SN54HC541, SN74HC541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS305C – JANUARY 1996 – REVISED AUGUST 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
Wide Operating Voltage Range of 2 V to 6 V
D
High-Current 3-State Outputs Drive Bus
Lines Directly or Up To 15 LSTTL Loads
D
Low Power Consumption, 80-µA Max ICC
D
Typical tpd = 10 ns
D
±6-mA Output Drive at 5 V
D
Low Input Current of 1 µA Max
D
Data Flow-Through Pinout (All Inputs on
Opposite Side From Outputs)
description/ordering information
These octal buffers and line drivers feature the
performance of the ’HC240 devices and a pinout
with inputs and outputs on opposite sides of the
package. This arrangement greatly facilitates
printed circuit board layout.
The 3-state outputs are controlled by a two-input
NOR gate. If either output-enable (OE1 or OE2)
input is high, all eight outputs are in the
high-impedance state. The ’HC541 devices
provide true data at the outputs.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
–40 C to 85 C
PDIP – N T ube of 20 SN74HC541N SN74HC541N
–40 C to 85 C
SOIC – DW
T ube of 25 SN74HC541DW
HC541
–40 C to 85 C
SOIC – DW
Reel of 2000 SN74HC541DWR
HC541
–40°C to 85°C
SOP – NS Reel of 2000 SN74HC541NSR HC541
–40°C to 85°C
SSOP – DB Reel of 2000 SN74HC541DBR HC541
TSSOP – PW
T ube of 70 SN74HC541PW
HC541
TSSOP – PW
Reel of 2000 SN74HC541PWR
HC541
Reel of 250 SN74HC541PWT
–55 C to 125 C
CDIP – J T ube of 20 SNJ54HC541J SNJ54HC541J
–55
°
C to 125
°
C
CFP – W T ube of 85 SNJ54HC541W SNJ54HC541W
LCCC – FK T ube of 55 SNJ54HC541FK SNJ54HC541FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE1
A1
A2
A3
A4
A5
A6
A7
A8
GND
VCC
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
SN54HC541 ...J OR W PACKAGE
SN74HC541 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
Y1
Y2
Y3
Y4
Y5
A3
A4
A5
A6
A7
A2
A1
OE1
Y7
Y6 V
OE2
A8
GND
Y8
SN54HC541 . . . FK PACKAGE
(TOP VIEW)
CC
Copyright 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HC541, SN74HC541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS305C – JANUARY 1996 – REVISED AUGUST 2003
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
OE1 OE2 A
OUTPUT
Y
L L L L
LLH H
HXX Z
X H X Z
logic diagram (positive logic)
OE1
OE2
To Seven Other Channels
A1 Y1
1
19
218
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±35 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HC541, SN74HC541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS305C – JANUARY 1996 – REVISED AUGUST 2003
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HC541 SN74HC541
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
V
High-level input voltage
VCC = 2 V 1.5 1.5
V
VIH
High-level input voltage
VCC = 4.5 V 3.15 3.15
V
IH
VCC = 6 V 4.2 4.2
V
Low-level input voltage
VCC = 2 V 0.5 0.5
V
VIL
Low-level input voltage
VCC = 4.5 V 1.35 1.35
V
IL
VCC = 6 V 1.8 1.8
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
t/ v
Input transition rise/fall time
VCC = 2 V 1000 1000
ns
t/
v
Input transition rise/fall time
VCC = 4.5 V 500 500
ns
VCC = 6 V 400 400
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C SN54HC541 SN74HC541
UNIT
PARAMETER
TEST CONDITIONS
MIN TYP MAX MIN MAX MIN MAX
UNIT
V
V = V or V
I = –20 A
2 V 1.9 1.998 1.9 1.9
V
V
V = V or V
IOH = –20
µ
A
4.5 V 4.4 4.499 4.4 4.4
V
VOH
VI = VIH or VIL
OH
6 V 5.9 5.999 5.9 5.9
V
OH
IIH IL
IOH = –6 mA 4.5 V 3.98 4.3 3.7 3.84
IOH = –7.8 mA 6 V 5.48 5.8 5.2 5.34
V
V = V or V
I = 20 A
2 V 0.002 0.1 0.1 0.1
V
V
V = V or V
IOL = 20
µ
A
4.5 V 0.001 0.1 0.1 0.1
V
VOL
VI = VIH or VIL
OL
6 V 0.001 0.1 0.1 0.1
V
OL
IIH IL
IOL = 6 mA 4.5 V 0.17 0.26 0.4 0.33
IOL = 7.8 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
IOZ VO = VCC or 0 6 V ±0.01 ±0.5 ±10 ±5µA
ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA
Ci2 V to 6 V 3 10 10 10 pF
SN54HC541, SN74HC541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS305C – JANUARY 1996 – REVISED AUGUST 2003
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC541 SN74HC541
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
t
A
Y
2 V 40 115 171 144
ns
tpd
A
Y
4.5 V 12 23 34 29
ns
pd
6 V 10 20 29 25
t
OE
Y
2 V 80 150 224 188
ns
ten
OE
Y
4.5 V 17 30 45 38
ns
en
6 V 15 26 38 32
t
OE
Y
2 V 40 150 224 188
ns
tdis
OE
Y
4.5 V 18 30 45 38
ns
dis
6 V 17 26 38 32
t
Y
2 V 28 60 90 75
ns
tt
Y
4.5 V 8 12 18 15
ns
t
6 V 6 10 15 13
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC541 SN74HC541
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
t
A
Y
2 V 65 165 246 206
ns
tpd
A
Y
4.5 V 16 33 49 41
ns
pd
6 V 14 28 42 35
t
OE
Y
2 V 100 200 298 250
ns
ten
OE
Y
4.5 V 20 40 60 50
ns
en
6 V 17 34 51 43
t
Y
2 V 45 210 315 265
ns
tt
Y
4.5 V 17 42 63 53
ns
t
6 V 13 36 53 45
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per buffer/driver No load 35 pF
SN54HC541, SN74HC541
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS305C – JANUARY 1996 – REVISED AUGUST 2003
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50% 10%10% 90% 90% VCC
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
VCC
VOH
VOL
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
50%
10%
90%
VCC
VCC
VOL
0 V
Output
Control
(Low-Level
Enabling)
Output
W aveform 1
(See Note B)
50%
tPZL tPLZ
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOH
0 V
50%
50%
tPZH tPHZ
Output
W aveform 2
(See Note B)
VCC
Test
Point
From Output
Under Test
CL
(see Note A)
RL
V
CC
S1
S2
LOAD CIRCUIT
PARAMETER CL
tPZH
tpd or tt
tdis
ten tPZL
tPHZ
tPLZ
1 k
1 k
50 pF
or
150 pF
50 pF
Open Closed
RLS1
Closed Open
S2
Open Closed
Closed Open
50 pF
or
150 pF Open Open––
NOTES: A. CL includes probe and test-fixture capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily . All input pulses are supplied by generators having the following
characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
JM38510/65711BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
M38510/65711BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SN54HC541J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SN74HC541DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC541N3 OBSOLETE PDIP N 20 TBD Call TI Call TI
SN74HC541NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC541NSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541NSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541NSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541PW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74HC541PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74HC541PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541PWT ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC541PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HC541FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC541J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 3
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC541, SN74HC541 :
Catalog: SN74HC541
Military: SN54HC541
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC541DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74HC541DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74HC541NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
SN74HC541PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74HC541PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC541DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74HC541DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74HC541NSR SO NS 20 2000 367.0 367.0 45.0
SN74HC541PWR TSSOP PW 20 2000 367.0 367.0 38.0
SN74HC541PWT TSSOP PW 20 250 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2