SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 D D D D D D D D D D 3.3-V Supply Operation 10-Bit-Resolution A/D Converter 11 Analog Input Channels Three Built-In Self-Test Modes Inherent Sample and Hold Total Unadjusted Error . . . 1 LSB Max On-Chip System Clock End-of-Conversion (EOC) Output Pin Compatible With TLC1543 CMOS Technology DB, DW, FK, J, OR N PACKAGE (TOP VIEW) A0 A1 A2 A3 A4 A5 A6 A7 A8 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC EOC I/O CLOCK ADDRESS DATA OUT CS REF + REF - A10 A9 description FN PACKAGE (TOP VIEW) A2 A1 A0 VCC EOC The TLV1543C, TLV1543I, and TLV1543M are CMOS 10-bit, switched-capacitor, successiveapproximation, analog-to-digital converters. These devices have three inputs and a 3-state output [chip select (CS), input-output clock (I/O CLOCK), address input (ADDRESS), and data output (DATA OUT)] that provide a direct 4-wire interface to the serial port of a host processor. The devices allow high-speed data transfers from the host. A3 A4 A5 A6 A7 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 I/O CLOCK ADDRESS DATA OUT CS REF + A8 GND A9 A10 REF - In addition to a high-speed A /D converter and versatile control capability, these devices have an on-chip 14-channel multiplexer that can select any one of 11 analog inputs or any one of three internal self-test voltages. The sample-and-hold function is automatic. At the end of A/D conversion, the end-of-conversion (EOC) output goes high to indicate that conversion is complete. The converter incorporated in the devices features differential high-impedance reference inputs that facilitate ratiometric conversion, scaling, and isolation of analog circuitry from logic and supply noise. A switched-capacitor design allows low-error conversion over the full operating free-air temperature range. The TLV1543C is characterized for operation from 0C to 70C. The TLV1543I is characterized for industrial temperature range of - 40C to 85C. The TLV1543M is characterized for operation over the full military temperature range of -55C to 125C. AVAILABLE OPTIONS PACKAGE TA SMALL OUTLINE (DB) SMALL OUTLINE (DW) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) PLASTIC CHIP CARRIER (FN) 0C to 70C TLV1543CDB TLV1543CDW -- -- TLV1543CN TLV1543CFN -40C to 85C TLV1543IDB -- -- -- -- -- -55C to 125C -- -- TLV1543MFK TLV1543MJ -- -- Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000 - 2004, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$( !,'&$% &!" $ %)(&&#$% )(! $-( $(!"% (.#% %$!'"($% %$#,#!, /#!!#$0 !,'&$ )!&(%%1 ,(% $ (&(%%#!+0 &+',( $(%$1 #++ )#!#"($(!% WWW.TI.COM 1 SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 functional block diagram 1 2 3 4 5 6 7 8 9 11 12 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 REF + REF - 14 13 10-Bit Analog-to-Digital Converter (switched capacitors) Sample and Hold 10 14-Channel Analog Multiplexer 4 Output Data Register Input Address Register 10 10-to-1 Data Selector and Driver 16 DATA OUT 4 3 System Clock, Control Logic, and I/O Counters Self-Test Reference ADDRESS I/O CLOCK CS 19 EOC 17 18 15 typical equivalent inputs INPUT CIRCUIT IMPEDANCE DURING SAMPLING MODE INPUT CIRCUIT IMPEDANCE DURING HOLD MODE 1 k TYP A0 -A10 A0 -A10 Ci = 60 pF MAX (equivalent input capacitance) 2 5 M TYP WWW.TI.COM SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 Terminal Functions TERMINAL I/O DESCRIPTION 17 I Serial address. A 4-bit serial address selects the desired analog input or test voltage that is to be converted next. The address data is presented with the MSB first and is shifted in on the first four rising edges of I/O CLOCK. After the four address bits have been read into the address register, ADDRESS is ignored for the remainder of the current conversion period. 1-9, 11, 12 I Analog signal. The 11 analog inputs are applied to A0 -A10 and are internally multiplexed. The driving source impedance should be less than or equal to 1 k. CS 15 I Chip select. A high-to-low transition on CS resets the internal counters and controls and enables DATA OUT, ADDRESS, and I/O CLOCK within a maximum of a setup time plus two falling edges of the internal system clock. A low-to-high transition disables ADDRESS and I/O CLOCK within a setup time plus two falling edges of the internal system clock. DATA OUT 16 O The 3-state serial output for the A/D conversion result. DATA OUT is in the high-impedance state when CS is high and active when CS is low. With a valid chip select, DATA OUT is removed from the high-impedance state and is driven to the logic level corresponding to the MSB value of the previous conversion result. The next falling edge of I/O CLOCK drives DATA OUT to the logic level corresponding to the next most significant bit, and the remaining bits are shifted out in order with the LSB appearing on the ninth falling edge of I/O CLOCK. On the tenth falling edge of I/O CLOCK, DATA OUT is driven to a low logic level so that serial interface data transfers of more than ten clocks produce zeroes as the unused LSBs. EOC 19 O End of conversion. EOC goes from a high- to a low- logic level on the trailing edge of the tenth I/O CLOCK and remains low until the conversion is complete and data are ready for transfer. GND 10 I The ground return terminal for the internal circuitry. Unless otherwise noted, all voltage measurements are with respect to GND. I/O CLOCK 18 I Input/output clock. I/O CLOCK receives the serial I/O CLOCK input and performs the following four functions: 1) It clocks the four input address bits into the address register on the first four rising edges of I/O CLOCK with the multiplex address available after the fourth rising edge. 2) On the fourth falling edge of I/O CLOCK, the analog input voltage on the selected multiplex input begins charging the capacitor array and continues to do so until the tenth falling edge of I/O CLOCK. 3) It shifts the nine remaining bits of the previous conversion data out on DATA OUT. 4) It transfers control of the conversion to the internal state controller on the falling edge of the tenth clock. REF + 14 I The upper reference voltage value (nominally VCC) is applied to REF +. The maximum input voltage range is determined by the difference between the voltage applied to REF + and the voltage applied to the REF - terminal. REF - 13 I The lower reference voltage value (nominally ground) is applied to REF -. VCC 20 I Positive supply voltage NAME NO. ADDRESS A0 -A10 detailed description With chip select (CS) inactive (high), the ADDRESS and I/O CLOCK inputs are initially disabled and DATA OUT is in the high-impedance state. When the serial interface takes CS active (low), the conversion sequence begins with the enabling of I/O CLOCK and ADDRESS and the removal of DATA OUT from the high-impedance state. The host then provides the 4-bit channel address to ADDRESS and the I/O CLOCK sequence to I/O CLOCK. During this transfer, the host serial interface also receives the previous conversion result from DATA OUT. I/O CLOCK receives an input sequence that is between 10 and 16 clocks long from the host. The first four I/O clocks load the address register with the 4-bit address on ADDRESS selecting the desired analog channel and the next six clocks providing the control timing for sampling the analog input. WWW.TI.COM 3 SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 detailed description (continued) There are six basic serial interface timing modes that can be used with the device. These modes are determined by the speed of I/O CLOCK and the operation of CS as shown in Table 1. These modes are (1) a fast mode with a 10-clock transfer and CS inactive (high) between conversion cycles, (2) a fast mode with a 10-clock transfer and CS active (low) continuously, (3) a fast mode with an 11- to 16-clock transfer and CS inactive (high) between conversion cycles, (4) a fast mode with a 16-bit transfer and CS active (low) continuously, (5) a slow mode with an 11- to 16-clock transfer and CS inactive (high) between conversion cycles, and (6) a slow mode with a 16-clock transfer and CS active (low) continuously. The MSB of the previous conversion appears on DATA OUT on the falling edge of CS in mode 1, mode 3, and mode 5, on the rising edge of EOC in mode 2 and mode 4, and following the 16th clock falling edge in mode 6. The remaining nine bits are shifted out on the next nine falling edges of I/O CLOCK. Ten bits of data are transmitted to the host through DATA OUT. The number of serial clock pulses used also depends on the mode of operation, but a minimum of ten clock pulses is required for conversion to begin. On the 10th clock falling edge, the EOC output goes low and returns to the high logic level when conversion is complete and the result can be read by the host. On the 10th clock falling edge, the internal logic takes DATA OUT low to ensure that the remaining bit values are zero if the I/O CLOCK transfer is more than ten clocks long. Table 1 lists the operational modes with respect to the state of CS, the number of I/O serial transfer clocks that can be used, and the timing edge on which the MSB of the previous conversion appears at the output. Table 1. Mode Operation MODES Fast Modes Slow Modes NO. OF I/O CLOCKS CS MSB AT DATA OUT TIMING DIAGRAM Mode 1 High between conversion cycles 10 CS falling edge Figure 9 Mode 2 Low continuously 10 EOC rising edge Figure 10 Mode 3 High between conversion cycles CS falling edge Figure 11 Mode 4 Low continuously 11 to 16 16 EOC rising edge Figure 12 Mode 5 High between conversion cycles CS falling edge Figure 13 Mode 6 Low continuously 11 to 16 16 16th clock falling edge Figure 14 These edges also initiate serial-interface communication. No more than 16 clocks should be used. fast modes The device is in a fast mode when the serial I/O CLOCK data transfer is completed before the conversion is completed. With a 10-clock serial transfer, the device can only run in a fast mode since a conversion does not begin until the falling edge of the 10th I/O CLOCK. mode 1: fast mode, CS inactive (high) between conversion cycles, 10-clock transfer In this mode, CS is inactive (high) between serial I/O CLOCK transfers and each transfer is ten clocks long. The falling edge of CS begins the sequence by removing DATA OUT from the high-impedance state. The rising edge of CS ends the sequence by returning DATA OUT to the high-impedance state within the specified delay time. Also, the rising edge of CS disables the I/O CLOCK and ADDRESS terminals within a setup time plus two falling edges of the internal system clock. mode 2: fast mode, CS active (low) continuously, 10-clock transfer In this mode, CS is active (low) between serial I/O CLOCK transfers and each transfer is ten clocks long. After the initial conversion cycle, CS is held active (low) for subsequent conversions; the rising edge of EOC then begins each sequence by removing DATA OUT from the low logic level, allowing the MSB of the previous conversion to appear immediately on this output. 4 WWW.TI.COM SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 mode 3: fast mode, CS inactive (high) between conversion cycles, 11- to 16-clock transfer In this mode, CS is inactive (high) between serial I/O CLOCK transfers and each transfer can be 11 to 16 clocks long. The falling edge of CS begins the sequence by removing DATA OUT from the high-impedance state. The rising edge of CS ends the sequence by returning DATA OUT to the high-impedance state within the specified delay time. Also, the rising edge of CS disables the I/O CLOCK and ADDRESS terminals within a setup time plus two falling edges of the internal system clock. mode 4: fast mode, CS active (low) continuously, 16-clock transfer In this mode, CS is active (low) between serial I/O CLOCK transfers and each transfer must be exactly 16 clocks long. After the initial conversion cycle, CS is held active (low) for subsequent conversions; the rising edge of EOC then begins each sequence by removing DATA OUT from the low logic level, allowing the MSB of the previous conversion to appear immediately on this output. slow modes In a slow mode, the conversion is completed before the serial I/O CLOCK data transfer is completed. A slow mode requires a minimum 11-clock transfer into I/O CLOCK, and the rising edge of the eleventh clock must occur before the conversion period is complete; otherwise, the device loses synchronization with the host serial interface, and CS has to be toggled to initialize the system. The eleventh rising edge of the I/O CLOCK must occur within 9.5 s after the tenth I/O clock falling edge. mode 5: slow mode, CS inactive (high) between conversion cycles, 11- to 16-clock transfer In this mode, CS is inactive (high) between serial I/O CLOCK transfers and each transfer can be 11 to 16 clocks long. The falling edge of CS begins the sequence by removing DATA OUT from the high-impedance state. The rising edge of CS ends the sequence by returning DATA OUT to the high-impedance state within the specified delay time. Also, the rising edge of CS disables the I/O CLOCK and ADDRESS terminals within a setup time plus two falling edges of the internal system clock. mode 6: slow mode, CS active (low) continuously, 16-clock transfer In this mode, CS is active (low) between serial I/O CLOCK transfers and each transfer must be exactly 16 clocks long. After the initial conversion cycle, CS is held active (low) for subsequent conversions. The falling edge of the sixteenth I/O CLOCK then begins each sequence by removing DATA OUT from the low state, allowing the MSB of the previous conversion to appear immediately at DATA OUT. The device is then ready for the next 16-clock transfer initiated by the serial interface. address bits The 4-bit analog channel-select address for the next conversion cycle is presented to the ADDRESS terminal (MSB first) and is clocked into the address register on the first four leading edges of I/O CLOCK. This address selects one of 14 inputs (11 analog inputs or 3 internal test inputs). analog inputs and test modes The 11 analog inputs and the 3 internal test inputs are selected by the 14-channel multiplexer according to the input address as shown in Tables 2 and 3. The input multiplexer is a break-before-make type to reduce input-to-input noise injection resulting from channel switching. Sampling of the analog input starts on the falling edge of the fourth I/O CLOCK, and sampling continues for six I/O CLOCK periods. The sample is held on the falling edge of the tenth I/O CLOCK. The three test inputs are applied to the multiplexer, sampled, and converted in the same manner as the external analog inputs. WWW.TI.COM 5 SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 Table 2. Analog-Channel-Select Address ANALOG INPUT SELECTED VALUE SHIFTED INTO ADDRESS INPUT BINARY HEX A0 0000 0 A1 0001 1 A2 0010 2 A3 0011 3 A4 0100 4 A5 0101 5 A6 0110 6 A7 0111 7 A8 1000 8 A9 1001 9 A10 1010 A Table 3. Test-Mode-Select Address INTERNAL SELF-TEST VOLTAGE SELECTED V ref) -V ref- VALUE SHIFTED INTO ADDRESS INPUT BINARY HEX 1011 B OUTPUT RESULT (HEX) 200 2 Vref - 1100 C 000 Vref + 1101 D 3FF Vref + is the voltage applied to the REF + input, and Vref - is the voltage applied to the REF - input. The output results shown are the ideal values and vary with the reference stability and with internal offsets. converter and analog input The CMOS threshold detector in the successive-approximation conversion system determines each bit by examining the charge on a series of binary-weighted capacitors (see Figure 1). In the first phase of the conversion process, the analog input is sampled by closing the SC switch and all ST switches simultaneously. This action charges all the capacitors to the input voltage. In the next phase of the conversion process, all ST and SC switches are opened and the threshold detector begins identifying bits by identifying the charge (voltage) on each capacitor relative to the reference (REF -) voltage. In the switching sequence, ten capacitors are examined separately until all ten bits are identified and the charge-convert sequence is repeated. In the first step of the conversion phase, the threshold detector looks at the first capacitor (weight = 512). Node 512 of this capacitor is switched to the REF+ voltage, and the equivalent nodes of all the other capacitors on the ladder are switched to REF-. If the voltage at the summing node is greater than the trip point of the threshold detector (approximately one-half the VCC voltage), a bit 0 is placed in the output register and the 512-weight capacitor is switched to REF-. If the voltage at the summing node is less than the trip point of the threshold detector, a bit 1 is placed in the register and the 512-weight capacitor remains connected to REF + through the remainder of the successive-approximation process. The process is repeated for the 256-weight capacitor, the 128-weight capacitor, and so forth down the line until all bits are counted. With each step of the successive-approximation process, the initial charge is redistributed among the capacitors. The conversion process relies on charge redistribution to count and weigh the bits from MSB to LSB. 6 WWW.TI.COM SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 converter and analog input (continued) SC Threshold Detector 512 Node 512 REF - 256 128 REF+ REF+ REF - REF - ST ST 16 8 REF+ REF - ST 4 REF+ REF - ST REF+ REF - ST 2 1 REF+ REF+ REF - ST REF - ST To Output Latches 1 REF - ST ST VI Figure 1. Simplified Model of the Successive-Approximation System chip-select operation The trailing edge of CS starts all modes of operation, and CS can abort a conversion sequence in any mode. A high-to-low transition on CS within the specified time during an ongoing cycle aborts the cycle, and the device returns to the initial state (the contents of the output data register remain at the previous conversion result). Exercise care to prevent CS from being taken low close to completion of conversion because the output data can be corrupted. reference voltage inputs There are two reference inputs used with these devices: REF+ and REF-. These voltage values establish the upper and lower limits of the analog input to produce a full-scale and zero-scale reading respectively. The values of REF+, REF-, and the analog input should not exceed the positive supply or be lower than GND consistent with the specified absolute maximum ratings. The digital output is at full scale when the input signal is equal to or higher than REF + and at zero when the input signal is equal to or lower than REF -. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC (see Note 1): TLV1543C/TLV1543I . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 6.5 V TLV1543M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 6 V Input voltage range, VI (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to VCC + 0.3 V Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to VCC + 0.3 V Positive reference voltage, Vref + . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.1 V Negative reference voltage, Vref - . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.1 V Peak input current (any input), I(p-p) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Peak total input current (all inputs), Ip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA Operating free-air temperature range, TA: TLV1543C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C TLV1543I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to 85C TLV1543M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 125C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values are with respect to digital ground with REF - and GND wired together (unless otherwise noted). WWW.TI.COM 7 SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 recommended operating conditions Supply voltage, VCC MIN NOM MAX TLV1543C/TLV1543I 3 3.3 5.5 V TLV1543M 3 3.3 3.6 V Positive reference voltage, Vref + (see Note 2) VCC 0 Negative reference voltage, Vref - (see Note 2) Differential reference voltage, Vref + - Vref - (see Note 2) 2.5 Analog input voltage (see Note 2) 0 TLV1543C/TLV1543I High-level control input voltage, VIH TLV1543M TLV1543C/TLV1543I Low-level control input voltage, VIL TLV1543M VCC = 3 V to 5.5 V VCC = 3 V to 3.6 V V V VCC + 0.2 VCC V V 2 V 2 V VCC = 3 V to 5.5 V VCC = 3 V to 3.6 V Setup time, address bits at data input before I/O CLOCK, tsu(A) (see Figure 4) VCC UNIT 0.6 0.8 V V 100 ns Hold time, address bits after I/O CLOCK, th(A) (see Figure 4) 0 ns Hold time, CS low after last I/O CLOCK, th(CS) 0 ns 1.425 s Setup time, CS low before clocking in first address bit, tsu(CS) (see Note 3) Clock frequency at I/O CLOCK (see Note 4) TLV1543C/TLV1543I 0 1.1 TLV1543M 0 2.1 Pulse duration, I/O CLOCK high, tw(H_I/O) 190 Pulse duration, I/O CLOCK low, tw(L_I/O) 190 Transition time, I/O CLOCK, tt(I/O) (see Note 5) Transition time, ADDRESS and CS, tt(CS) TLV1543C Operating free-air temperature, TA MHz ns ns 1 s 10 s 0 70 TLV1543I -40 85 TLV1543M -55 125 C C NOTES: 2. Analog input voltages greater than that applied to REF+ convert as all ones (1111111111), while input voltages less than that applied to REF- convert as all zeros (0000000000). 3. To minimize errors caused by noise at CS, the internal circuitry waits for a setup time plus two falling edges of the internal system clock after CS before responding to control input signals. No attempt should be made to clock in an address until the minimum CS setup time has elapsed. 4. For 11- to 16-bit transfers, after the tenth I/O CLOCK falling edge ( 2 V), at least one I/O clock rising edge ( 2 V) must occur within 9.5 s. 5. This is the time required for the clock input signal to fall from VIHmin to VILmax or to rise from VILmax to VIHmin. In the vicinity of normal room temperature, the devices function with input clock transition time as slow as 1 s for remote data-acquisition applications where the sensor and the A/D converter are placed several feet away from the controlling microprocessor. 8 WWW.TI.COM SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 electrical characteristics over recommended operating free-air temperature range, VCC = Vref+ = 3 V to 5.5 V, I/O CLOCK frequency = 1.1 MHz for the TLV1543C, and TLV1543I VCC = Vref+ = 3 V to 3.6 V, I/O CLOCK frequency = 2.1 MHz for the TLV1543M (unless otherwise noted) PARAMETER VOH VOL TEST CONDITIONS MIN TYP UNIT TLV1543C/TLV1543I VCC = 3 V, VCC = 3 V to 5.5 V, IOH = - 1.6 mA IOH = 20 A TLV1543M VCC = 3 V, VCC = 3 V to 3.6 V, IOH = - 1.6 mA IOH = 20 A IOL = 1.6 mA IOL = 20 A 0.4 V TLV1543C/TLV1543I VCC = 3 V, VCC = 3 V to 5.5 V, 0.1 V IOL = 1.6 mA IOL = 20 A 0.4 V TLV1543M VCC = 3 V, VCC = 3 V to 3.6 V, 0.1 V VO = VCC, VO = 0, VI = VCC CS at VCC 10 CS at VCC -10 High-level output voltage Low-level output voltage IOZ Off-state (high-impedance-state) output current IIH IIL High-level input current ICC Operating supply current Low-level input current VI = 0 CS at 0 V 2.4 V VCC -0.1 2.4 V V VCC -0.1 V Selected channel leakage current Maximum static analog reference current into REF + A 2.5 -0.005 -2.5 A 0.8 2.5 mA 1 A A Selected channel at 0 V, Unselected channel at VCC Vref + = VCC, A A 0.005 Selected channel at VCC, Unselected channel at 0 V Ci MAX -1 Vref - = GND 10 Input capacitance, Analog inputs TLV1543C/TLV1543I 7 60 TLV1543M 7 60 Input capacitance, Control inputs TLV1543C/TLV1543I 5 60 TLV1543M 5 60 A pF pF All typical values are at VCC = 5 V, TA = 25C. WWW.TI.COM 9 SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 operating characteristics over recommended operating free-air temperature range, VCC = Vref+ = 3 V to 5.5 V, I/O CLOCK frequency = 1.1 MHz for the TLV1543C, and TLV1543I VCC = Vref+ = 3 V to 3.6 V, I/O CLOCK frequency = 2.1 MHz for the TLV1543M PARAMETER TEST CONDITIONS MIN MAX UNIT Linearity error (see Note 6) 1 LSB Zero error (see Note 7) 1 LSB Full-scale error (see Note 7) 1 LSB Total unadjusted error (see Note 8) 1 LSB 21 s ADDRESS = 1011 Self-test output code (see Table 3 and Note 9) tc(1) 512 ADDRESS = 1100 0 ADDRESS = 1101 1023 Conversion time See Figures 9 -14 tc(2) Total cycle time (access, sample, and conversion) See Figures 9 -14 and Note 10 t(acq) Channel acquisition time (sample) See Figures 9 -14 and Note 10 tv td(I/O-DATA) Valid time, DATA OUT remains valid after I/O CLOCK See Figure 6 Delay time, I/O CLOCK to DATA OUT valid See Figure 6 td(I/O-EOC) td(EOC-DATA) Delay time, tenth I/O CLOCK to EOC See Figure 7 Delay time, EOC to DATA OUT (MSB) See Figure 8 tPZH, tPZL tPHZ, tPLZ Enable time, CS to DATA OUT (MSB driven) Disable time, CS to DATA OUT (high impedance) tr(EOC) tf(EOC) tr(bus) tf(bus) td(I/O-CS) TYP 21 +10 I/O CLOCK periods 6 10 s I/O CLOCK periods ns 240 ns 240 ns 100 ns See Figure 3 1.3 s See Figure 3 150 ns Rise time, EOC See Figure 8 300 ns Fall time, EOC See Figure 7 300 ns Rise time, data bus See Figure 6 300 ns Fall time, data bus See Figure 6 300 ns 9 s Delay time, tenth I/O CLOCK to CS to abort conversion (see Note 11) 70 All typical values are at TA = 25C. NOTES: 6. Linearity error is the maximum deviation from the best straight line through the A/D transfer characteristics. 7. Zero-scale error is the difference between 0000000000 and the converted output for zero input voltage; full-scale error is the difference between 1111111111 and the converted output for full-scale input voltage. 8. Total unadjusted error comprises linearity, zero-scale, and full-scale errors. 9. Both the input address and the output codes are expressed in positive logic. 10. I/O CLOCK period = 1/(I/O CLOCK frequency) (see Figure 6). 11. Any transitions of CS are recognized as valid only if the level is maintained for a setup time plus two falling edges of the internal clock (1.425 s) after the transition. 10 WWW.TI.COM SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION Test Point VCC Test Point VCC RL = 2.18 k RL = 2.18 k EOC DATA OUT 12 k CL = 50 pF 12 k CL = 100 pF Figure 2. Load Circuits Address Valid 2V CS tPZH, tPZL DATA OUT 2V VIL ADDRESS VIL tPHZ, tPLZ 2.4 V 90% 0.4 V 10% th(A) tsu(A) I/O CLOCK VIL Figure 3. DATA OUT to Hi-Z Voltage Waveforms Figure 4. ADDRESS Setup Voltage Waveforms 2V CS VIL tsu(CS) th(CS) I/O CLOCK VIL First Clock Last Clock VIL Figure 5. CS and I/O CLOCK Voltage Waveforms WWW.TI.COM 11 SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION tt(I/O) tt(I/O) I/O CLOCK 2V 2V VIL VIL VIL I/O CLOCK Period td(I/O-DATA) tv DATA OUT 2.4 V 0.4 V 2.4 V 0.4 V tr(bus), tf(bus) Figure 6. DATA OUT and I/O CLOCK Voltage Waveforms I/O CLOCK 10th Clock VIL td(I/O-EOC) 2.4 V EOC 0.4 V tf(EOC) Figure 7. I/O CLOCK and EOC Voltage Waveforms tr(EOC) 2.4 V EOC 0.4 V td(EOC-DATA) 2.4 V 0.4 V DATA OUT Valid MSB Figure 8. EOC and DATA OUT Voltage Waveforms 12 WWW.TI.COM SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 CS (see Note A) I/O CLOCK 1 2 3 4 5 6 Access Cycle B 7 8 9 10 Sample Cycle B IIIIII IIIIII 1 Hi-Z State DATA OUT A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 IIIIIIIIIIII IIIIIIIIIIII Previous Conversion Data MSB B9 IIII IIII LSB ADDRESS B3 B2 B1 B0 MSB C3 LSB EOC Shift in New Multiplexer Address, Simultaneously Shift Out Previous Conversion Value A/D Conversion Interval Initialize Initialize NOTE A: To minimize errors caused by noise at CS, the internal circuitry waits for a setup time plus two falling edges of the internal system clock after CS before responding to control input signals. No attempt should be made to clock in an address until the minimum CS setup time has elapsed. Figure 9. Timing for 10-Clock Transfer Using CS Must be High on Power Up CS (see Note A) I/O CLOCK 1 2 3 4 5 6 Access Cycle B DATA OUT A9 A8 A7 7 9 10 1 Sample Cycle B A6 A5 A4 A3 Previous Conversion Data IIIIIIIIIIII IIIIIIIIIIII MSB 8 A2 A1 A0 Low Level IIII IIII LSB ADDRESS B3 MSB B2 B1 B9 B0 C3 LSB EOC Shift in New Multiplexer Address, Simultaneously Shift Out Previous Conversion Value Initialize A/D Conversion Interval Initialize NOTE A: To minimize errors caused by noise at CS, the internal circuitry waits for a setup time plus two falling edges of the internal system clock after CS before responding to control input signals. No attempt should be made to clock in an address until the minimum CS setup time has elapsed. Figure 10. Timing for 10-Clock Transfer Not Using CS WWW.TI.COM 13 SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 III III III III III III IIIII IIIII See Note B CS (see Note A) I/O CLOCK 1 2 3 4 5 6 Access Cycle B DATA OUT A9 A8 7 8 9 10 Sample Cycle B A7 A6 A5 A4 A3 A2 A1 A0 Previous Conversion Data IIIIIIIIIII IIIIIIIIIII MSB 11 Low Level LSB ADDRESS B3 B2 B1 B0 MSB 1 16 Hi-Z B9 C3 LSB EOC Shift in New Multiplexer Address, Simultaneously Shift Out Previous Conversion Value A/D Conversion Interval Initialize Initialize NOTES: A. To minimize errors caused by noise at CS, the internal circuitry waits for a set up time plus two falling edges of the internal system clock after CS before responding to control input signals. No attempt should be made to clock in an address until the minimum CS setup time has elapsed. B. A low-to-high transition of CS disables ADDRESS and the I/O CLOCK within a maximum of a setup time plus two falling edges of the internal system clock. Figure 11. Timing for 11- to 16-Clock Transfer Using CS (Serial Transfer Interval Shorter Than Conversion) Must be High on Power Up CS (see Note A) I/O CLOCK 1 2 3 4 5 6 Access Cycle B DATA OUT A9 A8 A7 7 9 10 14 15 16 Sample Cycle B A6 A5 A4 A3 IIIIIIIIIIII IIIIIIIIIIII Previous Conversion Data MSB 8 A2 See Note B A1 A0 Low Level B3 B2 B1 B9 IIIII IIIII LSB ADDRESS MSB 1 B0 C3 LSB EOC Shift in New Multiplexer Address, Simultaneously Shift Out Previous Conversion Value Initialize A/D Conversion Interval Initialize NOTES: A. The first I/O CLOCK must occur after the rising edge of EOC. B. A low-to-high transition of CS disables ADDRESS and the I/O CLOCK within a maximum of a setup time plus two falling edges of the internal system clock. Figure 12. Timing for 16-Clock Transfer Not Using CS (Serial Transfer Interval Shorter Than Conversion) 14 WWW.TI.COM SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 CS (see Note A) I/O CLOCK 1 2 3 4 5 6 Access Cycle B DATA OUT A9 A8 A7 7 8 9 10 Sample Cycle B A6 A5 A4 A3 A2 A1 A0 IIIIIIIIIIII IIIIIIIIIIII III III Hi-Z State Low Level LSB ADDRESS B3 B2 B1 B0 MSB 1 16 See Note B Previous Conversion Data MSB 11 III III III III B9 IIIII IIIII C3 III III LSB EOC Shift in New Multiplexer Address, Simultaneously Shift Out Previous Conversion Value A/D Conversion Interval Initialize Initialize NOTES: A. To minimize errors caused by noise at CS, the internal circuitry waits for a set up time plus two falling edges of the internal system clock after CS before responding to control input signals. No attempt should be made to clock in an address until the minimum chip CS setup time has elapsed. B. The eleventh rising edge of the I/O CLOCK sequence must occur before the conversion is complete to prevent losing serial interface synchronization. Figure 13. Timing for 11- to 16-Clock Transfer Using CS (Serial Transfer Interval Longer Than Conversion) Must be High on Power Up CS (see Note A) I/O CLOCK 1 2 3 4 5 6 Access Cycle B DATA OUT A9 A8 A7 A6 A5 A4 A3 IIIIIIIIII IIIIIIIIII B3 MSB B2 B1 8 9 10 Sample Cycle B Previous Conversion Data MSB ADDRESS 7 A2 14 15 See Note A A1 Low Level A0 LSB B0 16 1 See Note B B9 IIIII IIIII C3 LSB EOC Shift in New Multiplexer Address, Simultaneously Shift Out Previous Conversion Value Initialize A/D Conversion Interval NOTES: A. The eleventh rising edge of the I/O CLOCK sequence must occur before the conversion is complete to prevent losing serial interface synchronization. B. The I/O CLOCK sequence is exactly 16 clock pulses long. Figure 14. Timing for 16-Clock Transfer Not Using CS (Serial Transfer Interval Longer Than Conversion) WWW.TI.COM 15 SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 APPLICATION INFORMATION 1023 1111111111 See Notes A and B 1022 1111111110 1021 1111111101 VF T = VFS - 1/2 LSB 513 1000000001 512 1000000000 VZ T = VZS + 1/2 LSB Step Digital Output Code VFS 511 0111111111 VZS 0000000001 1 0000000000 0 0.0048 0.0096 2.4528 2.4576 4.9056 2.4624 4.9080 2 0.0024 0000000010 4.9104 0 4.9152 VI - Analog Input Voltage - V NOTES: A. This curve is based on the assumption that Vref + and Vref - have been adjusted so that the voltage at the transition from digital 0 to 1 (VZ T) is 0.0024 V and the transition to full scale (VF T) is 4.908 V. 1 LSB = 4.8 mV. B. The full-scale value (VFS) is the step whose nominal midstep value has the highest absolute value. The zero-scale value (VZS) is the step whose nominal midstep value equals zero. Figure 15. Ideal Conversion Characteristics TLV1543 1 2 3 4 5 Analog Inputs 6 7 8 9 11 12 15 A0 CS A1 I/O CLOCK A2 ADDRESS 18 17 Processor A3 A4 DATA OUT A5 EOC 16 19 A6 A7 A8 A10 14 REF + A9 REF - 3-V DC Regulated 13 GND 10 To Source Ground Figure 16. Serial Interface 16 WWW.TI.COM Control Circuit SLAS072E - DECEMBER 1992 - REVISED JANUARY 2004 APPLICATION INFORMATION simplified analog input analysis Using the equivalent circuit in Figure 17, the time required to charge the analog input capacitance from 0 to VS within 1/2 LSB can be derived as follows: The capacitance charging voltage is given by ( VC = VS 1-e -t c /RtCi ) (1) Where: Rt = Rs + ri The final voltage to 1/2 LSB is given by VC (1/2 LSB) = VS - (VS /2048) (2) Equating equation 1 to equation 2 and solving for time tc gives ( VS -(VS/2048) = VS 1-e -t c /RtCi ) (3) and tc (1/2 LSB) = Rt x Ci x ln(2048) (4) Therefore, with the values given the time for the analog input signal to settle is tc (1/2 LSB) = (Rs + 1 k) x 60 pF x ln(2048) (5) This time must be less than the converter sample time shown in the timing diagrams. Driving Source TLV1543 Rs VS ri VI VC 1 k MAX Ci 60 pF MAX VI = Input Voltage at A0 -A10 VS = External Driving Source Voltage Rs = Source Resistance ri = Input Resistance Ci = Input Capacitance Driving source requirements: * Noise and distortion for the source must be equivalent to the resolution of the converter. * Rs must be real at the input frequency. Figure 17. Equivalent Input Circuit Including the Driving Source WWW.TI.COM 17 PACKAGE OPTION ADDENDUM www.ti.com 29-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) TBD Lead/ Ball Finish OBSOLETE LCCC FK 20 TLV1543CDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543CDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543CDBLE OBSOLETE SSOP DB 20 TLV1543CDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543CDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543CDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543CDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543CDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543CDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543CFN ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM TLV1543CFNG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM TLV1543CN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV1543CNE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TLV1543IDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543IDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543IDBLE OBSOLETE SSOP DB 20 TLV1543IDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV1543IDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 1 Call TI Call TI (3) Samples (Requires Login) 5962-9689401Q2A TBD Call TI MSL Peak Temp Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 29-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV1543MFKB OBSOLETE LCCC FK 20 TBD Call TI Call TI TLV1543MJ OBSOLETE CDIP J 20 TBD Call TI Call TI TLV1543MJB OBSOLETE CDIP J 20 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV1543CDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 TLV1543IDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV1543CDBR SSOP DB 20 2000 367.0 367.0 38.0 TLV1543IDBR SSOP DB 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MPLC004A - OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-018 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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