TLP2409
1
Photocouplers GaAℓAs Infrared LED & Photo IC
TLP2409
TLP2409
TLP2409
TLP2409
1.
1.
1.
1. Applications
Applications
Applications
Applications
• High-Speed Digital Interfacing for Instrumentation and Control Devices
• Transistor Inverters
• Switching Power Supplies
2.
2.
2.
2. General
General
General
General
The Toshiba TLP2409 consists of a high output power GaAℓAs light-emitting diode coupled with a high-speed
photodiode-transistor chip. It is housed in the SO8 package.
The TLP2409 features an operating temperature range of up to 125, making it ideal for applications like DC-
DC converters and industrial equipment which require operations at high temperatures.
3.
3.
3.
3. Features
Features
Features
Features
(1) Package: SO8
(2) Propagation delay time: tpHL = 0.8 µs, tpLH = 0.8µs (max)@ RL = 1.9 kΩ
(3) Operating temperature: -55 to 125
(4) Isolation voltage: 3750 Vrms (min)
(5) TTL-compatible
(6) Safety standards
UL-approved: UL1577 File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349
VDE-approved: Option (V4) EN60747-5-2 (Note)
(Note)
(Note)
(Note)
Note: When an EN60747-5-2 approved type is needed, please designate the Option (V4)
Option (V4)
Option (V4)
Option (V4).
4.
4.
4.
4. Packaging and Pin Configuration
Packaging and Pin Configuration
Packaging and Pin Configuration
Packaging and Pin Configuration
1: NC
2: Anode
3: Cathode
4: NC
5: GND (Emitter)
6: Output (Collector)
7: NC
8: VCC
SO8
2010-12-16
Rev.1.0
TLP2409
2
5.
5.
5.
5. Internal Circuit (Note)
Internal Circuit (Note)
Internal Circuit (Note)
Internal Circuit (Note)
Fig.
Fig.
Fig.
Fig. 5.1
5.1
5.1
5.1 Internal Circuit
Internal Circuit
Internal Circuit
Internal Circuit
Note: A 0.1µF bypass capacitor must be connected between pin 8 and pin 5.
6.
6.
6.
6. Principle of Operation
Principle of Operation
Principle of Operation
Principle of Operation
6.1.
6.1.
6.1.
6.1. Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Characteristics
Creepage distances
Clearance
Internal isolation thickness
Min
4.0
4.0
Unit
mm
7.
7.
7.
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Common
Characteristics
Input forward current
Input forward current derating
Input forward current (pulsed)
Input forward current derating
(pulsed)
Input reverse voltage
Power dissipation
Power dissipation derating
Output current
Output current derating
Output voltage
Supply voltage
Output power dissipation
Output power dissipation
derating
Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
(Ta ≤ 110)
(Ta > 110)
(Ta ≤ 110)
(Ta > 110)
(Ta ≤ 110)
(Ta > 110)
(Ta ≤ 95)
(Ta > 95)
(Ta ≤ 95)
(Ta > 95)
(10 s)
AC, 1 min, R.H. ≤ 60%
Symbol
IF
∆IF/∆Ta
IFP
∆IFP/∆Ta
VR
PD
∆PD/∆Ta
IO
∆IO/∆Ta
VO
VCC
PO
∆PO/∆Ta
Topr
Tstg
Tsol
BVS
Note
(Note 1)
(Note 2)
Rating
25
-0.67
50
-1.34
5
40
-1.0
16
-0.3
-0.5 to 20
-0.5 to 30
100
-1.8
-55 to 125
-55 to 150
260
3750
Unit
mA
mA/
mA
mA/
V
mW
mW/
mA
mA/
V
mW
mW/
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 ms, duty = 50%
Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
2010-12-16
Rev.1.0
TLP2409
3
8.
8.
8.
8. Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Characteristics
Input forward current
Output current
Operating temperature
Symbol
IF
IO
Topr
Note Min
-55
Typ.
Max
15
7
125
Unit
mA
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
9.
9.
9.
9. Electrical Characteristics (Note) (Unless otherwise specified, T
Electrical Characteristics (Note) (Unless otherwise specified, T
Electrical Characteristics (Note) (Unless otherwise specified, T
Electrical Characteristics (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Input forward voltage
Input forward voltage
temperature coefficient
Input reverse current
Input capacitance
High-level output current
Low-level output voltage
Current transfer ratio
High-level supply current
Symbol
VF
∆VF/∆Ta
IR
Ct
IOH
VOL
IO/IF
ICCH
Note Test
Circuit
Test Condition
IF = 16 mA
IF = 16 mA
VR = 3 V
V = 0 V, f = 1 MHz
IF = 0 mA, VCC = VO = 5.5 V
IF = 0 mA, VCC = 30 V,
VO = 20 V
IF = 0 mA, VCC = 30 V,
VO = 20 V, Ta = 100
IF = 16 mA, VCC = 4.5 V,
IO = 2.4 mA
IF = 16 mA, VCC = 4.5 V,
VO = 0.4 V
IF = 0 mA, VCC = 30 V
Min
1.40
20
Typ.
1.57
-2
60
3
0.01
Max
1.80
10
500
5
50
0.4
1
Unit
V
mV/
µA
pF
nA
µA
V
%
µA
Note: All typical values are at Ta = 25.
10.
10.
10.
10. Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total capacitance (input to
output)
Isolation resistance
Isolation voltage
Symbol
CS
RS
BVS
Note
(Note 1)
(Note 1)
Test Conditions
VS = 0 V, f = 1 MHz
VS = 500 V, R.H. ≤ 60%
AC, 1 min
AC, 1 s in oil
DC, 1 min in oil
Min
1×1012
3750
Typ.
1.0
1014
10000
10000
Max
Unit
pF
Ω
Vrms
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
2010-12-16
Rev.1.0
TLP2409
4
11.
11.
11.
11. Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
, V
, V
, V
, VCC
CC
CC
CC = 5 V)
= 5 V)
= 5 V)
= 5 V)
Characteristics
Propagation delay time to
logic low output
Propagation delay time to
logic high output
Common-mode transient
immunity at output high
Common-mode transient
immunity at output low
Symbol
tpHL
tpLH
CMH
CML
Note
(Note 1)
(Note 2)
Test
Circuit
Fig
12.1.1
Fig
12.1.2
Test Condition
IF = 0 → 16 mA, RL = 1.9 kΩ
IF = 16 → 0 mA, RL = 1.9 kΩ
IF = 0 mA, RL = 4.1 kΩ,
VCM = 400 Vp-p
IF = 16 mA, RL = 4.1 kΩ,
VCM = 400 Vp-p
Min
5000
-5000
Typ.
10000
-10000
Max
0.8
0.8
Unit
µs
V/µs
Note 1: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage
in the logic high state (VO > 2.0 V).
Note 2: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in
the logic low state (VO < 0.8 V).
12.
12.
12.
12. Test Circuits and Characteristics Curves
Test Circuits and Characteristics Curves
Test Circuits and Characteristics Curves
Test Circuits and Characteristics Curves
12.1.
12.1.
12.1.
12.1. Test Circuits
Test Circuits
Test Circuits
Test Circuits
Fig.
Fig.
Fig.
Fig. 12.1.1
12.1.1
12.1.1
12.1.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 12.1.2
12.1.2
12.1.2
12.1.2 Common-Mode Transient Immunity
Common-Mode Transient Immunity
Common-Mode Transient Immunity
Common-Mode Transient Immunity
2010-12-16
Rev.1.0
TLP2409
5
13.
13.
13.
13. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
13.1.
13.1.
13.1.
13.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow (See Fig. 13.1.1 and 13.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 13.1.1
13.1.1
13.1.1
13.1.1 An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
when Sn-Pb eutectic solder is used
Fig.
Fig.
Fig.
Fig. 13.1.2
13.1.2
13.1.2
13.1.2 An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
An example of a temperature profile
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
when lead(Pb)-free solder is used
• When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2.
13.2.
13.2.
13.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2010-12-16
Rev.1.0
TLP2409
6
14.
14.
14.
14. Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Land Pattern Dimensions for Reference Only
Fig.
Fig.
Fig.
Fig. 14.1
14.1
14.1
14.1 Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
Land Pattern Dimensions for Reference Only (unit: mm)
15.
15.
15.
15. Marking
Marking
Marking
Marking
Fig.
Fig.
Fig.
Fig. 15.1
15.1
15.1
15.1 Marking
Marking
Marking
Marking
2010-12-16
Rev.1.0
TLP2409
7
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions Unit: mm
Weight: 0.11 g (typ.)
Package Name(s)
TOSHIBA: 11-5K1S
Nickname: SO8
2010-12-16
Rev.1.0
TLP2409
8
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product
is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/
or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact
("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace
industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,
equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange
and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology
are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
2010-12-16
Rev.1.0
