CSPEMI202A 2 Channel Headset Microphone EMI Filter with ESD Protection Features Product Description * * The CSPEMI202A is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a microphone element. They also support bipolar signals, enabling audio signals to pass through without distortion. * * * * * * * Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports bipolar signals--ideal for audio applications Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.950mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available In addition, the CSPEMI202A provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. Applications * * * * * * * EMI filtering and ESD protection for headset microphone ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs The CSPEMI202A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI202A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Electrical Schematic MIC_IN1 68 A1 47pF MIC_IN2 MIC_OUT1 47pF 68 A3 47pF GND C1 C3 MIC_OUT2 47pF B2 (c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 1 CSPEMI202A PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 2 3 A MIC_OUT2 C1 C3 GND AD B MIC_OUT1 B2 Orientation Marking C MIC_IN1 MIC_IN2 A1 A3 A1 CSPEMI202A CSP Package Note: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 MIC_IN1 Microphone Input 1 (from microphone) A3 MIC_IN2 Microphone Input 2 (from microphone) B2 GND C1 MIC_OUT1 Microphone Output 1 (to audio circuitry) C3 MIC_OUT2 Microphone Output 2 (to audio circuitry) Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish 2 Standard Finish Ordering Part Ordering Part Bumps Package Number1 Part Marking Number1 Part Marking 5 CSP CSPEMI202A AD CSPEMI202AG AD Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. (c) 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/09/03 CSPEMI202A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 C DC Power per Resistor 100 mW DC Package Power Rating 200 mW RATING UNITS -40 to +85 C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance 61 68 75 C1 Capacitance 38 47 56 pF 1.0 A 15 -15 V V ILEAK Diode Leakage Current VIN=5.0V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off frequency ZSOURCE = 50, ZLOAD = 50 R = 68, C = 47pF VESD VCL fC 5 -5 7 -10 15 kV 8 kV +15 -19 V V 60 MHz Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. (c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 3 CSPEMI202A Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) (c) 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/09/03 CSPEMI202A Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance -- Edge To Corner Ball +50m Solder Ball Side Coplanarity +20m Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration Temperature (C) 250 200 150 100 50 0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile (c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 5 CSPEMI202A Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CSPEMI202A devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW A1 C B 5 A Millimeters Inches Nom Max A1 0.905 0.950 0.995 0.0356 0.0374 0.0392 A2 1.365 1.410 1.455 0.0537 0.0555 0.0573 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.175 0.225 0.275 0.0069 0.0089 0.0108 C2 0.220 0.270 0.320 0.0087 0.0106 0.0126 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 C2 Nom 1 2 3 Min # per tape and reel Min A2 Custom CSP Bumps Dim B4 B3 PACKAGE DIMENSIONS Package SIDE VIEW C1 B2 B1 Max D1 0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI202A Chip Scale Package 0.0140 0.0150 0.0159 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CSPEMI202A 1.41 X 0.95 X 0.6 1.52 X 1.07 X 0.72 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape 0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 6. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/09/03