© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 1
CSPEMI202A
2 Channel Headset Microphone EMI Filter with ESD Protection
Features
• Two channels of EMI filtering
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• Greater than 40dB attenuation at 1GHz
•+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
•+15kV ESD protection on each channel (HBM)
• Supports bipolar signals—ideal for
audio applications
• Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
• 5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• EMI filtering and ESD protection for headset
microphone ports
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
Product Description
The CSPEMI202A is a dual low-pass filter array inte-
grating two pi-style filters (C-R-C) that reduce EMI/RFI
emissions while at the same time providing ESD pro-
tection. This part is custom-designed to interface with a
microphone port on a cellular telephone or similar
device. Each high quality filter provides more than
35dB attenuation in the 800-2700 MHz range. These
pi-style filters support bidirectional filtering, controlling
EMI both to and from a microphone element. They also
support bipolar signals, enabling audio signals to pass
through without distortion.
In addition, the CSPEMI202A provides a very high
level of protection for sensitive electronic components
that may be subjected to electrostatic discharge (ESD).
The input pins are designed and characterized to
safely dissipate ESD strikes of 8kV, the maximum
requirement of the IEC 61000-4-2 international stan-
dard. Using the MIL-STD-883 (Method 3015) specifica-
tion for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater
than 15kV.
The CSPEMI202A is particularly well suited for porta-
ble electronics (e.g., cellular telephones, PDAs, note-
book computers) because of its small package format
and low weight. The CSPEMI202A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Electrical Schematic
68
Ω
47pF47pF
68
Ω
C1
C3
A1
A3
B2
MIC_OUT1
MIC_OUT2
GND
MIC_IN2
MIC_IN1
47pF47pF
© 2003 California Micro Devices Corp. All rights reserved.
2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI202A
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1 MIC_IN1 Microphone Input 1 (from microphone)
A3 MIC_IN2 Microphone Input 2 (from microphone)
B2 GND Device Ground
C1 MIC_OUT1 Microphone Output 1 (to audio circuitry)
C3 MIC_OUT2 Microphone Output 2 (to audio circuitry)
MIC_IN1 MIC_IN2
MIC_OUT1 MIC_OUT2
A1 A3
C3C1
GND
B2
Orientation
Marking
A1
AD
231
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Note:
CSPEMI202A
CSP Package
TOP VIEW BOTTOM VIEW
(Bumps Down View) (Bumps Up View)
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
1) These drawings are not to scale.
PART NUMBERING INFORMATION
Bumps Package
Standard Finish Lead-free Finish2
Ordering Part
Number1Part Marking
Ordering Part
Number1Part Marking
5 CSP CSPEMI202A AD CSPEMI202AG AD
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 3
CSPEMI202A
Specifications
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 200 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
R1Resistance 61 68 75 Ω
C1 Capacitance 38 47 56 pF
ILEAK Diode Leakage Current VIN=5.0V 1.0 µA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
5
-5
7
-10
15
-15
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
±15
±8
kV
kV
VCL Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+15
-19
V
V
fCCut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 68Ω, C = 47pF 60 MHz
© 2003 California Micro Devices Corp. All rights reserved.
4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI202A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 5
CSPEMI202A
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.275mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.325mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50µm
Solder Ball Side Coplanarity +20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (°C)
© 2003 California Micro Devices Corp. All rights reserved.
6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI202A
Mechanical Details
CSP Mechanical Specifications
CSPEMI202A devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
Package Dimensions for
CSPEMI202A Chip Scale Package
CSP Tape and Reel Specifications
Figure 6. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 5
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 0.905 0.950 0.995 0.0356 0.0374 0.0392
A2 1.365 1.410 1.455 0.0537 0.0555 0.0573
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.175 0.225 0.275 0.0069 0.0089 0.0108
C2 0.220 0.270 0.320 0.0087 0.0106 0.0126
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
12
C1
B1
A1
B3
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
3
B2
B4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL P0P1
CSPEMI202A 1.41 X 0.95 X 0.6 1.52 X 1.07 X 0.72 8mm 178mm (7") 3500 4mm 4mm
Top
For Tape Feeder Reference
Cover
Tape
P
1
Only including Draft.
Concentric Around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
