Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 9-1 1. Dimension a a 1 2 Substrate Protective coating Resistive element Inner termination Between termination Outer termination 3 4 5 b mm inch 6 Alumina Epoxy resin NiCr alloy special termination Ni plating Sn plating b L 2.000.20 .078.008 W 1.250.10 .049.004 a 0.400.25 .016.010 b 0.400.25 .016.010 t 0.500.10 .019.004 2. Power deratimg Curve 120 100 70 60 Rated Load(%) Operating Temperature Range 40 20 125 0 -55 -40 0 40 80 120 140 -55~+125C 160 Ambient Temperature (C) Flg.1 3. Ratings Item Rated power Rated voltage & Rated Continuous Working Voltage (RCWV) Rated value Explanation When used at ambient temperture over 0.1 W 70C, the load power should be reduced (at 70 C or lower) as shown in Fig.1 The rated voltage of each resistance should be calculated from the equation below, and when the rated voltage exceeds the maximum RCWV, the maximum RCWV should be the rated voltage. E = P xR Max.RCWV:100V E : rated voltage (V) P : rated power (W) R : nominal resistance value () Matsushita Electronic Components Co., Ltd. Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 Item 9-2 Rated value Explanation Voltage should be 2.5 x E . When the voltage exceeds the maximum overload voltage, the value shown below should be the maximum overload voltage. Max. overload voltage : 200V Max. overload Voltage Code. D B Tolerance for resistance Tolerance for resis. 0.5% 0.1% Tolerance D B Resistance range Resistance range Series E-96 series is special. E-24 When E-96 series overlap 10 ~1M E-24 series, E-24 series 100 ~100k E-24 should be the first priority 4. Explanation of Part Number <E-24 series> E R A 6 Y Type Thin Film Chip Resistor E D 1 Tolerance TCR 0 2 V Packaging Nominal Resistance Y 3 digit marking Std. Taping (5000pcs/reel) TCR 50x10-6/C 25x10-6/C 100x10-6/C Resit. range 10 ~ 91 100 ~ 100 k 110k ~ 1M D B V Tol. .5% .1% <E-96 series> E R A Thin Film Chip Resistor E 6 E Type E TCR D 1 Tolerance 0 Nominal Resistance 2 1 V Packaging No marking Std. Taping (5000pcs/reel) TCR 50x10-6/C 25x10-6/C 100x10-6/C Resit. range 10 ~ 97.6 100 ~ 100 k 102k ~ 1M D B Tol. .5% .1% Matsushita Electronic Components Co., Ltd. V Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 9-3 5. Appearance & Construction Item Rated value Explanation 1. The resistive element should be covered with protective coating that don't fade easily. The surface of coating should avoid unevenness, flaw, pinhole and discoloration. 2. The electrode should be printed uniformly, as shown in the dimensions. The plating should not fade easily, and should avoid Appearance & unevenness, flaw, pinhole, projection and discoloration. Construction 3. The electrode should be connected electrically, mechanically to resistive element. 4. Dimensions of the substrate should be as in the list and it should not have chipping, flaw, flash and crack. As far as there shall not designation especially, the following test and measurement shall be operated under normal temperature (5~35C), normal humidity(45~85%), normal atmospheric pressure( 8.6 x 10 4 ~ 1.06 x 105 Pa ). 6. Performance Specification Specifications Item Chip Resistor DC Resistance value shall DC be within the specified Resistance tolerance Temperature Coefficient Short-time overload Dielectric Withstanding Insulation Resistance Explanation At 20C, 65%RH Natural resistance change per Temperature degree centigrade. R 2 - R1 x 10 -6 / C R 1(t 2 - t 1) R1 : Resistance value at reference temperature(t1) R2 : Resistance value at test temperature(t2) t2 - t1 = 100C t1 = 25C Resistors shall be applied 2.5 times the rated voltage for 5 seconds. (0.5 % + 0.1) Max. overload voltage shall be 200V A.C. 200 V shall be applied between subNo evidence of flashover, strate and electrodes for 60 s. Insulation mechanical damage, Resistance arcing or insulation breakMeter down or AC power supply Resit. range TCR 10 50x10-6/C ~97.6 100 25x10 -6/C ~100 k 102k 100x10-6/C ~ 1M Min.1,000M Resistors shall be facing down. After applying DC 200V to the resistor, insulation resistance shall be measured. Matsushita Electronic Components Co., Ltd. Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 9-4 7. Mechanical characteristic Specifications Item Chip Resistor Explanation Substrate : Glass epoxy(t=1.6mm) Span : 90mm Bending distance :3mm (10 seconds) Without distinct deformation in appearance Bending Strength 1 .4 1 .2 1 .4 Te s t p rin tin g b o a rd 1 .6 5 (m m ) 40 (0.5 % + 0.05) 100 Solderability Resistance to Soldering Heat Resistance to Solvent Resistance to Vibration (Low Frequency) Resistors shall be dipped in the melted solder bath at 2355 C for 20.5 sec. Flux shall be removed from the surface of termination with clean organic solvent. Resistors shall be dipped in the melted (0.5 % + 0.05) solder bath at 270 3 C for 10 1 C sec. Solvent solution : Isopropyl alcohol Without distinct deformation in appearance Condition (1)Dipping 300 seconds (2)Ultrasonic wave eashing (20mW/cm2,28kHz) (0.5 % + 0.05) : 60 seconds Resistors shall be subjected to a single vibration having as double amplitude of 1.5 mm for 2 hours in each three mutually perpendicular directions for (0.5 % + 0.05) total 6 hours. The vibration frequency shall be varied uniformly 10 to 55 Hz, and return to 10 Hz traversing for 1min. Termination should be covered uniformly with solder (min. 95% coverage) Matsushita Electronic Components Co., Ltd. Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 9-5 8. Environment Test Item High Temperature Exposure Humidity (Steady State) Specifications Chip Resistor Explanation (0.5 % + 0.05) Resistors shall be exposed at1253C for 1000 048 hours. (0.5 % + 0.05) Resistors shall be exposed at 602C and 90~95% relative humidity in a humidity test chamber for 1000 048 hours. - 55 3 C 30minutes Temperature cycling Normal Within 3minutes (0.5 % + 0.05) 5 cycles 125 3 C 30minutes Load Life (1.0 % + 0.1) Load Life in Humidity (1.0 % + 0.1) 9. Other Characteristics Item Surface Temperature Resistors shall be exposed at 702C and 1000 048 hours. During this time. The rated voltage shall be applied intermittently for 1.5 hours ON,0.5 hours OFF. Resistors shall be exposed to at 402C and 90~95% relative humidity for 1000 048 hours. During this time the rated voltage shall be applied intermittently for 1.5 hours ON,0.5 hours OFF. Specifications Test Methods Resistors shall be mounted on glass epoxy substrate(t=1.0mm). A power of 0.063W shall be applied. The temperature rise at the center of resistor is measured. However, applied voltage must not exceed Max. overload voltage. less than 20C 10. Marking Express resistance value on resin side with three digits. (For example) 101 100 The first two digits are significant figures of resistance and the third one denotes number of zeros following. E-96 series: No marking Matsushita Electronic Components Co., Ltd. Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 9-6 11. Attention ! Common precautions in handling resistors (1) This catalog shows the quality and performance of a unit component. For quality assurance, exchange the delivery specification with us. Before adoption, be sure to evaluate and verify the product mounting it in your product. (2) We take no responsibility for troubles caused by the product usage that is not specified in this catalog. Be sure to exchange the delivery specification with us. (3) In traffic transportation equipment (trains, cars, traffic signal equipment, etc.),medical equipment, aerospace equipment, electric heating appliances, combustion and gas equipment, rotating equipment, disaster and crime preventive equipment,etc. in cases where it is forecast that the failure of this product gives serious damage to the human. life and others, use fail-safe design and ensure safety by studying the following items to Ensure safety as the system by setting protective circuits and protective equipment. Ensure safety as the system by setting such redundant circuits as do not cause danger by a single failure. (4) When a dogma shall be occurred about safety for this product, be sure to inform us rapidly, operate your technical examination. (5) The products in this catalog are in tended for use is general standard applications for general electronic equipment (AV products, household electric appliances, office equipment, information and communication equipment, etc.); hence, they do not take the use under the following special environments into consideration. Accordingly, the use in the following special environments, and such environmenta conditions may affect the performance of the products; prior to use, verify the performance, reliability, etc. thoroughly 1 Use in liquids such as water, oil, chemical, and organic solvent 2 Use under direct sunlight and in outdoor and dusty atmospheres 3 Use in places full of corrosive gases such as sea breeze, Cl2,H2S,NH3,SO2, AND NOX. 4 Use in environment with large static electricity and strong electromagnetic waves. 5 Where the product is close to heating component, and where an inflammable such as a polyvinyl chloride wire is arranged close to the product. 6 Where the resistor is sealed and coated with resin, etc. 7 Where water or a water-soluble detergent is used in cleaning free soldering and in flux cleaning after soldering (Pay particular attention to soluble flux.) (6) If transient load (heavy load in a short time) like pulse is expected to be applied,carry out evaluation and confirmation test with resistors actually mounted on your own board. When the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power. When the product shall be used under special condition, be sure to ask us in advance. (7) Halogen type (Chlorine type, Bromine type, etc.) or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. (8) When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as short as possible (three second or less up to 350C) (9) Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistor's performance. (10) Keep the rated power and ambient temperature within the specified derating curve. Avoid immersion of chip resistor in solvent for long time. Use solvent after the effect of immersion is confirmed. Matsushita Electronic Components Co., Ltd. Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 9-7 12. Storage Method If the product is stored in the following environments and conditions, the performance and solderability may be badly affected, avoid the storage in the following environments. 1. Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, AND NOX 2. Storage in places exposed to direct sunlight 3. Storage in places outside the temperature range of 5 to 35 deg. C and humidity range of 45 to 85%RH. 4. The period of guarantee for performance such as solderability is 1 year after our delivery; and this condition applies only to the case where the storage method specified in Item 3) has been followed. 13. Low, Regulation 1. This product has not been manufactured with any ozone depleting chemical controlled under the Montreal Protocol. 2. All the materials used in this part are registered material under the Law Concerning the Examination and Regulation of Manufactures, etc. of Chemical substances. 3. All the materials used in this part contain no brominated materials of PBBOs or PBBs as the flame-retardant. 4. If you need the notice by letter of "A preliminary judgement on the Laws of Japan foreign exchange and Foreign Trade control", be sure to let us know. 14. Renewal for specification When you confirm revision of this specification, the previous version shall lose its validity. 15. Manufacturing Locations Country: Japan Plant: Fukui Matsushita Electric Co.,Ltd Matsushita Electronic Components Co., Ltd. Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 9-8 1. Application Range This Specification covers taping spec. of ERA6 Type. 2. Physical Dimensions 2-1 Structure and reel dimensions shall be as shown in the figure below. 11.41.0 Carrier Tape(Paper) 9.01.0 Top Tape 180 +0 -3 60 min. 131.0 Adhesive Tape Unit : mm 2-2 Carrier Tape Dimensions P1 P2 P0 Do S p ro c k e t h o le E F W B A T 3. C h ip re s is to r C h ip h o le (mm) (inch) A 1.650.15 .065.006 B 2.500.20 .098.008 W 8.000.20 .315.008 F 3.500.05 .138.002 E 1.750.10 .069.004 (mm) P1 4.000.10 P2 2.000.05 P0 4.000.10 D0 1.50 0.10 0 T 0.840.05 (inchi) .157.004 .079.002 .157.004 .059 .004 0 .033.002 Tapping specifications 3-1 Taping When the test shall be operated with the below conditions, peel strength should be 0.049N~0.49N(5~50g), should not have flash and tear after peeling. <Test Methods> Peeling direction Carrier tape 10 Top tape Matsushita Electronic Components Co., Ltd. Subject Thin Film Chip Resistors Part No. Spec. No. PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E202H4 ERA6 9-9 Minimum Bending Radius When Carrier tape shall be bent by Minimum Bending Radius (15mm), no defection of chip and no break of carrier tape. However minimum bending radius shall be tested for 1 time. Resistance to climate When resistors shall be exposed at 60C, 90~95%RH for 120 hours, no defection of chip and no break of carrier tape. When the top tape shall be peeled tape should not have flash and tear 3-2 Quantity in Taping: 5000 pcs. /reel 3-3 Tape packaging Resistance side shall be facing upward. Chip resistors shall not be sticking to top tape and bottom tape Chip resistors shall be easy to take out from carrier tape and chip hole or sprocket hole shall not have flash and break. 4. Outer Packaging Quantity: 20 reels (Max. 100,000pcs.) Tape M arking When taping shall not reach Max. or quantity, the remaining empty space Shall be buried with buffer material. When the quantity shall be few, alternative-packaging methods may be used. No problem must occur during the exportation of the product. 5. Marking At last, production country is displayed in English. Side of reel (Marking shall be on one side) - Part name - Part number - Quantity - Lot Number - Maker name - Production country Packaging box - Customer name - part name - Part number - Customer part number - Quantity - Maker name - Production country Matsushita Electronic Components Co., Ltd.