1. General description
The TFA9892 is a high efficiency class-D audio amplifier with a sophisticated speaker
boost and protection algorithm. It can deliver 13.2 W peak output power into an 8
speaker at a supply voltage of 4.0 V. The internal boost converter raises the supply
voltage to 12 V, providing ample headroom for major improvements in sound quality.
A safe working environment is provided for the speaker under all operating conditions.
The TFA9892 maximizes acoustic output while ensuring diaphragm displacement and
voice coil temperature do not exceed their rated limits. This function is based on a
speaker box model that operates in all loudspeaker environments (e.g. free air, closed box
or vented box). Furthermore, advanced signal processing ensures the quality of the audio
signal is never degraded by unwanted clipping or distortion in the amplifier or speaker. An
integrated Multiband Dynamic Range Compressor (MDRC) allows the speaker to operate
at the highest possible power rating without suffering physical damage.
Unlike competing solutions, the adaptive sound maximizer algorithm uses feedback to
accurately calculate both the temperature and the excursion, allowing the TFA9892 to
adapt to changes in the acoustic environment.
Internal intelligent DC-to-DC conversion boosts the supply rail to provide additional
headroom and power output. The supply voltage is only raised when necessary. This
maximizes the output power of the class-D audio amplifier while limiting quiescent power
consumption in combination with a Pulse Frequency Modulation (PFM) scheme.
The device can be configured to drive either a hands-free speaker (4 to 8 ) for audio
playback, or a receiver speaker (32 ) for handset playback, allowing it to be embedded
in platforms that support either or both options. The maximum output power, gain, and
noise levels are lower in the Handset Call use case than in the Hands-free Call use case.
The TFA9892 also incorporates advanced battery protection. By limiting the supply
current when the battery voltage is low, it prevents the audio system from drawing
excessive load currents from the battery, which could cause a system undervoltage. The
advanced processor minimizes the impact of a falling battery voltage on the audio quality
by preventing distortion as the battery discharges.
Because it has a digital input interface, the TFA9892 features low RF susceptibility. The
second order closed loop architecture used in a class-D audio amplifier provides excellent
audio performance and high supply voltage ripple rejection. The TDM/I2S audio interface
provides a wide range of settings for multiple slots and Digital I/O. The settings are
communicated via an I2C-bus interface.
TFA9892
12 V boosted audio system with adaptive sound maximizer
and speaker protection
Rev. 1.0 — 1 September 2017 Product short data sheet
TFA9892_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1.0 — 1 September 2017 2 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
The device also provides the speaker with robust protection against ESD damage. In a
typical application, no additional components are needed to withstand a 15 kV discharge
on the speaker.
The TFA9892 is available in a 49-bump WLCSP (Wafer Level Chip-Size Package) with a
400 m pitch.
2. Features and benefits
Output power: 6.6 W into 8 at 4.0 V supply voltage (THD = 1 %)
Wide range of speakers: 4 to 8 for hands-free mode and 16 , 32 for handset
one
Sophisticated speaker-boost and protection algorithm that maximizes speaker
performance while protecting the speaker:
Fully embedded software, no additional license fee or porting required
Total integrated solution that includes DSP, ClassD amplifier, DC-to-DC converter
Adaptive excursion control - guarantees that the speaker membrane excursion never
exceeds its rated limit
Multiband dynamic range compressor (DRC) allows independent control of up to three
frequency bands
Real-time temperature protection - direct measurement ensures that voice coil
temperature never exceeds its rated limit
Environmentally aware - automatically adapts speaker parameters to acoustic and
thermal changes including compensation for speaker-box leakage
Four TDM/I2S inputs output (I/O) to support two audio sources or one PDM input and
inter-chip communications
Speaker current and voltage monitoring via TDM for Acoustic Echo Cancellation (AEC)
at the host
Option to route TDM input direct to TDM output to allow a second TDM output slave
device to be used in combination with the TFA9892
Sample frequencies fs from 16 kHz to 48 kHz supported in TDM/I2S mode;
speaker-boost and protection algorithm sample rate up to 48 kHz.
3 bit clock/word select ratios supported (32x, 48x, 64x) in TDM/I2S mode
I2C-bus control interface (400 kHz)
12 V DC-to-DC converter using PFM mode
Wide supply voltage range (fully operational from 2.7 V to 5.5 V)
Fully short-circuit proof across the load and to the supply lines
Low RF susceptibility
Input clock jitter insensitive interface
Thermally protected
15 kV system-level ESD protection without external components
‘Pop noise' free at all mode transitions
3. Applications
Mobile phones
Tablets
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Product short data sheet Rev. 1.0 — 1 September 2017 3 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
Portable Navigation Devices (PND)
Notebooks/Netbooks
MP3 players and portable media players
Small audio systems
4. Quick reference data
5. Ordering information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VBAT battery supply voltage on pin VBAT 2.7 - 5.5 V
VDDD digital supply voltage on pin VDDD 1.65 1.8 1.95 V
IBAT battery supply current on pin VBAT and in DC-to-DC converter coil;
Operating modes with load; DC-to-DC
converter in Adaptive Boost mode (no output
signal, VBAT =3.6V, V
DDD =1.8V)
-2.45-mA
Power-down mode - 1 5 A
IDDD digital supply current on pin VDDD; Operating mode; no audio
stream at the input; DSP enabled;
SpeakerBoost activated
-20-mA
Operating mode; no audio content; DSP
bypassed
-4.5-mA
on pin VDDD; Power-down mode no external
CLK or Data provided
-15-A
on pin VDDD; Power-down mode; internal
oscillator enabled; no external CLK or Data
provided
-50-A
Po(AV) average output power THD+N = 1 %; RL=8; VBAT = 4.0 V - 6.6 - W
Table 2. Ordering informatio n
Type number Package
Name Description Version
TFA9892AUK/N1 WLCSP49 wafer level chip-scale package; 49 bumps; 3.13 3.63 0.5 mm SOT1444-8
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Product short data sheet Rev. 1.0 — 1 September 2017 4 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
6. Block diagram
Fig 1. Block diagram
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Product short data sheet Rev. 1.0 — 1 September 2017 5 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
7. Pinning information
7.1 Pinning
a. Bottom view b. Transparent top view
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Product short data sheet Rev. 1.0 — 1 September 2017 6 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
Transparent top view
Fig 3. Bump mapping
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Product short data sheet Rev. 1.0 — 1 September 2017 7 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
Table 3. Pinning
Symbol Pin Type Description
FS1 A1 I digital audio Frame Sync for DIO1
DIO1 A2 I/O digital audio interface DIO1
DIO4 A3 I/O digital audio data in / out DIO4
INT A4 O interrupt output; open if unused
GNDD A5 P digital ground
OUTB A6 O inverting output
VDDP A7 P power supply voltage
BCK1 B1 I digital audio bit clock DIO1
GNDD B2 P digital ground
DIO3 B3 I digital audio data in/out DIO3
RST B4 I reset input
GNDP B5 P power ground
GNDP B6 P power ground
VDDP B7 P power supply voltage
DIO2/
SPDMI
C1 I/O digital audio data in/out DIO2 / SPDM data input
GNDD C2 P digital ground
TEST3 C3 O test signal input 3; for test purposes only, connect to PCB ground
TEST2 C4 O test signal input 2; for test purposes only, connect to PCB ground
GNDD C5 P digital ground
OUTA C6 O non-inverting output
VDDP C7 P power supply voltage
FS2 D1 I digital audio word select for DIO2
GNDD D2 P digital ground
TEST4 D3 O test signal input 4; for test purposes only, connect to PCB ground
TEST1 D4 O test signal input 1; for test purposes only, connect to PCB ground
GNDD D5 P digital ground
OUTA D6 - non-inverting output[1]
OUTA D7 - non-inverting output[1]
BCK2/
PDMCLK
E1 I digital audio bit clock DIO2 or PDM clock input
SPDMO E2 O PDM output; output open if unused
TEST5 E3 O test signal input 5; for test purposes only, connect to PCB ground
TEST6 E4 O test signal input 6; for test purposes only, connect to PCB ground
GNDB E5 P boosted ground
INB E6 P DC-to-DC boost converter input
VBST E7 O boosted supply voltage output
SDA F1 I/O I2C-bus data input/output
ADS1 F2 I address select input 1
ADS2 F3 I address select input 2
GNDD F4 P digital ground
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Product short data sheet Rev. 1.0 — 1 September 2017 8 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
[1] Is used to simplify routing to OUTA
GNDB F5 P boosted ground
INB F6 P DC-to-DC boost converter input
VBST F7 O boosted supply voltage output
SCL G1 I I2C-bus clock input
VBAT G2 P battery supply voltage sense input
VDDD G3 P digital supply voltage
GNDD G4 P digital ground
GNDB G5 P boosted ground
INB G6 P DC-to-DC boost converter input
VBST G7 O boosted supply voltage output
Table 3. Pinning …continued
Symbol Pin Type Description
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Product short data sheet Rev. 1.0 — 1 September 2017 9 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
8. Functional description
The TFA9892 is a highly efficient mono Bridge Tied Load (BTL) class-D audio amplifier
with a sophisticated SpeakerBoost protection algorithm. Figure 1 is a block diagram of the
TFA9892.
A SpeakerBoost protection algorithm, running on a CoolFlux Digital Signal Processor
(DSP) core, maximizes the acoustical output of the speaker while limiting membrane
excursion and voice coil temperature to a safe level. The mechanical protection
implemented guarantees that speaker membrane excursion never exceeds its rated limit,
to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature
never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal
processing ensures the audio quality remains acceptable at all times.
The protection algorithm implements an adaptive loudspeaker model that is used to
predict the extent of membrane excursion. The model is continuously updated to ensure
that the protection scheme remains effective even when speaker parameter values
change or the acoustic enclosure is modified.
Output sound pressure levels are boosted within given mechanical, thermal and quality
limits. An optional Bandwidth extension mode extends the low frequency response up to a
predefined limit before maximizing the output level. This mode is suitable for listening to
high quality music in quiet environments.
The frequency response of the TFA9892 can be modified via ten fully programmable
cascaded second-order biquad filters. The first two biquads are processed with 48-bit
double precision; biquads 3 to 10 are processed with 24-bit single precision.
At low battery voltage levels, the gain is automatically reduced to limit battery current. The
output volume can be controlled by the SpeakerBoost protection algorithm or by the host
application (external). In the latter case, the boost features of the SpeakerBoost protection
algorithm must be disabled to avoid neutralizing external volume control.
The SpeakerBoost protection algorithm output is converted into two pulse width
modulated (PWM) signals which are then injected into the class-D audio amplifier. The
3-level PWM scheme supports filterless speaker drive.
An adaptive DC-to-DC converter boosts the battery supply voltage in line with the output
of the SpeakerBoost protection algorithm. It switches to Follower mode (VBST =V
BAT; no
boost) when the audio output voltage is lower than the battery voltage. Next to adaptive
DC to DC a PFM mode is selected when the requested output current is low. The adaptive
boost and PFM mode ensures a high efficiency ClassHD Amplifier.
It contains four TDM/I2S input/output (DIO) ports. These ports can be selected as an input
or an output on demand. i.e. DIO1 and DIO2, can be selected as the audio input stream.
DIO3 is provided to support stereo applications, while DIO4 can be used to provide stereo
AEC as well. DIO1, DIO3 and DIO4 are clocked by FS1 and BCK1, while DIO2 is clocked
by FS2 and BCK2; see Figure 1).
DIO 3, 4 can be as well configured to transmit the DSP output signal, amplifier output
current and voltage information, or amplifier gain information. The gain information can be
used to facilitate communication between two devices in stereo applications.
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Product short data sheet Rev. 1.0 — 1 September 2017 10 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
A ‘pass-through’ option allows one of the DIO1, 2, 3 as input to be connected directly to
the DIO4 output. The pass-through option is provided to allow an output slave device (e.g.
a CODEC), connected in parallel with the TFA9892, to be routed directly to the audio host
via DIO4 output.
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Product short data sheet Rev. 1.0 — 1 September 2017 11 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
9. Limiting values
[1] Using an NXP demo board with a 1 mm wire/PCB track length on pin INB, AC pulses up to 18 V and 9 V can be observed without
causing any damage as these spikes only partly penetrate the device (which is protected by internal clamp circuits).
10. Thermal characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Vxvoltage on pin x on pin VBAT 0.3 +6 V
on pins VBST, VDDP 0.3 +12.4 V
on pin INB, OUTA, OUTB 0.3 +13.4[1] V
on pin VDDD 0.3 +2.5 V
on SCL, SDA, DIO1, DIO2, DIO3, DIO4 0.3 +2.5 V
Tjjunction temperature 40 +150 C
Tstg storage temperature 55 +150 C
Tamb ambient temperature 40 +85 C
VESD electrostatic discharge voltage according to Human Body Model (HBM) 2+2 kV
according to Charge Device Model (CDM) 500 +500 V
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to ambient 4-layer application board 35 K/W
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Product short data sheet Rev. 1.0 — 1 September 2017 12 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
11. Characteristics
11.1 DC Characteristics
Table 6. DC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP =V
BST = 12 V, adaptive boost mode; LBST =1
H[1];
RL=8
[1]; LL=40
H[1]; fi= 1 kHz; fs= 48 kHz; Tamb =25
C; default settings, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VBAT battery supply voltage on pin VBAT 2.7 - 5.5 V
IBAT battery supply current on pin VBAT and in DC-to-DC converter
coil; Operating modes with load;
DC-to-DC converter in Adaptive Boost
mode (no output signal, VBAT =3.6 V;
VDDD =1.8V)
-2.45- mA
Power-down mode - 1 5 A
VDDP power supply voltage on pin VDDP 2.7 - 12.2 V
VDDD digital supply voltage on pin VDDD; Brown out detector
(BOD) disabled.
[3] 1.65 1.8 1.95 V
IDDD digital supply current on pin VDDD; Operating mode; no
audio stream at the input; DSP enabled;
SpeakerBoost activated
-20- mA
Operating mode; no audio content;
DSP bypassed
-4.5- mA
Power-down mode - 15 - A
Power-down mode; internal oscillator
enabled
-50- A
Pins DIO1,2,3,4, BCK1, FS1, BCK2, FS2, ADS1, ADS2, SCL, SDA
VIH HIGH-level input voltage 0.7VDDD -V
DDD V
VIL LOW-level input voltage - - 0.3VDDD V
Cin input capacitance [2] --3pF
ILI input leakage current 1.8 V on input pin - - 0.1 A
Pins DIO1,2,3,4, SPDMI, INT, push-pull output stages
VOH HIGH-level output voltage IOH =4 mA - - V
DDD
0.4
V
VOL LOW-level output voltage IOL =4 mA - - 400 mV
Pins SDA, open drain outputs, external 10 k resistor to VDDD
VOH HIGH-level output voltage IOH =4 mA - - V
DDD
0.4
V
VOL LOW-level output voltage IOL =4 mA - - 400 mV
Pins OUTA, OUTB
RDSon drain-source on-state
resistance
Amplifier Active, NMOS + PMOS
VDDP =12V
-600- m
Protection
Tact(th_prot) thermal protection activation
temperature
130 - 150 C
Vuvp(VBAT) undervoltage protection
voltage on pin VBAT
2.3 - 2.5 V
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Product short data sheet Rev. 1.0 — 1 September 2017 13 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
[1] LBST = boost converter inductance; RL= load resistance; LL= load inductance (speaker).
[2] This parameter is not tested during production; the value is guaranteed by design and checked during product validation.
[3] If BOD is enabled min VDDD range goes to 1.7 V
11.2 AC characteristics
IO(ocp) overcurrent protection output
current
2-- A
DC-to-DC converter
VBST maximum voltage on pin VBST Maximum boost voltage setting 11.8 12 12.2 V
Table 6. DC characteristics …continued
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP =V
BST = 12 V, adaptive boost mode; LBST =1
H[1];
RL=8
[1]; LL=40
H[1]; fi= 1 kHz; fs= 48 kHz; Tamb =25
C; default settings, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 7. AC characteristics
All parameters are guaranteed for VBAT =3.6V; V
DDD =1.8V; V
DDP =V
BST = 12 V, adaptive boost mode; LBST =1
H[1];
RL=8
[1]; LL=40
H[1]; fi= 1 kHz; fs=48kHz; T
amb =25
C; default settings, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Amplifier output pow er
Po(AV) average output power Hands-free speaker THD+N = 1 %;
VBAT =4V
RL=8 ; VBST =12V 6.6 W
RL=6 ; VBST =10V 6.6 W
RL=4 ; VBST =8.5V 6.7 W
Hands-free speaker THD+N = 10 %;
VBAT =4V
RL=8 ; VBST =12V 8 W
Handset speaker THD+N = 1 %;
VBST =12V; V
BAT =4V
2W
Amplifier output; pin s OUTA and OUTB
VO(offset)output offset voltage absolute value - - 0.5 mV
Amplifier performance
po output power efficiency Po(RMS) = 2.5 W; including DC-to-DC
converter; 100 Hz audio signal
[2] -80-%
THD+N total harmonic distortion-plus-noise Po(RMS) =100mW; R
L=8 ; LL=44H[1] --0.1%
Vn(o) output noise voltage A-weighted; no output signal;
CoolFlux DSP bypassed;
Handset mode; BCK clock jitter < 1 ns
(PLL locked on BCK)
-16-V
DR dynamic range VO= 10 V (peak); A-weighted - 115 - dB
S/N signal-to-noise ratio VO= 10 V (peak); A-weighted - 100 - dB
PSRR power supply rejection ratio Vripple = 200 mV (RMS); fripple =217Hz - 75 - dB
fsw switching frequency directly coupled to the TDM FS input
frequency
256 - 384 kHz
G(I2S-VO) I2S to VO gain Coolflux DSP bypassed, measured at
input level -12 dBFS; TDMSPKG = 0 dB
-21-dB
VPOP pop noise voltage At mode transition and gain change 2 mV
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Product short data sheet Rev. 1.0 — 1 September 2017 14 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
[1] LBST = boost converter inductor; RL= load resistance; LL= load inductance (speaker).
[2] This parameter is not tested during production; the value is guaranteed by design and checked during product validation.
[3] The pilot tone is removed at the zero crossing after a soft mute, which takes on average 10 ms (20 ms max.) at a sample rate of 48 kHz
and 15 ms (30 ms max.) at a sample rate of 16 kHz.
[4] If a higher value is used, LPM should be disabled.
RLload resistance 4 8 32
CLload capacitance - - 200 pF
Amplifier powe r-up , pow er-d own and propagation delays
td(on) turn-on delay time PLL locked on BCK fs = 16 to 48 kHz - - 2 ms
PLL locked on FS fs =48kHz - - 6 ms
td(off) turn-off delay time - - 10 s
td(mute_off) mute off delay time - 1 - ms
td(soft_mute) soft mute delay time Coolflux DSP enabled [3] -120-ms
tPD propagation delay CoolFlux DSP bypassed fs = 48 kHz - - 600 s
SpeakerBoost protection mode,
tLookAhead = 10 ms, fs = 48 kHz
--12ms
Current-sensing performance
S/N signal-to-noise ratio IO= 1.2 A (peak); A-weighted - 75 - dB
Isense current sense mismatch IO= 0.5 A (peak) 3- +3%
B bandwidth [2] -8-kHz
LLload inductance RL≤32 30 - - H
CLload capacitance to ground [4] -200-pF
Table 7. AC characteristics …continued
All parameters are guaranteed for VBAT =3.6V; V
DDD =1.8V; V
DDP =V
BST = 12 V, adaptive boost mode; LBST =1
H[1];
RL=8
[1]; LL=40
H[1]; fi= 1 kHz; fs=48kHz; T
amb =25
C; default settings, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
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Product short data sheet Rev. 1.0 — 1 September 2017 15 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
11.3 TDM/I2S timing characteristics
[1] LBST = boost converter inductance; RL= load resistance; LL= load inductance.
[2] The I2S bit clock input (BCK) is used as a clock input for the DSP, as well as for the amplifier and the DC-to-DC converter. Note that both
the BCK and FS signals need to be present for the clock to operate correctly.
[3] This parameter is not tested during production; the value is guaranteed by design and checked during product validation.
[4] When the PLL is locked on BCK, amplifier output noise can deteriorate when clock jitter > 1 ns.
[5] The system is less sensitive to jitter when the PLL is locked on FS.
Table 8. TDM I2S bus interface characteristics; see Figure 4
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP =V
BST = 12 V, adaptive boost mode; LBST =1
H[1]; RL=
8
[1]; LL = 40
H[1]; fi= 1 kHz; fs = 48 kHz; Tamb = 25
C; default settings, unless otherwise specified .
Symbol Parameter Conditions Min Typ Max Unit
fssampling frequency on pin FS [2] 16 - 48 kHz
fclk clock frequency on pin BCK [2] 32fs- 512fsHz
tsu set-up time FS edge to BCK HIGH [3] 10 - - ns
DATA edge to BCK HIGH 10 - - ns
thhold time BCK HIGH to FS edge [3] 10 - - ns
BCK HIGH to DATA edge 10 - - ns
tJexternal clock jitter PLL locked on BCK [4] --2 ns
PLL locked on FS [5] - - 20 ns
Fig 4. TDM/I2S timing
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Product short data sheet Rev. 1.0 — 1 September 2017 16 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
11.4 I2C timing characteristics
[1] LBST = boost converter inductance; RL= load resistance; LL= load inductance.
[2] Cb is the total capacitance of one bus line in pF. The maximum capacitive load for each bus line is 400 pF.
[3] After this period, the first clock pulse is generated.
[4] To be suppressed by the input filter.
Table 9. I2C-bus interface characteristics; see Figure 5
All parameters are guaranteed for VBAT =3.6V; V
DDD =1.8V; V
DDP =V
BST = 12 V, adaptive boost mode; LBST =1
H[1];
RL=8
[1]; LL=40
H[1]; fi= 1 kHz; fs=48kHz; T
amb =25
C; default settings, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
fSCL SCL clock frequency - - 400 kHz
tLOW LOW period of the SCL clock 1.3 - - s
tHIGH HIGH period of the SCL clock 0.6 - - s
trrise time SDA and SCL signals [2] 20 + 0.1 Cb-- ns
tffall time SDA and SCL signals [2] 20 + 0.1 Cb-- ns
tHD;STA hold time (repeated) START
condition
[3] 0.6 - - s
tSU;STA set-up time for a repeated START
condition
0.6 - - s
tSU;STO set-up time for STOP condition 0.6 - - s
tBUF bus free time between a STOP and
START condition
1.3 - - s
tSU;DAT data set-up time 100 - - ns
tHD;DAT data hold time 0 - - s
tSP pulse width of spikes that must be
suppressed by the input filter
[4] 0 - 50 ns
Cbcapacitive load for each bus line - - 400 pF
Fig 5. I2C timing
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TFA9892_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1.0 — 1 September 2017 17 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
12. Application information
12.1 Application diagrams
Fig 6. Typical mono applica t ion
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TFA9892_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1.0 — 1 September 2017 18 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
Fig 7. Typical stereo application
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TFA9892_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1.0 — 1 September 2017 19 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
Fig 8. Stereo application using single coil
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TFA9892_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1.0 — 1 September 2017 20 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
13. Package outline
Fig 9. Package outline TF A9892AUK/N1 (WLCSP49)
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TFA9892_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1.0 — 1 September 2017 21 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “W afer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
•Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 10) than a SnPb process, thus
reducing the process window
•Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
•Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Tabl e 1 0 .
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 10.
Table 10. Lead-free pr ocess (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
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Product short data sheet Rev. 1.0 — 1 September 2017 22 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
14.3.1 Stand off
The stand off between the substrate and the chip is determined by:
•The amount of printed solder on the substrate
•The size of the solder land on the substrate
•The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
14.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
14.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 10. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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Product short data sheet Rev. 1.0 — 1 September 2017 23 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
14.3.4 Cleaning
Cleaning can be done after reflow soldering.
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Product short data sheet Rev. 1.0 — 1 September 2017 24 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
15. Revision history
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TFA9892_SDS v.1 20170901 Product short data sheet - -
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Product short data sheet Rev. 1.0 — 1 September 2017 25 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specificat ion — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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TFA9892_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1.0 — 1 September 2017 26 of 27
NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
CoolFlux — is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
DRAFT
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NXP Semiconductors TFA9892
12 V boosted audio system with adapt ive sound maximizer and
speaker protection
© NXP B.V. 2017. All rights reserved. All rights reserv ed.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 September 2017
Document identifier: TFA9892_SDS
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2
3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Functional description . . . . . . . . . . . . . . . . . . . 9
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
10 Thermal characteristics . . . . . . . . . . . . . . . . . 11
11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12
11.1 DC Characteristics . . . . . . . . . . . . . . . . . . . . . 12
11.2 AC characteristics. . . . . . . . . . . . . . . . . . . . . . 13
11.3 TDM/I2S timing characteristics . . . . . . . . . . . . 15
11.4 I2C timing characteristics . . . . . . . . . . . . . . . . 16
12 Application information. . . . . . . . . . . . . . . . . . 17
12.1 Application diagrams . . . . . . . . . . . . . . . . . . . 17
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
14 Soldering of WLCSP packages. . . . . . . . . . . . 21
14.1 Introduction to soldering WLCSP packages . . 21
14.2 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 21
14.3 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21
14.3.1 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
14.3.2 Quality of solder joint . . . . . . . . . . . . . . . . . . . 22
14.3.3 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
14.3.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
17 Contact information. . . . . . . . . . . . . . . . . . . . . 26
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
