3099125-M 2METRE - MULTICORE (SOLDER)

ROSIN BASED CORED SOLDER WIRE FLUX SPECIAL PROPERTIES

Properties of Multicore 309 solid flux for cored wires: Surface Insulation Resistance: Multicore 309 flux passes

the J-STD-004 SIR test and other elements of J-STD-004 test

protocols associated with the flux classification ROM1.

• Rosin based

• Fast soldering

Electromigration Test: Multicore 309 passes the Bellcore

GR-78-CORE Electromigration test.

• Pale residues

• Solders difficult surfaces

• Good spread on nickel, stainless steel,

chromel,monel, constantin, etc. RECOMMENDED OPERATING CONDITIONS

Soldering iron: Good results should be obtained using a

range of tip temperatures. However, the optimum tip

temperature and heat capacity required for a hand soldering

process is a function of both soldering iron design and the

nature of the task and care should be exercised to avoid

unnecessarily high tip temperatures for excessive times. A

high tip temperature will increase any tendency to flux spitting

and it may produce some residue darkening.

• Heat stable – low fuming

• Mild odour

PRODUCT RANGE

Multicore 309 cored wires are manufactured with a range of

flux contents. Although users will normally be using products

with a nominal flux content of 3%.

Multicore 309 cored wires are available in a variety of alloys

conforming to J-STD-006 and EN 29453 or alloys conforming

to similar national or international standards. For details refer

to document “Properties of Alloys used in Cored Solder Wires

”. A wide range of wire diameters is available.

The soldering iron tip should be properly tinned and this may

be achieved using Multicore cored wire. Severely

contaminated soldering iron tips should first be cleaned and

pre-tinned using Multicore Tip Tinner/Cleaner TTC1, then

wiped on a clean, damp sponge before re-tinning with

Multicore cored wire.

Alternative flux contents and alloys may be manufactured to

special order.

Soldering process: Multicore cored wires contain a careful

balance of resins and activators to provide clear residues,

maximum activity and high residue reliability, without cleaning

in most situations. To achieve the best results from Multicore

solder wires, recommended working practices for hand

soldering should be observed as follows:

TECHNICAL SPECIFICATION

A full description of test methods and detailed test results are

available on request.

Alloys: The alloys used for Multicore flux cored solder wires

conform to the purity requirements of the common national

and international standards. A wide range of wire diameters is

available manufactured to close dimensional tolerances. For

details refer to document “Properties of Alloys used in Cored

Solder Wires ”.

• Apply the soldering iron tip to the work surface, ensuring

that it simultaneously contacts the base material and the

component termination to heat both surfaces adequately.

This process should only take a fraction of a second.

• Apply Multicore flux cored solder wire to a part of the joint

surface away from the soldering iron and allow to flow

sufficiently to form a sound joint fillet – this should be

virtually instantaneous. Do not apply excessive solder or

heat to the joint as this may result in dull, gritty fillets and

excessive or darkened flux residues.

Flux: Multicore 309 solid flux is based on a blend of novel

activators and resins. It has a mild characteristic odour and

leaves a clear pale residue.

TYPICAL FLUX PROPERTIES

Test 309

Acid value 200mg KOH/g

Halide content <1.0%

EN 29451-1 Classification 1.1.2

JSTD Classification ROM1

Technical Data Shee

MulticoreCored Solder Wire Flux

309

April 2004

NOT FOR PRODUCT SPECIFICATIONS

THE TECHNICAL INFORMATION CONTAINED HEREIN ARE INTENDED AS REFERENCE ONLY:

PLEASE CONTACT HENKEL TECHNOLOGIES FOR ASSISTANCE AND RECOMMENDATIONS

ON SPECIFICATIONS FOR THIS

HENKEL LOCTITE ADHESIVES LTD. , KELSEY HOUSE, WOODLANE END. HEMEL

HEMPSTEAD, HERTFORDSHIRE HP2 4RQ, UK, TEL. +44 1442 233 233, FAX +44 1442 269 554

• Remove solder wire from the work piece and then remove the

iron tip.

The total process will be very rapid, depending upon thermal mass,

tip temperature and configuration and the solderability of the surfaces

to be joined.

Multicore flux cored solder wires provide fast soldering on copper and

brass surfaces as well as solder coated materials. Activity of the

halide activated versions on nickel is also good depending on the

state of oxidation of the nickel finish. The good thermal stability of

Multicore fluxes means they are also well suited to soldering

applications requiring high melting temperature alloys.

Cleaning: Multicore 309 flux cored solder wires have been

formulated to leave pale flux residues and to resist spilling and

fuming.

Cleaning will not be required in most situations but if necessary this is

best achieved using Multicore MCF800 Cleaner (see separate

technical data sheet). Other proprietary solvent or semi-aqueous

processes may be suitable. Saponification may be viable but

customers must ensure that the desired level of cleanliness can be

achieved by their chosen system.

HEALTH AND SAFETY

Warning: The following information is for guidance only and

users must refer to the Material Safety Data Sheet relevant to

Multicore 309 before use.

Health Hazards and Precautions: Inhalation of the flux

fumes given off during soldering should be avoided. The

fumes are irritating to the throat and respiratory system.

Prolonged or repeated exposure to rosin or modified rosin

based flux fumes may lead to the development of respiratory

sensitisation and occupational asthma.

Multicore solder wires must always be used with suitable fume

extraction equipment to remove fumes from the breathing

zone of operators and the general work environment.

Solder alloys containing lead give off negligible fume at normal

soldering temperatures up to 500°C.

Normal handling of lead alloy wires will not cause lead to be

absorbed through the skin. The most likely route of entry is

through ingestion but this will not be significant if a good

standard of personal hygiene is maintained. Eating, drinking

and smoking should not be permitted in the working area.

Hands should be washed with soap and warm water after

handling solder wire.

Waste disposal: Wherever possible, waste solder wire

should be recycled for recovery of metal. Otherwise it should

be disposed of according to local or national regulations.

Note

The data contained herein are furnished for information only

and are believed to be reliable. We cannot assume

responsibility for the results obtained by others over whose

methods we have no control. It is the user's responsibility to

determine suitability for the user's purpose of any production

methods mentioned herein and to adopt such precautions as

may be advisable for the protection of property and of persons

against any hazards that may be involved in the handling and

use thereof. In light of the foregoing, Henkel Corporation

specifically disclaims all warranties expressed or implied,

including warranties of merchantability or fitness for a

particular purpose, arising from sale or use of Henkel

Corporation’s products. Henkel Corporation specifically

disclaims any liability for consequential or incidental

damages of any kind, including lost profits. The

discussion herein of various processes or compositions is not

to be interpreted as representation that they are free from

domination of patents owned by others or as a license under

any Henkel Corporation patents that may cover such

processes or compositions. We recommend that each

prospective user test his proposed application before repetitive

use, using this data as a guide. This product may be covered

by one or more United States or foreign patents or patent

applications.