CAS24F64 64 Kb I2C CMOS Serial EEPROM Description The CAS24F64 is a 64 Kb CMOS Serial EEPROM device, internally organized as 8192 words of 8 bits each. It features a 32-byte page write buffer and supports the Standard (100 kHz), Fast (400 kHz) and Fast-Plus (1 MHz) I2C protocol. www.onsemi.com MARKING DIAGRAM Features * * * * * * * * Supports Standard, Fast and Fast-Plus I2C Protocol 1.7 V to 5.5 V Supply Voltage Range 32-Byte Page Write Buffer Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA) Low Power CMOS Technology 1,000,000 Program/Erase Cycles 100 Year Data Retention This Device is Pb-Free, Halogen Free/BFR Free, and RoHS Compliant WLCSP4 C4B SUFFIX CASE 567NH T Y W T YW = Specific Device Code = Year = Work Week PIN CONFIGURATIONS (Top View) VCC 1 VCC A1 A2 VSS SCL B2 SDA B1 WLCSP-4 SCL CAS24F64 SDA PIN FUNCTION Pin Name SDA SCL VCC VSS VSS Figure 1. Functional Symbol Function Serial Data Serial Clock Power Supply Ground ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. (c) Semiconductor Components Industries, LLC, 2016 May, 2016 - Rev. 0 1 Publication Order Number: CAS24F64/D CAS24F64 Table 1. ABSOLUTE MAXIMUM RATINGS Parameters Ratings Units Storage Temperature -65 to +150 C Voltage on Any Pin with Respect to Ground (Note 1) -0.5 to +6.5 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The DC input voltage on any pin should not be lower than -0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may undershoot to no less than -1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns. Table 2. RELIABILITY CHARACTERISTICS (Note 2) Parameter Symbol NEND (Note 3) TDR Endurance Data Retention Min Units 1,000,000 Program/Erase Cycles 100 Years 2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100 and JEDEC test methods. 3. Page Mode, VCC = 5 V, 25C. Table 3. D.C. OPERATING CHARACTERISTICS (VCC = 1.7 V to 5.5 V, TA = -40C to +85C, unless otherwise specified.) Symbol Parameter Test Conditions Min Max Units ICCR Read Current Read, fSCL = 1 MHz 1 mA ICCW Write Current Write, fSCL = 1 MHz 2 mA ISB Standby Current All I/O Pins at GND or VCC 1 mA IL I/O Pin Leakage Pin at GND or VCC 2 mA Input Low Voltage VCC 2.2 V -0.5 VCC x 0.3 V VCC < 2.2 V -0.5 VCC x 0.25 V VCC 2.2 V VCC x 0.7 VCC + 0.5 V VCC < 2.2 V VCC x 0.75 VCC + 0.5 V VCC 2.2 V, IOL = 3.0 mA 0.4 V VCC < 2.2 V, IOL = 1.0 mA 0.2 V VIL VIH VOL Input High Voltage Output Low Voltage Table 4. PIN IMPEDANCE CHARACTERISTICS (VCC = 1.7 V to 5.5 V, TA = -40C to +85C, unless otherwise specified.) Symbol Parameter Conditions Max Units CIN (Note 4) SDA I/O Pin Capacitance VIN = 0 V 8 pF CIN (Note 4) Input Capacitance (other pins) VIN = 0 V 6 pF 4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100 and JEDEC test methods. www.onsemi.com 2 CAS24F64 Table 5. A.C. CHARACTERISTICS (VCC = 1.7 V to 5.5 V, TA = -40C to +85C.) (Note 5) Standard Parameter Symbol FSCL tHD:STA Min Fast Max Clock Frequency Min 100 START Condition Hold Time Fast-Plus Max Min 400 Max Units 1,000 kHz 4 0.6 0.26 ms tLOW Low Period of SCL Clock 4.7 1.3 0.45 ms tHIGH High Period of SCL Clock 4 0.6 0.35 ms 4.7 0.6 0.26 ms tSU:STA START Condition Setup Time tHD:DAT Data In Hold Time 0 0 0 ns tSU:DAT Data In Setup Time 250 100 50 ns tR (Note 6) SDA and SCL Rise Time tF (Note 6) SDA and SCL Fall Time tSU:STO STOP Condition Setup Time tBUF Bus Free Time Between STOP and START tAA SCL Low to Data Out Valid tDH Data Out Hold Time Ti (Note 6) tWR tPU (Notes 6, 7) 1,000 300 300 300 100 ns 100 ns 4 0.6 0.26 ms 4.7 1.3 0.5 ms 3.5 100 0.9 100 0.40 100 ms ns Noise Pulse Filtered at SCL and SDA Inputs 50 50 50 ns Write Cycle Time 4 4 4 ms 0.35 0.35 0.35 ms Power-up to Ready Mode Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Test conditions according to "A.C. Test Conditions" table. 6. Tested initially and after a design or process change that affects this parameter. 7. tPU is the delay between the time VCC is stable and the device is ready to accept commands. Table 6. A.C. TEST CONDITIONS Input Levels 0.20 x VCC to 0.8 x VCC for VCC 2.2 V & 0.15 x VCC to 0.85 x VCC for VCC < 2.2 V Input Rise and Fall Times 50 ns Input Reference Levels 0.3 x VCC, 0.7 x VCC Output Reference Levels 0.5 x VCC Output Load Current Source: IOL = 3 mA (VCC 2.2 V); IOL = 1 mA (VCC < 2.2 V); CL = 100 pF www.onsemi.com 3 CAS24F64 Power-On Reset (POR) Each CAS24F64 incorporates Power-On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after VCC exceeds the POR trigger level and will power down into Reset mode when VCC drops below the POR trigger level. This bi-directional POR behavior protects the device against `brown-out' failure following a temporary loss of power. Master or the Slaves drive the SDA line. A `0' is transmitted by pulling a line LOW and a `1' by letting it stay HIGH. Data transfer may be initiated only when the bus is not busy (see A.C. Characteristics). During data transfer, SDA must remain stable while SCL is HIGH. START/STOP Condition An SDA transition while SCL is HIGH creates a START or STOP condition (Figure 2). The START consists of a HIGH to LOW SDA transition, while SCL is HIGH. Absent the START, a Slave will not respond to the Master. The STOP completes all commands, and consists of a LOW to HIGH SDA transition, while SCL is HIGH. Pin Description SCL: The Serial Clock input pin accepts the clock signal generated by the Master. SDA: The Serial Data I/O pin accepts input data and delivers output data. In transmit mode, this pin is open drain. Data is acquired on the positive edge, and is delivered on the negative edge of SCL. Device Addressing The Master addresses a Slave by creating a START condition and then broadcasting an 8-bit Slave address. For the CAS24F64, the first four bits of the Slave address are set to 1010 (Ah); the next three bits, A2, A1 and A0, must match the logic state of the similarly named input pins. The devices in WLCSP 4-bumps respond only to the Slave Address with A2 A1 A0 = 000. The R/W bit tells the Slave whether the Master intends to read (1) or write (0) data (Figure 3). Functional Description The CAS24F64 supports the Inter-Integrated Circuit (I2C) Bus protocol. The protocol relies on the use of a Master device, which provides the clock and directs bus traffic, and Slave devices which execute requests. The CAS24F64 operates as a Slave device. Both Master and Slave can transmit or receive, but only the Master can assign those roles. Acknowledge During the 9th clock cycle following every byte sent to the bus, the transmitter releases the SDA line, allowing the receiver to respond. The receiver then either acknowledges (ACK) by pulling SDA LOW, or does not acknowledge (NoACK) by letting SDA stay HIGH (Figure 4). Bus timing is illustrated in Figure 5. I2C Bus Protocol The 2-wire I2C bus consists of two lines, SCL and SDA, connected to the VCC supply via pull-up resistors. The Master provides the clock to the SCL line, and either the SCL SDA START CONDITION STOP CONDITION Figure 2. Start/Stop Timing 1 0 1 0 A2 A1 A0 R/W DEVICE ADDRESS* * The devices in WLCSP 4-bumps respond only to the Slave Address with A2 A1 A0 = 000. Figure 3. Slave Address Bits www.onsemi.com 4 CAS24F64 BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER 1 BUS RELEASE DELAY (RECEIVER) 8 9 DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER START ACK SETUP ( tSU:DAT) ACK DELAY ( tAA) Figure 4. Acknowledge Timing tHIGH tF tLOW tR tLOW SCL tHD:DAT tSU:STA tHD:STA tSU:DAT tSU:STO SDA IN tAA tDH tBUF SDA OUT Figure 5. Bus Timing WRITE OPERATIONS Byte Write data, the internal byte address is incremented up to the end of page, where it then wraps around (within the page). New data can therefore replace data loaded earlier. Following the STOP, data loaded during the Page Write session will be written to memory in a single internal Write cycle (tWR). To write data to memory, the Master creates a START condition on the bus and then broadcasts a Slave address with the R/W bit set to `0'. The Master then sends two address bytes and a data byte and concludes the session by creating a STOP condition on the bus. The Slave responds with ACK after every byte sent by the Master (Figure 6). The STOP starts the internal Write cycle, and while this operation is in progress (tWR), the SDA output is tri-stated and the Slave does not acknowledge the Master (Figure 7). Acknowledge Polling As soon (and as long) as internal Write is in progress, the Slave will not acknowledge the Master. This feature enables the Master to immediately follow-up with a new Read or Write request, rather than wait for the maximum specified Write time (tWR) to elapse. Upon receiving a NoACK response from the Slave, the Master simply repeats the request until the Slave responds with ACK. Page Write The Byte Write operation can be expanded to Page Write, by sending more than one data byte to the Slave before issuing the STOP condition (Figure 8). Up to 32 distinct data bytes can be loaded into the internal Page Write Buffer starting at the address provided by the Master. The page address is latched, and as long as the Master keeps sending Delivery State The CAS24F64 is shipped erased, i.e., all bytes are FFh. www.onsemi.com 5 CAS24F64 BUS ACTIVITY: S T A MASTER R T ADDRESS BYTE SLAVE ADDRESS ADDRESS BYTE DATA BYTE a7 - a0 d7 - d0 a15 - a8 S S T O P P * * * A C K A C K SLAVE *a15 - a13 are don't care bits. A C K A C K Figure 6. Byte Write Sequence SCL SDA 8th Bit Byte n ACK tWR STOP CONDITION START CONDITION ADDRESS Figure 7. Write Cycle Timing BUS ACTIVITY: S T A MASTER R T ADDRESS BYTE SLAVE ADDRESS DATA BYTE n ADDRESS BYTE DATA BYTE n+1 S T O P DATA BYTE n+P P S SLAVE A C K A C K A C K Figure 8. Page Write Sequence www.onsemi.com 6 A C K A C K A C K A C K CAS24F64 READ OPERATIONS Immediate Read Write sequence by sending data, the Master then creates a START condition and broadcasts a Slave address with the R/W bit set to `1'. The Slave responds with ACK after every byte sent by the Master and then sends out data residing at the selected address. After receiving the data, the Master responds with NoACK and then terminates the session by creating a STOP condition on the bus (Figure 10). To read data from memory, the Master creates a START condition on the bus and then broadcasts a Slave address with the R/W bit set to `1'. The Slave responds with ACK and starts shifting out data residing at the current address. After receiving the data, the Master responds with NoACK and terminates the session by creating a STOP condition on the bus (Figure 9). The Slave then returns to Standby mode. Sequential Read Selective Read If, after receiving data sent by the Slave, the Master responds with ACK, then the Slave will continue transmitting until the Master responds with NoACK followed by STOP (Figure 11). During Sequential Read the internal byte address is automatically incremented up to the end of memory, where it then wraps around to the beginning of memory. To read data residing at a specific address, the selected address must first be loaded into the internal address register. This is done by starting a Byte Write sequence, whereby the Master creates a START condition, then broadcasts a Slave address with the R/W bit set to `0' and then sends two address bytes to the Slave. Rather than completing the Byte N O BUS ACTIVITY: S T A MASTER R T S A T CO K P SLAVE ADDRESS P S A C K SLAVE SCL 8 SDA DATA BYTE 9 8th Bit DATA OUT NO ACK STOP Figure 9. Immediate Read Sequence and Timing BUS ACTIVITY: S T A MASTER R T ADDRESS BYTE SLAVE ADDRESS S T A R T ADDRESS BYTE S N O A C K SLAVE ADDRESS P S A C K SLAVE A C K A C K A C K DATA BYTE Figure 10. Selective Read Sequence N O A C K BUS ACTIVITY: MASTER A C K SLAVE ADDRESS A C K A C K S T O P P SLAVE A C K DATA BYTE n DATA BYTE n+1 DATA BYTE n+2 Figure 11. Sequential Read Sequence www.onsemi.com 7 S T O P DATA BYTE n+x CAS24F64 PACKAGE DIMENSIONS WLCSP4 0.77x0.77, 0.35P CASE 567NH ISSUE O A E EE PIN A1 REFERENCE 2X 0.02 C 2X 0.02 C B D A3 A2 A DIE COAT TOP VIEW DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE CONTACT BALLS. 4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF CONTACT BALLS. 5. DIMENSION b IS MEASURED AT THE MAXIMUM CONTACT BALL DIAMETER PARALLEL TO DATUM C. DIM A A1 A2 A3 b D E e A2 0.10 C DETAIL A A OPTIONAL CONSTRUCTION 0.05 C NOTE 4 4X b 0.05 C A B 0.03 C NOTE 5 C A1 SIDE VIEW SEATING PLANE MILLIMETERS MIN MAX 0.38 0.28 0.08 0.12 0.23 REF 0.025 REF 0.16 0.20 0.77 BSC 0.77 BSC 0.35 BSC RECOMMENDED SOLDERING FOOTPRINT* e A1 e B PACKAGE OUTLINE A 1 2 0.35 PITCH BOTTOM VIEW 4X 0.18 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 CAS24F64 ORDERING INFORMATION Device Order Number CAS24F64C4BTR Specific Device Marking Package Type Temperature Range Lead Finish Shipping T WLCSP-4 (-40C to +85C) SnAgCu Tape & Reel, 5,000 Units / Reel 8. All packages are RoHS-compliant (Lead-free, Halogen-free). 9. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 10. Caution: The EEPROM devices delivered in WLCSP must never be exposed to ultra violet light. When exposed to ultra violet light the EEPROM cells lose their stored data. ON Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 www.onsemi.com 9 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CAS24F64/D