
ITR20004/L24
Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 1 Page: 7 of 8
Device No:DRX-200-138 Prepared date:2005/11/15 Prepared by: Carryllhsu
█Reliability Test Item And Condition
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD:10%
NO. Item Test Conditions Test Hours/
Cycles
Sample
Sizes
Failure
Judgement
Criteria
Ac/Re
1 Solder Heat TEMP.:260℃±5℃ 10secs 22pcs 0/1
2 Temperature Cycle H : +85℃ 30mins
5mins
L : -55℃ 30mins
50Cycles 22pcs 0/1
3 Thermal Shock H :+100℃ 5mins
10secs
L :-10℃ 5mins
50Cycles 22pcs 0/1
4 High Temperature
Storage
TEMP.:+100℃ 1000hrs 22pcs 0/1
5 Low Temperature
Storage
TEMP.:-55℃ 1000hrs 22pcs 0/1
6 DC Operating Life IF=20mA 1000hrs 22pcs 0/1
7 High Temperature/
High Humidity
85℃ / 85% R.H 1000hrs 22pcs
IR≧U×2
Ee≦L×0.8
VF≧U×1.2
U:Upper
Specification
Limit
L:Lower
Specification
Limit
0/1
█Recommended Method of Storage
The following are general recommendations for moisture sensitive level (MSL) 4
storage and use:
z Shelf life in sealed bag: 12 months at < 40 °C and < 90% relative humidity (RH)
z After bag is opened, devices that will be subjected to reflow solder or other high temperature
process must
a) Mounted within 72 hours of factory conditions < 30 °C/60%RH, or
b) Stored at <20% RH
z Devices require bake, before mounting, if:
Humidity Indicator Card is > 20% when read at 23 ± 5 °C
z If baking is required, devices may be baked:
a) 192 hours at 40℃,and <5% RH(dry air/nitrogen) or
b) 96 hours at 60℃,and <5% RH for all device containers
c) 24 hours at 125 °C