February 2004 AS7C34096A (R) 3.3V 512K x 8 CMOS SRAM * Equal access and cycle times * Easy memory expansion with CE, OE inputs * TTL-compatible, three-state I/O * JEDEC standard packages Features * Pin compatible to AS7C34096 * Industrial and commercial temperature * Organization: 524,288 words x 8 bits * Center power and ground pins * High speed - 400 mil 36-pin SOJ - 44-pin TSOP 2 - 48 pin BGA. 6 X 9mm - 10/12/15/20 ns address access time - 4/5/6/7 ns output enable access time * ESD protection 2000 volts * Latch-up current 200 mA * Low power consumption: ACTIVE Pin arrangements - 650 mW / max @ 10 ns 36-pin SOJ (400 mil) * Low power consumption: STANDBY - 18 mW / max CMOS A0 A1 A2 A3 A4 CE I/O1 I/O2 VCC GND I/O3 I/O4 WE A5 A6 A7 A8 A9 Logic block diagram VCC GND 524,288 x 8 Array (4,194,304) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 NC NC NC A18 A17 A16 A15 OE I/O8 I/O7 GND VCC I/O6 I/O5 A14 A13 A12 A11 A10 NC NC NC 48-pin BGA Package 1 2 3 4 5 6 A A0 A1 NC A3 A6 A8 B I/O5 A2 WE A4 A7 I/O1 C I/O6 NC NC A5 NC I/O2 D VSS NC NC NC NC VCC E VCC NC NC NC NC VSS F I/O7 NC A18 A17 NC I/O3 G I/O8 OE CE A16 A15 I/O4 H A9 A10 A11 A12 A13 A14 I/O8 Control Circuit WE OE CE A10 A11 A12 A13 A14 A15 A16 A17 A18 Column decoder NC A18 A17 A16 A15 OE I/O8 I/O7 GND VCC I/O6 I/O5 A14 A13 A12 A11 A10 NC 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 I/O1 Sense amp A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 Row decoder Input buffer 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 44-pin TSOP 2 NC NC A0 A1 A2 A3 A4 CE I/O1 I/O2 VCC GND I/O3 I/O4 WE A5 A6 A7 A8 A9 NC NC Selection guide Maximum address access time Maximum outputenable access time Maximum operating current Maximum CMOS standby current 2/12/04, v. 1.2 Industrial Commercial -10 10 4 180 170 5 -12 12 5 160 150 5 Alliance Semiconductor -15 15 6 140 130 5 -20 20 7 110 100 5 Unit ns ns mA mA mA P. 1 of 10 Copyright (c) Alliance Semiconductor. All rights reserved. AS7C34096A (R) Functional description The AS7C34096A is a high-performance CMOS 4,194,304-bit Static Random Access Memory (SRAM) device organized as 524,288 words x 8 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are desired. Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 4/5/6/7 ns are ideal for high-performance applications. The chip enable input CE permits easy memory expansion with multiple-bank memory systems. When CE is high the device enters standby mode. The device is guaranteed not to exceed 18mW power consumption in CMOS standby mode. A write cycle is accomplished by asserting write enable (WE) and chip enable (CE). Data on the input pins I/O1-I/O8 is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE). A read cycle is accomplished by asserting output enable (OE) and chip enable (CE), with write enable (WE) high. The chip drives I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or write enable is active, output drivers stay in high-impedance mode. All chip inputs and outputs are TTL-compatible, and operation is from a single 3.3V supply voltage. This device is available as per industry standard 400-mil 36-pin SOJ and 44-pin TSOP 2 packages and also with 48B uBGA package with 6 X 9mm external dimension. Absolute maximum ratings Parameter Voltage on VCC relative to GND Voltage on any pin relative to GND Power dissipation Storage temperature (plastic) Temperature with VCC applied DC current into output (low) Symbol Vt1 Vt2 PD Tstg Tbias IOUT Min -0.5 -0.5 - -65 -55 - Max +5.0 VCC +0.5 1.0 +150 +125 20 Unit V V W C C mA NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Truth table CE WE OE Data Mode H X X High Z Standby (ISB, ISB1) L H H High Z Output disable (ICC) L H L DOUT Read (ICC) L L X DIN Write (ICC) Key: X = Don't care, L = Low, H = High 2/12/04, v. 1.2 Alliance Semiconductor P. 2 of 10 AS7C34096A (R) Recommended operating condition Parameter Supply voltage Input voltage Ambient operating temperature commercial industrial Symbol VCC(10/12/15/20) VIH** VIL* TA TA Min 3.0 2.0 -0.5 0 -40 Nominal 3.3 - - - - Max 3.6 VCC + 0.5 0.8 70 85 Unit V V V C C * V min = -1.0V for pulse width less than 5ns. ** IL VIH max = VCC + 2.0V for pulse width less than 5ns. DC operating characteristics (over the operating range)1 Parameter Input leakage current Symbol |ILI| Output leakage current |ILO| Operating power supply current ICC Standby power supply current Output voltage -10 -12 -15 -20 Min Max Min Max Min Max Min Max Unit Test conditions - 1 - 1 - 1 - 1 A - 1 - 1 - 1 - 1 A Industrial - 180 - 160 - 140 - 110 mA Commercial - 170 - 150 - 130 - 100 mA VCC = Max, VIN = GND to VCC VCC = Max, CE = VIH VOUT= GND to VCC VCC = Max, CE < VIL f = fMax, IOUT = 0mA ISB VCC = Max, CE = VIH f = fMax, IOUT = 0mA - 60 - 60 - 60 - 60 mA ISB1 VCC = Max, CE VCC - 0.2V, VIN 0.2V or VIN VCC - 0.2V, f=0 - 5 - 5 - 5 - 5 mA VOL IOL = 8 mA, VCC = Min - 0.4 - 0.4 - 0.4 - 0.4 V VOH IOH = -4 mA, VCC = Min 2.4 - 2.4 - 2.4 - 2.4 - V Capacitance (f = 1MHz, Ta = 25 C, VCC = NOMINAL)2 Signals Test conditions Max Unit Input capacitance Parameter CIN A, CE, WE, OE VIN = 0V 5 pF I/O capacitance CI/O I/O VIN = VOUT = 0V 7 pF 2/12/04, v. 1.2 Symbol Alliance Semiconductor P. 3 of 10 AS7C34096A (R) Read cycle (over the operating range)3,9 Parameter -10 Max Min -12 Max Min -15 Max Min -20 Max Symbol Min Unit Notes Read cycle time tRC 10 - 12 - 15 - 20 - ns Address access time tAA - 10 - 12 - 15 - 20 ns 3 Chip enable (CE) access time tACE - 10 - 12 - 15 - 20 ns 3 Output enable (OE) access time tOE - 4 - 5 - 6 - 7 ns Output hold from address change tOH 3 - 3 - 3 - 3 - ns 5 CE Low to output in low Z tCLZ 3 - 3 - 3 - 3 - ns 4, 5 CE High to output in high Z tCHZ - 5 - 6 - 7 - 9 ns 4, 5 OE Low to output in low Z tOLZ 0 - 0 - 0 - 0 - ns 4, 5 OE High to output in high Z tOHZ - 5 - 6 - 7 - 9 ns 4, 5 Power up time tPU 0 - 0 - 0 - 0 - ns 4, 5 Power down time tPD - 10 - 12 - 15 - 20 ns 4, 5 Key to switching waveforms Rising input Falling input Undefined/don't care Read waveform 1 (address controlled)3,6,7,9 tRC Address tAA tOH DOUT Data valid Read waveform 2 (CE, OE controlled)3,6,8,9 tRC1 CE tOE OE tOLZ tOHZ tACE tCHZ DOUT Data valid tCLZ Supply current 2/12/04, v. 1.2 tPU tPD 50% 50% Alliance Semiconductor ICC ISB P. 4 of 10 AS7C34096A (R) Write cycle (over the operating range)11 -10 Symbol Min Max Parameter -12 Min Max -15 Min Max -20 Min Max Unit Notes Write cycle time tWC 10 - 12 - 15 - 20 - ns Chip enable (CE) to write end tCW 7 - 8 - 10 - 12 - ns Address setup to write end tAW 7 - 8 - 10 - 12 - ns Address setup time tAS 0 - 0 - 0 - 0 - ns Write pulse width (OE = high) tWP1 7 - 8 - 10 - 12 - ns Write pulse width (OE = low tWP2 10 - 12 - 15 - 20 - ns Address hold from end of write tAH 0 - 0 - 0 - 0 - ns Write recovery time tWR 0 - 0 - 0 - 0 - ns Data valid to write end tDW 5 - 6 - 7 - 9 - ns Data hold time tDH 0 - 0 - 0 - 0 - ns 4, 5 Write enable to output in high Z tWZ 0 5 0 6 0 7 0 9 ns 4, 5 Output active from write end tOW 3 - 3 - 3 - 3 - ns 4, 5 Write waveform 1 (WE controlled)10,11 tWC tWR tAH tAW Address tWP WE tAS tDW DIN tDH Data valid tWZ tOW DOUT 2/12/04, v. 1.2 Alliance Semiconductor P. 5 of 10 AS7C34096A (R) Write waveform 2 (CE controlled)10,11 tWC tWR tAH tAW Address tAS tCW CE tWP WE tWZ DIN tDW tDH Data valid DOUT AC test conditions - Output load: see Figure B. Input pulse level: GND to 3.0V. See Figures A and B. Input rise and fall times: 2 ns. See Figure A. Input and output timing reference levels: 1.5V. +3.0V GND 90% 10% Thevenin equivalent: 168 DOUT +1.728V +3.3V DOUT 350 90% 10% 320 C13 GND Figure B: 3.3V Output load 2 ns Figure A: Input pulse Notes 1 2 3 4 5 6 7 8 9 10 11 12 13 During VCC power-up, a pull-up resistor to VCC on CE is required to meet ISB specification. This parameter is sampled, but not 100% tested. For test conditions, see AC Test Conditions. tCLZ and tCHZ are specified with CL = 5pF as in Figure B. Transition is measured 500 mV from steady-state voltage. This parameter is guaranteed, but not tested. WE is HIGH for read cycle. CE and OE are LOW for read cycle. Address valid prior to or coincident with CE transition Low. All read cycle timings are referenced from the last valid address to the first transitioning address. N/A All write cycle timings are referenced from the last valid address to the first transitioning address. N/A C=30pF, except on High Z and Low Z parameters, where C=5pF. 2/12/04, v. 1.2 Alliance Semiconductor P. 6 of 10 AS7C34096A (R) Package dimensions c 44434241403938 37 36 35 34333231 30 29 28 27262524 23 44-pin TSOP 2 A A1 A2 b c d E1 E e L E1 E 1 2 3 4 5 6 7 8 9 10 111213 14 15 16 17 1819 20 21 22 d A2 A A1 e b e L 0-5 D b1 36-pin SOJ E1 E2 A A1 b Pin 1 Seating Plane c A2 E 2/12/04, v. 1.2 Alliance Semiconductor A A1 A2 b b1 c D e E E1 E2 44-pin TSOP 2 Min(mm) Max(mm) 1.2 0.05 0.15 0.95 1.05 0.30 0.45 0.21 0.12 18.31 18.52 10.06 10.26 11.68 11.94 0.80 (typical) 0.40 0.60 36-pin SOJ 400 Min(mils) Max(mils) 0.128 0.148 0.025 - 0.105 0.115 0.015 0.020 0.026 0.032 0.007 0.013 .920 .930 0.045 0.055 0.370 BSC 0.395 0.405 0.435 0.445 P. 7 of 10 AS7C34096A (R) 48-ball FBGA Detail View Side View A E2 D E E2 Y E Die Die E1 0.3/Typ Bottom View 6 5 4 3 Top View 2 1 Ball #A1 index Ball #A1 A B C D SRAM Die C1 C E F A G H Elastomer A B B1 Notes 1. Bump counts: 48 (8 row x 6 column). 2. Pitch: (x,y) = 0.75 mm x 0.75 mm (typ). 3. Units: millimeters. 4. All tolerance are 0.050 unless otherwise specified. 5. Typ: typical. 6. Y is coplanarity: 0.10 (max). 2/12/04, v. 1.2 A B B1 C C1 D E E1 E2 Y Alliance Semiconductor 48-ball FBGA Minimum Typical - 0.75 5.90 6.00 - 3.75 8.90 9.00 - 5.25 0.30 0.35 - - - 0.32 0.24 0.27 - - Maximum - 6.10 - 9.10 - 0.40 1.20 - 0.3 0.10 P. 8 of 10 AS7C34096A (R) Ordering codes Package Temperature Commercial SOJ Industrial Commercial TSOP 2 Industrial Commercial BGA Industrial 10 ns 12 ns 15 ns 20 ns AS7C34096A-10JC AS7C34096A-12JC AS7C34096A-15JC AS7C34096A-20JC AS7C34096A-10JI AS7C34096A-12JI AS7C34096A-15JI AS7C34096A-20JI AS7C34096A-10TC AS7C34096A-12TC AS7C34096A-15TC AS7C34096A-20TC AS7C34096A-10TI AS7C34096A-12TI AS7C34096A-15TI AS7C34096A-20TI AS7C34096A-10BC AS7C34096A-12BC AS7C34096A-15BC AS7C34096A-20BC AS7C34096A-10BI AS7C34096A-12BI AS7C34096A-15BI AS7C34096A-20BI Note: Add suffix `N' to the above part number for Lead Free Parts. (Ex: AS7C34096A - 10 TIN) Part numbering system AS7C J, T, or B X X Packages: Temperature ranges: Voltage: SRAM Device J: SOJ 400 mil C: Commercial, 0C to 70C N=Lead Free Parts Access time prefix 3 - 3.3V CMOS number T: TSOP 2 I: Industrial, -40C to 85C B: 48-ball FBGA 6x9 mm 2/12/04, v. 1.2 X 4096A -XX Alliance Semiconductor P. 9 of 10 (R) AS7C34096A (R) Alliance Semiconductor Corporation 2575, Augustine Drive, Santa Clara, CA 95054 Tel: 408 - 855 - 4900 Fax: 408 - 855 - 4999 Copyright (c) Alliance Semiconductor All Rights Reserved Part Number: AS7C34096A Document Version: v. 1.2 www.alsc.com (c) Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. 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