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Datasheet
RSJ151P10
Pch 100V 15A Power MOSFET
Outline
V
DSS
100V
TO-263S
SC-83
LPT(S)
R
DS(on)
(Max.) 120m
I
D
15A
P
D
50W
Features Inner circuit
1) Low on-resistance.
2) Fast switching speed.
3) Drive circuits can be sim ple.
4) Parallel use is easy.
5) Pb-free lead plating ; RoHS com p liant
6) 100% Avalanche tested Packaging specifi cations
Type
Packaging Taping
Application Reel size (mm) 330
Switching Power Supply Tape width (mm) 16
Automotive Motor Drive Basic ordering unit ( pcs) 2,500
Drain - Source voltage V
DSS
100 V
Automot ive Solenoid Drive Taping code TL
Marking RSJ151P10
Absolute maximum rati ngs(T
a
= 25°C)
Parameter Symbol Value Unit
Pulsed drain current I
D,pulse *2
30 A
T
c
= 25°C
T
c
= 100°C
Continuous drain curr ent I
D *1
A
15
I
D *1
8A
P
D
1.35 W
Avalanche energy, single pulse
Avalanche current
T
c
= 25°C
T
a
= 25°C
*4
Power dissipation
Gate - Source voltage V
GSS
20 V
P
D
50 W
mJ
A
E
AS
*3
I
AR
*3
33
15
Junction temperat ur e T
j
150 °C
Range of storage t em per ature T
stg
55 to 150 °C
(2)
(1)
(3)
1 ESD PROTECTION DIODE
2 BODY DIODE
(1) Gate
(2) Drain
(3) Source
∗2
∗1
(1) (2) (3)
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Datasheet
RSJ151P10
Thermal resistance, junction - case
- 95 135
VGS = 4.0V, ID = 15A - 100 140
220
RDS(on) *5
Electrical characteristics(Ta = 25°C)
Parameter
Drain - Source breakdown voltage
Zero gate voltage drain current
V(BR)DSS
IDSS
-
-
-1
-100
Values Unit
gfs
VDS = 100V, VGS = 0V
Tj = 25°C
VDS = 100V, VGS = 0V
Thermal resistance
Parameter Symbol
Symbol Conditions
VGS = 0V, ID = 1mA
Tsold
Thermal resistance, junction - ambient *4
Soldering temperature, wavesoldering for 10s
RthJA
RthJC
VGS = 4.5V, ID = 15A
Values Unit
Min. Typ. Max.
- 2.5 °C/W
- - °C/W92.6
-
Min. Typ. Max.
°C
V
100 --
- - 265
10 A
Tj = 125°C
VGate threshold voltage VGS (th) VDS = 10V, ID = 1mA 1.0 -2.5
Gate - Source leakage current IGSS VGS = 20V, VDS = 0V --
A
m
VGS = 10V, ID = 15A
Tj = 125°C
Forward transfer admittance VDS = 10V, ID = 15A 13 26 - S
Static drain - source
on - state resistance
VGS = 10V, ID = 15A - 85 120
- 155
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Datasheet
RSJ151P10
*1 Limited only by maximum temperat ur e allowed.
*2 Pw 10s, Duty cycle 1%
*3 L ⋍ 200H, V
DD
= 50V, Rg = 10, starting T
j
= 25°C
*4 Mounted on a epoxy PCB FR4 (20m m × 30mm × 0.8mm)
*5 Pulsed
-
Continuous source curr ent
64 -
I
S
= 15A
di/dt = 100A/s
Reverse recovery charge Q
rr *5
- 145 -
Body diode electrical characterist i cs (Source-Drain)(T
a
= 25°C)
Parameter Symbol Conditions Values Unit
Min. Typ. Max.
Gate plat eau voltage V
(plateau)
V
DD
⋍ 50V, I
D
= 15A -3.1
C
30 A
Forward voltage V
SD *5
V
GS
= 0V, I
S
= 15A --
1.2 V
60 - ns
T
c
= 25°C
Reverse recovery time t
rr *5
I
S
*1
--
15 A
Pulsed source current I
SM
*2
-
Electrical charact eri st i cs(T
a
= 25°C)
Parameter Symbol Conditions Values Unit
Min. Typ. Max.
pFOutput capacit ance C
oss
V
DS
= 25V - 160 -
Reverse transfer capacitance C
rss
f = 1MHz
Input capacitance C
iss
V
GS
= 0V - 3800 -
- 100 -
Turn - on delay time t
d(on) *5 V
DD
⋍ 50V, V
GS
= 10V
-30-
ns
Rise time t
r *5
I
D
= 7.5A -40-
Turn - off delay tim e t
d(off) *5
R
L
= 12- 165 -
Fall time t
f *5
R
G
= 10-95-
Gate Charge characterist i cs (T
a
= 25°C)
Parameter Symbol Conditions Values Unit
Min. Typ. Max.
-
-V
I
D
= 15A
V
GS
= 10V
-10-
Gate - Drain charge Q
gd *5
-10-
nCGate - Sour ce char ge Q
gs *5
Total gate charge Q
g *5
V
DD
⋍ 50V -
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Datasheet
RSJ151P10
Electrical charact eri st i c curves
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
0.01
0.1
1
10
0.00010.001 0.01 0.1 1 10 100 1000
Ta=25ºC
Rth(j-c)(t) = r(t)×Rth(ch-c)
Rth(j-c) = 2.5º C/W
top D = 1
D = 0.5
D = 0.1
D = 0.05
D = 0.01
D = Single
0.01
0.1
1
10
100
0.1 1 10 100 1000
Ta=25ºC
Single Pulse
PW = 100us
PW = 1ms
PW = 10ms
Operation in this
area is limited
by RDS(on)
Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area
Power Dissipation : PD/PDmax. [%]
Drain Current : -ID[A]
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Norm alized T r ans ient T her mal Resistance : r(t)
Pulse Width : PW [s]
Junction Temperature : Tj[°C] Drain - Source Voltage : -VDS [V]
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Datasheet
RSJ151P10
Electrical charact eri st i c curves
0.1
1
10
100
0.01 0.1 1 10 100
VDD= 50V,RG=25
VGF= 10V,VGR=0V
Starting Tch=25ºC
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0 0.2 0.4 0.6 0.8 1
Ta=25ºC
Pulsed VGS=10.0V
VGS=4.0V
VGS=4.5V
VGS=3.5V
VGS=3.0V
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0246810
VGS=2.0V
VGS=10.0V
VGS=3.5V
VGS=4.0V
VGS=3.0V
Ta=25ºC
Pulsed
Fig.6 Typical Output Characteristics(I)
Drain Current : -ID[A]
Drain - Source Voltage : -VDS [V]
Fig.7 Typical Output Characteristics(II)
Drain Current : -ID[A]
Drain - Source Voltage : -VDS [V]
Fig.4 Avalanche Current vs Inductive Load
Avalanche Cur rent : - IAS [A]
Coil Inductanc e : L [m H]
Fig.5 Avalanche Energy Derating Curve
vs Junction Temperature
Avalanche Energy : EAS / EAS max . [%]
Junction Temperature : Tj[°C]
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Datasheet
RSJ151P10
Electrical charact eri st i c curves
60
70
80
90
100
110
120
-50 0 50 100 150
VGS = 0V
ID = 1mA
0.001
0.01
0.1
1
10
100
012345
VDS= 10V
Ta= 125ºC
Ta= 75ºC
Ta= 25ºC
Ta= 25ºC
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100 125 150
VDS = 10V
ID = 1mA
0.01
0.1
1
10
100
0.01 0.1 1 10 100
VDS= 10V
Ta= 25ºC
Ta=25ºC
Ta=75ºC
Ta=125ºC
Fig.10 Gate Threshold Voltage
vs. Junction Temperature
Gate Thr es hold Voltage : -VGS(th) [V]
Junction Temperature : Tj[°C]
Fig.11 Transconductance vs. Drain Current
Trans c onductanc e : gfs [S]
Drain Current : -ID[A]
Fig.8 Breakdown Voltage
vs. Junction Temperature
Junction Temperature : Tj[°C]
Fig.9 Typical Transfer Characteristics
Gate - Source Voltage : -VGS [V]
Drain Current : -ID[A]
Norm ar ize Drain - Sour ce Br eakdown Voltage
: -V(BR)DSS [V]
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Datasheet
RSJ151P10
Electrical charact eri st i c curves
0
50
100
150
200
250
300
350
400
0 5 10 15
Ta=25ºC
ID = 15A
ID = 7.5A
10
100
1000
0.01 0.1 1 10 100
Ta=25ºC
VGS= 10V
VGS= 4.5V
VGS= 4.0V
0
50
100
150
200
-50 0 50 100 150
VGS = 10V
ID= 15A
Fig.13 Static Drain - Source On - State
Resistance vs. Drain Current(I)
Static Dr ain - Sourc e O n-State Res istanc e
: RDS(on) [m]
Junction Temperature : Tj[ºC]
Fig.14 Static Drain - Source On - State
Resistance vs. Junction Temperature
Static Dr ain - Sourc e O n-State Res istanc e
: RDS(on) [m]
Drain Current : -ID[A]
Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage
Static Dr ain - Sourc e O n-State Res istanc e
: RDS(on) [m]
Gate - Source Voltage : -VGS [V]
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Datasheet
RSJ151P10
Electrical charact eri st i c curves
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
10
100
1000
0.01 0.1 1 10 100
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= 25ºC
VGS= 10V
10
100
1000
0.01 0.1 1 10 100
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= 25ºC
VGS= 4.5V
10
100
1000
0.01 0.1 1 10 100
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= 25ºC
VGS= 4.0V
Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(II)
Static Dr ain - Sourc e O n-State Res istanc e
: RDS(on) [m]
Drain Current : -ID[A]
Fig.16 Static Drain - Source On - State
Resista n c e vs. Drain Cu rre n t(III)
Static Dr ain - Sourc e O n-State Res istanc e
: RDS(on) [m]
Drain Current : -ID[A]
Fig.18 Drain Current Derating Curve
Drain Current Dis sipation
: ID/ID max. (%)
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current(IV)
Static Dr ain - Sourc e O n-State Res istanc e
: RDS(on) [m]
Drain Current : -ID[A] Junction Temperature : Tj[ºC]
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Datasheet
RSJ151P10
Electrical charact eri st i c curves
10
100
1000
10000
100000
0.01 0.1 1 10 100
Coss
Crss
Ciss
Ta= 25ºC
f = 1MHz
VGS = 0V
1
10
100
1000
10000
0.01 0.1 1 10 100
tr
tf
td(on)
td(off)
Ta=25ºC
VDD= 50V
VGS= 10V
RG=10
0
5
10
0 10203040506070
Ta=25ºC
VDD= 50V
ID= 15A
RG=10
0.01
0.1
1
10
100
0.0 0.5 1.0 1.5
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= 25ºC
VGS=0V
Fig.19 Typical Capacitance
vs. Drain - Source Voltage
Capacitance : C [pF]
Drain - Source Voltage : -VDS [V]
Fig.21 Dynamic Input Characteristics
Gate - Source Voltage : -VGS [V]
Total Gate Charge : Qg[nC]
Fig.20 Switching Characteristics
Switching Tim e : t [ns]
Drain Current : -ID[A]
Fig.22 Source Current
vs. Source - Drain Voltage
Source Curr ent : -IS[A]
Source-D rain Voltage : -VSD [V]
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Datasheet
RSJ151P10
Electrical charact eri st i c curves
1
10
100
0.1 1 10 100
Ta=25ºC
di / dt = 100A / s
VGS = 0V
Fig23 Reverse Recovery Time
vs.Source Current
Reverse Recovery Time : trr [ns]
Source Curr ent : -IS[A]
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Datasheet
RSJ151P10
Measurement circuit s
Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform
Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform
V
GS
R
G
V
DS
D.U.T.
I
AS
L
V
DD
IAS
VDD
V(BR)DSS
I
AS
2
L
EAS =V(BR)DSS
-
VDD
V(BR)DSS
1
2
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Datasheet
RSJ151P10
Dimensions (Unit : mm)
Dimension in mm / inches
LPTS
L3
b2
b3
eb
L2E
c1
A2
L1
c
H
A3
Lp
L
L4
l3
l2 l1
b6
xBA
B
A1
eb5
DA
Pattern of terminal position areas
[Not a recommended pattern of soldering pads]
MIN MAX MIN MAX
A1
0.00 0.30 0.000 0.012
A2
4.30 4.70 0.169 0.185
A3
b
0.68 0.98 0.027 0.039
b2
b3
1.14 1.44 0.045 0.057
c
0.30 0.60 0.012 0.024
c
1
1.10 1.50 0.043 0.059
D
9.80 10.40 0.386 0.409
E
8.80 9.20 0.346 0.362
e
H
E
12.80 13.40 0.504 0.528
L
2.70 3.30 0.106 0.130
L1
0.90 1.50 0.035 0.059
L2
L3
L4
L
p
0.90 1.50 0.035 0.059
x
- 0.25 - 0.010
MIN MAX MIN MAX
b5
- 1.23 - 0.049
b6
- 10.40 - 0.409
l1
- 2.10 - 0.083
l2
- 7.55 - 0.297
l3
- 13.40 - 0.528
DIM MILIMETERS INCHES
0.25 0.010
8.90 0.350
2.54 0.100
1.10 0.043
7.25 0.285
1.00 0.039
DIM MILIMETERS INCHES
12/12 2017.08 - Rev.C
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products please dispose them properly using an authorized industry waste company.
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Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
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1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
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Products with other articles such as components, circuits, systems or external equipment (including software).
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third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
