A2
A1
A2
D²PAK
TO-220AB TO-220AB Ins.
A2
A1
G
G
A1
G
A2
A1
G
A2
A2
Features
Medium current Triac
Low thermal resistance with clip bonding
Low thermal resistance insulation ceramic for insulated BTA
High commutation (4Q) or very high commutation (3Q, Snubberless™)
capability
BTA series UL1557 certified (file ref: 81734)
Packages are RoHS (2002/95/EC) compliant
Insulated tab (BTA series, rated at 2500 VRMS)
Applications
Snubberless versions (BTA/BTB...W and T1635) especially recommended for
use on inductive loads, because of their high commutation performances
On/off or phase angle function in applications such as static relays, light
dimmers and appliance motor speed controllers
Description
Available either in through-hole or surface mount packages, the BTA16, BTB16 and
T1610, T1635 and T1650 Triac series are suitable for general purpose mains power
AC switching. They can be used as ON/OFF function in applications such as static
relays, heating regulation or induction motor starting circuit. They are also
recommended for phase control operations in light dimmers and appliance motors
speed controllers.
The Snubberless™ versions (W suffix and T1610, T1635, T1650) are especially
recommended for use on inductive loads, because of their high commutation
performance.
By using an internal ceramic pad, the Snubberless™ series provide an insulated tab
(rated at 2500 VRMS) complying with UL standards (file reference: E81734).
Product status link
BTA16
BTB16
T1610
T1635
T1650
Product summary
IT(RMS) 16 A
VDRM/VRRM 600, 800 V
IGTSnubberless™ 10, 35, 50 mA
IGTstandard 25, 50 mA
Snubberless™, logic level and standard 16 A Triacs
T1610, T1635, T1650
BTA16, BTB16
Datasheet
DS2114 - Rev 11 - May 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute maximum ratings
Symbol Parameters Value Unit
IT(RMS) RMS on-state current (full sine wave)
TO-220AB, D2PAK Tc = 100 °C
16 A
TO-220AB Ins. Tc = 86 °C
ITSM
Non repetitive surge peak on-state current (full cycle,
Tj initial = 25 °C)
F = 50 Hz tp = 20 ms 160
A
F = 60 Hz tp = 16.7 ms 168
I2t I2t value for fusing tp = 10 ms 144 A2s
dl/dt
Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz Tj = 125 °C 50 A/µs
VDSM/VRSM Non repetitive surge peak off-state voltage tp = 10 ms Tj = 25 °C VDRM/VRRM +
100 V
IGM Peak gate current tp = 20 µs Tj = 125 °C 4 A
PG(AV) Average gate power dissipation Tj = 125 °C 1 W
Tstg Storage junction temperature range -40 to +150 °C
TjOperating junction temperature range -40 to +125 °C
Table 2. Static electrical characteristics
Symbol Test conditions TjValue Unit
VT(1) ITM = 22.5 A, tp = 380 µs 25 °C Max. 1.55 V
VTO(1) threshold on-state voltage 125 °C Max. 0.85 V
RD(1) Dynamic resistance 125 °C Max. 25
IDRM/IRRM VDRM = VRRM
25 °C
Max.
5 µA
125 °C 2 mA
1. For both polarities of A2 referenced to A1
Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - standard (4 quadrants)
Symbol Parameters Quadrant
BTA16
BTB16 Unit
C B
IGT(1)
VD = 12 V, RL = 33 Ω
I - II - III
IV Max. 25
50
50
100 mA
VGT All Max. 1.3 V
VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C All Min. 0.2 V
IH(2) IT = 500 mA Max. 25 50 mA
ILIG = 1.2 IGT
I - III - IV Max. 40 60
mA
II Max. 80 120
T1610, T1635, T1650, BTA16, BTB16
Characteristics
DS2114 - Rev 11 page 2/18
Symbol Parameters Quadrant
BTA16
BTB16 Unit
C B
dV/dt(2) VD = 67 % VDRM gate open, Tj = 125 °C Min. 200 400 V/µs
(dV/dt)c(2) (dI/dt)c = 7 A/ms, Tj = 125 °C Min. 5 10 V/µs
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
Table 4. Electrical characteristics (Tj = 25 °C, unless otherwise specified) - Snubberless and logic level (3
quadrants)
Symbol Parameters Quadrant
T1610 / BTA16-
SW / BTB16-
SW
T1635 /
BTA16-CW /
BTB16-CW
T1650 /
BTA16-BW /
BTB16-BW
Unit
IGT(1)
VD = 12 V, RL = 30 Ω
I - II - III
Max. 10 35 50 mA
VGT Max. 1.3 V
VGD VD = VDRM, RL = 3,3 kΩ, Tj = 125 °C Min. 0.2 V
IH(2) IT = 500 mA Max. 15 35 50 mA
ILIG = 1.2 IGT
I - III Max. 25 50 70
mA
II Max. 30 60 80
(dV/dt)(2) VD = 67 % VDRM gate open, Tj = 125 °C Min. 40 500 1000 V/µs
(dI/dt)c(2)
(dV/dt)c = 0.1 V/μs, Tj = 125 °C
Min.
8.5
A/ms
(dV/dt)c = 10 V/μs, Tj = 125 °C 3.0
Without snubber, Tj = 125 °C 8.5 14
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
Table 5. Thermal resistance
Symbol Parameters Value Unit
Rth(j-c) Max. junction to case (AC)
TO-220AB / D²PAK 1.2
°C/W
TO-220AB insulated 2.1
Rth(j-a)
Junction to ambient (S = 2 cm²) D²PAK 45
Junction to ambient TO-220AB / TO-220AB ins 60
1. Copper surface under tab.
T1610, T1635, T1650, BTA16, BTB16
Characteristics
DS2114 - Rev 11 page 3/18
1.1 Characteristics (curves)
Figure 2. Maximum power dissipation versus on-state
RMS current (full cycle)
0 2 4 6 8 10
0
2
4
6
8
10
12
14
16
18
20
P(W)
IT(RMS)(A)
12 14 16
Figure 3. RMS on-state current versus case temperature
(full cycle)
0 25 50 75 100 125
0
2
4
6
IT(RMS)(A)
Tc(°C)
BTB/T16
BTA
8
10
12
14
16
18
Figure 4. On-state rms current versus ambient
temperature (full cycle)
0 25 50 75 100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
IT(RMS)(A)
Tc(°C)
Printed circuit board FR4, copper thickness: 35 µm
D²PAK
(S = 1 cm²)
Figure 5. Relative variation of thermal impedance versus
pulse duration
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
1E-2
1E-1
1E+0
K = [Zth/Rth]
tp(s)
Zth(j-c)
Zth(j-a)
T1610, T1635, T1650, BTA16, BTB16
Characteristics (curves)
DS2114 - Rev 11 page 4/18
Figure 6. On-state characteristics (maximum values)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1
10
100
200
ITM(A)
VTM(V)
Tj max.
Vto = 0.85 V
Rd = 25 mΩ
Tj = Tj max.
Tj = 25 °C
Figure 7. Surge peak on-state current versus number of
cycles
1 1 0 100 1000
0
20
40
60
80
100
120
140
160
180
ITSM(A)
Numb er of cycles
t=20ms
One cy cle
Non repetitive
T initial=25°C
j
Repetitive
T =85°C
C
Figure 8. Non-repetitive surge peak on-state current for a
sinusoidal
0.01 0.10 1. 00 10. 00
100
1000
3000
ITSM(A),I t (A s)
22
ITSM
dI/dt limitation:
50A/µs
puls e wi th wid th t < 10 ms
pt (ms)
p
T initial=25°C
j
Figure 9. Relative variation of gate trigger current
-40 -20 02 04 06 08 0 100 120 140
0.0
0.5
1.0
1.5
2.0
2.5
T( °C)
j
IGT, IH, IL[Tj] /
IGT
IH& IL
holding cu rrent and latch in g current versus ju nc ti on
temperature (typ ical values)
IGT, IH, IL[Tj = 25 °C]
Figure 10. Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
0.1 1.0 10.0 100.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
(dl/dt)c [(dV/dt)c] / specified (dl/dt)c
(dV/dt)c (V/µs)
C
SW/T1610
T1635/T1650/CW/BW
Snubberless and logic level types
B
Figure 11. Relative variation of critical rate of decrease of
main current versus (junction temperature (typical values)
0 25 5 0 75 100 125
0
1
2
3
4
5
6
(dl/dt)c [Tj] / (dl/dt)c [Tj specified]
Tj(°C)
T1610, T1635, T1650, BTA16, BTB16
Characteristics (curves)
DS2114 - Rev 11 page 5/18
Figure 12. D²PAK thermal resistance junction to ambient versus copper surface under tab
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
Rth(j-a) (°C/W)
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
SCu(cm²)
T1610, T1635, T1650, BTA16, BTB16
Characteristics (curves)
DS2114 - Rev 11 page 6/18
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
T1610, T1635, T1650, BTA16, BTB16
Package information
DS2114 - Rev 11 page 7/18
2.1 TO-220AB Insulated and non Insulated package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
Figure 13. TO-220AB Insulated and non Insulated package outline
C
b2
c2
F
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M
Resin gate 0.5 mm
max. protusion(1)
Resin gate 0.5 mm
max. protusion(1)
(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.
I
T1610, T1635, T1650, BTA16, BTB16
TO-220AB Insulated and non Insulated package information
DS2114 - Rev 11 page 8/18
Table 6. TO-220ABInsulated and non Insulated package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.5984 0.6260
a1 3.75 0.1476
a2 13.00 14.00 0.5118 0.5512
B 10.00 10.40 0.3937 0.4094
b1 0.61 0.88 0.0240 0.0346
b2 1.23 1.32 0.0484 0.0520
C 4.40 4.60 0.1732 0.1811
c1 0.49 0.70 0.0193 0.0276
c2 2.40 2.72 0.0945 0.1071
e 2.40 2.70 0.0945 0.1063
F 6.20 6.60 0.2441 0.2598
I 3.73 3.88 0.1469 0.1528
L 2.65 2.95 0.1043 0.1161
I2 1.14 1.70 0.0449 0.0669
I3 1.14 1.70 0.0449 0.0669
I4 15.80 16.40 16.80 0.6220 0.6457 0.6614
M 2.6 0.1024
1. Inch dimensions are for reference only.
T1610, T1635, T1650, BTA16, BTB16
TO-220AB Insulated and non Insulated package information
DS2114 - Rev 11 page 9/18
2.2 D²PAK package information
Figure 14. D²PAK package outline
(1) Resin gate position accepted in one of the two positions or in the symmetrical opposites
e
G
E1
E2
c2
A
D2 D1
b
b2
H
E
L2
L3
D
V2
c
A1
A2
A3
L
R
Gauge Plane
Resin gate
0.5 mm max.
protrusion(1)
T1610, T1635, T1650, BTA16, BTB16
D²PAK package information
DS2114 - Rev 11 page 10/18
Table 7. D²PAK package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.1693 0.1811
A1 2.49 2.69 0.0980 0.1059
A2 0.03 0.23 0.0012 0.0091
A3 0.25 0.0098
b 0.70 0.93 0.0276 0.0366
b2 1.25 1.7 0.0492 0.0669
c 0.45 0.60 0.0177 0.0236
c2 1.21 1.36 0.0476 0.0535
D 8.95 9.35 0.3524 0.3681
D1 7.50 8.00 0.2953 0.3150
D2 1.30 1.70 0.0512 0.0669
e 2.54 0.1
E 10.00 10.28 0.3937 0.4047
E1 8.30 8.70 0.3268 0.3425
E2 6.85 7.25 0.2697 0.2854
G 4.88 5.28 0.1921 0.2079
H 15 15.85 0.5906 0.6240
L 1.78 2.28 0.0701 0.0898
L2 1.27 1.40 0.0500 0.0551
L3 1.40 1.75 0.0551 0.0689
R 0.40 0.0157
V2
1. Dimensions in inches are given for reference only
T1610, T1635, T1650, BTA16, BTB16
D²PAK package information
DS2114 - Rev 11 page 11/18
Figure 15. D²PAK recommended footprint (dimensions are in mm)
16.90
10.30
3.70
5.08
1.30
8.90
T1610, T1635, T1650, BTA16, BTB16
D²PAK package information
DS2114 - Rev 11 page 12/18
3Ordering information
Figure 16. Ordering information scheme (BTA16 and BTB16 series)
BT A 16 - 600 BW (RG)
Triac
Insulation
A = Insulated
B = Non-insulated
Current
Voltage
Sensitivity and type
Packing mode
RG = Tube
16 = 16 A
600 = 600 V
800 = 800 V
B = 50 mA
C = 25 mA standard
SW = 10 mA logic level
BW = 50 mA Snubberless™
CW = 35 mA Snubberless™
T1610, T1635, T1650, BTA16, BTB16
Ordering information
DS2114 - Rev 11 page 13/18
Figure 17. Ordering information scheme (T8 series)
T 16 35 - 600 G (-TR)
Triac series
Package
G = D²PAK
Current
Voltage
Sensitivity
Packing mode
Blank = Tube
TR = Tape and reel
16 = 16 A
600 = 600 V
800 = 800 V
10 = 10 mA
35 = 35 mA
50 = 50 mA
T1610, T1635, T1650, BTA16, BTB16
Ordering information
DS2114 - Rev 11 page 14/18
3.1 Product selector
Table 8. Product selector
Part Number
Sensitivity Type Package
600 800
BTB16-600C 35 mA Standard TO-220AB
BTB16-600B BTB16-800B 50 mA Standard TO-220AB
BTB16-600SW BTB16-800SW 10 mA Snubberless™ TO-220AB
BTB16-600CW BTB16-800CW 35 mA Snubberless™ TO-220AB
BTB16-600BW BTB16-800BW 50 mA Snubberless™ TO-220AB
BTA16-600C 35 mA Standard TO-220AB Ins.
BTA16-600B BTA16-800B 50 mA Standard TO-220AB Ins.
BTA16-600SW BTA16-800SW 10 mA Snubberless™ TO-220AB Ins.
BTA16-600CW BTA16-800CW 35 mA Snubberless™ TO-220AB Ins.
BTA16-600BW BTA16-800BW 50 mA Snubberless™ TO-220AB Ins.
T1610-600G T1610-800G 10 mA Snubberless™ D2PAK
T1635-600G T1635-800G 35 mA Snubberless™ D2PAK
T1650-600G 50 mA Snubberless™ D2PAK
T1610, T1635, T1650, BTA16, BTB16
Product selector
DS2114 - Rev 11 page 15/18
3.2 Ordering information
Table 9. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
BTA16-600BRG BTA16-600B
TO-220AB Ins.
2.30 50
Tube
BTA16-600BWRG BTA16-600BW
BTA16-600CRG BTA16-600C
BTA16-600CWRG BTA16-600CW
BTA16-600SWRG BTA16-600SW
BTA16-800BRG BTA16-800B
BTA16-800BWRG BTA16-800BW
BTA16-800CWRG BTA16-800CW
BTA16-800SWRG BTA16-800SW
BTB16-600BRG BTB16-600B
TO-220AB Tube
BTB16-600BWRG BTB16-600BW
BTB16-600CRG BTB16-600C
BTB16-600CWRG BTB16-600CW
BTB16-600SWRG BTB16-600SW
BTB16-800BRG BTB16-800B
BTB16-800BWRG BTB16-800BW
BTB16-800CWRG BTB16-800CW
BTB16-800SWRG BTB16-800SW
T1610-600G-TR T1610-600G
D²PAK 1.50
1000 Tape and reel
T1610-800G-TR T1610-800G
T1635-600G-TR T1635-600G
T1635-800G-TR T1635-800G
T1650-600G-TR T1650-600G
T1635-600G T1635-600G 50 Tube
T1610, T1635, T1650, BTA16, BTB16
Ordering information
DS2114 - Rev 11 page 16/18
Revision history
Table 10. Document revision history
Date Revision Changes
Oct-2002 6A Last update.
13-Feb-2006 7 TO-220AB delivery mode changed from bulk to tube. ECOPACK statement
added.
03-Jul-2009 8 Added part number T1610.
04-Dec-2009 9 Updated value for VDSM / VRSM in Table 2. Updated temperature in Table 2
from 15 °C to 86 °C.
11-Mar-2010 10 Updated value for VDSM / VRSM in Table 2. Updated temperature in Table 2
from 15 °C to 86 °C.
30-May-2018 11 Updated Section ● Product status / summary. Added T1650 package
information.
T1610, T1635, T1650, BTA16, BTB16
DS2114 - Rev 11 page 17/18
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
T1610, T1635, T1650, BTA16, BTB16
DS2114 - Rev 11 page 18/18