TORX1952(F)
2014-05-20
1
FIBER OPTIC RECEIVING MODULE
TORX1952(F)
GENERAL-PURPOSE OPTICAL RECEIVING MODULE
Data rate：DC to 10Mb／s (NRZ code)
Transmission distance：Up to 10m ( Using TOTX1952(F) and APF)
For JIS F05 Optical Connector
TTL Interface
ATC (Automatic Threshold Control) circuit is used for stabilized output at a wide range of optical power level.
1. Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Storage Temperature Tstg −40 to 85 °C
Operating Temperature Topr −40 to 85 °C
Supply Voltage VCC −0.5 to 6 V
Low Level Output Current IOL 20 mA
High Level Output Current IOH −1 mA
Soldering Temperature Tsol 260 (Note 1) °C
Note 1: Soldering time ≤ 10 s (More than 1 mm apart from the package).
Using continuously heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated
failure rate, etc).
2. Operating Ranges
Characteristics Symbol Min Typ. Max Unit
Supply Voltage VCC 4.75 5.0 5.25 V
High Level Output Current IOH - - −150 μA
Low Level Output Current IOL - - 2.0 mA
Start of commercial production
2011/03
TORX1952(F)
2014-05-20
2
3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V)
Characteristics Symbol Test Condition Min Typ. Max Unit
Data Rate NRZ Code(Note 2) DC - 10 Mb / s
Transmission Distance Using APF and TOTX1952(F) (Note3),
DC to 10 Mb/s 0.2 - 10 m
Pulse Width Distortion (Note4) ∆tw
Using APF and TOTX1952(F),
Pulse width 100 ns
Pulse cycle 200 ns, CL = 10 pF
−30 - 30 ns
Maximum Receivable Power (Note 5) PMAX DC to 10 Mb / s, Using APF −14.5 - - dBm
Minimum Receivable Power (Note 5) PMIN DC to 10 Mb / s, Using APF - - −27 dBm
Current Consumption ICC - 9 20 mA
High Level Output Voltage VOH VCC=4.75V 3.5 4.0 - V
Low Level Output Voltage VOL VCC=5.25V - 0.1 0.4 V
Note 2: High level output when optical flux is received. Low level output when it is not received.
The duty factor must be kept 25 to 75%.
Note 3: All Plastic Fiber (980 / 1000μm) with polished surface.
Note 4: Between input of TOTX1952(F) and output of TORX1952(F).
Note 5: BER ≤ 10−9, Valued by peak.
4. Application Circuit
5. Applicable Optical Fiber with Fiber Optic Connectors
All Plastic Fiber (980μm / 1000μm cladding ), NA=0.5
F05 type optical connector with polished surface
TORX1952(F)
2014-05-20
3
6. Precautions during use
(1) Absolute maximum rating
The absolute maximum ratings are the limit values which must not be exceeded during operation of device.
None of these rating value must not be exceeded. If The absolute maximum rating value is exceeded, the
characteristics of devices may never be recovered properly. In extreme cases, the device may be
permanently damages.
(2) Operating Range
The operating range is the range of conditions necessary for the device to operate as specified in individual
technical datasheets and databooks. Care must be exercised in the design of the equipment.
If a device is used under conditions that do not exceed absolute maximum ratings but exceed the operating
range, the specifications related to device operation and electrical characteristics may not be met, resulting
in a decrease in reliability.
If greater reliability is required, derate the device’s operating ranges for voltage, current, power and
temperature before use.
(3) Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle, optical modules
are optical components. During soldering, ensure that flux dose not contact with the emitting surface or
detecting surface. Also ensure that proper flux removal is conducted after soldering.
Some optical modules come with protective cap. The protective cap is used to avoid malfunction when the
optical module is not in use. Not that it is not dust or waterproof.
As mentioned before, optical modules are optical component. Thus, in principle, soldering where there may
be flux residue or flux removal after soldering is not recommended. Toshiba recommends that soldering be
performed without the optical module mounted on the board. Then, after the board is cleaned, solder the
optical module manually. Do not perform any further cleaning.
If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make sure,
without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of flux.
In such a case, check the reliability.
(4) Noise resistance
Where the fiber optic receiving module case uses conductive resin, shield by connecting the reinforcing pin
at a front end of the module to GND. When using this optical module, connect the pin to SIGNAL−GND.
Where the fiber optic receiving module case has a resistance of several tens of ohms, take care that the
case does not contact power line of other circuits.
It is believed that the use of optical transfer devices improve the noise resistance. In principle, optical fiber
is not affected by noise. However, especially receiving module which handle signals whose level is
extremely small, are comparatively more susceptible to noise.
TOSLINK improves noise resistance using a conductive case. However, the current of the signal output
from the photodiode of the optic receiving module is extremely small. Thus, depending on the usage
environment, shielding the case is not sufficient for noise resistance.
When using TOSLINK, Toshiba recommends that you test using the actual device and check the noise
resistance.
Use a simple noise filter on the TOSLINK fiber optic receiving module power line. If the ripple in power
supply used is high, further reinforce the filter.
When locating the optical module in an area susceptible to radiated noise, increase shielding by covering
the optical module and the power line filter using a metallic cover.
(5) Vibration and shock
This module is resin−molded construction with wire fixed by resin. This structure is relatively sound against
vibration or shock, In actual equipment, there are some cases where vibration, shock, and stress is applied
to soldered parts or connected parts, resulting in line cut. Attention must be paid to the design of the
mechanism for applications which are subject to large amounts of vibration.
(6) Fixing fiber optical receiving module
Solder the fixed pin (pins 5 and 6) of fiber optic receiving module TORX1952(F) to the printed circuit board
to fix the module to the board.
TORX1952(F)
2014-05-20
4
(7) Shielding and wiring pattern of fiber optic receiving modules
To shield, connect the fixed pins (pins 5 and 6) of fiber optic receiving module TORX1952(F) to the GND.
Where the fiber optic receiving module uses conductive resin, be careful that the case does not touch wiring
(including land).
To improve noise resistance, shield the optical module and the power line filter using a metallic cover.
(8) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour
solvent in the optical connector ports. If solvent is inadvertently poured there, clean with cotton tips.
(9) Protective cap
When the fiber optic receiving module TORX1952(F) is not in use, use the protective cap.
(10) Supply voltage
Use the supply voltage within the operating ranges (VCC = 5 ± 0.25 V). Make sure that supply voltage does
not exceed the absolute maximum rating value of 6 V, even instantaneously.
(11) Output
When the receiver output is at low level and connected to the power supply, or when the output is at high
level and connected to GND, the internal IC may be destroyed.
(12) Soldering condition
Solder at 260°C or less within ten seconds.
(13) Incidence of a photo Flash
If strong light such as a photo flash is incident on an optical module, a transmission error may occur.
Be careful to avoid such situations.
(14) Precaution on waste
When discarding devices and packing materials, follow procedures stipulated by local regulations in order
to protect the environment against contamination.
TORX1952(F)
2014-05-20
5
7. Package Outline drawing
Unit: mm
Pin connection
1.Output
2.GND1
3.Vcc
4.GND2
5.Case
6.Case
TORX1952(F)
2014-05-20
6
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
