power dissipation at

3 and 5W with air flow and heat sink thermal management (refer to Table 6 to calculate

other power dissipation values).

Thermal Testing Summary Testing proved that a heat sink in combination with a relatively small amount of air-flow

(100 LFM or less) will easily realize a 0-70°C ambient operating temperature for the

TS68040 with almost any configuration of the output buffers. A heat sink alone may be

capable of providing all necessary cooling, depending on the particular heat sink

height/size restraints, the maximum ambient operating temperature required, and the

output buffer configuration chosen. Also forced air cooling alone may attain a 0-70°C

ambient operating temperature. However this factor is highly dependent on the output

buffer configuration chosen and the available forced air for cooling. Figure 7 is a sum-

mary of the test results of the relationship between ΦJA and air-flow for the TS68040.

Table 9. Thermal Parameters With Heat Sink and No Air Flow

Thermal Mgmt.

Technique Defined Parameters Measured Calculated

Heat Sink PDTJΦJC ΦJA ΦCA TCTA

2338B 3W 125°C1°C/W 14°C/W 13°C/W 122°C83°C

2338B 5W 125°C1°C/W 14°C/W 13°C/W 120°C55°C

Table 10. Thermal Parameters with Heat Sink and Air Flow

Thermal Mgmt. Technique Defined Parameters Measured Calculated

Air-flow Heat sink PDTJΦJC ΦJA ΦCA TCTA

100 LFM 2338B 3W 125°C1°C/W 3.1°C/W 2.1°C/W 122°C 115.7°C

250 LFM 2338B 3W 125°C1°C/W 2.2°C/W 1.2°C/W 122°C 118.4°C

500 LFM 2338B 3W 125°C1°C/W 1.7°C/W 0.7°C/W 122°C 119.9°C

750 LFM 2338B 3W 125°C1°C/W 1.5°C/W 0.5°C/W 122°C 120.5°C

1000 LFM 2338B 3W 125°C1°C/W 1.4°C/W 0.4°C/W 122°C 120.8°C

100 LFM 2338B 5W 125°C1°C/W 3.1°C/W 2.1°C/W 120°C 109.5°C

250 LFM 2338B 5W 125°C1°C/W 2.2°C/W 1.2°C/W 120°C 114°C

500 LFM 2338B 5W 125°C1°C/W 1.7°C/W 0.7°C/W 120°C 116.5°C

750 LFM 2338B 5W 125°C1°C/W 1.5°C/W 0.5°C/W 120°C 117.5°C

1000 LFM 2338B 5W 125°C1°C/W 1.4°C/W 0.4°C/W 120°C 118°C

TS68040

2116A–HIREL–09/02

Figure 7. Relationship of ΦJA Air-Flow for PGA

Mechanical and

Environment

The microcircuits shall meet all mechanical environmental requirements of either MIL-

STD-883 for class B devices or for Atmel standard screening.

Marking The document where are defined the marking are identified in the related reference doc-

uments. Each microcircuit are legible and permanently marked with the following

information as minimum:

•Atmel Logo

•Manufacturer’s Part Number

•Class B Identification

•Date-code Of Inspection Lot

•ESD Identifier If Available

•Country Of Manufacturing

Table 11. Characteristics Guaranteed

Package Symbol Parameter Value Unit

PGA 179

θJ-A Thermal Resistance Junction-to-ambient See Figure 7 °C/W

θJ-C Thermal Resistance Junction-to-case 1 °C/W

CQFP 196

θJ-A Thermal Resistance Junction-to-ambient TBD °C/W

θJ-C Thermal Resistance Junction-to-case 1 °C/W

18 TS68040

2116A–HIREL–09/02

Quality Conformance

Inspection

DESC/MIL-STD-883 Is in accordance with MIL-M-38535 and method 5005 of MIL-STD-883. Group A and B

inspections are performed on each production lot. Groups C and D inspection are per-

formed on a periodical basis.

Electrical

Characteristics

General Requirements All static and dynamic electrical characteristics specified for inspection purposes and the

relevant measurement conditions are given below:

•Table 12: Static electrical characteristics for the electrical variants.

•Table 13: Dynamic electrical characteristics for TS68040 (25 MHz, 33 MHz).

For static characteristics (Table 12), test methods refer to IEC 748-2 method number,

where existing.

For dynamic characteristics (Table 13), test methods refer to clause “Static Characteris-

tics”on page 18 of this specification.

Indication of “min.”or “max.”in the column «test temperature»means minimum or max-

imum operating temperature as defined in sub-clause Table 5 here above.

Static Characteristics

Table 12. Electrical Characteristics

-55°C≤ TC≤ TJmax; 4.75V ≤ VCC ≤ 5.25V unless otherwise specified(1)(2)(3)(4)

Symbol Characteristic Min Max Unit

VIH Input High Voltage 2 VCC V

VIL Input Low Voltage GND 0.8 V

VUUndershoot -0.8 V

Iin Input Leakage Current

at 0.5/2.4V

AVEC,BCLKBG,CDIS,

IPLn,MDIS, PCLK, RSTI,SCn,

TBI,TCI,TCK,TEA

-20 20 µA

ITSI Hi-z (Off-state) Leakage Current

at 0.5/2.4V

An, BB,CIOUT, Dn, LOCK,

LOCKE,R/W,SIZn,TA,TDO,

TIP

, TLNn, TMn, TS,TTn,UPAn

-20 20 µA

IIL Signal Low Input Current

VIL =0.8V

TMS, TDI, TRST -1.1 -0.18 mA

IIH Signal High Input Current

VIH =2.0V

TMS, TDI, TRST -0.94 -0.16 mA

VOH Output High Voltage

Larger Buffers - IOH =35mA

Small Buffers - IOH =5mA

2.4 V

TS68040

2116A–HIREL–09/02

Notes: 1. All testing to be performed using worst-case test conditions unless otherwise specified.

2. Maximum operating junction temperature (TJ) = +125°. Minimum case operating temperature (TC)=-55°.Thisdeviceisnot

tested at TC= +125°. Testing is performed by setting the junction temperature TJ= +125°and allowing the case and ambient

temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.

3. Capacitance is periodically sampled rather than 100% tested.

4. Power dissipation may vary in between limits depending on the application.

Dynamic Characteristics

Notes: 1. All testing to be performed using worst-case test conditions unless otherwise specified.

2. Maximum operating junction temperature (TJ) = +125°. Minimum case operating temperature (TC)=-55°.Thisdeviceisnot

tested at TC= +125°. Testing is performed by setting the junction temperature TJ= +125°and allowing the case and ambient

temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.

3. Specification value at maximum frequency of operation.

4. If not tested, shall be guaranteed to the limits specified.

VOL Output Low Voltage

Larger buffers - IOL =35mA

Small buffers - IOL =5mA

0.5 V

PDPower Dissipation (TJ= 125°C)

Larger Buffers Enabled

Small Buffers Enabled

7.7

6.3 W

Cin Capacitance - Note 4

Vin =0V,f=1MHz 25 pF

Table 12. Electrical Characteristics (Continued)

-55°C≤ TC≤ TJmax; 4.75V ≤ VCC ≤ 5.25V unless otherwise specified(1)(2)(3)(4)

Symbol Characteristic Min Max Unit

Table 13. Clock AC Timing Specifications (see Figure 8)

-55°C≤ TC≤ TJmax; 4.75V ≤ VCC ≤ 5.25V unless otherwise specified(1)(2)(3)(4)

Num Characteristic

25 MHz 33 MHz

UnitMin Max Min Max

Frequency of Operation 20 25 20 33 MHz

1PCLKCycleTime 20251525ns

2 PCLK Rise Time(4) 1.7 1.7 ns

3PCLKFallTime

(4) 1.6 1.6 ns

4 PCLK Duty Cycle Measured at 1.5V(4) 47.5 52.5 46.67 53.33 %

4a PCLK Pulse Width High Measured at 1.5V(3)(4) 9.5 10.5 7 8 ns

4b PCLK Pulse Width Low Measured at 1.5V(3)(4) 9.5 10.5 7 8 ns

5BCLKCycleTime 40503060ns

6, 7 BCLK Rise and Fall Time 4 3 ns

8 BCLK Duty Cycle Measured at 1.5V(4) 40 60 40 60 %

8a BCLK Pulse Width High Measured at 1.5V(4) 16 24 12 18 ns

8b BCLK Pulse Width Low Measured at 1.5V(4) 16 24 12 18 ns

9 PCLK, BCLK Frequency Stability(4) 1000 1000 ppm

10 PCLK to BCLK Skew 9 n/a ns

20 TS68040

2116A–HIREL–09/02

Figure 8. Clock Input Timing

Table 14. Output AC Timing Specifications(1) (Figure 9 to Figure 15)

These output specifications are only for 25 MHz. They must be scaled for lower operating frequencies. Refer to

TS6804DH/AD for further information. -55°C≤ TC≤ TJmax; 4.75V ≤ VCC ≤ 5.25V unless otherwise specified.(2)(3)(4)

Num Characteristic

25 MHz 33 MHz

Unit

Large

Buffer(1)

Small

Buffer(1)

Large

Buffer(1)

Small

Buffer(1)

Min Max Min Max Min Max Min Max

11 BCLK to address CIOUT,LOCK,LOCKE,

R/W, SIZn, TLN, TMn, UPAn valid(5)

9 21 9 30 6.50 18 6.50 25 ns

12 BCLK to output invalid (output hold) 9 9 6.50 6.50 ns

13 BCLK to TS valid 9 21 9 306.50186.5025 ns

14 BCLK to TIP valid 9 21 9 30 6.50 18 6.50 25 ns

18 BCLK to data-out valid(6) 9 23 9 32 6.50 20 6.50 27 ns

19 BCLK to data-out invalid (output hold)(6) 9 9 6.50 6.50 ns

20 BCLK to output low impedance(5)(6) 9 9 6.50 6.50 ns

21 BCLK to data-out high impedance 9 20 9 20 6.50 17 6.50 17 ns

26 BCLK to multiplexed address valid(5) 19 31 19 40 14 26 14 33 ns

27 BCLK to multiplexed address driven(5) 19 19 14 14 ns

28 BCLK to multiplexed address high

impedance(5)(6)

9 18 9 18 6.50 15 6.50 15 ns

29 BCLK to multiplexed data driven(6) 19 19 14 20 14 20 ns

30 BCLK to multiplexed data valid(6) 19 33 19 42 14 28 14 35 ns

38 BCLK to address CIOUT

,LOCK,LOCKE,R/W,

SIZn, TS, TLNn, TMn, TTn, UPAn high

impedance(5)

9 18 9 18 6.50 15 6.50 15 ns

39 BCLK to BB,TA,TIPhigh impedance 19 28 19 28 14 23 14 23 ns

40 BCLK to BR,BBvalid 9 21 9 306.50186.5025 ns

43 BCLK to MI valid 9 21 9 306.50186.5025 ns

48 BCLK to TA valid 9 21 9 306.50186.5025 ns

50 BCLK to IPEND, PSTn, RSTO valid 9 21 9 306.50186.5025 ns

TS68040

2116A–HIREL–09/02

Notes: 1. Output timing is specified for a valid signal measured at the pin. Large buffer timing is specified driving a 50Ωtransmission

line with a length characterized by a 2.5 ns one-way propagation delay, terminated through 50Ωto 2.5V. Large buffer output

impedance is typically 3Ω, resulting in incident wave switching for this environment. Small buffer timing is specified driving

an unterminated 30Ωtransmission line with a length characterized by a 2.5 ns one-way propagation delay. Small buffer out-

put impedance is typically 30Ω; the small buffer specifications include approximately 5 ns for the signal to propagate the

length of the transmission line and back.

2. All testing to be performed using worst-case test conditions unless otherwise specified.

3. The following pins are active low: AVEC,BG,BS,BR,CDIS,CIOUT, IPEND,IPLO,IPL1,IPL2,LOCK,LOCKE,MDIS,MI,

RST0,RSTI,TA,TBI,TCI,TEA,TIP,TRST,TSand W of R/W.

4. Maximum operating junction temperature (TJ) = +125°. Minimum case operating temperature (TC)=-55°.Thisdeviceisnot

tested at TC= +125°. Testing is performed by setting the junction temperature TJ= +125°and allowing the case and ambient

temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.

5. Timing specifications 11, 20 and 38 for address bus output timing apply when normal bus operation is selected. Specifica-

tions 26, 27 and 28 should be used when the multiplexed bus mode of operation is enabled.

6. Timing specifications 18 and 19 for data bus output timing apply when normal bus operation is selected. Specifications 28

and 29 should be used when the multiplexed bus mode of operation is enabled.

Table 15. Input AC Timing Specifications (Figure 9 to Figure 15)

-55°C≤ TC≤ TJmax; 4.75V ≤ VCC ≤ 5.25V unless otherwise specified(1)(2)(3)(4)

Num Characteristic

25 MHz 33 MHz

UnitMin. Max. Min. Max.

15 Data-in Valid to BCLK (Setup) 5 4 ns

16 BCLK to Data-in Invalid (Hold) 4 4 ns

17 BCLK to Data-in High Impedance (Read Followed By Write) 49 36.5 ns

22a TA ValidtoBCLK(Setup) 10 10 ns

22b TEA Valid to BCLK (Setup) 10 10 ns

22c TCI Valid to BCLK (Setup) 10 10 ns

22d TBI Valid to BCLK (Setup) 11 10 ns

23 BCLK to TA,TEA,TCI,TBIInvalid (Hold) 2 2 ns

24 AVEC ValidtoBCLK(Setup) 5 5 ns

25 BCLK to AVEC Invalid (Hold) 2 2 ns

31 DLE Width High 8 8 ns

32 Data-in Valid to DLE (Setup) 2 2 ns

33 DLE to Data-in Invalid (Hold) 8 8 ns

34 BCLK to DLE Hold 3 3 ns

35 DLE High to BCLK 16 12 ns

36 Data-in Valid to BCLK (DLE Mode Setup) 5 5 ns

37 BCLK Data-in Invalid (DLE Mode Hold) 4 4 ns

41a BB ValidtoBCLK(Setup) 7 7 ns

41b BG Valid to BCLK (Setup) 8 7 ns

41c CDIS,MDISValid to BCLK (Setup) 10 8 ns

41d IPLn ValidtoBCLK(Setup) 4 3 ns

42 BCLK to BB,BG, CDIS,IPLn,MDISInvalid (Hold) 2 2 ns

44a Address Valid to BCLK (Setup) 8 7 ns

44b SIZn Valid BCLK (Setup) 12 8 ns

22 TS68040

2116A–HIREL–09/02

Notes: 1. All testing to be performed using worst-case test conditions unless otherwise specified.

2. The following pins are active low: AVEC,BG,BS,BR,CDIS,CIOUT, IPEND,IPLO,IPL1,IPL2,LOCK,LOCKE,MDIS,MI,

RST0,RSTI,TA,TBI,TCI,TEA,TIP,TRST,TSand W of R/W.

3. Maximum operating junction temperature (TJ) = +125°. Minimum case operating temperature (TC)=-55°.Thisdeviceisnot

tested at TC= +125°. Testing is performed by setting the junction temperature TJ= +125°and allowing the case and ambient

temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.

4. The levels on CDIS,MDIS,andtheIPL2-IPL0 signals enable or disable the multiplexed bus mode, data latch enable mode,

and driver impedance selection respectively.

44c TTn Valid to BCLK (Setup) 6 8.5 ns

44d R/W ValidtoBCLK(Setup) 6 5 ns

44e SCn Valid to BCLK (Setup) 10 11 ns

45 BCLK to Address SIZn, TTn, R/W, SCn Invalid (Hold) 2 2 ns

46 TS ValidtoBCLK(Setup) 5 9 ns

47 BCLK to TS Invalid (Hold) 2 2 ns

49 BCLK to BB High Impedance (68040 Assumes Bus Mastership) 9 9 ns

51 RSTI Valid to BCLK 5 4 ns

52 BCLK to RSTI Invalid 2 2 ns

53 Mode Select Setup to RSTI Negated(4) 20 20 ns

54 RSTI Negated to Mode Selects Invalid(4) 22ns

Table 15. Input AC Timing Specifications (Figure 9 to Figure 15) (Continued)

-55°C≤ TC≤ TJmax; 4.75V ≤ VCC ≤ 5.25V unless otherwise specified(1)(2)(3)(4)

Num Characteristic

25 MHz 33 MHz

UnitMin. Max. Min. Max.

TS68040

2116A–HIREL–09/02

Figure 9. Read/Write Timing

Note: Transfer attribute signals UPAN, SIZN, TTN, TMN, TLNN, R/W,LOCK,LOCKE,CIOUT

Table 16. JTAG Timing Application (Figure 16 to Figure 19)

-55°C≤ TC≤ TJmax; 4.75V ≤ VCC ≤ 5.25V unless otherwise specified(1)(2)

Num Characteristic Min Max Unit

TCK Frequency 010MHz

1 TCK Cycle Time 100 ns

2 TCK Clock Pulse Width Measured at 1.5V 40 ns

3 TCK Rise and Fall Times 0 10 ns

4TRST

SetupTimetoTCKFallingEdge 40 ns

5TRST

Assert Time 100 ns

6 Boundary Scan Input Data Setup Time 50 ns

7 Boundary Scan Input Data Hold Time 50 ns

8 TCK to Output Data Valid 0 50 ns

9 TCK to Output High Impedance 0 50 ns

10 TMS, TDI Data Setup Time 20 ns

11 TMS, TDI Data Hold Time 5 ns

12 TCK to TDO Data Valid 0 20 ns

13 TCK to TDO High Impedance 0 20 ns

24 TS68040

2116A–HIREL–09/02

Notes: 1. All testing to be performed using worst-case test conditions unless otherwise specified.

2. Maximum operating junction temperature (TJ) = +125°. Minimum case operating temperature (TC)=-55°.Thisdeviceisnot

tested at TC= +125°. Testing is performed by setting the junction temperature TJ= +125°and allowing the case and ambient

temperatures to rise and fall as necessary so as not to exceed the maximum junction temperature.

Switching Test Circuit

and Waveforms

Figure 10. Address and Data Bus Timing —Multiplexed Bus Mode

Table 17. Boundary Scan Instruction Codes

Bit 2 Bit 1 Bit 0 Instruction Selected Test Data Register Accessed

0 0 0 Extest Boundary Scan

0 0 1 Highz Bypass

0 1 0 Sample/Preload Boundary Scan

0 1 1 DRVCTLT Boundary Scan

1 0 0 Shutdown Bypass

1 0 1 Private Bypass

1 1 0 DRVCTLS Boundary Scan

1 1 1 Bypass Bypass

TS68040

2116A–HIREL–09/02

Figure 11. DLE Timing Burst Access

Figure 12. Bus Arbitration Timing

26 TS68040

2116A–HIREL–09/02

Figure 13. Snoop Hit Timing

TS68040

2116A–HIREL–09/02

Figure 14. Snoop Miss Timing

Figure 15. Other Signal Timing

28 TS68040

2116A–HIREL–09/02

Figure 16. Clock Input Timing Diagram

Figure 17. TRST Timing Diagram

Figure 18. Boundary Scan Timing Diagram

TS68040

2116A–HIREL–09/02

Figure 19. Test Access Port Timing Diagram

Functional

Description

Programming Model The TS68040 integrates the functions of the integer unit, MMU, and FPU. As shown in

Figure 20, the registers depicted in the programming model provide access and control

for the three units. The registers are partitioned into two levels of privilege: user and

supervisor. User programs, executing in the user mode, can only use the resources of

the user model. System software, executing in the supervisor mode, has unrestricted

access to all processor resources.

The integer portion of the user programming model, consisting of 16, general-purpose,

32-bit registers and two control registers, is the same as the user programming model of

the TS68030. The TS68040 user programming model also incorporates the TS68882

programming model consisting of eight, floating-point, 80-bit data registers, a floating-

point control register, a floating-point status register, and a floating-point instruction

address register.

The supervisor programming model is used exclusively by TS68040 system program-

mers to implement operating system functions, I/O control, and memory management

subsystems. This supervisor/user distinction in the TS68000 architecture was carefully

planned so that all application software can be written to execute in the nonprivileged

user mode and migrate to the TS68040 from any TS68000 platform without modifica-

tion. Since system software is usually modified by system designers when porting to a

new design, the control features are properly placed in the supervisor programming

model. For example, the transparent translation registers of the TS68040 can only be

read or written by the supervisor software; the programming resources of user applica-

tion programs are unaffected by the existence of the transparent translation registers

Registers D0-D7 are data registers containing operands for bit and bit field (1- to 32-bit),

byte (8-bit), word (16-bit), long-word (32-bit), and quad-word (64-bit) operations. Regis-

ters A0-A6 and the stack pointer registers (user, interrupt, and master) are address

registers that may be used as software stack pointers or base address registers. Regis-

ter A7 is the user stack pointer in user mode, and is either the interrupt or master stack

pointer (A7’or A7’’) in supervisor mode. In supervisor mode, the active stack pointer

(interrupt or master) is selected based on a bit in the status register (SR). The address

30 TS68040

2116A–HIREL–09/02

registers may be used for word and long-word operations, and all of the 16 general-pur-

pose registers (D0-D7, A0-A7 in Figure 20) may be used as index registers.

The eight, 80-bit, floating-point data registers (FP0-FP7) are analogous to the integer

data registers (D0-D7) of all TS68000 Family processors. Floating-point data registers

always contain extended-precision numbers. All external operands, regardless of the

data format, are converted to extended-precision values before being used in any float-

ing-point calculation or stored in a floating-point data register.

The program counter (PC) usually contains the address of the instruction being exe-

cuted by the TS68040. During instruction execution and exception processing, the

processor automatically increments the contents of the PC or places a new value in the

PC, as appropriate. The status register (SR in the supervisor programming model) con-

tains the condition codes that reflect the results of a previous operation and can be used

for conditional instruction execution in a program. The lower byte of the SR is accessible

in user mode as the condition code register (CCR). Access to the upper byte of the SR

is restricted to the supervisor mode.

As part of exception processing, the vector number of the exception provides an index

into the exception vector table. The base address of the exception vector table is stored

in the vector base register (VBR). The displacement of an exception vector is added to

the value in the VBR when the TS68040 accesses the vector table during exception

processing.

Alternate function code registers, SFC and DFC (source and destination), contain 3-bit

function codes. Function codes can be considered extensions of the 32-bit linear

address. Function codes are automatically generated by the processor to select address

spaces for data and program accesses at the user and supervisor modes. The alternate

function code registers are used by certain instructions to explicitly specify the function

codes for various operations. The cache control register (CACR) controls enabling of

the on-chip instruction and data caches of the TS68040.

The supervisor root pointer (SRP) and user root pointer (URP) registers point to the root

of the address translation table tree to be used for supervisor mode and user mode

accesses. The URP is used if FC2 of the logical address is zero, and the SRP is used if

FC2 is one.

The translation control register (TC) enables logical-to-physical address translation and

selects either 4K or 8K page sizes. As shown in Figure 20, there are four transparent

translation registers - ITT0 and ITT1 for instruction accesses and DTT0 and DTT1 for

data accesses. These registers allow portions of the logical address space to be trans-

parently mapped and accessed without the use of resident descriptors in an ATC. The

MMU status register (MMUSR) contains status information from the execution of a

PTEST instruction. The PTEST instruction searches the translation tables for the logical

address as specified by this instruction’s effective address field and the DFC.

The 32-bit floating-point control register (FPCR) contains an exception enable byte that

enables disables traps for each class of floating-point exceptions and a mode byte that

sets the user-selectable modes. The FPCR can be read or written to by the user and is

cleared by a hardware reset or a restore operation of the null state. When cleared, the

FPCR provides the IEEE 754 standard defaults. The floating-point status register

(FPSR) contains a condition code byte, quotient bits, an exception status byte, and an

accrued exception byte. All bits in the FPSR can be read or written by the user. Execu-

tion of most floating-point instructions modifies this register.

TS68040

2116A–HIREL–09/02

For the subset of the FPU instructions that generate exception traps, the 32-bit floating-

point instruction address register (FPIAR) is loaded with the logical address of an

instruction before the instruction is executed. This address can then be used by a float-

ing-point exception handler to locate a floating-point instruction that has caused an

exception. The move floating-point data register (FMOVE) instruction (to from the

FPCR, FPSR, or FPIAR) and the move multiple data registers (FMOVEN) instruction

cannot generate floating-point exceptions; therefore, these instructions do not modify

theFPIAR.Thus,theFMOVEandFMOVEMinstructionscanbeusedtoreadthe

FPIAR in the trap handler without changing the previous value.

Figure 20. Programming Model

32 TS68040

2116A–HIREL–09/02

Data Types and

Addressing Modes

The TS68040 supports the basic data types shown in Table 18. Some data types apply

only to the integer unit, some only to the FPU, and some to both the integer unit and the

FPU. In addition, the instruction set supports operations on other data types such as

memory addresses.

Note: 1. IU = Integer Unit.

The three integer data formats that are common to both the integer unit and the FPU

(byte, word, and long word) are the standard twos-complement data formats defined in

the TS68000 Family architecture. Whenever an integer is used in a floating-point opera-

tion, the integer is automatically converted by the FPU to an extended-precision floating-

point number before being used. The ability to effectively use integers in floating-point

operations saves user memory because an integer representation of a number usually

requires fewer bits than the equivalent floating-point representation.

Single- and double-precision floating-point data formats are implemented in the FPU as

defined by the IEEE standard. These data formats are the main floating-point formats

and should be used for most calculations involving real numbers.

The extended-precision data format is also in conformance with the IEEE standard, but

the standard does not specify this format to the bit level as it does for single- and dou-

ble-precision. The memory format for the FPU consists of 96 bits (three long words).

Only 80 bits are actually used; the other 16 bits are reserved for future use and for long-

word alignment of the floating-point data structures in memory. The extended-precision

format has a 15-bit exponent, a 64-bit mantissa, and a 1-bit mantissa sign. Extended-

precision numbers are intended for use as temporary variables, intermediate values, or

where extra precision is needed.

The TS68040 addressing modes are shown in Table 19. The register indirect address-

ing modes support post-increment, predecrement, offset, and indexing, which are

particularly useful for handling data structures common to sophisticated applications

and high-level languages. The program counter indirect mode also has indexing and off-

set capabilities; this addressing mode is typically required to support position-

independent software. In addition to these addressing modes, the TS68040 provides

index sizing and scaling features that enhance software performance. Data formats are

supported orthogonally by all arithmetic operations and by all appropriate addressing

modes.

Table 18. Data Types

Operand Data Type Size Execution Unit (IU(1),FPU) Notes

Bit 1-bit IU

Bit Field 1-32 bits IU Field of consecutive bits

BCD 32 bits IU Packaged: 2 digits byte

Unpacked: 1 digit byte

Byte Integer 8 bits IU, FPU

Word Integer 16 bits IU, FPU

Long-word Integer 32 bits IU, FPU

Quad-word Integer 64 bits IU Any two data registers

16-byte 128 bits IU Memory-only, aligned 16-byte boundary

Single-precision Real 32 bits FPU 1-bit sign, 8-bit exponent, 23-bit mantissa

Double-precision Real 64 bits FPU 1-bit sign, 11-bit exponent, 52-bit mantissa

Extended-precision Real 80 bits FPU 1-bit sign, 15-bit exponent, 64-bit mantissa

TS68040

2116A–HIREL–09/02

Note:

DN = Data register, D0-D7

AN = Address register, A0-A7

d8,d

16 = A twos-complement or sign-extended displacement; added as part of the effective address calculation;

size is 8 (d8)or16(d

16) bits; when omitted, assemblers use a value of zero.

Xn = Address or data register used as an index register; form is Xn, SIZE*SCALE, where SIZE is W or L

(indicates index register size) and SCALE is 1, 2, 4 or 8 (index register os multiplied by SCALE); use of

SIZE and or SCALE is optional.

bd = A twos-complement base displacement; when present, size can be 16 or 32 bits.

od = Outer displacement added as part of effective address calculation after any memory indirection; use is

optionalwithasizeof16or32bits.

PC = Program counter.

(data) = Immediate value of 8, 16 or 32 bits.

( ) = Effective address.

[ ] = Used as indirect address to long-word address.

–Instruction Set Overview

Table 19. Addressing Modes

Addressing Modes Syntax

Date Register Direct

Address Register Direct

Address Register Indirect

Address Register Indirect With Postincrement

Address Register Indirect With Predecrement

Address Register Indirect With Displacement

(An)

(d16,An)

Address Register Indirect With Index (8-bit Displacement)

Address Register Indirect With Index (Base Displacement)

(d8,An,Xn)

(bd, An, Xn)

Memory Indirect

Memory Indirect Postincrement

Memory Indirect Preindexed

([bd, An], Xn, od)

([bd, An, Xn], od)

Program Counter Indirect With Displacement (d16,PC)

Program Counter Indirect With Index

PC Indirect With Index (8-bit Displacement)

PC Indirect With Index (Base Displacement

(d8,PC,Xn)

(bd, PC, Xn)

Program Counter Memory Indirect

PC Memory Indirect Postindexed

PC Memory Indirect Preindexed

([bd, PC], Xn, od)

([bd, PC, Xn], od)

Absolute

Absolute Short

Absolute Long

xxx.W

xxx.L

Immediate # (data)

34 TS68040

2116A–HIREL–09/02

The instruction provided by the TS68040 are listed in Table 20. The instruction set has

been tailored to support high-level languages and is optimized for those instructions

most commonly executed (however, all instructions listed are fully supported). Many

instructions operate on bytes, words, and long words, and most instructions can use any

of the addressing modes of Table 19.

Table 20. Instruction Set Summary

Mnemonic Description

ABCD

ADD

ADDA

ADDI

ADDQ

ADDX

AND

ANDI

ASL, ASR

Add Decimal With Extend

Add

Add Address

Add Immediate

Add Quick

AddWithExtend

Logical AND

Logical AND Immediate

Arithmetic Shift Left And Right

Bcc

BCHG

BCLR

BFCHG

BFCLR

BFEXTS

BFEXTU

BFFFO

BFINS

BFSET

BFTST

BKPT

BRA

BSET

BSR

BTST

Branch Conditionally

Test Bit And Change

Test B it An d Cl ea r

Test Bit Field And Change

Test Bit Field And Clear

Signed Bit Field Extract

Unsigned Bit Field Extract

Bit Field Find First One

Bit Field Insert

Test Bit Field And Set

Test B it Fiel d

Breakpoint

Branch

Test Bit And Set

Branch To Subroutine

Test B it

CAS

CAS2

CHK

CHK2

CINV(1)

CLR

CMP

CMPA

CMPI

CMPM

CMP2

CPUSH(1)

Compare And Swap Operands

Compare And Swap Dual Operands

Check Register Against Bounds

Check Register Against Upper And Lower Bounds

Invalidate Cache Entries

Clear

Compare

Compare Address

Compare Immediate

Compare Memory To Memory

Compare Register Against Upper And Lower Bounds

Push Then Invalidate Cache Entries

DBCC

DIVS, DIVSL

DIVU, DIVUL

Test Condition, Decrement And Branch

Signed Divide

Unsigned Divide

EOR

EORI

EXG

EXT, EXTB

Logical Exclusive OR

Logical Exclusive OR Immediate

Exchange Registers

Sign Extend

TS68040

2116A–HIREL–09/02

ILLEGAL Take Illegal Instruction Trap

JMP

JSR

Jump

Jump To Subroutine

LEA

LINK

LSL, LSR

Load Effective Address

Link And Allocate

Logical Shift Left And Right

MOVE

MOVE16(1)

MOVEA

MOVE CCR

MOVE SR

MOVE USP

MOVEC(1)

MOVEM

MOVEP

MOVEQ

MOVES(1)

MULS

MULU

Move

16-byte Block Move

Move Address

Move Condition Code Register

Move Status Register

Move User Stack Pointer

Move Control Register

Move Peripheral

Move Quick

Move Alternate Address Space

Move Multiply

Signed Multiply

Unsigned Multiply

NBCD

NEG

NEGX

NOP

NOT

Negate decimal with extend

Negate

Negate with extend

No operation

Logical complement

ORI

Logical Inclusive OR

Logical Inclusive OR Immediate

PAC K

PEA

PFLUSH(1)

PTEST(1)

Pack BCD

Push Effective Address

Flush Entry(ies) In The ATCs

Test A Logical Address

RESET

ROL, ROR

ROXL, ROXR

RTD

RTE

RTR

RTS

Reset External Devices

Rotate Left And Right

Rotate With Extend Left And Right

Return And Deallocate

Return From Exception

Return And Restore Codes

Return From Subroutine

Table 20. Instruction Set Summary (Continued)

Mnemonic Description

36 TS68040

2116A–HIREL–09/02

Note: 1. TS6840 additions or alterations to the TS68030 and TS68881/TS68882 instructions

sets.

Note: 1. TS6840 additions or alterations to the TS68030 and TS68881/TS68882 instructions

sets.

The TS68040 floating-point instructions, a commonly used subset of the TS68882

instruction set, are implemented in hardware. The remaining unimplemented instruc-

tions are less frequently used and are efficiently emulated in software, maintaining

compatibility with the TS68881/TS68882 floating-point coprocessors.

The TS68040 instruction set includes MOVE16, a new user instruction that allows high-

speed transfers of 16-byte blocks between external devices such as memory to memory

or coprocessor to memory.

SBCD

Scc

STOP

SUB

SUBA

SUBI

SUBQ

SUBX

SWAP

Substract Decimal With Extend

Set Conditionally

Stop

Subtract

Subtract Address

Subtract Immediate

Subtract Quick

Subtract With Extend

Swap Register Words

TAS

TRAP

TRAPcc

TRAPV

TST

Test Operand And Set

Trap

Trap Conditionally

Trap On Overflow

Trap Operand

UNLK

UNPK

Unlink

Unpack BCD

Table 21. Floating-point instructions

Mnemonic Description

FABS(1)

FADD(1)

FBcc

FCMP

FDBcc

FDIV(1)

FMOVE(1)

FMOVEM

FMUL(1)

FNEG(1)

FRESTORE

FSAVE

FScc

FSQRT(1)

FSUB(1)

FTRAPcc

FTST

Floating-point Absolute Value

Floating-point Add

Branch On Floating-point Condition

Floating-point Compare

Floating-point Decrement And Branch

Floating-point Divide

Move Floating-point Register

Move Multiple Floating-point Registers

Floating-point Multiply

Floating-point Negate

Restore Floating-point Internal State

Save Floating-point Internal State

Set According To Floating-point Condition

Floating-point Square Root

Floating-point Substract

Trap On Floating-point Condition

Floating-point Test

Table 20. Instruction Set Summary (Continued)

Mnemonic Description

TS68040

2116A–HIREL–09/02

Instruction and Data

Caches

Studies have shown that typical programs spend much of their execution time in a few

main routines or tight loops. Earlier members of the TS68000 Family took advantage of

this locality of reference phenomenon to varying degrees. The TS68040 takes further

advantage of cache technology with its two, independent, on-chip, physical address

space caches, one for instructions and one for data. The caches reduce the processor’s

external bus activity and increase CPU throughput by lowering the effective memory

access time. For a typical system design, the large caches of the TS68040 yield a very

high hit rate, providing a substantial increase in system performance. Additionally, the

caches are automatically burstfilled from the external bus whenever a cache miss

occurs.

The autonomous nature of the caches allows instruction-stream fetches, data-stream

fetches, and a third external access to occur simultaneously with instruction execution.

For example, if the TS68040 requires both an instruction-stream access and an external

peripheral access and if the instruction is resident in the on-chip cache, the peripheral

access proceeds unimpeded rather than being queued behind the instruction fetch. If a

data operand is also required and if it is resident in the data cache, it can also be

accessed without hindering either the instruction access from its cache or the peripheral

access external to the chip. The parallelism inherent in the TS68040 also allows multiple

instructions that do not require any external accesses to execute concurrently while the

processor is performing an external access for a previous instruction.

Cache Organization The instruction and data caches are four-way set-associative with 64 sets of four, 16-

byte lines for a total cache storage of 4K bytes each. As shown in Figure 21, each 16-

byte line contains an address tag and state information. State information for each entry

consists of a valid flag for the entire line in both instruction and data caches and write

status for each long word in the data cache. The write status in the data cache signifies

whether or not the long-word data is dirty (meaning that the data in the cache has been

modified but has not been written back to external memory) for data in copyback pages.

38 TS68040

2116A–HIREL–09/02

Figure 21. Cache Organization Overview

The caches are accessed by physical addresses from the on-chip MMUs. The transla-

tion of the upper bits of the logical address occurs concurrently with the accesses into

the set array in the cache by the lower address bits. The output of the ATC is compared

with the tag field in the cache to determine if one of the lines in the selected set matches

the translated physical address. If the tag matches and the entry is valid, then the cache

has a hit.

If the cache hits and the access is a read, the appropriate long word from the cache line

is multiplexed onto the appropriate internal bus. If the cache hits and the access is a

write, the data, regardless of size, is written to the appropriate portion of the correspond-

ing longword entry in the cache.

When a data cache miss occurs and a previously valid cache line is needed to cache

the new line, any dirty data in the old line will be internally buffered and copied back to

memory after the new cache line has been loaded.

Pushing of dirty data can be forced by the CPUSH instruction.

TS68040

2116A–HIREL–09/02

Cachability of data in each memory page is controlled by two bits in the page descriptor

for each page. Cachable pages may be either write through or copyback, with no write-

allocate for misses to write through pages. Non-cachable pages may also be specified

as non-cachable I/O, forcing accesses to these pages to occur in order of instruction

execution.

Cache Coherency The TS68040 has the ability to snoop the external bus during accesses by other bus

masters to maintain coherency between the TS68040’s caches and external memory

systems. External write cycles are snooped by both the instruction cache and data

cache; whereas, external read cycles are snooped only by the data cache. In addition,

external cycles can be flagged on the bus as snoopable or non snoopable. When an

external cycle is marked as snoopable, the bus snooper checks the caches for a coher-

ency conflict based on the state of the corresponding cache line and the type of external

cycle.

Although the internal execution units and the bus snooper circuit all have access to the

on-chip caches, the snooper has priority over the execution units to allow the snooper to

resolve coherency discrepancies immediately.

Cache Instructions The TS68040 supports the following instructions for cache maintenance. Both instruc-

tions may selectively operate on the data or instruction cache.

CINV: Invalidates a single line, all lines in a physical page, or the entire cache.

CPUSH: Pushes selected dirty data cache lines to memory, then invalidates all selected

lines.

Operand Transfer

Mechanisms

The TS68040 external synchronous bus supports multiple masters and overlaps arbitra-

tion with data transfers. The bus is optimized to perform high-speed transfers to and

from an external cache or memory. The data and address buses are each 32 bits wide.

Transfer Types The TS68040 provides two signals (TT1-TT0) that define four types of bus transfers:

normal access, MOVE16 access, alternate access, and interrupt acknowledge access.

Normal accesses identify normal memory references: MOVE16 accesses are memory

accesses by a MOVE16 instruction; and alternate accesses identify accesses to the

undefined address spaces (function code values of 0, 3, 4, 7). The interrupt acknowl-

edge access is used to fetch an interrupt vector during interrupt exception processing.

Burst Transfer Operation During burst read write to cache transfers, the values on the address and transfer type

signals do not change; they are the address of the first requested item of the cache line.

When the TS68040 request a burst read transfer of a cache line, the address bus indi-

cates the address of the long word in the line needed first, but the memory system is

expected to provide data in the following order (modulo 4): 0, 1, 2, 3 (long-word offsets).

The first address needed may not be from offset 0; nevertheless, all four long words

must be transferred. Burst writes occur in a similar manner.

Bus Snooping Bus snooping ensures that data in main memory is consistent with data in the on-chip

caches. If an alternate bus master is performing a read transfer on the bus and snooping

is enabled, and if the snoop logic determines that the on-chip data cache has dirty data

(data valid but not consistent with memory) for this transfer, the memory is prevented

from responding to the read request, and the TS68040 supplies the data directly to the

master. If the alternate master is performing a write transfer on the bus and snooping is

enabled, and if the snooper determines that one of the on-chip caches has a valid line

for this request, then the snooper may either invalidate or update the line as selected by

the snoop control signals.

40 TS68040

2116A–HIREL–09/02

Exception Processing The TS68040 provides the same extensions to the exception stacking process as the

TS68030. If the M bit in the status register is set, the master stack pointer is used for all

task-related exceptions. When a nontask-related exception occurs (i.e., an interrupt),

the M bit is cleared, and the interrupt stack pointer is used. This feature allows a task’s

stack area to be carried within a single processor control block, and new tasks may be

initiated by simply reloading the master stack pointer and setting the M bit.

The externally generated exceptions are interrupts, bus errors, and reset conditions.

The interrupts are requests from external devices for processor action; whereas, the bus

error and reset signals are used for access control and processor initialization. The

internally generated exceptions come from instructions, address errors, tracing, or

breakpoints. The TRAP, TRAPcc, TRAPVcc, FTRAPcc, CHK, CHK2, and DIV instruc-

tions can all generate exceptions as part of their instruction execution. Tracing behaves

like a very high-priority, internally generated interrupt whenever it is processed. The

other internally generated exceptions are caused by unimplemented floating-point

instructions, illegal instructions, instruction fetches from odd addresses, and privilege

violations. Finally, the MMU can generate exceptions, for access violations and for when

invalid descriptors are encountered during table searches.

Exception processing for the TS68040 occurs on the following sequence:

1. an internal copy is made of the status register,

2. the vector number of the exception is determined,

3. current processor status is saved,

4. the exception vector offset is determined by multiplying the vector number by

four.

This offset is then added to the contents of the VBR to determine the memory address

of the exception vector. The instruction at the address given in the exception vector is

fetched, and normal instruction decoding and execution is started.

Memory Management

Units

The full addressing range of the TS68040 is 4G bytes (4,294,967,296 bytes). However,

most TS68040 systems implement a much smaller physical memory. Nonetheless, by

using virtual memory techniques, the system can be made to appear to have a full

4G bytes of physical memory available to each user program. The independent instruc-

tion and data MMUs fully support demand paged virtual-memory operating systems with

either 4K or 8K page sizes. In addition to its main function of memory management,

each MMU protects supervisor areas from accesses by user programs and also pro-

vides write protection on a page-by-page basis. For maximum efficiency, each MMU

operates in parallel with other processor activities.

Translation Mechanism Because logical-to-physical address translation is one of the most frequently executed

operations of the TS68040 MMUs, this task has been optimized. Each MMU initiates

address translation by searching for a descriptor containing the address translation

information in the ATC. If the descriptor does not reside in the ATC, then the MMU per-

forms external bus cycles via the bus controller to search the translation tables in

physical memory. After being located, the page descriptor is loaded into the ATC, and

the address is correctly translated for the access, provided no exception conditions are

encountered.

TS68040

2116A–HIREL–09/02

Address Translation Cache An integral part of the translation function previously described is the dual cache mem-

ory that stores recently used logical-to-physical address translation information (page

descriptors) for instruction and date accesses. These caches are 64-entry, four-way, set

associative. Each ATC compare the logical address of the incoming access against its

entries. If one of the entries matches, there is a hit, and the ATC sends the physical

address to the bus controller, which then starts the external bus cycle (provided there

was no hit in the corresponding cache for the access).

Translation Tables The translation tables of the TS68040 have a three level tree structure and reside in

main memory. Since only a portion of the complete tree needs to exist at any one time,

the tree structure minimizes the amount of memory necessary to set up the tables for

most programs. As shown in Figure 20, either the user root pointer or the supervisor root

pointer points to the first level table, depending on the values of the function code for an

access. Table entries at the second level of the tree (pointer tables) contain pointers to

the third level (page tables). Entries in the page tables contain either page descriptors or

indirect pointers to page descriptors. The mechanism for performing table search opera-

tions uses portions of the logical address (as indices) at each level of the search. All

addresses in the translation table entries are physical addresses.

Figure 22. Translation Table Structure

There are two variations of table searches for both 4K and 8K page sizes: normal

searches and indirect searches. An indirect search differs in that the entry in the third

level page table contains a pointer to a page descriptor rather than the page descriptor

itself.

Entries in the translation tables contain control and status information on addition to the

physical address information. Control bits specify write protection, limit access to super-

visor only, and determine cachability of data in each memory page. Each page

descriptor also has two user-programmable bits that appear on the UPA0 and UPA1 sig-

nals during an external access for use as address modifier bits.

42 TS68040

2116A–HIREL–09/02

A global bit can be set in each page descriptor to prevent flushing of the ATC entry for

that page by some PFLUSH instruction variants, allowing system ATC entries to remain

resident during task swaps. If these special PFLUSH instructions are not used, this bit

can be user defined. The MMUs automatically maintain access history information for

the pages by updating the used (U) and modified (M) status bits.

MMU Instructions The MMU instructions supported by the TS68040 are as follows:

PFLUSH: Allows flushing of either selected ATC entries by function code and logical

address or the entire ATCs.

PTEST: Takes an address and function code and searches the translation tables for the

corresponding entry, which is then loaded into the ATC. The results of the search are

available in the MMU status register and are often useful in determining the cause of a

fault.

All of the TS68040 MMU instructions are privileged and can only be executed from the

supervisor mode.

Transparent Translation Four transparent translation registers, two each for instruction and data accesses, have

been provided on the TS68040 MMU to allow portions of the logical address space to be

transparently mapped and accessed without the need for corresponding entries resident

in the ATC. Each register can be used to define a range of logical addresses from

16M bytes to 4G bytes with a base address and a mask. All addresses within these

ranges are not mapped, and are optionally protected against user or supervisor

accesses and write accesses. Logical addresses in these areas become the physical

addresses for memory access. The transparent translation feature allows rapid move-

ment of large blocks of data in memory or I/O space without disturbing the context of the

on-chip ATCs or incurring delays associated with translation table searches.

Preparation For

Delivery

Packaging Microcircuits are prepared for delivery in accordance with MIL-M-38510 or Atmel

standard.

Certificate of Compliance Atmel offers a certificate of compliances with each shipment of parts, affirming the prod-

ucts are in compliance either with MIL-STD-883 or Atmel standard and guarantying the

parameters not tested at temperature extremes for the entire temperature range.

Handling MOS devices must be handled with certain precautions to avoid damage due to accu-

mulation of static charge. Input protection devices have been designed in the chip to

minimize the effect of this static buildup. However, the following handling practices are

recommended:

a) Devices should be handled on benches with conductive and grounded surfaces.

b) Ground test equipment, tools and operator.

c) Do not handle devices by the leads.

d) Store devices in conductive foam or carriers.

e) Avoid use of plastic, rubber, or silk in MOS areas.

f) Maintain relative humidity above 50 percent if practical.

TS68040

2116A–HIREL–09/02

Package Mechanical

Data

179 pins –PGA

Dim

Millimeters Inches

Min Max Min Max

A 46.863 47.625 1.845 1.875

B 46.863 47.625 1.845 1.875

C 2.3876 1.875 0.094 0.116

D 4.318 4.826 0.170 0.190

E 1.143 1.4 0.045 0.055

F 1.143 1.4 0.045 0.055

G 2.54 BSC 0.100 BSC

H(1) 0.432 0.483 0.017 0.019

Note: 1. For untinned leads (gold)

44 TS68040

2116A–HIREL–09/02

196 pins –Tie Bar CQFP

Cavity Up (on request)

Dim Millimeters Inches

A 3.30 max 0.130 max

B 0.23 +0.05

0.23 -0.038

0.009 +0.002

0.009 -0.015

C 0.635 typ. .025 typ.

D1 33.91 ± 0.25 1.335 ± 0.01

J 0.89 ± 0.13 0.035 ± 0.005

L 63.5 ± 0.51 2.5 ± 0.02

TS68040

2116A–HIREL–09/02

196 pins –Gullwing

CQFP cavity up

* Reduce pin count shown for clarity, 49 pins per side

Symbol Millimeters Inches

A 4.19 max 0.165 max

A1 0.673 ± 0.2 .0265 ±.008

b0.23 +0.05

0.23 -0.038

.009 +.002

.009 -.0015

c0.127 +0.05 .005 +.002

0.127 -0.025 .005 -.001

D/E 33.91 ±0.25 1.335 ±.01

e .635 BSC .025 BSC

e1 30.48 ±0.13 1.2 ±.005

HD/HE 38.8 ±0.18 1.528 ±.007

L 0.813 ±0.2 .032 ±.008

N 196 196

R 0.55 ±0.25 .022 ±.01

R1 0.23 min .009 min

46 TS68040

2116A–HIREL–09/02

Ordering Information

MIL-STD-883 C and

Internal Standard

Notes: 1. On request.

2. Standard process.

3. Non request for small quantity.

DESC Drawing 5962-93143

Device

Temperature range:

M: Tc = -55; Tj = +125°C

V: Tc = -40; Tj = +110°C

Package:

F: CQFP/Gullwing leads

R: PGA

FT: CQFP Flat tie-bar(3)

Standard lead finish

Gold

TS68040 MR1B/C25 A

Operating frequency:

25: 25 MHz

33: 33 MHz

Revision level

Screening level:

B/C: MIL-STD-883, class B

D/T: Internal standard with burn-in

U: Upscreening

U/T: Upscreening + burn-in

___: Internal standard

Lead finish:

1: Hot solder dip(1)

__: Gold(2)

Device

DESC Screening

Speed:

01: 25 MHz

02: 33 MHz

TS68040 DESC 01 XA

Lead finish:

A: Hot solder dip

C: Gold

Package:

X: PGA

Y: CQFP Flat tie-bar

Z: CQFP Gullwing leads

Revision level

TS68040

2116A–HIREL–09/02

Detailed TS68040 Part

List

Hi-REL Product

Commercial Atmel

Part Number Norms Package Temperature range (°C)

Frequency

(MHz) Drawing number

TS68040MRB/C25A MIL-STD-883 PGA 179 TC= -55/+TJ= +125 25 Atmel datasheet

TS68040MRB/C33A MIL-STD-883 PGA 179 TC= -55/+TJ= +125 33 Atmel datasheet

TS68040MFB/C25A MIL-STD-883 CQFP 196 TC= -55/+TJ= +125 25 Atmel datasheet

TS68040MFB/C33A MIL-STD-883 CQFP 196 TC= -55/+TJ= +125 33 Atmel datasheet

TS68040DESC01XAA DESC PGA 179 tin TC= -55/+TJ= +125 25 5962-9314301MXA

TS68040DESC02XAA DESC PGA 179 tin TC= -55/+TJ= +125 33 5962-9314302MXA

TS68040DESC01XCA DESC PGA 179 gold TC= -55/+TJ= +125 25 5962-9314301MXC

TS68040DESC02XCA DESC PGA 179 gold TC= -55/+TJ= +125 33 5962-9314302MXC

TS68040DESC01YCA DESC CQFP 196 tie

bar gold TC= -55/+TJ= +125 25 5962-9314301MYC

TS68040DESC02YCA DESC CQFP 196 tie

bar gold TC= -55/+TJ= +125 33 5962-9314302MYC

TS68040DESC01ZAA DESC CQFP 196

gullwing tin TC= -55/+TJ= +125 25 5962-9314301MZA

TS68040DESC01ZCA DESC CQFP 196

gullwing gold TC= -55/+TJ= +125 25 5962-9314301MZC

TS68040DESC02ZAA DESC CQFP 196

gullwing tin TC= -55/+TJ= +125 33 5962-9314302MZA

TS68040DESC02ZCA DESC CQFP 196

gullwing gold TC= -55/+TJ= +125 33 5962-9314302MZC

TS68040MFB/C25A MIL-STD-883 CQFP 196 TC= -55/+TJ= +125 25 Atmel datasheet

TS68040MFB/C33A MIL-STD-883 CQFP 196 TC= -55/+TJ= +125 33 Atmel datasheet

TS68040MRD/T25A BURN IN PGA 179 TC= -55/+TJ= +125 25 Atmel datasheet

TS68040MRD/T33A BURN IN PGA 179 TC= -55/+TJ= +125 33 Atmel datasheet

TS68040MFD/T25A BURN IN CQFP 196 TC= -55/+TJ= +125 25 Atmel datasheet

TS68040MFD/T33A BURN IN CQFP 196 TC= -55/+TJ= +125 33 Atmel datasheet

48 TS68040

2116A–HIREL–09/02

Note: FT: available on request.

Standard Product

Commercial Atmel

Part Number Norms Package Temperature Range (°C)

Frequency

(MHz) Drawing Number

TS68040VR25A Atmel standard PGA 179 TC= -40/+TJ= +110 25 Atmel datasheet

TS68040VR33A Atmel standard PGA 179 TC= -40/+TJ= +110 33 Atmel datasheet

TS68040MR25A Atmel standard PGA 179 TC= -55/+TJ= +125 25 Atmel datasheet

TS68040MR33A Atmel standard PGA 179 TC= -55/+TJ= +125 33 Atmel datasheet

TS68040VF25A Atmel standard CQFP 196 TC= -40/+TJ= +110 25 Atmel datasheet

TS68040VF33A Atmel standard CQFP 196 TC= -40/+TJ= +110 33 Atmel datasheet

TS68040MF25A Atmel standard CQFP 196 TC= -55/+TJ= +125 25 Atmel datasheet

TS68040MF33A Atmel standard CQFP 196 TC= -55/+TJ= +125 33 Atmel datasheet

Printed on recycled paper.

Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty

whichisdetailedinAtmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors

which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does

not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted

by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical

components in life support devices or systems.

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FAX (33) 4-42-53-60-01

1150 East Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906

TEL 1(719) 576-3300

FAX 1(719) 540-1759

Scottish Enterprise Technology Park

Maxwell Building

East Kilbride G75 0QR, Scotland

TEL (44) 1355-803-000

FAX (44) 1355-242-743

RF/Automotive

Theresienstrasse 2

Postfach 3535

74025 Heilbronn, Germany

TEL (49) 71-31-67-0

FAX (49) 71-31-67-2340

1150 East Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906

TEL 1(719) 576-3300

FAX 1(719) 540-1759

Biometrics/Imaging/Hi-Rel MPU/

High Speed Converters/RF Datacom

Avenue de Rochepleine

BP 123

38521 Saint-Egreve Cedex, France

TEL (33) 4-76-58-30-00

FAX (33) 4-76-58-34-80

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http://www.atmel.com

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