2:1, Single-Ended Multiplexer ICS83052I
DATA SHEET
ICS83052I REVISION B DECEMBER 8, 2011 1©201 1 Integrated Device Technology , Inc.
GENERAL DESCRIPTION
The ICS83052I is a low skew, 2:1, Single-ended Multiplexer. The
ICS83052I has two selectable single-ended clock inputs and one
single-ended clock output. The output has a VDDO pin which may
be set at 3.3V, 2.5V, or 1.8V, making the device ideal for use in
voltage trans-lation applications. An output enable pin places the
output in a high impedance state which may be useful for testing
or debug. The device operates up to 250MHz and is packaged in
an 8 TSSOP.
BLOCK DIAGRAM PIN ASSIGNMENT
FEATURES
• 2:1 single-ended multiplexer
• Q nominal output impedance: 15Ω (VDDO = 3.3V)
• Maximum output frequency: 250MHz
• Propagation delay: 2.7ns (maximum), (VDD = VDDO = 3.3V)
• Input skew: 160ps (maximum), (VDD = VDDO = 3.3V)
• Part-to-part skew: 490ps (maximum), (VDD = VDDO = 3.3V)
• Additive phase jitter, RMS at 155.52MHz (12kHz - 20MHz):
0.18ps (typical), (VDD = VDDO = 3.3V)
• Operating supply modes:
VDD/VDDO
3.3V/3.3V
3.3V/2.5V
3.3V/1.8V
2.5V/2.5V
2.5V/1.8V
• -40°C to 85°C ambient operating temperature
Available in standard (RoHS 5) and lead-free (RoHS 6)
packages
CLK0
CLK1
SEL0
OE
Q
ICS83052I
8-Lead TSSOP
4.40mm x 3.0mm x 0.925mm
package body
G Package
Top View
VDDO
GND
CLK1
VDD
1
2
3
4
Q
SEL0
CLK0
OE
8
7
6
5
ICS83052I REVISION B DECEMBER 8, 2011 2©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
TABLE 1. PIN DESCRIPTIONS
TABLE 2. PIN CHARACTERISTICS
TABLE 3. CONTROL INPUT FUNCTION TABLE
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ICS83052I REVISION B DECEMBER 8, 2011 3©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V
DD 4.6V
Inputs, VI-0.5V to VDD + 0.5 V
Outputs, V
O-0.5V to VDDO + 0.5V
Package Thermal Impedance, θJA 101.7°C/W (0 mps)
Storage Temperature, T
STG -65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional op-
eration of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for ex-
tended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 3.3V±5%, 2.5V±5% OR 1.8V±5%,TA = -40°C TO 85°C
TABLE 4B. POWER SUPPLY DC CHARACTERISTICS, VDD = 2.5V±5%, VDDO = 2.5V±5% OR 1.8V±5%, TA = -40°C TO 85°C
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ICS83052I REVISION B DECEMBER 8, 2011 4©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
TABLE 5A. AC CHARACTERISTICS, VDD = VDDO = 3.3V ± 5%, TA = -40°C TO 85°C
TABLE 4C. LVCMOS/LVTTL DC CHARACTERISTICS, TA = -40°C TO 85°C
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DD
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ICS83052I REVISION B DECEMBER 8, 2011 5©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
TABLE 5B. AC CHARACTERISTICS, VDD = 3.3V ± 5%, VDDO = 2.5V ± 5%, TA = -40°C TO 85°C
TABLE 5C. AC CHARACTERISTICS, VDD = 3.3V ± 5%, VDDO = 1.8V ± 5%, TA = -40°C TO 85°C
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ICS83052I REVISION B DECEMBER 8, 2011 6©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
TABLE 5D. AC CHARACTERISTICS, VDD = VDDO = 2.5V ± 5%, TA = -40°C TO 85°C
TABLE 5E. AC CHARACTERISTICS, VDD = 2.5V ± 5%, VDDO = 1.8V ± 5%, TA = -40°C TO 85°C
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ICS83052I REVISION B DECEMBER 8, 2011 7©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
ADDITIVE PHASE JITTER
Additive Phase Jitter (Random)
at 155.52MHz (12kHz - 20MHz)
= 0.18ps (typical)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
-190
The spectral purity in a band at a specific offset from the
fundamental compared to the power of the fundamental is called
the dBc Phase Noise. This value is normally expressed using a
Phase noise plot and is most often the specified plot in many
applications. Phase noise is defined as the ratio of the noise power
present in a 1Hz band at a specified offset from the fundamental
frequency to the power value of the fundamental. This ratio is
expressed in decibels (dBm) or a ratio of the power in the 1Hz
As with most timing specifications, phase noise measurements
has issues relating to the limitations of the equipment. Often
the noise floor of the equipment is higher than the noise floor of
band to the power in the fundamental. When the required offset
is specified, the phase noise is called a dBc value, which simply
means dBm at a specified offset from the fundamental. By
investigating jitter in the frequency domain, we get a better
understanding of its effects on the desired application over the
entire time record of the signal. It is mathematically possible to
calculate an expected bit error rate given a phase noise plot.
the device. This is illustrated above. The device meets the noise
floor of what is shown, but can actually be lower. The phase
noise is dependant on the input source and measurement
equipment.
OFFSET FROM CARRIER FREQUENCY (HZ)
SSB P HASE NOISE dBc /HZ
1k 10k 100k 1M 10M 100M
ICS83052I REVISION B DECEMBER 8, 2011 8©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
PARAMETER MEASUREMENT INFORMATION
SCOPE
Qx
LVCMOS
GND
3.3V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
2.4±5%
VDDO
-0.9V±5%
VDD
0.9V±5%
SCOPE
Qx
LVCMOS
GND
2.5V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
2.05V±5%
VDDO
-1.25V±5%
VDD
1.25V±5%
3.3V CORE/3.3V OUTPUT LOAD AC TEST CIRCUIT
SCOPE
Qx
LVCMOS
GND
1.65V±5%
-1.65V±5%
3.3V CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT
2.5 CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT PART-TO-PART SKEW
SCOPE
Qx
LVCMOS
GND
1.25V±5%
-1.25V±5%
SCOPE
Qx
LVCMOS
GND
1.6V±5%
VDDO
-0.9V±5%
VDD
0.9V±5%
VDD,
VDDO
VDD,
VDDO
tsk(pp)
V
DDO
2
V
DDO
2
Qy
Qx
Part 1
Part 2
ICS83052I REVISION B DECEMBER 8, 2011 9©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
Clock
Outputs
20%
80% 80%
20%
t
R
t
F
t
PERIOD
t
PW
t
PERIOD
odc =
V
DDO
2
x 100%
tPW
Q
tp
LH
tp
H
L
V
DDO
2
V
DD
2
V
DDO
2
V
DD
2
CLK0, CLK1
Q
INPUT SKEW
OUTPUT RISE/FALL TIMEPROPAGATION DELAY
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
t
PD1
t
PD2
tsk(i) = t
PD2
– t
PD1
CLKx
Q
CLKy
Q
ICS83052I REVISION B DECEMBER 8, 2011 10 ©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
INPUTS:
CLK INPUT:
For applications not requiring the use of the test clock, it can be
left floating. Though not required, but for additional protection, a
1kΩ resistor can be tied from the CLK input to ground.
CONTROL PINS:
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
RECOMMENDATIONS FOR UNUSED INPUT PINS
APPLICATIONS INFORMATION
ICS83052I REVISION B DECEMBER 8, 2011 11 ©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS830521I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS830521I is the sum of the core power plus the analog power plus the power
dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
Core and LVDS Output Power Dissipation
Power (core)MAX = VDD_MAX * (IDD+ IDDo ) = 3.4565V * (40mA + 5mA) = 155.93mW
Output Impedance ROUT Power Dissipation due to Loading 50Ω to VDD/2
Output Current IOUT = VDDO_MAX / [2 * (50Ω + ROUT)] = 3.465 / [2 * (50Ω + 15Ω)] = 26.7mA
Power Dissipation on the ROUT per LVCMOS output
Power (ROUT) = ROUT * (IOUT)2 = 15Ω * (26.7mA)2 = 10.7mW
Dynamic Power Dissip ation at 250MHz
Power (250MHz) = CPD * frequency * (VDD)2 = 18pF * 250MHz * (3.465V)2 = 54.0mW
Total Power Dissip ation
T ot al Power
= Power (core)MAX + Power (ROUT) Total Power + Power (250MHz)
= 155.93mW + 10.7mW + 54.0mW
=220.6mW
ICS83052I REVISION B DECEMBER 8, 2011 12 ©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
2. Junction T emperature
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of
the device. The maximum recommended junction temperature is 125°C. Limiting the internal transistor junction, TJ, to
125°C ensures that the bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA
must be used.
Assuming no air flow and a multi-layer board, the appropriate value is 101.7°C/W per Table 6.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.221W * 101.7°C/W = 107.4°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (multi-layer).
TABLE 6. θJAVS. AIR FLOW TABLE FOR 8 LEAD TSSOP
θθ
θ
θθ
AJ
yticoleVYB
dnoceSrepsreteM 015.2
sdraoBtseTdradnatSCEDEJ,BCPreyaL-itluMW/C°7.101W/C°5.09W/C°8.98
ICS83052I REVISION B DECEMBER 8, 2011 13 ©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
RELIABILITY INFORMATION
TRANSISTOR COUNT
The transistor count for ICS83052I is: 967
ICS83052I REVISION B DECEMBER 8, 2011 14 ©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
TABLE 7. PACKAGE DIMENSIONS
PACKAGE OUTLINE - G SUFFIX FOR 8 LEAD TSSOP
Reference Document: JEDEC Publication 95, MO-153
LOBMYS sretemilliM
muminiMmumixaM
N8
A--02.1
1A50.051.0
2A08.050.1
b91.003.0
c90.002.0
D09.201.3
ECISAB04.6
1E03.405.4
eCISAB56.0
L54
.057.0
α°8
aaa--01.0
ICS83052I REVISION B DECEMBER 8, 2011 15 ©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and
industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT
reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
TABLE 8. ORDERING INFORMATION
rebmuNredrO/traPgnikraMegakcaPgnigakcaPgnippihSerutarepmeT
IGA25038IA250POSSTdael8ebutC°58otC°04-
TIGA25038IA250P
OSSTdael8leer&epat0052C°58otC°04-
FLIGA25038LIA25POSST"eerF-daeL"dael8ebutC°58otC°04-
TFLIGA25038LIA25POSST"eer
F-daeL"dael8leer&epat0052C°58otC°04-
.tnailpmocSHoReradnanoitarugifnoceerF-bPehterarebmuntrapehtotxiffus
"FL"nahtiwderedroeratahtstraP:ETON
ICS83052I REVISION B DECEMBER 8, 2011 16 ©201 1 Integrated Device Technology , Inc.
ICS83052I Data Sheet 2:1, SINGLE ENDED MULTIPLEXER
TEEHSYROTSIHNOISIVER
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BB4,A4 8T 3
21 Vdetcerroc-selbaTylppuSrewoP
ODD
.xam/nim .gnikrameerf-daeldedda-elbaTnoitamrofnIgniredrO 60/7/8
B8T21.gnikrameerf-daeldetcerroc-elbaTnoitam
rofnIgniredrO 70/61/3
BB4T3 Irofstinudetcerroc-elbaTylppuSrewoPV5.2
DD
I&
ODD
.80/52/6
B,B5,A5T ,D5,C5 ,E5
,llA 6,5,4 21,11 71
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NdeddA .noitcessnoitaredisnoCrewoPdeddA .noitamrofnItcatnoCdetadpU
11/8/21
W e’ve Got Your Timing Solution.
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