Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
CC2592
SWRS159 –FEBRUARY 2014
CC2592 2.4-GHz Range Extender
1 Introduction
1.1 Features
1
• Seamless Interface to 2.4-GHz Low-Power RF • Digital Control of LNA Gain by HGM Terminal
Devices from Texas Instruments • 100 nA in Power Down (LNA_EN = PA_EN = 0)
• +22-dBm Output Power • Low-Transmit Current Consumption
• 3-dB Typical Improved Sensitivity on CC2520, – 155 mA at 3 V for +22 dBm, PAE = 34%
CC253X, and CC85XX • Low-Receive Current Consumption
• Very Few External Components – 4.0-mA for High-Gain Mode
– Integrated Switches – 1.9-mA for Low-Gain Mode
– Integrated Matching Network • 4.7-dB LNA Noise Figure, Including T/R Switch
– Integrated Balun and External Antenna Match
– Integrated Inductors • RoHS Compliant 4-mm × 4-mm QFN-16 Package
– Integrated PA • 2.0-V to 3.7-V Operation
– Integrated LNA • –40°C to +125°C Operation
1.2 Applications
• All 2.4-GHz ISM Band Systems • IEEE 802.15.4 and ZigBee Gateways
• Wireless Sensor Networks • Wireless Consumer Systems
• Wireless Industrial Systems • Wireless Audio Systems
• IEEE 802.15.4 and ZigBee®Metering Systems
1.3 Description
The CC2592 device is a cost-effective and high-performance RF front end for low-power and low-voltage
2.4-GHz wireless applications.
The CC2592 device is a range extender for all CC25XX 2.4-GHz low-power RF transceivers, transmitters,
and system-on-chip products from Texas Instruments.
To increase the link budget, the CC2592 device provides a power amplifier for increased output power
and an LNA with a low-noise figure for improved receiver sensitivity.
The CC2592 device provides a very small size, high-output power RF design with its 4-mm × 4-mm QFN-
16 package.
The CC2592 device contains PA, LNA, switches, RF-matching, and balun for simple design of high-
performance wireless applications.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
RF_N
RF_P
ANT
BIAS LNA_EN
PA_EN
EN
LOGIC
BIAS
VDD_PAVDD_LNA
BALUN
HGM
VDD_BIAS
PREAMP
EN
PA
LNA
EN
CC2592
SWRS159 –FEBRUARY 2014
www.ti.com
1.4 Functional Block Diagram
Figure 1-1 shows a simplified block diagram of the CC2592 device.
Figure 1-1. CC2592 Simplified Block Diagram
2Introduction Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2592
CC2592
SWRS159 –FEBRUARY 2014
www.ti.com
2 Device Characteristics
2.1 Absolute Maximum Ratings
Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values
may cause permanent damage to the device.
Parameter Conditions Value Unit
Supply voltage All supply terminals must have the same voltage –0.3 to 3.8 V
Voltage on any digital terminal –0.3 to VDD+0.3, max 3.8 V
Input RF level +10 dBm
2.2 Handling Ratings
Under no circumstances must the handling ratings be violated. Stress exceeding one or more of the limiting values may
cause permanent damage to the device.
Parameter Conditions Value Unit
Storage temperature range –50 to 150 °C
Human Body Model 2000 V
ESD Charge Device Model 1000 V
2.3 Recommended Operating Conditions
The operating conditions for the CC2592 device are listed below.
Parameter Conditions Min Max Unit
Ambient temperature range –40 125 °C
Operating supply voltage 2.0 3.7 V
Operating frequency range 2400 2483.5 MHz
4Device Characteristics Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2592
CC2592
www.ti.com
SWRS159 –FEBRUARY 2014
2.4 Electrical Characteristics
Tc= 25°C, VDD = 3.0 V, fRF = 2440 MHz (unless otherwise noted). Measured on CC2592EM reference design including
external matching components.
Parameter Test Conditions Min Typ Max Unit
Receive current, high-gain mode HGM = 1 4 mA
Receive current, low-gain mode HGM = 0 1.9 mA
POUT = 20 dBm 123
Transmit current mA
POUT = 22 dBm 155
Transmit current No input signal 50 mA
Power down current EN = 0 0.1 0.3 µA
High-input level (control terminals) PA_EN, LNA_EN, HGM 1.3 Vdd V
Low-input level (control terminals) PA_EN, LNA_EN, HGM 0.3 V
Power down - Receive mode switching 1 µs
time
Power down - Transmit mode switching 1 µs
time
RF Receive
Gain, high-gain mode HGM = 1 11 dB
Gain, low-gain mode HGM = 0 6 dB
Gain variation over frequency 2400 to 2483.5 MHz, HGM = 1 2 dB
Gain variation over power supply 2.0 V to 3.7 V, HGM = 1 1.5 dB
Gain variation over temperature –40°C to 85°C, HGM = 1 1.7 dB
Gain variation over temperature 85°C to 125°C, HGM = 1 1 dB
HGM = 1, including internal T/R 4.7 dB
Noise figure, high-gain mode switch and external antenna match
Input 1-dB compression, high-gain mode HGM = 1 –18 dBm
Input IP3, high-gain mode HGM = 1 –9 dBm
Input reflection coefficient, S11 HGM = 1, measured at antenna port –15 dB
RF Transmit
Gain 24 dB
PIN = 0.0 dBm 20.3
Output power, POUT dBm
PIN = 4.0 dBm 21.9
Power added efficiency, PAE POUT = 22 dBm 34 %
Output 1-dB compression 15 dBm
Output power variation over frequency 2400 to 2483.5 MHz, PIN = 4 dBm 0.5 dB
Output power variation over power supply 2.0 V to 3.7 V, PIN = 4 dBm 3.8 dB
Output power variation over temperature –40°C to 125°C, PIN = 4 dBm 1.7 dB
Second harmonic power FCC requirement –41.2 dBm
Third harmonic power FCC requirement –41.2 dBm
No damage 20:1
VSWR Stability 7.5:1
Copyright © 2014, Texas Instruments Incorporated Device Characteristics 5
Submit Documentation Feedback
Product Folder Links: CC2592
GND 1
2
3
4
12
11
10
9
5 6 78
16 15 14 13
QFN-16 4x4mm
RF_N
RF_P
HGM
LNA_EN
PA_EN
BIAS
GND
GND
GND
GND
VDD_PA
VDD_BIAS
VDD_LNA
ANT
GND
CC2592
SWRS159 –FEBRUARY 2014
www.ti.com
3 Device Information
3.1 Terminal and I/O Configuration
Figure 3-1 and Table 3-1, provide the terminal layout and description for the CC2592 device.
Figure 3-1. Terminal Top View
6Device Information Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2592
CC2592
www.ti.com
SWRS159 –FEBRUARY 2014
Table 3-1. Terminal Functions
Terminal Type Description
No. Name
– GND Ground The exposed die attach pad must be connected to a solid ground
plane. See CC2592EM reference design for the recommended layout.
1, 4, 9, 11, 12, 16 GND Ground Ground connections. Only terminals 9, 11, and 12 should be shorted
to the die attach pad on the top PCB layer.
2 RF_N RF RF interface toward CC25xx device
3 RF_P RF RF interface toward CC25xx device
5 PA_EN Digital input Digital control terminal. See Table 9-1 for details.
6 LNA_EN Digital input Digital control terminal. See Table 9-1 or details.
7 HGM Digital input Digital control terminal
HGM = 1 →Device in High Gain Mode
HGM = 0 →Device in Low Gain Mode
8 BIAS Analog Biasing input. Resistor between this node and ground sets bias
current for PA and LNA.
10 ANT RF Antenna interface
13 VDD_LNA Power 2.0- to 3.7-V power
14 VDD_BIAS Power 2.0- to 3.7-V power
15 VDD_PA Power 2.0- to 3.7-V power
Copyright © 2014, Texas Instruments Incorporated Device Information 7
Submit Documentation Feedback
Product Folder Links: CC2592
NF 10log(F) 10log(3.37) 5.28 dB
8
4.7 10
210
111
110
F 1 10 1
F F 10 3.37
G10
CC2592 CC2520
NF = 4.7 dB
Gain = 11 dB NF = 8 dB
CC2592
SWRS159 –FEBRUARY 2014
www.ti.com
4 Sensitivity Improvement Example
Figure 4-1.
The noise factor of a system consisting of the CC2592 device and a CC2520 device, as seen in Figure 4-
1is given by:
(1)
The noise figure is: (2)
The noise figure is reduced from 8 dB for the CC2520 standalone to 5.28 dB for the CC2592 and CC2520
device combination, leading to a 2.72-dB theoretical improvement in sensitivity.
In practice, tests on the CC2592 and CC25XX devices show around 3-dB improvement in sensitivity. For
the CC2538 and CC2592 devices, the improvement is almost 4 dB (approximately –97 dBm to –101 dBm)
8Sensitivity Improvement Example Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2592
RF_P
RXTX
RF_N
RF_P
RXTX
RF_N
CC2592
ANT
LNA_EN
HGM
BIAS
VDD
VDD_PA
VDD_LNA
VDD_BIAS
RF_P
PA_EN
RF_N
R81
VDD
VDD
C101
L101
L102
C109
C103
C151
C106
C131
LNA_EN
HGM
PA_EN
LDB182G4520C-110
Balun
SMA
SMA L103
C105
C107
C108
C152
C21
CC2592
www.ti.com
SWRS159 –FEBRUARY 2014
5 CC2592EM Evaluation Module
Figure 5-1 shows an evaluation module circuit of the CC2592 device.
Figure 5-1. CC2592 Evaluation Module
Table 5-1 lists the materials in the CC2592 evaluation module circuit.
Table 5-1. List of Materials
Device Function Value
L101 PA bias inductor 4.7 nH, Multilayer chip inductor
L102 Part of antenna match 1 nH, Multilayer chip inductor
L103 Part of antenna match 1.8 nH, Multilayer chip inductor
C101 Part of antenna match 2.2-pF 0402 Chip capacitor
C103 Part of antenna match 2.2-pF 0402 Chip capacitor
C105 Part of antenna match 0.1-pF 0402 Chip capacitor
C106 Decoupling 12-pF 0402 Chip capacitor
C107 Decoupling 1-nF 0402 Chip capacitor
C108 Decoupling 1-µF 0402 Chip capacitor
C109 DC block 18-pF 0402 Chip capacitor
C21 Balun matching capacitor 0.2-pF 0402 Chip capacitor
C152 Balun matching capacitor 0.3-pF 0402 Chip capacitor
C131 Decoupling 1-nF 0402 Chip capacitor
C151 Decoupling 12-pF 0402 Chip capacitor
R81 Bias resistor 3.9 kΩ, 0402 resistor
Copyright © 2014, Texas Instruments Incorporated CC2592EM Evaluation Module 9
Submit Documentation Feedback
Product Folder Links: CC2592
20
40
60
80
100
120
140
160
180
200
0
4
8
12
16
20
24
28
32
36
±20 ±16 ±12 ±8 ±4 048
Current Consumption (mA)
Output Power (dBm) and PAE (%)
Input Power (dBm)
Pout
PAE
Ivdd
C004
90
100
110
120
130
140
150
160
170
180
18
20
22
24
26
28
30
32
34
36
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
Current Consumption (mA)
Output Power (dBm) and PAE (%)
Power Supply (V)
Pout
PAE
Ivdd
C005
90
100
110
120
130
140
150
160
170
180
18
20
22
24
26
28
30
32
34
36
2400 2410 2420 2430 2440 2450 2460 2470 2480 2490
Current Consumption (mA)
Output Power (dBm) and PAE (%)
Frequency (MHz)
Pout
PAE
Ivdd
C007
4
5
6
7
8
9
10
11
12
±40 ±20 0 20 40 60 80 100 120
Gain (dB)
Temperature (C)
HGM
LGM
C001
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
4
5
6
7
8
9
10
11
12
13
2400 2410 2420 2430 2440 2450 2460 2470 2480 2490
Noise Figure (dB)
Gain (dB)
Frequency (MHz)
HGM
LGM
NF HGM
C003
4
5
6
7
8
9
10
11
12
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
Gain (dB)
Power Supply (V)
HGM
LGM
C002
CC2592
SWRS159 –FEBRUARY 2014
www.ti.com
6 Typical Characteristics
spacer
Figure 2. LNA Gain Versus Power Supply
Figure 1. LNA Gain and Noise Figure Versus Frequency
Figure 3. LNA Gain Versus Temperature Figure 4. Output Power, PAE, and Current Consumption Versus
Frequency
Input Power Level = +4 dBm
Figure 5. Output Power, PAE, and Current Consumption Versus Figure 6. Output Power, PAE, and Current Consumption Versus
Input Power Power Supply
Input Power Level = +4 dBm
10 Typical Characteristics Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2592
142
144
146
148
150
152
154
156
158
160
18
20
22
24
26
28
30
32
34
36
±40 ±20 0 20 40 60 80 100 120 140
Current Consumption (mA)
Output Power (dBm) and PAE (%)
Temperature (C)
Pout
PAE
Ivdd
C006
CC2592
www.ti.com
SWRS159 –FEBRUARY 2014
Figure 7. Output Power, PAE, and Current Consumption Versus Temperature
Input Power Level = +4 dBm
Copyright © 2014, Texas Instruments Incorporated Typical Characteristics 11
Submit Documentation Feedback
Product Folder Links: CC2592
CC2592
SWRS159 –FEBRUARY 2014
www.ti.com
7 Controlling the Output Power from CC2592
The output power of the CC2592 device is controlled by controlling the input power. The CC2592 PA is
designed to work in compression (class AB).
Driving the CC2592 device too far into saturation might result in spurious emissions and harmonics above
regulatory limits. This caution should especially be considered for systems targeting a wide operating
temperature range, where a combination of low temperature, low supply voltage, and a transceiver that
increases output power (drive level) at low temperature, can result in high spurious emissions.
Figure 7-1 shows the maximum recommended drive level versus temperature and supply voltage.
Figure 7-1. Maximum Recommended Drive Level
8 Input Levels on Control Terminals
The three digital control terminals (PA_EN, LNA_EN, and HGM) have built-in level-shifting functionality,
meaning that if the CC2592 device operates off a 3.7-V supply voltage, the control terminals still sense
1.6- to 1.8-V signals as a logical 1. However, the input voltages should not have a logical 1 level that is
higher than the supply.
12 Input Levels on Control Terminals Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2592
CC2530
RF_P
RXTX
RF_N
RF_P
RXTX
RF_N
CC2592
ANT
LNA_EN
HGM
BIAS
VDD
VDD_PA
VDD_LNA
VDD_BIAS
RF_P
PA_EN
RF_N
R81
VDD
VDD
C101
L101
L102
C109
C103
C151
C106
C131
P1.0
P0.7
P1.1
SMA L103
C105
C107
C108 RF_P
RF_N
Alternatively to
VDD/GND/MCU
CC2592
www.ti.com
SWRS159 –FEBRUARY 2014
9 Connecting the CC2592 Device to a CC25xx Device
Table 9-1 shows the control logic for connecting CC2592 to a CC25xx device.
Table 9-1. Control Logic for Connecting CC2592 to a CC25xx Device
PA_EN LNA_EN HGM Mode of Operation
0 0 X Power Down
X 1 0 RX Low-Gain Mode
X 1 1 RX High-Gain Mode
1 0 X TX
Figure 9-1 shows the application circuit for the CC2592 and CC253X devices.
Figure 9-1. Application Circuit Example for CC2530 + CC2592
Copyright © 2014, Texas Instruments Incorporated Connecting the CC2592 Device to a CC25xx Device 13
Submit Documentation Feedback
Product Folder Links: CC2592
CC2592
SWRS159 –FEBRUARY 2014
www.ti.com
10 Device and Documentation Support
10.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 10-1. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
CC2592 Click here Click here Click here Click here Click here
10.2 Trademarks
ZigBee is a registered trademark of ZigBee Alliance.
10.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
10.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
14 Device and Documentation Support Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC2592
PACKAGE OPTION ADDENDUM
www.ti.com 15-May-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
CC2592RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 CC2592
CC2592RGVT ACTIVE VQFN RGV 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU | Call TI Level-2-260C-1 YEAR -40 to 125 CC2592
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 15-May-2015
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CC2592RGVR VQFN RGV 16 2500 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2
CC2592RGVT VQFN RGV 16 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CC2592RGVR VQFN RGV 16 2500 336.6 336.6 28.6
CC2592RGVT VQFN RGV 16 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
