INTEGRATED CIRCUITS DIVISION
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DS-LCC120-R10 1
LCC120
1-Form-C OptoMOS® Relay
Part # Description
LCC120 8-Pin DIP (50/Tube)
LCC120S 8-Pin Surface Mount (50/Tube)
LCC120STR 8-Pin Surfact Mount Tape & Reel (1000/Reel)
Parameters Ratings Units
Blocking Voltage 250 VP
Load Current 170 mArms / mADC
On-Resistance (max) 20
Applications
Features
Description
Ordering Information
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• 3750Vrms Input/Output Isolation
• 1-Form-C Solid State Relay
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-pin Package
• Flammability Rating UL 94 V-0
• Surface Mount Tape & Reel Versions Available
LCC120P is a 250V, 170mA, 20 1-Form-C relay. It
is ideal for applications focused on peak load current
handling capablilities.
This device is perfect for applications where a signal
needs to be switched between two different lines. The
small 8-lead package makes it an ideal space-saving
replacement for a 1-Form-C electromechanical relay
(EMR).
Switching Characteristics for a
Form-C Device
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate # 1175739
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
IF
10%
90%
ton
toff
10%
90%
ton toff
ILOAD
ILOAD
Form-A
Form-B
1
2
3
4
Do Not Use
+ Control
– Control
Do Not Use
8
7
6
5
Normally Closed Pole
Normally Open Pole
AC/DC Configuration
Pin Configuration
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2R10
LCC120
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Absolute Maximum Ratings @ 25ºC
Parameter Min Max Unit
Blocking Voltage - 250 VP
Reverse Input Voltage - 5 V
Input control Current - 50 mA
Peak (10ms) - 1 A
Input Power Dissipation 1- 150 mW
Total Power Dissipation 2- 800 mW
Isolation Voltage, Input to Output 3750 - Vrms
Operating Temperature -40 +85 ºC
Storage Temperature -40 +125 ºC
1 Derate linearly 1.33mW / ºC.
2 Derate linearly 6.67mW / ºC.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous, AC/DC Confi guration - IL- - 170 mArms / mADC
Peak t=10ms ILPK --±400 mAP
On-Resistance, AC/DC Confi guration IL=170mA RON -1620
Off-State Leakage Current VL=250VPILEAK --1 µA
Switching Speeds
Turn-On IF=10mA, VL=10V ton --5 ms
Turn-Off toff --5
Output Capacitance VL=50V, f=1MHz COUT -50- pF
Input Characteristics
Input Control Current to Activate IL=170mA IF- - 10 mA
Input Control Current to Deactivate - IF0.4 0.7 - mA
Input Voltage Drop IF=10mA VF0.9 1.35 1.56 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -3- pF
Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION
LCC120
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R10
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
Temperature (ºC)
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
10Ps
1.2
1.0
0.8
0.6
0.4
0.2
0
1ms100Ps 100ms 1s
10ms 10s 100s
Form-A
Typical Turn-On Time
(N=50, IF=10mA, IL=170mADC)
0.75 1.35 2.251.05 1.65
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
1.95
Form-A
Typical Turn-Off Time
(N=50, IF=10mA, IL=170mADC)
0.320.23 0.50 0.680.590.41
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Form-A
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=170mADC)
35
30
25
20
15
10
5
0
8.5 9.1 9.7 10.38.8 9.4 10.0
On-Resistance (:)
Device Count (N)
Form-A
Typical IF for Switch Operation
(N=50, IL=170mADC)
1.05 3.15 4.552.45 3.85 5.25
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
1.75
Form-A
Typical IF for Switch Dropout
(N=50, IL=170mADC)
25
20
15
10
5
0
1.75 3.15 4.551.05 2.45 3.85 5.25
LED Current (mA)
Device Count (N)
Form-A
Typical Blocking Voltage Distribution
(N=50)
35
30
25
20
15
10
5
0
330 350 370 390340 360 380
Blocking Voltage (VP)
Device Count (N)
FORM-A RELAY PERFORMANCE DATA*
COMMON PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
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4R10
LCC120
Form-A
Typical Turn-Off Time
vs. LED Forward Current
(IL=170mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.25
0.20
0.15
0.10
0.05
0
50
Form-A
Typical IF for Switch Dropout
vs. Temperature
(IL=170mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0-20 0 20 40 60 80 100
Form-A
Typical Turn-Off Time
vs. Temperature
(IF=10mA, IL=170mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Form-A
Typical Turn-On Time
vs. LED Forward Current
(IL=170mADC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
50
Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=170mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100
Form-A
Typical Turn-On Time
vs. Temperature
(IL=170mADC)
Temperature (ºC)
Turn-On Time (ms)
-40
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
IF=10mA
IF=15mA
IF=20mA
Form-A
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=170mADC)
Temperature (ºC)
On-Resistance (:)
-40
12
10
8
6
4
2
0
-20 0 20 40 60 80 100
Form-A
Typical Load Current vs. Load Voltage
(IF=10mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-3 -1-2 0 1 23
Form-A
Maximum Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
250
200
150
100
50
0
-40 -20 0 20 40 60 80 120100
I
F
=30mA
I
F
=20mA
I
F
=10mA
Form-A
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
350
345
340
335
330
325
320
315
310
305
-20 0 20 40 60 80 100
FORM-A RELAY PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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LCC120
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R10
Form-B
Typical Turn-On Time
(N=50, IF=10mA, IL=170mADC)
0.25 0.45 0.650.35 0.55 0.75
Turn-On Time (ms)
Device Count (N)
30
25
20
15
10
5
0
Form-B
Typical Turn-Off Time
(N=50, IF=10mA, IL=170mADC)
1.0 1.8 2.62.21.40.6
Turn-Off Time (ms)
Device Count (N)
30
25
20
15
10
5
0
Form-B
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=170mADC)
30
25
20
15
10
5
0
9.3 11.1 12.9 14.710.2 12.0 13.8
On-Resistance (:)
Device Count (N)
Form-B
Typical IF for Switch Operation
(N=50, IL=170mADC)
30
25
20
15
10
5
0
2.01.2 2.8 4.4 6.03.6
LED Current (mA)
Device Count (N)
5.2
Form-B
Typical IF for Switch Dropout
(N=50, IL=170mADC)
25
20
15
10
5
0
1.75 3.15 4.551.05 2.45 3.85 5.25
LED Current (mA)
Device Count (N)
Form-B
Typical Blocking Voltage Distribution
(N=50)
30
25
20
15
10
5
0
263 297 331 365280 314 348
Blocking Voltage (VP)
Device Count (N)
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=170mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
1.6
1.4
1.2
1.0
0.8
0.6
0.4
50
Form-B
Typical IF for Switch Dropout
vs. Temperature
(IL=170mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100
Form-B
Typical Turn-Off Time
vs. Temperature
(IL=170mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
IF=10mA
IF=15mA
IF=20mA
Form-B
Typical Turn-On Time
vs.LED Forward Current
(IL=170mADC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.45
0.40
0.35
0.30
0.25
0.20
50
Form-B
Typical IF for Switch Operation
vs. Temperature
(IL=170mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100
Form-B
Typical Turn-On Time
vs. Temperature
(IF=10mA, IL=170mADC)
Temperature (ºC)
Turn-On Time (ms)
-40
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100
FORM-B RELAY PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
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6R10
LCC120
Form-B
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=170mADC)
Temperature (ºC)
On-Resistance (:)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Form-B
Typical Load Current vs. Load Voltage
(IF=10mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-4 -2 -1-3 1 3 420
Form B
Maximum Load Current
vs. Temperature
(IF=10mA)
Temperature (ºC)
Load Current (mA)
250
200
150
100
50
0
-40 -20 0 20 40 60 80 120100
Form-B
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
320
310
300
290
280
270
260
250
240 -20 0 20 40 60 80 100
FORM-B RELAY PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
LCC120
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R10
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
LCC120 / LCC120S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
LCC120 250ºC 30 seconds 1
LCC120S 250ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
8
LCC120
Specification: DS-LCC120-R10
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/26/2018
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P1=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
Mechanical Dimensions
LCC120
LCC120STR Tape & Reel
LCC120S
