AFBR-15x9Z
DC to 10 Mbd Versatile Link Fiber Optic
Analog Transmitter for 1 mm POF and 200 µm PCS
Data Sheet
Description
The AFBR-15x9Z analog transmitter utilizes a 650 nm LED
source in a housing designed to eciently couple into
1 mm Polymer Optical Fiber (POF) and 200 µm diameter
Plastic-Clad Silica (PCS). Links up to 50 m are supported
with 1 mm POF, and up to 200 m with 200 µm PCS. It is
designed to interoperate with Avago´s HFBR-25xxZ, AF-
BR-25xxZ and AFBR-26xxZ receivers.
The transmitter is a 4-pin device, packed in Versatile Link
housing. Versatile Link components can be interlocked
(N-plexed together) to minimize space and to provide dual
connections with the duplex connectors. Various simplex
and duplex connectors, as well as POF cables are available
for Versatile Link components. Please contact Avago
Technologies for details or visit our company website at
www.avagotech.com
AFBR-15x9Z - Part number selection guide
Features
• RoHS-compliant
• Data transmission at signal rates from DC up to 10 MBd
• Up to 50 meters distance with 1 mm Polymer Optical
Fiber (POF) and 200 meters with 200 µm PCS
• Operating temperature range of -40 °C to +85 °C
• Compatible with Avago’s Versatile Link family of
connectors, for easy termination of ber
Applications
• Industrial control and factory automation
• Serial eld buses
• Intra-system links; Board-to-Board, Rack-to-Rack
• Extension of RS-232 and RS-485
• High voltage isolation
• Elimination of ground loops
• Reduces voltage transient susceptibility
Available options
Horizontal Package AFBR-1529Z
Vertical Package AFBR-1539Z
5 = 650 nm products
–15 x 9 Z
1 = Transmitter (TX)
2 = Horizontal Package
3 = Vertical Package
Z = Extended Temperature Range,
RoHS Compliant
9 = 10 MBd
AFBR
2
Package and Handling Information
Versatile Link packages are made of a ame-retardant
material and use the same pad layout as a standard,
eight-pin dual-in-line package. Versatile Link packages
are stackable and are enclosed to provide a dust-resistant
seal. Snap action simplex, simplex latching, duplex, and
duplex latching connectors are oered with simplex or
duplex cables.
Package Housing Color
Versatile Link components and simplex connectors are
color-coded to eliminate confusion when making connec-
tions. Transmitters are gray.
Handling
Versatile Link components are auto-insertable. When wave
soldering is performed with Versatile Link components,
the optical port plug should be left in to prevent contami-
nation of the port. Do not use reow solder processes (i.e.,
infrared reow or vapor-phase reow). Non-halogenated
water-soluble uxes (i.e., 0% chloride), not rosin-based
uxes, are recommended for use with Versatile Link com-
ponents.
Versatile Link components are moisture-sensitive devices
and are shipped in a moisture-sealed bag. If the compo-
nents are exposed to air for an extended period of time,
they may require a baking step before the soldering
process. Refer to the special labeling on the shipping tube
for details.
6.86
(0.270)
10.16
(0.400)
4.19
(0.165)
1.27
(0.050)
2.54
(0.100)
0.51
(0.020)
18.8
(0.74)
2.03
(0.080)
7.62
(0.30)
0.64
(0.025)
7.62
(0.300)
2.77
(0.109)
1.85
(0.073)
0.64 (0.025) DIA.
5.08
(0.200)
3.81 (0.150) MAX.
3.56 (0.140) MIN.
2.03
(0.080)
10.16
(0.400)
5.08
(0.200)
6.86
(0.27)
18.80
(0.740)
18.29
(0.720)
DIMENSIONS IN MILLIMETERS (INCHES)
Mechanical Dimensions
Horizontal Module Vertical Module
3
4 13 2
5 8
7.62
(0.300)
1.01 (0.040) DIA.
1.85
(0.073) MIN.
PCB EDGE
TOP VIEW
2.54
(0.100)
7.62
(0.300)
DIMENSIONS IN MILLIMETERS (INCHES).
Versatile Link Printed Board Layout Dimensions
Horizontal Module Vertical Module
Interlocked (Stacked) Assemblies
packages can be disengaged if necessary. Repeated
stacking and unstack ing causes no damage to individual
units.
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Horizontal Modules Stacking Vertical Modules
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter -
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This tech nique prevents
potential harm that could occur to ngers and hands of
assemblers from the package pins. Stacked horizontal
TOP VIEW
4
Figure 1. Recommended drive circuit Top View
(IF,on = 30 mA nominal at TA = 25 °C)
Pin Description Transmitter
Fiber port facing front, pins downward,
1 = Rightmost pin to 4 = Leftmost pin
Pin Name Function/Description Notes
1 Anode LED Anode
2 Cathode LED Cathode
3Pin No function, physical pin available,
recommended to signal GND
4 Pin No function, physical pin available,
recommended to signal GND
5 Housing Pin Physical pin available,
recommended to chassis GND
1
8 Housing Pin Physical pin available,
recommended to chassis GND
1
VCC
1
4
2
3
8
5
DATA
C1
R1
AFBR-15x9Z
68 5
7
R2
C2
4
1/2 SN75451
Value Tolerance
R1 2 kΩ5%
R2 100 Ω1%
C1 0.1 µF20%
C2 10 µF20%
Note:
This is an inverting circuitry, thus the
LED is o in case of DATA "H". Therefore,
an inverting receiver, e.g. AFBR-2529Z,
should be used accordingly.
Regulatory Compliance
Feature Test Method Performance
Electrostatic Discharge (ESD) to the Electrical Pins Human Body Model MIL-STD-883 Method 3015 Min ± 2000 V
Eye Safety IEC 60825-1,2 ,Class 1 Class 1
Specied Link Performance, TA = -40 °C to +85 °C, 10 MBd
Parameter Min Max Unit Condition Note
Link Distance with Standard Loss POF cable 0.1 50 m -40 °C to +85 °C 2
Link Distance with 200 µm PCS cable 0.1 200 m -40 °C to +85 °C 3
Notes:
1. Pins 5 and 8 are for mounting and retaining purposes. Make sure they are electrically connected to Chassis GND.
2. POF is HFBR-R/EXXYYYZ plastic (1 mm) optical ber. Worst-case attenuation used (0.27 dB/m for standard loss POF cable from -40 °C to +85 °C at
650 nm). Link performance is valid in combination with AFBR-26x4Z and AFBR-25x9Z.
3. PCS, worst-case attenuation (12 dB/km from -40 °C to +85 °C at 650 nm).
5
Absolute Maximum Ratings
Parameter Symbol Min Max Unit Notes
Storage and Operating Temperature TS,O -40 85 °C
Transmitter Peaking Forward Input Current IF,PK 45 mA 1
Transmitter Short Term Peaking Forward Input Current IF, PKshort 80 mA 2
Transmitter Average Forward Input Current IF,AVG 30 mA
Transmitter Reverse Input Voltage VR3 V
Notes:
1. For IF,PK > 30 mA the duty factor must maintain ≤ 30 mA IF,AVG and pulse width ≤ 1 µs
2. Maximum short term peaking forward current must not longer be applied than 5 ns to improve rise time or enhance signaling rate. Applying a
short term peaking forward current shall not result in exceeding 30 mA average forward current.
Recommended Operating Conditions
Parameter Symbol Min Max Unit Notes
Ambient Temperature, no air ow TA-40 85 °C 1, 2
Transmitter Average Forward Input Current IF,AVG 3 30 mA
Signaling Rate fsDC 10 Mbd 3
Notes:
1. Recommended operating conditions are those values outside of which functional performance is not intended, device reliability is not implied,
and damage to the device may occur over an extended period of time. See Reliability Data Sheet for specic reliability performance.
2. Measured at the housing.
3. Without peaking of the electrical input signal
Process Compatibility
Parameter Symbol Min Typical Max Unit Notes
Solder Environment TSOLD 260 °C 1, 3, 4
tSOLD 10 sec 2, 3, 4
Notes:
1. Maximum temperature refers to peak temperature.
2. Maximum time refers to time spent at peak temperature.
3. Solder surface to be at least 1 mm below lead frame stops.
4. Product is Moisture Sensitive Level 3.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.
AV02-4367EN - February 4, 2014
AFBR-15x9Z analog Transmitter
The AFBR-15x9Z analog transmitter utilizes a 650 nm LED source in a housing designed to eciently couple into 1 mm
Polymer Optical Fiber (POF) or 200 µm Plastic-Clad Silica (PCS). Links up to 50 meters are supported with 1 mm POF.
Links up to 200 meters are supported with 200 µm PCS.
Electrical and Optical Characteristics
(T
A = -40° C to +85° C unless otherwise stated)
Parameter Symbol Min Typical Max Unit Conditions Notes
Peak Output Power, 1 mm POF, 30 mA PT-6 -1 2 dBm IF,DC = 30 mA 1
Peak Output Power, 200 µm PCS, 30 mA PT-18 -12 -9 dBm IF,DC = 30 mA 1
Peak Output Power, 1 mm POF, 10 mA PT-11 -6 -3 dBm IF,DC = 10 mA 1
Peak Output Power, 1 mm POF, 5 mA PT-14 -9 -6 dBm IF,DC = 5 mA 1
Peak Output Power, 1 mm POF, 3 mA PT-16 -11 -8 dBm IF,DC = 3 mA 1
Optical Power Temperature Coecient ΔPT/ΔT-0.01 dB/K -40 °C…+25 °C
Optical Power Temperature Coecient ΔPT/ΔT-0.02 dB/K +25 °C…+85 °C
Peak emission wavelength λP630 650 685 nm
Peak Emission wavelength
Temperature coecient
Δλ/ΔT0.16 nm/K
Spectral Width FWHM 20 nm
Forward Voltage VF1.4 2.3 V IF,DC = 3 mA to 30 mA
Forward Voltage temperature coecient ΔVF/ΔT1.6 mV/K IF,DC = 30 mA
Reverse Input Breakdown voltage 9 20 V
Diode Capacitance 30 70 pF
Optical Rise time tr16 ns 10% to 90% 2
Optical Fall time tf16 ns 90% to 10% 2
Notes:
1. Optical power measured with polished connector end face at the end of 0.5 meters of 1 mm diameter POF with a numerical aperture (NA) of 0.5,
or of 200 µm diameter PCS, with NA=0.37.
2. Using the recommended drive circuitry according to Figure 3.
Figure 2. Typical forward voltage vs. drive current Figure 3. Typical optical output power vs. drive current
1.4
1.5
1.6
1.7
1.8
1.9
2
2.1
2.2
2.3
1 10 100
VF - FORWARD VOLRAGE - V
IF - TRANSMITTER DRIVE CURRENT - mA
-40° C
25° C
85° C
-40° C
25° C
85° C
- 16
-14
-12
-10
-8
-6
-4
-2
0
2
1 10 100
PT - OUTPUT POWER - dBm
IF - TRANSMITTER DRIVE CURRENT - mA
